Modular thermal printing device

Abstract

The utility model relates to the technical field of thermal head manufacturing, in particular to a modularized thermal printing device, which is characterized in that a heating resistor body, an electrode lead, an insulating substrate and a control IC (integrated circuit) are respectively arranged on a heating working module, a connecting module and an IC control module; the heating working module, the connecting module and the IC control module are spliced on the bottom plate through glue or screws, an insulating substrate, a heating resistor body and a first part electrode wire are arranged in the heating working module, and an insulating substrate, a control IC and a second part electrode wire are arranged in the IC control module. The connecting module is provided with a metal wire used for achieving electrical connection of the first part electrode wire and the second part electrode wire and a supporting protection layer used for supporting the metal wire, and the metal wire is arranged on the lower side of the supporting protection layer. The two ends of the metal wire on the connecting module are connected with the first part electrode wire and the second part electrode wire respectively.

Description

Technical field:

[0001] The utility model relates to the technical field of thermal head manufacturing, in particular to a modular thermal printing device which has a reasonable structure, is easy to assemble and disassemble, can significantly improve subsequent maintenance efficiency, and reduce energy consumption. Background technology:

[0002] The thermal print head mainly includes components such as a heating element, an electrode wire, and a control IC. The heating element is composed of two or more heating resistors arranged in a straight line, and the electrode wire is used to achieve electrical connection of the heating element. In existing thermal print heads, the above components are all arranged on a ceramic substrate, and the relevant electrical components are encapsulated and solidified by a protective layer to achieve the purpose of protecting the electrical components. At the same time, the control IC device is welded and fixed to the pad end of the electrode wire, and the connection between the electrode wire and the control IC device is further covered with a protective layer. Under this structure, when an individual heating resistor is damaged, the heating element fixed on the ceramic substrate and the control IC device are replaced as a whole, resulting in a huge waste of materials and increasing after-sales maintenance costs.

[0003] Currently, regarding the splicing of thermal printing equipment, most consideration is the cascade splicing of multiple traditional thermal printing units as described above. For example, the patent with announcement number CN201471856U discloses a method of splicing multiple thermal print heads, the purpose of which is to increase the effective printing length. However, it still cannot solve the problem of separate replacement of the heating element and the IC control unit. Summary of the invention:

[0004] In view of the shortcomings and deficiencies in the prior art, the utility model proposes a modular thermal printing device which has a reasonable structure, is easy to assemble and disassemble, can significantly improve the efficiency of subsequent maintenance, and reduces energy consumption.

[0005] The utility model is achieved through the following measures:

[0006] A modular thermal printing device comprises a heating resistor, an electrode wire, an insulating substrate, and a control IC. The heating resistor is connected to the control IC via the electrode wire. The heating resistor is arranged on the surface of the insulating substrate. The electrode wire includes a comb-shaped common electrode and a comb-shaped individual electrode. The heating resistor is arranged between the comb-shaped common electrode and the comb-shaped individual electrode. The device is characterized in that the heating resistor, electrode wire, insulating substrate, and control IC are respectively arranged on a heating working module, a connecting module, and an IC control module. The heating working module, connecting module, and IC control module are assembled on a base plate by gluing or screws. The heating working module is provided with an insulating substrate, a heating resistor, and a first portion of electrode wires. The IC control module is provided with an insulating substrate, a control IC, and a second portion of electrode wires. The connecting module is provided with a metal wire for electrically connecting the first portion of electrode wires to the second portion of electrode wires, and a supporting protective layer for supporting the metal wires. The metal wire is arranged below the supporting protective layer. The connecting module is arranged above the junction of the heating working module and the IC control module. The two ends of the metal wire on the connecting module are respectively connected to the first portion of electrode wires and the second portion of electrode wires.

[0007] In the heating working module of the present invention, a base glaze layer is provided on the surface of the insulating substrate, and the heating resistor and the first part of the electrode wire are arranged on the base glaze layer. The first part of the electrode wire includes a comb-shaped common electrode, a comb-shaped individual electrode, a partial individual electrode and a welding pad. After the partial individual electrode is connected to the comb-shaped individual electrode, it extends to the upper surface of the insulating substrate of the heating working module near the IC control module and is connected to the welding pad. The welding pad is used to be connected to one end of the metal wire in the connection module.

[0008] The insulating substrate of the IC control module of the utility model is provided with a second part of the electrode wire in the area close to the heating working module, and the front end of the second part of the electrode wire is provided with a welding pad for connecting to the other end of the metal wire on the connection module. The other end of the second part of the electrode wire is connected to the control IC. Furthermore, the COM electrode can also be set on the IC control module.

[0009] Both ends of the metal wire in the connecting module of the present invention are respectively provided with free ends that can hang down, which are used to connect with the welding pads in the heating working module and the IC control module respectively; further, in order to ensure that the metal wire in the connecting module is not corroded by external water vapor, a sealing protrusion is provided at the edge of the lower surface of the supporting protective layer, so that when the connecting module is spliced ​​with the heating working module and the IC control module above the two, the gap at the joint is closed; further, the lower side of the supporting protective layer is also provided with a plug-in buckle for buckling with the bottom plate or the heat dissipation plate, and the bottom plate or the heat dissipation plate is correspondingly provided with a plug-in groove.

[0010] The utility model takes into account that the insulating substrates in the heating working module and the IC control module are ceramic substrates with a brittle and hard texture and a functional glaze layer on the surface. In order to avoid damaging the surface components of the insulating substrate, metal heat dissipation plates are respectively provided in the heating working module and the IC control module. The insulating substrate and the metal heat dissipation plates are fixed by gluing, and screw holes are provided on the metal heat dissipation plates that can be detachably connected to the base plate.

[0011] A solder resist protective layer is provided above the joints between the connection module, the heating working module and the IC control module in the utility model to protect the internal electrical circuit.

[0012] In the utility model, the surface of the bottom glaze layer of the heating working module is provided with comb-shaped individual electrodes and comb-shaped common electrodes, and the comb-shaped individual electrodes and the comb-shaped common electrodes form a comb-shaped electrode pair, and the heating resistor is arranged in the middle of the comb-shaped electrode pair along the main printing direction; one end of the comb-shaped common electrode is connected to the heating resistor, and the other end is connected to the COM electrode; one end of the comb-shaped individual electrode is connected to the heating resistor, and the other end is provided with a connecting pad, which is connected to the metal electrode on the connecting module; the surface of the heating resistor and the comb-shaped common electrode and part of the surface of the comb-shaped individual electrode are provided with a wear-resistant protective layer; the local area above the second part of the electrode wire in the IC control module is also provided with a wear-resistant protective layer.

[0013] The thermal print head provided by the utility model has the beneficial effect of being modularized, and each module of the thermal print head can be replaced individually after being damaged, thereby improving material utilization and saving costs. Description of the drawings:

[0014] Attachment Figure 1 It is a structural diagram of the present utility model.

[0015] Figure 2 It is a schematic diagram of the cross-sectional structure of the heating working module in the present utility model.

[0016] Figure 3 This is a schematic diagram of the cross-sectional structure of the IC control module in this utility model.

[0017] Figure 4 This is a schematic diagram of the cross-sectional structure of the connection module in the present utility model.

[0018] Figure 5 This is a schematic diagram of the planar structure of the connection module in the present utility model.

[0019] Figure 6 This is a schematic diagram of the side structure of the connection module in the present utility model.

[0020] Figure 7 This is a schematic diagram of the connection structure of each module in the present utility model.

[0021] Figure markings: base plate 1, heating working module 2, heating working area heat sink 2-1, heating working area insulating substrate 2-2, heating working area bottom glaze layer 2-3, comb-shaped common electrode 2-4a, comb-shaped individual electrode 2-4b, connecting pad 2-4c, heating resistor 2-5, IC control module 3, IC control area heat sink 3-1, IC control area insulating substrate 3-2, IC control area bottom glaze layer 3-3, second part electrode wire 3-3a, COM electrode 3-3b, IC controller 3-4, packaging glue protective layer 3-5, connecting module 4, supporting protective layer 4-1, metal electrode 4-2, sealing layer 4-3, fixing buckle 4-4, solder resist protective layer 5, wear-resistant protective layer 6. Specific implementation method:

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] Example

[0024] This embodiment provides a modular thermal print head, including a supporting base plate 1, on which a heating working module 2, an IC control module 3 and a connecting module 4 are provided; the heating working module 2 and the IC control module 3 are fixed to the supporting base plate 1 by a detachable connection method such as a screw; the connecting module 4 realizes the electrical connection between the heating working module 2 and the IC control module 3 through a metal electrode 4-1, and the connecting module 4 is fixed to the supporting base plate 1 by a detachable connection method such as a snap.

[0025] The supporting base plate 1 may be a metal heat dissipation plate;

[0026] As attached Figure 4 、 5 6, the connection module 4 comprises an insulating support protective layer 4-1, a metal electrode 4-2, a sealing layer 4-3 and a fixing buckle 4-4, one end of the metal electrode 4-2 is connected to the connection pad 2-4c on the heating working module 2, and the other end is connected to the individual electrode (second part of the electrode wire) 3-3a on the IC control module 3; the insulating support protective layer 4-1 of the connection module 4 is further provided with a sealing layer 4-3 around the side of the metal electrode; the connection module 4 is fixed to the supporting base plate 1 by the buckle 4-4; a solder resist protective layer 5 is provided at the connection between the connection module 4 and the heating working module 2 and the IC control module 3;

[0027] This example is attached Figure 2As shown, the heating working module 2 includes a heating working area heat sink 2-1, a heating working area insulating substrate 2-2 is provided on the heating working area heat sink 2-1, and a heating working area bottom glaze layer 2-3 is provided on the surface of the heating working area insulating substrate 2-2; comb-shaped individual electrodes 2-4b and comb-shaped common electrodes 2-4a are provided on the surface of the heating working area bottom glaze layer 2-3, the comb-shaped individual electrodes 2-4b and the comb-shaped common electrodes 2-4a form a comb-shaped electrode pair, and the heating resistor 2-5 is arranged along the main printing direction. Located in the middle of the comb-shaped electrode pair; one end of the comb-shaped common electrode 2-4a is connected to the heating resistor 2-5, and the other end is connected to the COM electrode; one end of the comb-shaped individual electrode 2-4b is connected to the heating resistor 2-5, and the other end is connected to the connecting pad 2-4c; the connecting pad 2-4c is connected to one end of the metal electrode 4-2 on the connecting module 4; the surfaces of the heating resistor 2-5 and the comb-shaped common electrode 2-4a and part of the surface of the comb-shaped individual electrode 2-4b are provided with a wear-resistant protective layer 6;

[0028] This example is attached Figure 3 As shown, the IC control module 3 includes an IC control area heat sink 3-1, an IC control area insulating substrate 3-2 is arranged on the IC control area heat sink 3-1, and the surface of the IC control area insulating substrate 3-2 is partially or fully configured with an IC control area bottom glaze layer 3-3; the surface of the IC control area bottom glaze layer 3-3 is configured with individual electrodes (second part electrode wires) 3-3a and COM electrodes 3-3b; one end of the individual electrode 3-3a is connected to one end of the metal electrode 4-2 on the connection module 4, and the surface of this part of the electrode is provided with a wear-resistant protective layer 6; the COM electrode 3-3b is provided with an IC controller 3-4, and a protective packaging glue 3-5 is provided on the surface of the IC controller 3-4 and the surrounding part of the wear-resistant protective layer 6.

[0029] When working, the heating working module 2 and the IC control module 3 in the thermal printing device are electrically connected via the connecting module 4, and the three parts are detachably assembled on the base plate 1, so that the setting areas of the three parts can be adjusted within a certain range according to customer needs, and if any module fails, the fault can be solved by replacing the corresponding module, avoiding the high repair and maintenance costs brought by traditional whole-machine replacement.

[0030] Compared with the prior art, the utility model has the remarkable advantages of reasonable structure, simple operation, ability to replace each module separately, improved material utilization, cost saving, etc.

Claims

1. A modular thermal printing device, comprising a heating resistor, an electrode wire, an insulating substrate, and a control IC, wherein the heating resistor is connected to the control IC via the electrode wire, the heating resistor is arranged on the surface of the insulating substrate, the electrode wire comprises a comb-shaped common electrode and a comb-shaped individual electrode, and the heating resistor is arranged between the comb-shaped common electrode and the comb-shaped individual electrode, characterized in that: The heating resistor, electrode wire, insulating substrate and control IC are respectively arranged on the heating working module, the connecting module and the IC control module. The heating working module, the connecting module and the IC control module are assembled on the bottom plate by gluing or screws. The heating working module is provided with an insulating substrate, a heating resistor and a first part of the electrode wire. The IC control module is provided with an insulating substrate, a control IC and a second part of the electrode wire. The connecting module is provided with a metal wire for realizing the electrical connection between the first part of the electrode wire and the second part of the electrode wire, and a supporting protective layer for supporting the metal wire. The metal wire is arranged on the lower side of the supporting protective layer. The connecting module is arranged on the upper side of the joint between the heating working module and the IC control module. The two ends of the metal wire on the connecting module are respectively connected to the first part of the electrode wire and the second part of the electrode wire.

2. A modular thermal printing device according to claim 1, characterized in that: A base glaze layer is provided on the surface of the insulating substrate in the heating working module, and the heating resistor and the first part of the electrode wires are arranged on the base glaze layer. The first part of the electrode wires include a comb-shaped common electrode, a comb-shaped individual electrode, a part of the individual electrodes and a welding pad. After the part of the individual electrodes are connected to the comb-shaped individual electrodes, they extend to the upper surface of the insulating substrate of the heating working module near the IC control module and are connected to the welding pad. The welding pad is used to connect to one end of the metal wire in the connection module.

3. A modular thermal printing device according to claim 2, characterized in that: A second portion of electrode wires is provided in an area of ​​the insulating substrate of the IC control module close to the heating working module, and a welding pad for connecting to the other end of the metal wire on the connecting module is provided at the front end of the second portion of the electrode wires, and the other end of the second portion of the electrode wires is connected to the control IC.

4. A modular thermal printing device according to claim 3, characterized in that: Both ends of the metal wire in the connection module are respectively provided with free ends that can hang down, which are used to be connected to the welding pads in the heating working module and the IC control module respectively.

5. A modular thermal printing device according to claim 1, characterized in that: A sealing protrusion is provided at the edge of the lower surface of the supporting protective layer, so that when the connecting module is spliced ​​with the heating working module and the IC control module along the upper part of the two, the gap at the joint is closed.

6. A modular thermal printing device according to claim 1, characterized in that: A metal heat sink is provided in the heating working module and the IC control module respectively. The insulating substrate and the metal heat sink are fixed by gluing. Screw holes are provided on the metal heat sink for detachable connection with the base plate. A plug-in buckle for buckling with the base plate or the heat sink is also provided on the lower side of the supporting protective layer of the connection module. A plug-in groove is correspondingly provided on the base plate or the heat sink.

7. A modular thermal printing device according to claim 1, characterized in that: A solder resist protective layer is provided above the joints between the connection module, the heating working module and the IC control module.

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