Interior rearview mirror shell

Abstract

According to the inside rearview mirror shell provided by the utility model, a plurality of heat dissipation holes for air convection are formed in the shell, the heat dissipation piece used for installing the chip and the PCB is arranged in the shell, and heat generated by the chip and the PCB is conducted through the heat dissipation piece. According to the interior rearview mirror shell disclosed by the invention, heat generated by the chip and the PCB can be quickly transferred to air in the shell through the heat dissipation piece, and then the heat is quickly discharged through the heat dissipation holes, so that electronic devices in the shell are prevented from being damaged due to over-high temperature.

Description

Technical Field

[0001] The utility model relates to the field of vehicle safety equipment, in particular to a housing of an interior rearview mirror of a vehicle. Background Art

[0002] A smart rearview mirror is a type of interior rearview mirror for cars. Its working principle is to transmit the external images to the interior rearview mirror for display through a camera, and to form an independent algorithm system through the built-in electronic devices in the interior rearview mirror. It can then identify the driver's driving status through images and help improve driving safety.

[0003] However, since the built-in electronic components of the interior rearview mirror generate a large amount of heat when working, in order to prevent the electronic components in the interior rearview mirror from being damaged due to excessive temperature, an interior rearview mirror housing with strong heat dissipation capability is urgently needed. Utility Model Content

[0004] In view of this, an embodiment of the utility model provides a housing for an interior rearview mirror to solve the problem of heat dissipation of electronic components inside the interior rearview mirror.

[0005] To achieve the above purpose, the present invention provides the following technical solutions:

[0006] A vehicle interior rearview mirror housing, comprising: a housing and a heat sink;

[0007] The front of the shell is used to fix the display screen, and the shell is also provided with a plurality of heat dissipation holes for air convection;

[0008] The heat sink is arranged in the housing, and is used to install the chip and the PCB board, and to conduct the heat generated by the chip and the PCB board.

[0009] Preferably, the heat sink is further provided with a plurality of screw holes for cooperating with screws, and the screws are used to fix the PCB board to the heat sink.

[0010] Preferably, a plurality of heat sinks are provided on a side of the heat sink away from the chip and the PCB board.

[0011] Preferably, the plurality of heat sinks are distributed at preset intervals.

[0012] Preferably, a plurality of heat sinks are arrayed on the heat sink.

[0013] Preferably, a side of the heat sink away from the chip and the PCB board is processed by sandblasting.

[0014] Preferably, a connecting structure is provided on the back of the heat sink, and the connecting structure is used to connect with the suspension connecting member.

[0015] Preferably, heat dissipation fins are provided at the connection structure.

[0016] Preferably, it also includes: a thermally conductive pad;

[0017] The heat sink is provided with a boss for fixing the chip;

[0018] The heat conductive pad is arranged between the chip and the boss.

[0019] Preferably, the heat dissipation holes are long grille structures.

[0020] Based on the above-mentioned utility model, a car interior rearview mirror housing is provided, by opening a plurality of heat dissipation holes for air convection on the shell, and arranging a heat sink for mounting a chip and a PCB board in the shell, and conducting the heat generated by the chip and the PCB board through the heat sink. Through the above-mentioned disclosed car interior rearview mirror housing, the heat generated by the chip and the PCB board can be quickly transferred to the air in the housing through the heat sink, and then the heat is quickly discharged through the heat dissipation holes, so as to avoid damage to the electronic components in the housing due to excessive temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0022] Figure 1 A schematic diagram of the structure of a vehicle interior rearview mirror housing provided by an embodiment of the utility model;

[0023] Figure 2 A schematic diagram of the three-dimensional structure of a heat sink provided in an embodiment of the utility model;

[0024] Figure 3 A schematic diagram of the back structure of a heat sink provided by an embodiment of the utility model;

[0025] Figure 4 A schematic diagram of the front structure of a heat sink provided by an embodiment of the utility model;

[0026] Figure 5 A top view of a heat sink provided in an embodiment of the utility model;

[0027] Figure 6 A front view of a housing provided by an embodiment of the utility model;

[0028] Figure 7 A side view of a housing provided in accordance with an embodiment of the present utility model.

[0029] Among them, the shell 1, the heat dissipation holes 11, the heat dissipation component 2, the screw holes 21, the screws 22, the heat sink 23, the connection structure 24, the heat dissipation fins 25, the boss 26, and the hanging connection component 3. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] The utility model embodiment provides a vehicle interior rearview mirror housing 1, see Figures 1 to 7 , Figure 1 Schematic diagram of the structure of the interior rearview mirror housing 1, the interior rearview mirror housing 1 comprises: a housing 1 and a heat sink 2;

[0032] The front of the housing 1 is used to fix the display screen, and the housing 1 is also provided with a plurality of heat dissipation holes 11 for air convection;

[0033] The heat sink 2 is disposed in the housing 1 , and is used to mount the chip and the PCB board and conduct the heat generated by the chip and the PCB board.

[0034] It should be noted that the electronic devices with relatively large heat dissipation in existing interior rearview mirrors are chips and PCB boards. Therefore, this application uses the heat dissipation of chips and PCB boards as examples.

[0035] It should also be noted that since the heat sink 2 can conduct the heat generated by the chip and the PCB board, when the chip and the PCB board are installed on the heat sink 2, the heat generated by the chip and the PCB board can be quickly transferred to the air through the heat sink 2, and then the heat can be quickly discharged through the multiple air convection heat dissipation holes 11 opened in the outer shell.

[0036] It is worth noting that the heat dissipation holes 11 can be provided on the left and right sides of the housing 1 , and / or on the upper and lower sides of the housing 1 , and those skilled in the art can make selections according to requirements.

[0037] The embodiment of the utility model has a plurality of heat dissipation holes 11 for air convection in the housing, and a heat sink 2 for mounting a chip and a PCB board is arranged in the housing 1, and the heat generated by the chip and the PCB board is conducted through the heat sink 2. Through the above disclosed interior rearview mirror housing 1, the heat generated by the chip and the PCB board can be quickly transferred to the air in the housing 1 through the heat sink 2, and then the heat is quickly discharged through the heat dissipation holes 11, so as to avoid damage of the electronic components in the housing 1 due to excessive temperature.

[0038] Preferably, the heat sink 2 is formed by metal die-casting.

[0039] It should be noted that the heat sink 2 is formed by metal die-casting, which can ensure the rigidity of the heat sink 2, thereby maintaining the fixed shape of the PCB board and the heat sink 2 during the driving of the vehicle, thereby avoiding abnormal noise of the vehicle and ensuring the thermal conductivity of the heat sink 2.

[0040] Preferably, the heat sink 2 is formed by die-casting of AlSi10Mg.

[0041] It should be noted that the heat sink 2 can be die-casted using AlSi10Mg or other metal materials, and those skilled in the art can make the selection according to their needs.

[0042] Specifically, the heat sink 2 is further provided with a plurality of screw holes 21 for cooperating with screws 22 , and the screws 22 are used to fix the PCB board to the heat sink 2 .

[0043] It should be noted that by opening a plurality of screw holes 21 in the heat sink 2 and fixing the PCB board by screws 22 cooperating with the screw holes 21, the fixing strength of the PCB board can be further ensured to prevent the PCB board from making abnormal noises during driving of the vehicle.

[0044] It is worth noting that the heat sink 2 can be fixed to the PCB board by the cooperation of the screws 22 and the screw holes 21, or can be fixed to the PCB board by snap-fitting, and those skilled in the art can replace it according to needs.

[0045] Furthermore, a plurality of heat sinks 23 are provided on a side of the heat sink 2 away from the chip and the PCB board.

[0046] It should be noted that by providing a plurality of heat sinks 23 on a side of the heat sink 2 away from the chip and the PCB board, the contact area between the heat sink 2 and the air can be increased, thereby further improving the heat dissipation capacity of the heat sink 2 and the heat dissipation capacity of the interior rearview mirror housing 1.

[0047] Specifically, the plurality of heat sinks 23 are distributed at a preset interval.

[0048] It should be noted that the plurality of heat sinks 23 are distributed at a preset interval, so that when air enters the housing 1 through the heat dissipation holes 11, smooth air flow can be ensured, thereby quickly cooling the heat sink 2 and preventing the electronic components in the housing 1 from being damaged due to excessive temperature.

[0049] Specifically, a plurality of heat sinks 23 are arrayed on the heat sink 2 .

[0050] It should be noted that arranging multiple heat sinks 23 in an array on the heat sink 2 can further increase the contact area between the heat sink 23 and the air, thereby improving the cooling effect on the heat sink 2, and allowing air flowing in different directions to enter the multiple heat sinks 23 for air cooling and enter the heat dissipation holes to air cool the heat sink 2.

[0051] Preferably, the distance between adjacent heat sinks 23 in the transverse direction is 5 mm, and the distance between adjacent heat sinks 23 in the longitudinal direction is 9 mm to 11 mm.

[0052] Preferably, grooves with a width of 2.5 mm and a depth of 9 mm to 11 mm are evenly distributed in the middle of the heat sink 23 .

[0053] It should be noted that the grooves with a width of 2.5 mm and a depth of 9 mm to 11 mm are evenly distributed in the middle of the heat sink 23, which can further increase the contact area with the air and reduce the resistance of air convection.

[0054] Specifically, a side of the heat sink 2 away from the chip and the PCB board is processed by sandblasting.

[0055] It should be noted that by using a sandblasting process on the side of the heat sink 2 away from the chip and the PCB board, the heat exchange coefficient between the heat sink 2 and the air can be further improved, thereby accelerating the heat dissipation of the chip and the PCB board.

[0056] Furthermore, a connection structure 24 is provided on the back of the heat sink 2 , and the connection structure 24 is used to be connected to the suspension connector 3 .

[0057] It should be noted that, by providing a connection structure 24 for connecting with the suspension connector 3 on the back of the heat sink 2, the heat sink 2 can be hung in the vehicle, which is convenient for installation by the staff.

[0058] It is worth noting that, in order to facilitate the connection between the hanging connector 3 and the heat sink 2 , the housing 1 is provided with a mounting hole for the hanging connector 3 to pass through.

[0059] Preferably, the connection structure 24 is composed of a plurality of connection columns.

[0060] Furthermore, heat dissipation fins 25 are provided at the connection structure 24 .

[0061] It should be noted that by providing heat dissipation fins 25 at the connection structure 24, the contact area between the heat sink 2 and the air can be further increased, and heat exchange with the external air can be performed through the mounting holes to achieve heat dissipation of the heat sink 2, further improving the heat dissipation capacity of the interior rearview mirror housing 1.

[0062] Furthermore, the interior rearview mirror housing 1 further includes: a thermally conductive pad;

[0063] The heat sink 2 is provided with a boss 26 for fixing the chip;

[0064] The thermal pad is disposed between the chip and the boss 26 .

[0065] It should be noted that by setting a boss 26 for fixing the chip on the heat sink 2 and setting a thermally conductive gasket between the chip and the boss 26, the thermally conductive gasket can effectively reduce the contact thermal resistance generated by the chip surface and the contact surface of the heat sink 2, and then the heat energy generated by the chip can be quickly transferred to the heat sink 2 through the thermally conductive gasket, effectively improving the heat dissipation capacity of the chip.

[0066] It is worth noting that the thermal pad can be replaced with thermal adhesive.

[0067] Specifically, the heat dissipation holes 11 are long grid structures.

[0068] It should be noted that the heat dissipation holes 11 are configured as a long grille structure, which can effectively increase the air convection rate and thus improve the heat dissipation capacity inside the housing 1 .

[0069] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A vehicle interior rearview mirror housing, characterized in that: include: Housing and heat sink; The front side of the housing is used to fix the display screen, and the housing is also provided with a plurality of heat dissipation holes for air convection; The heat sink is arranged in the housing, and is used for mounting the chip and the PCB board, and conducting the heat generated by the chip and the PCB board.

2. The interior rearview mirror housing according to claim 1, characterized in that: The heat sink is also provided with a plurality of screw holes for cooperating with screws, and the screws are used to fix the PCB board to the heat sink.

3. The interior rearview mirror housing according to claim 1, characterized in that: A plurality of heat sinks are arranged on one side of the heat sink away from the chip and the PCB board.

4. The interior rearview mirror housing according to claim 3, characterized in that: The plurality of heat sinks are distributed at a preset interval.

5. The interior rearview mirror housing according to claim 3, characterized in that: A plurality of heat sinks are arrayed on the heat sink.

6. The interior rearview mirror housing according to claim 1, characterized in that: The side of the heat sink away from the chip and the PCB board is processed by sandblasting.

7. The interior rearview mirror housing according to claim 1, characterized in that: A connecting structure is provided on the back of the heat sink, and the connecting structure is used to be connected to the suspension connecting member.

8. The vehicle interior rearview mirror housing according to claim 7, characterized in that: The connection structure is provided with heat dissipation fins.

9. The vehicle interior rearview mirror housing according to claim 1, characterized in that: Also includes: Thermal pads; The heat sink is provided with a boss for fixing the chip; The thermal conductive pad is arranged between the chip and the boss.

10. The vehicle interior rearview mirror housing according to claim 1, characterized in that: The heat dissipation holes are of a long grille structure.

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