Laser processing system

Abstract

The utility model provides a laser processing system, relates to the field of laser detection, and solves the technical problems that the laser power detection error is large, and the laser power and the light spot form cannot be detected at the same time. The laser processing system comprises a laser emitting assembly, a processing platform and a laser detection assembly. Firstly, the laser detection assembly can directly receive the processing light beam and directly detect the power of the processing light beam, so that the power detection error of the processing light beam is reduced; secondly, the laser detection assembly has the function of detecting the power and the light spot form of the processing light beam at the same time, so that the power and the light spot form of the processing light beam can be detected at the same time; thirdly, the processing platform and the laser detection assembly can receive the processing light beams in a switching manner, so that the influence on the productivity of laser processing is small; and fourthly, the laser detection assembly is arranged below the laser emission assembly, so that the light spot morphology and the laser power which are closer to the real working state can be obtained.

Description

Technical Field

[0001] The present application relates to the field of laser detection, and in particular to a laser processing system. Background Art

[0002] In the field of laser processing, especially in short-pulse laser applications, such as laser modification and ablation of crystalline silicon solar cells, perovskite scribing, etc., lasers are usually used to achieve local modification or removal of materials. In order to optimize process uniformity and reduce laser-induced damage, the laser spot is usually shaped into a flat-top spot through optical elements, so that it has a relatively uniform internal optical power density distribution and relatively sharp edges, thereby achieving better processing effects. Limited by the fluctuations in laser directivity and the stability of optical components, the flat-top spot obtained by shaping may deviate from the optimal state and will affect the laser processing effect. Therefore, it is necessary to regularly detect the spot shape and laser power.

[0003] In the related art, during laser detection, the laser beam emitted by the laser is usually split into two sub-beams with higher power and lower power. The sub-beam with higher power continues to be used for laser processing, and the sub-beam with lower power is transmitted to a power detection device. The power of the complete laser is calculated using the sub-beam data measured by the power detection device. With this method, since the power of the complete laser is indirectly calculated based on the power of the sub-beam with lower power, the error is large, and this method cannot detect both the laser power and the spot shape at the same time. Utility Model Content

[0004] In order to solve the above technical problems, the present application is proposed. The embodiment of the present application provides a laser processing system.

[0005] In a first aspect, an embodiment of the present application provides a laser processing system, comprising: a laser emitting component, configured to emit a processing beam downward; a processing platform, disposed below the laser emitting component, configured to carry a material to be processed, and to receive the processing beam emitted by the laser emitting component so as to process the material to be processed through the received processing beam; a laser detection component, disposed below the laser emitting component, configured to receive the processing beam, and detect the power of the processing beam and the spot shape of the processing beam; wherein the laser detection component is located on one side of the processing platform, and the processing platform and the laser detection component can switchably receive the processing beam.

[0006] In some embodiments, the laser detection assembly can be moved directly below the laser emitting assembly to receive the processing beam.

[0007] In some embodiments, the laser detection assembly is tilted and configured to receive the processing beam vertically.

[0008] In some embodiments, the laser detection component includes: a spectrometer, configured to receive a processing beam and split the processing beam into a first sub-beam and a second sub-beam with different propagation directions, wherein a first power of the first sub-beam is greater than a second power of the second sub-beam; a power meter, located in the propagation direction of the first sub-beam, configured to receive and detect the first sub-beam, and determine the power of the processing beam based on the detection result of the first sub-beam; a photosensitive element, located in the propagation direction of the second sub-beam, a first optical path between the laser emitting component and the photosensitive element is equal to a second optical path between the laser emitting component and the processing platform, the photosensitive element is configured to receive and detect the second sub-beam, and determine the spot shape of the processing beam based on the detection result of the second sub-beam.

[0009] In some embodiments, the beam splitting element includes: a polarization beam splitter, configured to receive a processing beam, and split the processing beam into a first sub-beam and a second sub-beam with orthogonal propagation directions, wherein a first power of the first sub-beam and a second power of the second sub-beam can be adjusted based on the polarization state of the processing beam, and the processing beam is a linearly polarized beam with an adjusted polarization state, or the processing beam is obtained after adjustment based on the linearly polarized beam with an adjusted polarization state; or the beam splitting element includes: a beam splitter, configured to receive the processing beam, and split the processing beam into a first sub-beam and a second sub-beam with different propagation directions.

[0010] In some embodiments, the laser emitting assembly includes: a half-wave plate, which can rotate around its axis, and the linearly polarized light beam of the laser emitting assembly forms an angle with the fast axis of the half-wave plate, and the angle is configured to adjust the polarization direction of the linearly polarized light beam.

[0011] In some embodiments, the beam splitter includes: at least one layer of dielectric beam splitting film, configured to reflect a portion of the processing light beam and allow another portion of the processing light beam to pass through, so that the processing light beam is split into a first sub-beam and a second sub-beam with different propagation directions; a substrate, having a light receiving surface and a light emitting surface, at least one layer of dielectric beam splitting film is located on one side of the light receiving surface of the beam splitter, and the substrate is configured to allow the first sub-beam or the second sub-beam to pass through; at least one layer of anti-reflection film is arranged on one side of the light emitting surface of the beam splitter, and is configured to increase the transmittance of the first sub-beam or the second sub-beam.

[0012] In some embodiments, a power ratio of the first sub-beam to the processing beam is greater than or equal to 90%, and a power ratio of the second sub-beam to the processing beam is less than or equal to 10%.

[0013] In some embodiments, the propagation direction of the first sub-beam is the same as the propagation direction of the processing beam, and the propagation direction of the second sub-beam is perpendicular to the propagation direction of the processing beam; or, the propagation direction of the second sub-beam is the same as the propagation direction of the processing beam, and the propagation direction of the first sub-beam is perpendicular to the propagation direction of the processing beam.

[0014] In some embodiments, the laser emitting component includes: a laser configured to emit a linearly polarized light beam; a beam expander configured to receive a linearly polarized light beam with an adjusted polarization state, and adjust the beam diameter of the linearly polarized light beam, to obtain and emit a linearly polarized light beam with an adjusted beam diameter; a diffractive optical element configured to receive a linearly polarized light beam with an adjusted beam diameter, and adjust the energy distribution of the linearly polarized light beam, to obtain and emit a linearly polarized light beam with an adjusted energy distribution; a galvanometer configured to receive a linearly polarized light beam with an adjusted energy distribution, and change the propagation direction of the linearly polarized light beam, to obtain and emit a linearly polarized light beam with an adjusted propagation direction; and a field mirror configured to receive and focus the linearly polarized light beam with an adjusted propagation direction, to obtain and emit a processing light beam to a processing platform or a laser detection component.

[0015] The laser processing system proposed in the embodiment of the present application has the following characteristics: first, the laser detection component can directly receive the processing light beam and directly detect the power of the processing light beam, can detect the power of the processing light beam more accurately, and reduce the power detection error of the processing light beam; second, because the laser detection component has the function of detecting both the power and the spot shape of the processing light beam, it is possible to detect both the power and the spot shape of the processing light beam at the same time; third, because the laser detection component is arranged on the lower side of the laser emission component, and the processing platform and the laser detection component can switchably receive the processing light beam, it is possible to quickly switch to detecting the processing light beam during the laser processing process, and quickly switch back to laser processing after the detection is completed, which has little impact on the production capacity of laser processing, has better real-time performance and higher stability, and can be well compatible with online detection of laser processing applications; fourth, the laser detection component is arranged outside the laser emission component and below the laser emission component, so that a real laser state close to that during laser processing can be obtained, so a spot morphology and laser power closer to the real working state can be obtained, thereby improving the accuracy of laser detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0017] Figure 1Shown is a schematic structural diagram of a laser processing system provided by an exemplary embodiment of the present application.

[0018] Figure 2 Shown is a schematic structural diagram of a laser processing system provided by another exemplary embodiment of the present application.

[0019] Figure 3 Shown is a schematic structural diagram of a laser processing system provided by another exemplary embodiment of the present application.

[0020] Figure 4 Shown is a schematic structural diagram of a laser processing system provided by another exemplary embodiment of the present application.

[0021] Reference numerals:

[0022] 100, laser emission component; 110, laser; 120, half-wave plate; 130, galvanometer; 140, beam expander; 150, diffractive optical element; 160, field lens; 200, processing platform; 300, laser detection component; 310, spectroscopic element; 311, polarization beam splitter; 312, beam splitter; 320, power meter; 330, photosensitive element. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0024] Exemplary Devices

[0025] Figure 1 FIG. 1 is a schematic diagram of the structure of a laser processing system provided by an exemplary embodiment of the present application. Figure 2 FIG. 1 is a schematic structural diagram of a laser processing system provided by another exemplary embodiment of the present application. Figure 3 FIG. 1 is a schematic structural diagram of a laser processing system provided by another exemplary embodiment of the present application. Figure 4 FIG. 1 is a schematic diagram of the structure of a laser processing system provided by another exemplary embodiment of the present application. Figure 1 to Figure 4 The portion in the dotted box marked with 100 is the laser emitting assembly 100. Figure 1 to Figure 4 The portion in the dashed box marked with 300 is the laser detection component 300, and the line A connecting multiple components is used to represent the optical path in the laser processing system.

[0026] like Figure 1 to Figure 4As shown, the laser processing system includes: a laser emitting component 100, which is configured to emit a processing light beam downward; a processing platform 200, which is arranged below the laser emitting component 100, and is configured to carry a material to be processed, and receive the processing light beam emitted by the laser emitting component 100, so as to process the material to be processed through the received processing light beam; a laser detection component 300, which is arranged below the laser emitting component 100, and is configured to receive the processing light beam, and detect the power of the processing light beam and the spot shape of the processing light beam; wherein the laser detection component 300 is located on one side of the processing platform 200, and the processing platform 200 and the laser detection component 300 can switchably receive the processing light beam.

[0027] Specifically, the processing beam can be a linearly polarized beam or an adjusted linearly polarized beam, that is, the laser emitting assembly 100 can be used to emit laser light and / or adjust the laser light, and finally obtain a processing beam for processing the material to be processed. The laser emitting assembly 100 adjusts the laser light including but not limited to polarization state adjustment, propagation direction adjustment, energy distribution adjustment, focusing, diameter adjustment, etc. The laser detection assembly 300 can exemplarily include a power meter and / or a charge-coupled device (CCD).

[0028] In actual applications, the laser emitting component 100 can emit a processing light beam to the processing platform 200 to process the material to be processed. When detecting the processing light beam, the detection can be performed once at predetermined intervals, or, the detection can be performed once each time a batch of material to be processed is processed. The detection time can be selected during a short non-processing time in the processing flow (such as material change time) so as not to affect the normal processing flow and ensure processing efficiency. When the laser detection starts, the processing platform 200 can receive the processing light beam and switch to the laser detection component 100 receiving the processing light beam. After the laser detection is completed, the laser detection component 100 can receive the processing light beam and switch to the processing platform 200 receiving the processing light beam.

[0029] In the above embodiments, first, the laser detection component 300 can directly receive the processing light beam and directly detect the power of the processing light beam, can detect the power of the processing light beam more accurately, and reduce the power detection error of the processing light beam; second, since the laser detection component 300 has the function of detecting the power and spot shape of the processing light beam at the same time, it is possible to detect the power and spot shape of the processing light beam at the same time; third, since the laser detection component 300 is arranged on the lower side of the laser emission component 100, and the processing platform 200 and the laser detection component 300 can switch to receive the processing light beam, it is possible to quickly switch to detecting the processing light beam during the laser processing process, and quickly switch back to laser processing after the detection is completed, which has little impact on the production capacity of laser processing, has better real-time performance and higher stability, and can be well compatible with online detection of laser processing applications; fourth, the laser detection component 300 is arranged outside the laser emission component 100 and can be located below the laser emission component 100, so that a real laser state close to the laser processing can be obtained, so a spot morphology and laser power closer to the real working state can be obtained, thereby improving the accuracy of laser detection.

[0030] Compared with the internal splitting of the laser emitting component 100, since the power of the internal splitting beam does not pass through the subsequent optical elements (the transmittance is not 100%), the measured power will be artificially high, resulting in a large difference between the power of the internal splitting beam and the actual laser power during laser processing, resulting in inaccurate laser detection. In addition, during the internal splitting of the laser emitting component 100, if the light spot is shaped, the shaped light spot cannot be obtained without subsequent focusing, so the accuracy of the light spot morphology detection cannot be guaranteed using this method.

[0031] In some embodiments, the laser detection assembly 300 can be moved directly below the laser emitting assembly 100 to receive the processing beam. Figure 1 The laser detection assembly 300 is shown to be located on the lower side of the laser emission assembly 100. Figure 2 It is shown that the laser detection component 300 is located directly below the laser emitting component 100. When laser detection starts, the laser detection component 300 is controlled to move from the lower side of the laser emitting component 100 to directly below the laser emitting component 100. After the laser detection is completed, the laser detection component 300 is controlled to move from directly below the laser emitting component 100 back to the lower side of the laser emitting component 100, thereby realizing rapid switching between laser processing and laser detection.

[0032] In a specific example, the laser detection component 300 is located at the lower left of the laser emission component 100, and can be moved to the right to move the laser detection component 300 directly below the laser emission component 100. With this structure, only the position of the laser detection component 300 can be moved to complete the rapid switching between laser processing and laser detection, so that the effect of laser detection on the laser processing efficiency is small, avoiding the reduction of laser processing capacity due to laser detection.

[0033] In some embodiments, Figure 3 As shown, the laser detection component 300 is tilted and configured to receive the processing light beam vertically. Specifically, when the laser detection is started, the laser emission component 100 is controlled to change the emission direction of the processing light beam, so that the processing light beam changes from incident on the processing platform 200 to vertically incident on the laser detection component 300. After the laser detection is completed, the laser emission component 100 can be controlled to change the emission direction of the processing light beam again, so that the processing light beam changes from vertically incident on the laser detection component 300 to incident on the processing platform 200, thereby realizing rapid switching between laser processing and laser detection.

[0034] Exemplarily, the laser emitting assembly 100 may include a galvanometer 130, which may be used to change the propagation direction of the processing light beam so that the processing light beam can be incident on the laser detection assembly 300 or the processing platform 200. If the beam splitter 310 is a polarization beam splitter 311, and the polarization beam splitter 311 has a cubic structure composed of two triangular prisms, the processing light beam can be incident on the polarization beam splitter 311 perpendicular to the light receiving surface of the cubic structure of the polarization beam splitter 311. If the beam splitter 310 is a beam splitter 312, the processing light beam can be incident on the beam splitter 312 at an angle of 45 degrees to the light receiving surface of the beam splitter 312, thereby ensuring that the spot shape of the second sub-beam after the splitting is consistent with the spot shape of the processing light beam. In addition, if the laser detection component 300 includes a photosensitive element 330 for detecting the spot shape, in order to ensure that the spot shape of the light beam received by the photosensitive element 330 (i.e., the second sub-beam in the following text) is the same as the spot shape of the processing light beam, the photosensitive element 330 needs to receive the second sub-beam vertically, that is, the light receiving surface of the photosensitive element 330 needs to be perpendicular to the incident angle of the second sub-beam.

[0035] Through this structure, the laser processing state and detection state can be quickly switched without changing the position of each optical element in the laser processing system, so that the impact of laser detection on laser processing efficiency is relatively small, avoiding the reduction of laser processing capacity due to laser detection.

[0036] In some embodiments, Figure 1 to Figure 4As shown, the laser detection component 300 includes: a spectroscopic element 310, a power meter 320 and a photosensitive element 330. The spectroscopic element 310 is configured to receive a processing light beam and split the processing light beam into a first sub-beam and a second sub-beam with different propagation directions, wherein the first power of the first sub-beam is greater than the second power of the second sub-beam. The spectroscopic element 310 can be exemplarily a polarization beam splitter 311 or a beam splitter 312; the power meter 320 is located in the propagation direction of the first sub-beam, and is configured to receive and detect the first sub-beam, and determine the power of the processing light beam based on the detection result of the first sub-beam. Here, since the first power of the first sub-beam is greater than the second power of the second sub-beam, that is, most of the light beam in the processing light beam can enter the power meter 320, so that the detection result of the first sub-beam detected by the power meter 320 can be close to the power of the processing light beam. Therefore, when the spectroscopic element 310 splits the light, the first power of the first sub-beam is greater than the second power of the second sub-beam. The greater the proportion of the power to the power of the processing beam, the closer the detection result of the first sub-beam detected by the power meter 320 is to the power of the processing beam; the photosensitive element 330 is located in the propagation direction of the second sub-beam, and the first optical path from the laser emitting component 100 to the photosensitive element 330 is equal to the second optical path from the laser emitting component 100 to the processing platform 200, so as to ensure that the spot shape of the second sub-beam received by the photosensitive element 330 is the same as the spot shape of the processing beam. The photosensitive element 330 is configured to receive and detect the second sub-beam, and determine the spot shape of the processing beam based on the detection result of the second sub-beam. Here, since the spot shape is not affected by the power size, the ratio of the second power of the second sub-beam to the power of the processing beam can be smaller. The photosensitive element 330 can be a CCD for example.

[0037] For example, Figure 2 and Figure 3 As shown, if the processing light beam is emitted by the field lens 160 in the laser emitting assembly 100, the optical path between the field lens 160 and the beam splitter 310 is the first sub-optical path, and the optical path between the beam splitter 310 and the photosensitive element 330 is the second sub-optical path, then the second optical path is equal to the sum of the first sub-optical path and the second sub-optical path. Figure 3 As shown, when the laser detection component 300 is tilted, the processing light beam is emitted obliquely by the galvanometer 160, the first sub-optical path is the movement distance of the tilted processing light beam, the second sub-optical path is the movement distance of the tilted second sub-optical path, and the vertically downward second optical path between the laser emitting component 100 and the processing platform 200 is equal to the sum of the tilted first sub-optical path and the tilted second sub-optical path.

[0038] In the related art, if you want to measure the power and spot shape of the laser, you can only make the laser enter the power detection device and the spot shape detection device in sequence, and measure the power and spot shape of the laser in sequence. The detection speed is slow, which affects the efficiency of laser processing. In the embodiment of the present application, through this structure, the processing beam can be divided into two sub-beams, and the power meter 320 and the photosensitive element 330 are used to simultaneously measure the power and spot shape of the processing beam, which greatly improves the detection efficiency. Moreover, in another traditional technology for detecting laser power, the laser is divided into two sub-beams of higher power and lower power. The sub-beam of higher power continues to be used for laser processing, and the sub-beam of lower power is transmitted to a power detection device, and the power of the complete laser is calculated from the power of the sub-beam of lower power. Due to the errors existing in each optical element (such as a spectrometer, a laser, a power detection device, etc.), the power of the complete laser calculated in this way has a large error. In the embodiment of the present application, since the first power of the first sub-beam is relatively large and very close to the power of the processing beam, the power of the first sub-beam of higher power is directly used as the power of the processing beam. No calculation is required, and the power of the processing beam can be directly measured, making the detection result more accurate.

[0039] In some embodiments, the power ratio of the first sub-beam to the processing beam is greater than or equal to 90%, and the power ratio of the second sub-beam to the processing beam is less than or equal to 10%. By making the power ratio of the first sub-beam to the processing beam greater than or equal to 90%, the first power detected by the power meter 320 can be very close to the actual power of the processing beam, thereby improving the stability and accuracy of laser power detection. By making the power ratio of the second sub-beam to the processing beam less than or equal to 10%, the laser can be output at high power in the working state, thereby ensuring the reliability of the spot morphology detection and preventing the second sub-beam from damaging the photosensitive element 330 due to excessive power.

[0040] In some embodiments, the propagation direction of the first sub-beam is the same as the propagation direction of the processing beam, and the propagation direction of the second sub-beam is perpendicular to the propagation direction of the processing beam; or, the propagation direction of the second sub-beam is the same as the propagation direction of the processing beam, and the propagation direction of the first sub-beam is perpendicular to the propagation direction of the processing beam. In this way, it is convenient to adjust the position and posture of each component in the laser detection component 300. For example, in order to ensure that the spot shape of the second sub-beam received by the photosensitive element 330 is the same as the spot shape of the processing beam irradiated on the material to be processed, the second sub-beam needs to be perpendicular to the light-receiving surface of the photosensitive element 330. For example, if the beam splitting element 310 is a polarization beam splitter 311, the polarization beam splitter 311 usually requires the incident direction of the light beam to be perpendicular to the light-receiving surface of the cube structure. Therefore, by making the propagation direction of the sub-beam the same as or perpendicular to the propagation direction of the processing beam, it is more convenient to design and adjust the laser detection component 300.

[0041] Exemplarily, the processing beam enters the beam splitter 310 along a first direction, the second sub-beam enters the photosensitive element 330 along the first direction, and the first sub-beam enters the power meter 320 along a second direction, and the second direction is perpendicular to the first direction.

[0042] Exemplarily, the processing beam enters the beam splitter 310 along a first direction, the first sub-beam enters the power meter 320 along the first direction, and the second sub-beam enters the photosensitive element 330 along a second direction, which is perpendicular to the first direction.

[0043] In some embodiments, Figure 1 to Figure 4 As shown, the spectroscopic element 310 includes: a polarization beam splitter 311, which is configured to receive a processing beam and split the processing beam into a first sub-beam and a second sub-beam with propagation directions orthogonal to each other, wherein a first power of the first sub-beam and a second power of the second sub-beam can be adjusted based on the polarization state of the processing beam (i.e., a power ratio between the first sub-beam and the second sub-beam is determined by the polarization state of the processing beam), and the processing beam is a linearly polarized beam with an adjusted polarization state, or the processing beam is obtained after adjustment based on the linearly polarized beam with an adjusted polarization state; or, the spectroscopic element 310 includes: a beam splitter 312, which is configured to receive the processing beam and split the processing beam into a first sub-beam and a second sub-beam with different propagation directions.

[0044] Specifically, if the polarization beam splitter 311 is used, the polarization direction of the linearly polarized beam is adjusted, that is, the polarization direction of the processing beam obtained subsequently is changed, and the angle between the polarization direction of the processing beam and the light receiving surface of the cube structure of the polarization beam splitter 311 determines the power ratio of the first sub-beam and the second sub-beam split by the polarization beam splitter 311. Therefore, through this structure, the first power of the first sub-beam and the second power of the second sub-beam can be adjusted dynamically in real time, thereby improving the laser detection effect. If the beam splitter 312 is used, the processing beam can be split into the first sub-beam and the second sub-beam according to a fixed ratio.

[0045] In some embodiments, the laser emission assembly 100 includes: a half-wave plate 120, the half-wave plate 120 can rotate around its axis, and the linearly polarized light beam of the laser emission assembly 100 forms an angle with the fast axis of the half-wave plate 120, and the angle is configured to adjust the polarization direction of the linearly polarized light beam. Specifically, the half-wave plate can be mounted on a wave plate mounting frame, and the half-wave plate and the wave plate mounting frame can be rotatably connected, so that the half-wave plate can be rotated, and the polarization direction of the linearly polarized light beam can be changed by changing the angle between the polarization direction of the linearly polarized light beam and the fast axis (or slow axis) of the half-wave plate, so that the first power of the first sub-beam and the second power of the second sub-beam can be accurately adjusted.

[0046] In some embodiments, the beam splitter 312 includes: at least one layer of dielectric spectroscopic film, configured to reflect a portion of the processing light beam and to allow another portion of the processing light beam to pass through, so that the processing light beam is split into a first sub-beam and a second sub-beam with different propagation directions; a substrate, having a light receiving surface and a light emitting surface, at least one layer of dielectric spectroscopic film located on one side of the light receiving surface of the beam splitter, the substrate configured to allow the first sub-beam or the second sub-beam to pass through; at least one layer of anti-reflection film, disposed on one side of the light emitting surface of the beam splitter, configured to increase the transmittance of the first sub-beam or the second sub-beam. By setting the beam splitter 312, the processing light beam can be split into the first sub-beam and the second sub-beam according to a fixed power ratio. When producing the beam splitter 312, the power ratio of the first sub-beam and the second sub-beam split by the beam splitter 312 can be changed by setting dielectric spectroscopic films of different thicknesses and different numbers of dielectric spectroscopic films.

[0047] In some embodiments, Figure 1 to Figure 4 As shown, the laser emitting assembly 100 includes: a laser 110, which is configured to emit a linearly polarized light beam; a beam expander 140, which is configured to receive a linearly polarized light beam with an adjusted polarization state (in the case where a half-wave plate 120 is provided between the laser 110 and the beam expander 140, the linearly polarized light beam is adjusted by the half-wave plate 120 to be a linearly polarized light beam with an adjusted polarization state; in the case where there is no half-wave plate 120 between the laser 110 and the beam expander 140, the beam expander 140 can directly receive the linearly polarized light beam), and adjust the beam diameter of the linearly polarized light beam to obtain and emit a linear polarized light beam with an adjusted beam diameter. Polarized light beam; the diffractive optical element 150 is configured to receive the linearly polarized light beam with adjusted beam diameter, and adjust the energy distribution of the linearly polarized light beam to achieve the light spot shaping effect, and obtain and emit the linearly polarized light beam with adjusted energy distribution; the galvanometer 130 is configured to receive the linearly polarized light beam with adjusted energy distribution, and change the propagation direction of the linearly polarized light beam, and obtain and emit the linearly polarized light beam with adjusted propagation direction; the field lens 160 is configured to receive and focus the linearly polarized light beam with adjusted propagation direction, and obtain and emit the processing light beam to the processing platform 200 or the laser detection component 300. Through this structure, the processing light beam finally generated can form a flat-top light spot on the working platform 200, and the flat-top light spot has a relatively uniform internal light power density distribution and a relatively sharp light spot edge, so as to achieve a better processing effect.

[0048] In a specific example, if Figure 1As shown, the laser processing system includes: a laser 110, a half-wave plate 120, a beam expander 140, a diffractive optical element 150, a galvanometer 130, a field lens 160, a processing platform 200, a polarization beam splitter 311, a power meter 320, and a photosensitive element 330. The linearly polarized light beam is emitted by the laser 110, and is adjusted by the half-wave plate 120, the beam expander 140, the diffractive optical element 150, the galvanometer 130, and the field lens 160 in sequence to obtain a processing light beam, which enters the processing platform 200, or enters the polarization beam splitter 311. The processing light beam entering the polarization beam splitter 311 is split into a first sub-beam and a second sub-beam. The first sub-beam enters the power meter 320 to detect the power, and the second sub-beam enters the photosensitive element 330 to detect the light spot shape.

[0049] In another specific example, Figure 4 As shown, the laser processing system includes: a laser 110, a beam expander 140, a diffractive optical element 150, a galvanometer 130, a field lens 160, a processing platform 200, a beam splitter 312, a power meter 320, and a photosensitive element 330. The linearly polarized light beam is emitted by the laser 110, and is adjusted by the beam expander 140, the diffractive optical element 150, the galvanometer 130, and the field lens 160 in sequence to obtain a processing light beam, which enters the processing platform 200, or enters the beam splitter 312. The processing light beam entering the beam splitter 312 is split into a first sub-beam and a second sub-beam. The first sub-beam enters the power meter 320 to detect the power, and the second sub-beam enters the photosensitive element 330 to detect the light spot shape.

[0050] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0051] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.

[0052] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0053] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0054] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A laser processing system, characterized in that: include: A laser emitting assembly configured to emit a processing beam downward; A processing platform is disposed below the laser emitting assembly and is configured to carry a material to be processed and receive the processing light beam emitted by the laser emitting assembly so as to process the material to be processed by the received processing light beam; A laser detection component is disposed below the laser emission component and is configured to receive the processing light beam and detect the power of the processing light beam and the spot shape of the processing light beam; Wherein, the laser detection component is located on one side of the processing platform, and the processing platform and the laser detection component can switchably receive the processing light beam.

2. The laser processing system according to claim 1, characterized in that: The laser detection assembly can be moved to be directly below the laser emitting assembly to receive the processing light beam.

3. The laser processing system according to claim 1, characterized in that: The laser detection assembly is tilted and configured to vertically receive the processing light beam.

4. The laser processing system according to claim 1, characterized in that: The laser detection assembly comprises: A beam splitting element is configured to receive the processing beam and split the processing beam into a first sub-beam and a second sub-beam with different propagation directions, wherein a first power of the first sub-beam is greater than a second power of the second sub-beam; a power meter, located in a propagation direction of the first sub-beam, configured to receive and detect the first sub-beam, and determine the power of the processing beam based on a detection result of the first sub-beam; A photosensitive element is located in the propagation direction of the second sub-beam, and a first optical path between the laser emitting component and the photosensitive element is equal to a second optical path between the laser emitting component and the processing platform. The photosensitive element is configured to receive and detect the second sub-beam, and determine the spot shape of the processing beam based on the detection result of the second sub-beam.

5. The laser processing system according to claim 4, characterized in that: The light splitting element comprises: a polarization beam splitter configured to receive the processing beam and split the processing beam into a first sub-beam and a second sub-beam with orthogonal propagation directions, wherein a first power of the first sub-beam and a second power of the second sub-beam can be adjusted based on the polarization state of the processing beam, and the processing beam is a linearly polarized beam with an adjusted polarization state, or the processing beam is obtained by adjusting the linearly polarized beam with an adjusted polarization state; Alternatively, the light splitting element comprises: The beam splitter is configured to receive the processing beam and split the processing beam into a first sub-beam and a second sub-beam with different propagation directions.

6. The laser processing system according to claim 5, characterized in that: The laser emission assembly comprises: A half-wave plate, wherein the half-wave plate can rotate around its axis, and the linearly polarized light beam of the laser emitting assembly forms an angle with the fast axis of the half-wave plate, and the angle is configured to adjust the polarization direction of the linearly polarized light beam.

7. The laser processing system according to claim 5, characterized in that: The beam splitter comprises: at least one dielectric beam splitter film, configured to reflect a portion of the processing light beam and transmit another portion of the processing light beam, so as to split the processing light beam into a first sub-beam and a second sub-beam with different propagation directions; A substrate having a light receiving surface and a light emitting surface, at least one layer of the dielectric beam splitting film is located on one side of the light receiving surface of the beam splitter, and the substrate is configured to allow the first sub-beam or the second sub-beam to pass through; At least one anti-reflection film is disposed on one side of the light emitting surface of the beam splitter and is configured to increase the transmittance of the first sub-beam or the second sub-beam.

8. The laser processing system according to claim 4, characterized in that: A power ratio of the first sub-beam to the processing beam is greater than or equal to 90%, and a power ratio of the second sub-beam to the processing beam is less than or equal to 10%.

9. The laser processing system according to claim 4, characterized in that: The propagation direction of the first sub-beam is the same as the propagation direction of the processing beam, and the propagation direction of the second sub-beam is perpendicular to the propagation direction of the processing beam; or, The propagation direction of the second sub-beam is the same as the propagation direction of the processing beam, and the propagation direction of the first sub-beam is perpendicular to the propagation direction of the processing beam.

10. The laser processing system according to claim 1, characterized in that: The laser emission assembly comprises: a laser configured to emit a linearly polarized light beam; A beam expander, configured to receive the linearly polarized light beam with adjusted polarization state, and adjust the beam diameter of the linearly polarized light beam, to obtain and emit the linearly polarized light beam with adjusted beam diameter; A diffractive optical element is configured to receive the linearly polarized light beam with adjusted beam diameter, adjust the energy distribution of the linearly polarized light beam, obtain and emit the linearly polarized light beam with adjusted energy distribution; A galvanometer, configured to receive the linearly polarized light beam with adjusted energy distribution, and change the propagation direction of the linearly polarized light beam, to obtain and emit the linearly polarized light beam with adjusted propagation direction; The field lens is configured to receive and focus the linearly polarized light beam with adjusted propagation direction, obtain and emit the processing light beam to the processing platform or the laser detection component.

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