Plastic package jig for button-type chip

Abstract

The utility model discloses a plastic package jig for a button-type chip, and relates to the technical field of plastic package jigs, and the plastic package jig specifically comprises a lower die which is provided with a plurality of placing holes at intervals and is also provided with a plurality of glue channels; the upper die is placed on the lower die, a plurality of matching holes are formed in the positions, corresponding to the placing holes, of the upper die, and a through hole is formed in the middle of the upper die; the impermeable layer is laid on the upper mold, and avoiding holes are formed in the positions, corresponding to the through holes, of the impermeable layer; and the at least two handles are respectively arranged on two sides of the lower die. According to the utility model, the technical problem that plastic package materials are accumulated on a test surface during plastic package of an existing chip is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of plastic packaging jigs, in particular to a plastic packaging jig for button-type chips. Background Art

[0002] Chip encapsulation refers to the process of encapsulating and protecting the semi-finished products after bonding with plastic encapsulation resin under certain pressure and temperature conditions. Specifically, the semi-finished products to be encapsulated are placed into a jig, and the jig is placed on a plastic encapsulation machine. With the cooperation of the jig, the chip encapsulation operation is realized.

[0003] When the conventional chip is plastic-sealed, the plastic-sealing material will overflow from the upper layer and then cover the test surface of the chip, thus affecting the subsequent test work of the chip. Utility Model Content

[0004] The utility model aims to provide a plastic sealing fixture for button-type chips, which solves the technical problem of the prior art that plastic sealing materials are accumulated on the test surface when the chip is plastic sealed.

[0005] The embodiment of the present application discloses a plastic packaging fixture for a button-type chip, comprising:

[0006] A lower mold, wherein a plurality of placement holes are provided at intervals on the lower mold, and a plurality of glue paths are provided on the lower mold;

[0007] An upper mold is placed on the lower mold, and a plurality of matching holes are opened in the upper mold corresponding to the placement holes, and a through hole is opened in the middle of the upper mold;

[0008] An anti-seepage layer is laid on the upper mold, and an avoidance hole is provided at a position of the anti-seepage layer corresponding to the through hole;

[0009] At least two handles are respectively installed on both sides of the lower mold.

[0010] The present application provides an anti-seepage layer on the upper mold, which can prevent the plastic package from leaking out and accumulating on the surface of the test surface, thereby ensuring the quality of the chip.

[0011] Based on the above technical solution, the embodiment of the present application can also be improved as follows:

[0012] Furthermore, the placement hole is a stepped shape. The beneficial effect of adopting this step is that the stepped shape can ensure the stability of the chip product during plastic packaging.

[0013] Furthermore, the anti-seepage layer is a non-woven fabric. The beneficial effect of adopting this step is that it can better prevent materials from accumulating on the test surface.

[0014] Furthermore, the glue path includes:

[0015] The main glue path is circular and is arranged in the middle of the lower mold, and the main glue path cooperates with the through hole.

[0016] The plurality of auxiliary glue channels are connected to the main glue channel. The beneficial effect of adopting this step is that the main glue channel and the auxiliary glue channel cooperate with each other to better achieve plastic sealing.

[0017] Furthermore, the placement holes are arranged in multiple rows, and every two rows of the placement holes form a group, and at least one auxiliary glue path is arranged between any two adjacent groups of the placement holes. The beneficial effect of adopting this step is to ensure the plastic sealing effect through the arrangement of specific positions.

[0018] Furthermore, a matching glue channel is provided at a position corresponding to the upper mold and the auxiliary glue channel. The beneficial effect of adopting this step is to ensure the plastic sealing effect.

[0019] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0020] 1. The present application provides an anti-seepage layer on the upper mold surface, which can prevent the plastic packaging material from accumulating on the test surface of the chip and effectively ensure the quality.

[0021] 2. The position of the glue path is designed in this application to effectively ensure the plastic sealing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 This is a schematic diagram of the lower mold structure of a plastic packaging fixture for button-type chips according to a specific embodiment of the utility model;

[0024] Figure 2 This is a schematic diagram of the upper mold structure of a plastic packaging fixture for button-type chips according to a specific embodiment of the utility model;

[0025] Figure 3 This is a schematic diagram of the anti-seepage layer structure of a plastic sealing fixture for a button-type chip according to a specific embodiment of the utility model;

[0026] Figure 4 This is a front view of a plastic packaging fixture for button-type chips according to a specific embodiment of the utility model;

[0027] 1-lower mold; 2-upper mold; 3-anti-seepage layer; 4-handle;

[0028] 101- placement hole; 102- glue channel; 103- matching hole; 104- main glue channel; 105- auxiliary glue channel;

[0029] 201-through hole; 202-matching rubber channel;

[0030] 301-Avoidance hole. DETAILED DESCRIPTION

[0031] The following embodiments of the technical solution of the utility model are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the utility model, and are therefore only used as examples, and cannot be used to limit the protection scope of the utility model.

[0032] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which the utility model belongs.

[0033] In this application, unless otherwise clearly specified and limited, the terms "installation", "connection", "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0034] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0035] Example:

[0036] like Figure 1-4 As shown, the present application discloses a plastic encapsulation jig for button-type chips, which is used to complete the plastic encapsulation of the chip. Compared with the existing jigs, it can prevent the plastic encapsulation material from accumulating on the test surface of the material, thereby facilitating the subsequent testing and processing of the material.

[0037] The specific structure of this application includes:

[0038] A lower mold 1, wherein a plurality of placement holes 101 are provided at intervals on the lower mold 1, and a plurality of glue paths 102 are provided on the lower mold 1. When in use, the corresponding material is placed on the lower mold 1 to facilitate subsequent plastic sealing processing;

[0039] The upper mold 2 is placed on the lower mold 1, and a plurality of matching holes 103 are opened in the upper mold 2 corresponding to the placement hole 101. A through hole 201 is opened in the middle of the upper mold 2. Similarly, the upper mold 2 and the lower mold 1 cooperate with each other to complete the material positioning, so as to facilitate the subsequent plastic sealing;

[0040] The anti-seepage layer 3 is laid on the upper mold 2, and the anti-seepage layer 3 is provided with an avoidance hole 301 at a position corresponding to the through hole 201. The avoidance hole 301 is to avoid affecting the flow of the plastic packaging material. At the same time, after laying, when the excess material is exposed, it can be adsorbed on the anti-seepage layer, so as to avoid the plastic packaging material from accumulating on the test surface and affecting the subsequent detection work;

[0041] At least two handles 4 are respectively installed on both sides of the lower mold 1, that is, the handles 4 arranged at intervals are convenient for workers to carry, which is beneficial to subsequent further work.

[0042] In order to ensure that the corresponding chip material can be stably placed in the lower mold 1, the placement hole 101 is designed. The placement hole 101 is stepped, so that the chip material can be better supported.

[0043] In order to better prevent the detection surface of the chip from accumulating the plastic packaging material, specific restrictions are imposed on the material of the anti-seepage layer 3, and the anti-seepage layer 3 is a non-woven fabric.

[0044] Further explanation of the glue path of this application is provided as follows: Figure 1 As shown, the glue channel 102 includes:

[0045] The main glue channel 104 is circular and is disposed in the middle of the lower mold 1 , and the main glue channel 104 matches the through hole 201 .

[0046] The plurality of auxiliary glue channels 105 are connected to the main glue channel 104 , and the plastic sealing effect can be ensured by the plurality of auxiliary glue channels 105 .

[0047] In order to further ensure the effect of plastic sealing, the positions of the placement holes 101 and the glue paths 102 are further limited. The placement holes 101 are arranged in multiple rows, and every two rows of the placement holes 101 form a group. At least one auxiliary glue path 105 is arranged between any two adjacent groups of the placement holes 101, so as to ensure that the plastic sealing material can enter the placement holes 101 well.

[0048] Wherein, a matching glue channel 202 is provided at a position of the upper mold 2 corresponding to the auxiliary glue channel 105 .

[0049] The present application mainly utilizes laying an impermeable layer 3 on the surface of the upper mold 2, and utilizing non-woven fabric to absorb excess plastic packaging material, thereby preventing plastic packaging material from accumulating on the test surface of the chip, and can further improve product quality.

[0050] In the specification of the present utility model, a lot of specific details are described. However, it is understood that the embodiments of the present utility model can be practiced without these specific details. In some examples, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this specification.

[0051] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model, and they should all be included in the scope of the claims and specification of the utility model.

Claims

1. A plastic packaging fixture for button-type chips, characterized in that: include: A lower mold, wherein a plurality of placement holes are provided at intervals on the lower mold, and a plurality of glue paths are provided on the lower mold; An upper mold is placed on the lower mold, and a plurality of matching holes are opened in the upper mold corresponding to the placement holes, and a through hole is opened in the middle of the upper mold; An anti-seepage layer is laid on the upper mold, and an avoidance hole is provided at a position of the anti-seepage layer corresponding to the through hole; At least two handles are respectively installed on both sides of the lower mold.

2. The plastic sealing jig according to claim 1, characterized in that: The placement hole is stepped.

3. The plastic sealing jig according to claim 2, characterized in that: The anti-seepage layer is non-woven fabric.

4. The plastic sealing jig according to claim 1, characterized in that: The glue path comprises: A main glue path, which is circular and disposed in the middle of the lower mold, and which cooperates with the through hole; A plurality of auxiliary glue channels are connected to the main glue channel.

5. The plastic packaging jig according to claim 4, characterized in that: The placement holes are arranged in a plurality of rows, and every two rows of the placement holes form a group. At least one auxiliary glue channel is arranged between any two adjacent groups of the placement holes.

6. The plastic packaging jig according to claim 5, characterized in that: A matching glue channel is arranged at a position corresponding to the upper mold and the auxiliary glue channel.

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