Plate-type carrier plate

Abstract

The utility model provides a plate-type carrier plate, which is used in the field of photovoltaic technology, and comprises a carrier plate body, the carrier plate body is composed of a first tray and a second tray which are spliced with each other, the first tray and the second tray are both provided with silicon wafer grooves, the width of the first tray is equal to that of the second tray, and the width of the second tray is equal to that of the first tray. The first tray is longer than or equal to the second tray. According to the plate-type carrier plate, splicing seams of the carrier plate body are reduced by reducing the number of the trays forming the carrier plate body, and therefore the purposes of improving the mounting precision of the carrier plate body and improving the automatic sheet placing precision are achieved.

Description

Technical Field

[0001] The present application relates to the field of photovoltaic technology, and in particular to a plate-type carrier. Background Art

[0002] As the capacity of battery production lines continues to increase, the chambers are also increasing, and the existing plate-type PECVD carriers are also getting larger. The current carriers are mainly produced from short-fiber carbon fiber sheets and used in conjunction with carbon fiber frames.

[0003] The problems existing in the existing plate-type PECVD substrate are as follows:

[0004] Currently, the sizes of short-fiber carbon fiber boards on the market are 2000×1300mm and 2000×1200mm. The mainstream single-board carrier body can hold 200 210 half-sheet silicon wafers or 100 210 full-sheet silicon wafers. In order to facilitate the design and production of plate-type carriers, the carrier body on the plate-type carrier is designed to be assembled from four trays of the same size. The large number of joints between the trays will also reduce the installation accuracy of the carrier body and reduce the accuracy of automatic film placement.

[0005] In addition, short-fiber carbon fiber boards of old sizes are gradually being phased out due to market reasons. The latest and most widely used carbon fiber board size is 2600mm×2000mm. It is very wasteful to cut the board into four pallets of the same size and assemble them on this basis. Therefore, a new pallet assembly method is needed that can reduce material costs and improve the installation accuracy of the carrier body. Utility Model Content

[0006] In view of this, the present application provides a plate-type carrier, which reduces the joints of the carrier body by reducing the number of trays constituting the carrier body, thereby achieving the purpose of improving the installation accuracy of the carrier body and improving the accuracy of automated film placement.

[0007] In order to achieve the above objectives, this application provides the following technical solutions:

[0008] A plate-type carrier, comprising:

[0009] The carrier body is composed of a first tray and a second tray spliced ​​to each other, the first tray and the second tray are both provided with silicon wafer grooves, the width of the first tray is equal to the width of the second tray, and the length of the first tray is greater than or equal to the length of the second tray.

[0010] Optionally, the first pallet is cut from a first plate, and the second pallet is cut from a second plate. The first plate and the second plate have the same size. The first plate can be cut into at least one first pallet, and the second plate can be cut into at least two second pallets.

[0011] Optionally, the first plate can be cut into one piece of the first pallet, and the second plate can be cut into three pieces of the second pallets.

[0012] Optionally, a wide side of the first tray and a wide side of the second tray are spliced ​​and aligned with each other; the silicon wafer placed in the silicon wafer slot is a half-sheet silicon wafer, and the silicon wafer slots are arranged in a rectangular array on the first tray and the second tray; the length direction of the silicon wafer slot extends along the width direction of the first tray and the second tray.

[0013] Optionally, a first area and a second area are provided on the first tray, and a rectangular array formed by the silicon wafer grooves is provided in the first area and the second area; a first isolation zone extending along the length direction of the first tray is formed between the first area and the second area;

[0014] A third area and a fourth area are provided on the second tray, and a rectangular array formed by the silicon wafer grooves is provided in the third area and the fourth area; a second isolation zone extending along the length direction of the second tray is formed between the third area and the fourth area.

[0015] Optionally, the number of the silicon wafer slots on the first tray is 16 rows and 10 columns, the number of the silicon wafer slots on the second tray is 4 rows and 10 columns, and / or,

[0016] The number of the silicon wafer slots on the first tray is 17 rows and 10 columns, and the number of the silicon wafer slots on the second tray is 3 rows and 10 columns.

[0017] Optionally, the first plate and / or the second plate are made of short-fiber carbon fiber plate.

[0018] Optionally, it also includes a support frame connected below the carrier body and supporting the carrier body.

[0019] Optionally, a width of the support frame is greater than or equal to a width of the first tray, and a length of the support frame is greater than or equal to a sum of lengths of the first tray and the second tray.

[0020] Optionally, bolt fixing holes and positioning holes are formed around the first tray and the second tray, the first tray and the second tray are spliced ​​by bolts, and the first tray and the second tray are connected to the support frame by positioning pins.

[0021] Different from the prior art in which the carrier body is composed of four pallets of the same size, the plate carrier provided in the present application is composed of two pallets of the same width and the same or different lengths, thereby reducing the number of pallets that constitute the carrier body, thereby reducing the joints of the carrier body, and further achieving the purpose of improving the installation accuracy of the carrier body and improving the accuracy of automated film placement. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0023] Figure 1 It is a schematic diagram of a plate-type carrier in the prior art;

[0024] Figure 2 Schematic diagram of the plate carrier of the present application.

[0025] exist Figure 1-Figure 2 middle:

[0026] 1. First tray; 11. First area; 12. Second area; 13. First isolation zone; 2. Second tray; 21. Third area; 22. Fourth area; 23. Second isolation zone; 3. Silicon wafer slot; 4. Support frame. DETAILED DESCRIPTION

[0027] The present application provides a plate-type carrier, which reduces the number of trays constituting the carrier body to reduce the joints of the carrier body, thereby achieving the purpose of improving the installation accuracy of the carrier body and improving the accuracy of automated film placement.

[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0029] like Figure 1 As shown, an embodiment of the present application provides a plate-type carrier, comprising:

[0030] The carrier body is composed of a first tray 1 and a second tray 2 which are spliced ​​to each other. Silicon wafer grooves 3 are provided on the first tray 1 and the second tray 2. The width of the first tray 1 is equal to the width of the second tray 2. The length of the first tray 1 is greater than or equal to the length of the second tray 2.

[0031] In the prior art, the carrier body is formed by splicing four pallets of the same size. In this way, the carrier body has four seams, the installation accuracy is poor, and the automatic film placement accuracy will also be affected accordingly; however, in the present application, the carrier body is spliced ​​together by two pallets. The two pallets have the same width and the same or different lengths, that is, the two pallets can be the same size or one large and one small. Compared with splicing four pallets, this splicing method can change the seams between the pallets from four to one, which can greatly improve the installation accuracy of the carrier body, thereby reducing errors and improving the automatic film placement accuracy.

[0032] In a preferred embodiment, the first pallet 1 is cut from a first plate, and the second pallet 2 is cut from a second plate. The first plate and the second plate have the same size. The first plate can be cut into at least one first pallet 1, and the second plate can be cut into at least two second pallets 2.

[0033] Compared with the prior art, in which a quarter-sized pallet is cut out from a plate material of smaller size (such as the mainstream market specifications of 2000×1300mm and 2000×1200mm), in this embodiment, a first pallet 1 of a larger size and a second pallet 2 of a smaller size are cut out from a plate material of a new size (such as a plate material of a new size of 2600mm×2000mm) of the same specification, that is, N first plates are used to cut out N first pallets 1 of larger size, and 1 second plate is used to cut out N second pallets 2 of smaller size, that is, N+1 plates can be used to form N sets of carrier bodies, instead of using the old cutting method to cut a 1 / 4-sized pallet from a plate material of a new size, thereby improving the utilization rate of raw materials.

[0034] In a preferred embodiment, the first plate can be cut into one first pallet 1 , and the second plate can be cut into three second pallets 2 .

[0035] In the prior art, the size of the mainstream plate raw materials is relatively small. For example, a plate with a size of 1300mm×2000mm, and the size of four pallets are 1170×1150mm, so one piece of raw material can make one pallet, and four raw material plates are needed to produce a set of carrier bodies. The utilization rate of the raw material plates is (1170×1150×4) / (2000×1300×4)=51%, that is, the utilization rate is about 51%, which is relatively low.

[0036] According to the size of the new plate material, the size of the carbon fiber plate material is 2600mm×2000mm, the size of the first tray 1 is 2340mm×1795mm, and the size of the second tray 2 is 2340mm×505mm. Thus, three first trays 1 are cut out from three first plates, and three second trays 2 are cut out from one second plate. That is, four plates can be assembled into three sets of carrier bodies, and the plate utilization rate is (2340×2300×3) / (2600×2000×4)=77.5%. Therefore, after using the solution of this embodiment, the utilization rate of the carbon fiber raw material can be increased from the original 51% to 77%, or even higher.

[0037] In a preferred embodiment, Figure 2 As shown, a wide side on the lower side of the first tray 1 and a wide side on the upper side of the second tray 2 are spliced ​​and aligned with each other. Of course, according to actual conditions, a wide side on the upper side of the first tray 1 and a wide side on the lower side of the second tray 2 can also be spliced ​​and aligned with each other, as long as blank edges are left around the integrally spliced ​​carrier body for splicing and installation; the silicon wafers placed in the silicon wafer slots 3 are half-sheet silicon wafers, and the silicon wafer slots 3 are arranged in a rectangular array on the first tray 1 and the second tray 2; the length direction of the silicon wafer slots 3 extends along the width direction of the first tray 1 and the second tray 2, as shown in FIG. Figure 2 As shown in FIG. 1 , the length of the silicon wafer slot 3 extends in the transverse direction in the figure, that is, the length direction of the silicon wafer slot 3 is the same as the width direction of the first tray 1 and the second tray 2 .

[0038] In order to improve the utilization rate of the tray, no gap is set between adjacent silicon wafer slots 3, and they are adjacent to each other, that is, no gap is set between adjacent silicon wafer slots 3 in the same row, and no gap is set between adjacent silicon wafer slots 3 in the same column;

[0039] An entire area can be set on the first tray 1, in which the silicon wafer slots 3 are arranged into a rectangular array. Of course, according to actual conditions, several independent areas can be set on the first tray 1, and the areas can be isolated from each other, so as to avoid crowding too many silicon wafers together, thereby reducing the difficulty of automatic wafer placement and retrieval.

[0040] In a preferred embodiment, Figure 2 As shown, a first area 11 and a second area 12 are provided on the first tray 1, and a rectangular array formed by silicon wafer grooves 3 is provided in both the first area 11 and the second area 12; a first isolation zone 13 extending along the length direction of the first tray 1 is formed between the first area 11 and the second area 12;

[0041] The second tray 2 is provided with a third area 21 and a fourth area 22 , each of which is provided with a rectangular array formed by silicon wafer grooves 3 ; a second isolation zone 23 extending along the length direction of the second tray 2 is formed between the third area 21 and the fourth area 22 .

[0042] By providing an isolation zone and reducing the width of the first area 11 / the second area 12, it is prevented that many silicon wafers are crowded together, thereby reducing the difficulty of automatic wafer placement and wafer removal.

[0043] Of course, if the size of the tray allows, the tray can also be divided into more mutually separated areas separated by isolation belts, for example, the first tray 1 can be divided into 1×3 or 2×2 independent areas, and the silicon wafers can be arranged into a rectangular array in these independent areas, thereby further reducing the difficulty of automated wafer placement and retrieval.

[0044] In a preferred embodiment, the number of the silicon wafer slots 3 on the first tray 1 is 16 rows and 10 columns, the number of the silicon wafer slots 3 on the second tray 2 is 4 rows and 10 columns, and / or,

[0045] The number of the silicon wafer slots 3 on the first tray 1 is 17 rows and 10 columns, and the number of the silicon wafer slots 3 on the second tray 2 is 3 rows and 10 columns.

[0046] The silicon wafer slots 3 can be arranged according to the size of the first tray 1 and the second tray 2, as long as a total of 20 rows and 10 columns are arranged on the first tray 1 and the second tray 2;

[0047] Since the length of the first tray 1 is greater than that of the second tray 2, it is necessary to arrange more rows of silicon wafer slots 3 on the first tray 1; according to the dimensions of the first tray 1 and the second tray 2 in the preferred embodiment - the dimensions of the first tray 1 are 2340 mm × 1795 mm, and the dimensions of the second tray 2 are 2340 mm × 505 mm, two layout methods can be adopted. The first case is Figure 2 In the case shown in the figure, the number of rows of silicon wafer slots 3 on the first tray 1 is 16 rows, and in the second case, the number of rows of silicon wafer slots 3 on the second tray 2 is 17 rows (not shown in the figure). In the corresponding two cases, the number of rows of silicon wafer slots 3 on the second tray 2 is 4 rows / 3 rows. In this case, the number of rows of silicon wafer slots 3 on the second tray 2 is smaller, and the ungrooved edge is wider. The first embodiment or the second embodiment can be selected according to actual working conditions.

[0048] In a preferred embodiment, the first plate and / or the second plate is made of short-fiber carbon fiber plate with high strength and good supporting performance.

[0049] In a preferred embodiment, Figure 2As shown, it also includes a support frame 4 connected below the carrier body to support the carrier body.

[0050] In order to lift the carrier body so that the silicon wafer can receive light better, a supporting structure is arranged under the carrier body.

[0051] In a preferred embodiment, the width of the support frame 4 is greater than or equal to the width of the first pallet 1 , and the length of the support frame 4 is greater than or equal to the sum of the lengths of the first pallet 1 and the second pallet 2 .

[0052] In order to better support the carrier body formed by splicing the first tray 1 and the second tray 2, the size of the support frame 4 is preferably equal to or slightly larger than the size of the carrier body.

[0053] In a preferred embodiment, bolt fixing holes and positioning holes are opened around the first pallet 1 and the second pallet 2. The first pallet 1 and the second pallet 2 are fixed and spliced ​​by bolts, and the first pallet 1 and the second pallet 2 are connected to the support frame 4 by positioning pins.

[0054] Bolt fixing holes may be provided on the first tray 1 and the second tray 2. Specifically, bolt fixing holes may be provided at the joint of the first tray 1 and the second tray 2 and at the edge where the silicon wafer slot 3 is not provided. Then, a connecting piece is provided below the first tray 1 and the second tray 2, and the first tray 1 and the second tray 2 are connected to the connecting piece by bolts respectively, so as to achieve splicing of the two, which will not affect the silicon wafer slot 3.

[0055] After the first tray 1 and the second tray 2 are assembled, they are fixed to the support frame 4 by positioning pins.

[0056] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0057] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.

[0058] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed or recombined, and these decompositions or recombinations should be regarded as equivalent solutions of the present application.

[0059] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0060] It should be understood that the qualifiers "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used to more clearly explain the technical solutions and cannot be used to limit the scope of protection of the present application.

[0061] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A plate-type carrier, characterized in that: include: The carrier body is composed of a first tray and a second tray spliced ​​together, the first tray and the second tray are both provided with silicon wafer grooves, the width of the first tray is equal to the width of the second tray, and the length of the first tray is greater than or equal to the length of the second tray.

2. The plate-type carrier according to claim 1, characterized in that: The first pallet is cut from a first plate, and the second pallet is cut from a second plate. The first plate and the second plate have the same size. The first plate can be cut into at least one first pallet, and the second plate can be cut into at least two second pallets.

3. The plate-type carrier according to claim 2, characterized in that: The first plate can be cut into one piece of the first pallet, and the second plate can be cut into three pieces of the second pallets.

4. The plate-type carrier according to claim 3, characterized in that: A wide side of the first tray and a wide side of the second tray are spliced ​​and aligned with each other; the silicon wafers placed in the silicon wafer slots are half-sheet silicon wafers, and the silicon wafer slots are arranged in a rectangular array on the first tray and the second tray; the length direction of the silicon wafer slots extends along the width direction of the first tray and the second tray.

5. The plate-type carrier according to claim 4, characterized in that: The first tray is provided with a first area and a second area, wherein a rectangular array formed by the silicon wafer slots is provided in both the first area and the second area; a first isolation zone extending along the length direction of the first tray is formed between the first area and the second area; A third area and a fourth area are provided on the second tray, and a rectangular array formed by the silicon wafer grooves is provided in the third area and the fourth area; a second isolation zone extending along the length direction of the second tray is formed between the third area and the fourth area.

6. The plate-type carrier according to claim 4, characterized in that: The number of the silicon wafer slots on the first tray is 16 rows and 10 columns, the number of the silicon wafer slots on the second tray is 4 rows and 10 columns, and / or, The number of the silicon wafer slots on the first tray is 17 rows and 10 columns, and the number of the silicon wafer slots on the second tray is 3 rows and 10 columns.

7. The plate-type carrier according to claim 2, characterized in that: The first plate and / or the second plate are made of short-fiber carbon fiber plate.

8. The plate-type carrier according to claim 1, characterized in that: It also includes a support frame connected below the carrier body and supporting the carrier body.

9. The plate-type carrier according to claim 8, characterized in that: The width of the support frame is greater than or equal to the width of the first tray, and the length of the support frame is greater than or equal to the sum of the lengths of the first tray and the second tray.

10. The plate-type carrier according to claim 8, characterized in that: Bolt fixing holes and positioning holes are provided around the first tray and the second tray. The first tray and the second tray are spliced ​​by bolts, and the first tray and the second tray are connected to the support frame by positioning pins.

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