Device for chemically plating copper on surface of PI (Polyimide) film
By designing an electroless copper plating device on the surface of PI film with adhesive rollers and heating wires, the problem of dust pollution in PI film copper plating operations is solved, and high-quality copper plating effect and product quality are achieved.
Patent Information
- Application Number
- CN202421854403.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-02
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2034-08-02
AI Technical Summary
During the copper plating process of PI film, PI film is prone to contact with dust, resulting in incomplete copper plating reaction and defects.
A chemical copper plating device on the surface of PI film is designed, and the combined structure of two sets of viscous rollers and springs is adopted. The elastic potential energy of the spring makes the viscous rollers tightly adhere to the surface of the PI film, and the copper plating rollers are driven by the motor to perform copper plating operation. At the same time, the combined structure of heating wire and fan blades is used to bake the copper plating PI film.
Effectively remove dust and impurities on the surface of PI film, improve the quality of copper plating, prevent impurities from mixing inside the copper film, and improve product production quality and user satisfaction.
Smart Images
Figure CN222861640U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of PI film production, and more specifically to a PI film surface chemical copper plating device. Background Art
[0002] PI film, or polyimide film, is a thin-film insulating material with excellent performance. It is made by polycondensing and casting pyromellitic anhydride and diaminodiphenyl ether in a strong polar solvent, and then imidizing. PI film is called "golden film" because of its excellent performance and is widely used in many fields.
[0003] Although the PI film itself has many excellent properties, such as good thermal stability, mechanical properties and insulation properties, its electrical conductivity is relatively poor. In order to improve the electrical conductivity of the PI film and enable it to function in the electronic field, it is usually copper-plated. After copper plating, a layer of conductive copper film will be formed on the surface of the PI film, which not only maintains the original excellent performance, but also has good electrical conductivity.
[0004] Currently, when copper plating is performed on PI film, the PI film is first modified and activated. A layer of silver particles will form on the surface of the activated PI film. These silver particles will serve as catalytic centers for subsequent chemical copper plating. However, on the transfer path of catalysis after activation, the PI film will inevitably come into contact with dust, and the vibration of the machine will also shake off some dust. These small amounts of dust will fall on the surface of the PI film, causing the subsequent chemical copper plating to not react completely. The dust will adhere to the copper-plated surface and cause defects, so it needs to be improved and optimized. Utility Model Content
[0005] In order to overcome the deficiencies of the prior art, the utility model provides a PI film surface chemical copper plating device, which has the advantage of high copper plating quality.
[0006] To achieve the above object, the utility model provides the following technical solution: a PI film surface chemical copper plating device, comprising a workbench, a copper plating bin is fixedly installed on the top of the workbench, an observation window is opened on the front side of the copper plating bin, a discharge port is opened on the left side of the copper plating bin, and a feed port is opened on the right side of the copper plating bin;
[0007] A feeding roller is arranged on the top of the workbench, and the feeding roller is located on the right side of the copper plating bin, a PI film is rolled up on the outer surface of the feeding roller, a baffle is fixedly installed on the right side of the copper plating bin, a fixed platform is fixedly installed on both the front and rear sides of the inner wall of the baffle, a sticky roller 1 is rotatably installed between the two groups of the fixed platforms, a guide rod is fixedly installed inside the two groups of the fixed platforms, a slider is movably sleeved on the outer wall of the guide rod, the two groups of sliders are movably installed inside the fixed platforms, and a sticky roller 2 is rotatably installed between the two groups of the sliders, and one end of the two groups of the sliders and the inner wall of the fixed platform are elastically connected by a spring;
[0008] Two groups of copper plating rollers are rotatably installed inside the copper plating warehouse, a winding roller is rotatably installed on the left side of the workbench, and a second motor is fixedly installed on the rear wall of the workbench, and the output shaft of the second motor is fixedly connected to the winding roller.
[0009] As a preferred technical solution of the utility model, a drying table is fixedly installed on the left side of the copper plating warehouse;
[0010] A motor three is fixedly installed on the rear side of the drying table, a fan blade is rotatably installed on the rear side wall of the drying table, an output shaft of the motor three and the fan blade are fixedly connected, a heating wire is fixedly laid on the top of the drying table, and a power interface is fixedly provided at the front end of the drying table.
[0011] As a preferred technical solution of the utility model, one end of the PI film is located on the outer surface of the feed roller, and the other end thereof passes through between the first and second adhesive rollers and between the two groups of copper-plated rollers, and is finally fixed to the outer wall of the winding roller.
[0012] As a preferred technical solution of the utility model, a dustproof shell is fixedly installed on the rear side wall of the copper plating bin, two sets of gears are rotatably installed inside the dustproof shell, and the two sets of gears are respectively fixedly connected to the two sets of copper plating rollers.
[0013] As a preferred technical solution of the utility model, a motor is fixedly mounted on the outer wall of the dustproof shell, and the output shaft of the gear is fixedly connected to one group of the gears, and the two groups of gears are meshed with each other.
[0014] As a preferred technical solution of the utility model, the elastic potential energy of the spring between the second and first adhesive rollers causes the second and first adhesive rollers to abut against the upper and lower surfaces of the PI film respectively.
[0015] As a preferred technical solution of the utility model, the model of the heating wire is Ni-Cr 80 / 20 nickel-chromium alloy wire, which is responsible for heat treatment of the surface of the PI film.
[0016] Compared with the prior art, the beneficial effects of the utility model are as follows:
[0017] 1. The utility model uses the elastic potential energy of the spring to tightly fit the surface of the PI film by the second and first adhesive rollers. The copper plating rollers copper-plate the upper and lower surfaces of the PI film while being wound up by the winding rollers through the operation of the second motor and the first motor. Compared with the traditional device, the device uses the two sets of adhesive rollers to remove dust and impurities attached to the surface of the PI film by the first and second adhesive rollers while the PI film is copper-plated, thereby effectively improving the quality of subsequent copper plating, preventing impurities from being mixed in the copper film, and improving the production quality of the product.
[0018] 2. The utility model, through the operation of motor three and the access of external power supply, makes the heating wire itself start to heat up and the fan blades rotate, so that a drying area is formed inside the drying table, and the copper-plated PI film is baked. Compared with the traditional device, the device bakes the PI film so that the PI film is in a dry state when it is rolled up, and further makes the PI film less likely to adhere to dust and impurities, so that the quality of the product is guaranteed and the user satisfaction is improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a schematic diagram of the structure of the utility model;
[0020] Figure 2 This is a schematic diagram of the cross-sectional structure of the utility model;
[0021] Figure 3 This is a schematic diagram of the winding roller structure of the utility model;
[0022] Figure 4 This is a schematic diagram of the structure of the slider of the utility model;
[0023] Figure 5 This is a schematic diagram of the structure of the dustproof shell of the utility model;
[0024] Figure 6 This is a schematic diagram of the heating wire structure of the utility model.
[0025] In the figure: 1. workbench; 2. copper plating bin; 3. observation window; 4. discharge port; 5. feed port; 6. feed roller; 7. baffle; 8. PI film; 9. fixed table; 10. sticky roller one; 11. guide rod; 12. slider; 13. sticky roller two; 14. spring; 15. copper plating roller; 16. dust cover; 17. gear; 18. motor one; 19. winding roller; 20. motor two; 21. drying table; 22. fan blade; 23. motor three; 24. heating wire; 25. power interface. DETAILED DESCRIPTION
[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0027] like Figures 1 to 6 As shown, the utility model provides a PI film surface chemical copper plating device, comprising a workbench 1, a copper plating bin 2 is fixedly installed on the top of the workbench 1, an observation window 3 is opened on the front side of the copper plating bin 2, a discharge port 4 is opened on the left side of the copper plating bin 2, and a feed port 5 is opened on the right side of the copper plating bin 2;
[0028] A feeding roller 6 is arranged on the top of the workbench 1, and the feeding roller 6 is located on the right side of the copper plating bin 2, a PI film 8 is rolled up on the outer surface of the feeding roller 6, a baffle 7 is fixedly installed on the right side of the copper plating bin 2, a fixed platform 9 is fixedly installed on both the front and rear sides of the inner wall of the baffle 7, a sticky roller 10 is rotatably installed between the two groups of fixed platforms 9, a guide rod 11 is fixedly installed inside the two groups of fixed platforms 9, a slider 12 is movably sleeved on the outer wall of the guide rod 11, the two groups of sliders 12 are movably installed inside the fixed platform 9, and a sticky roller 2 13 is rotatably installed between the two groups of sliders 12, one end of the two groups of sliders 12 and the inner wall of the fixed platform 9 are elastically connected by a spring 14;
[0029] Two sets of copper plating rollers 15 are rotatably installed inside the copper plating bin 2, a winding roller 19 is rotatably installed on the left side of the workbench 1, and a motor 20 is fixedly installed on the rear wall of the workbench 1, and the output shaft of the motor 20 is fixedly connected to the winding roller 19.
[0030] When the surface of the PI film 8 needs to be coated, the staff first rolls up the PI film 8 on the surface of the feeding roller 6, and then lifts the adhesive roller 13, and passes one end of the PI film 8 through the adhesive roller 10 and the adhesive roller 13 and the two sets of copper-plated rollers 15, and finally fixes it on the outer wall of the winding roller 19. When the adhesive roller 13 is lifted, the two sets of sliders 12 will move upward along the guide rod 11 and squeeze the spring 14. After the fixation is completed, the staff releases the adhesive roller 13, and through the elastic potential energy of the spring 14, the adhesive roller 13 and the adhesive roller 10 tightly fit the surface of the PI film 8, and then the staff starts the motor 20 and the motor 18. The rotation of motor 18 drives two groups of copper plating rollers 15 to rotate through two groups of gears 17. The rotation of copper plating rollers 15 will perform copper plating on the upper and lower surfaces of PI film 8. At the same time, the rotation of motor 20 will drive the winding roller 19 to rotate. The rotation of winding roller 19 will rewind the copper-plated PI film 8. When rewinding, winding roller 19 will pull PI film 8, so that PI film 8 slowly passes between sticky roller 2 13 and sticky roller 1 10, and through the viscosity of sticky roller 2 13 and sticky roller 1 10, the two groups of sticky rollers will pick up dust and impurities on the surface of PI film 8 during copper plating on PI film 8, so that the surface of PI film 8 is clean, and the quality of copper plating is higher.
[0031] Through the elastic potential energy of the spring 14, the adhesive roller 2 13 and the adhesive roller 1 10 tightly fit the surface of the PI film 8. Through the operation of the motor 2 20 and the motor 1 18, the copper plating roller 15 is copper-plated on the upper and lower surfaces of the PI film 8 while being rolled up by the winding roller 19. Compared with the traditional device, the device uses two sets of adhesive rollers to set up the PI film 8 so that dust and impurities attached to the surface are removed by the adhesive roller 10 and the adhesive roller 2 13 while the PI film 8 is copper-plated, which effectively improves the quality of subsequent copper plating, prevents impurities from being mixed in the copper film, and improves the production quality of the product.
[0032] Among them, a drying table 21 is fixedly installed on the left side of the copper plating warehouse 2;
[0033] A motor 3 23 is fixedly installed on the rear side of the drying table 21, a fan blade 22 is rotatably installed on the rear side wall of the drying table 21, the output shaft of the motor 3 23 and the fan blade 22 are fixedly connected, a heating wire 24 is fixedly laid on the top of the drying table 21, and a power interface 25 is fixedly set at the front end of the drying table 21.
[0034] When copper plating is performed, the staff starts the motor three 23 and connects the external power cord to the power interface 25. At this time, the power supply will cause the heating wire 24 to start heating itself. At the same time, the operation of the motor three 23 drives the fan blades 22 to rotate, and the copper-plated PI film 8 is baked through the fan blades 22 and the heating wire 24 to make it dry and not easy to adhere to dust and impurities.
[0035] Through the operation of the motor three 23 and the access to the external power supply, the heating wire 24 starts to heat itself and the fan blade 22 rotates, so that a drying area is formed inside the drying table 21, and the copper-plated PI film 8 is baked. Compared with the traditional device, the device bakes the PI film 8 so that the PI film 8 is in a dry state when it is rolled up, and further makes the PI film 8 less likely to adhere to dust and impurities, so that the quality of the product is guaranteed and the user satisfaction is improved.
[0036] Among them, one end of the PI film 8 is located on the outer surface of the feed roller 6, and the other end thereof passes through between the adhesive roller 10 and the adhesive roller 2 13 and between the two groups of copper-plated rollers 15, and is finally fixed on the outer wall of the winding roller 19.
[0037] A dust cover 16 is fixedly installed on the rear side wall of the copper plating bin 2 , and two sets of gears 17 are rotatably installed inside the dust cover 16 , and the two sets of gears 17 are fixedly connected to the two sets of copper plating rollers 15 respectively.
[0038] Among them, the outer wall of the dustproof shell 16 is fixedly installed with a motor 18, and the output shaft of the gear 17 is fixedly connected to one group of gears 17, and the two groups of gears 17 are meshed with each other.
[0039] The rotation of the motor 18 drives the two sets of copper plating rollers 15 to rotate through the two sets of gears 17. The rotation of the copper plating rollers 15 will perform copper plating operations on the upper and lower surfaces of the PI film 8.
[0040] Among them, the elastic potential energy of the spring 14 is used between the adhesive roller 2 13 and the adhesive roller 1 10, so that the adhesive roller 2 13 and the adhesive roller 1 10 are respectively in contact with the upper and lower surfaces of the PI film 8.
[0041] When winding, the winding roller 19 will pull the PI film 8, so that the PI film 8 slowly passes between the sticky roller 2 13 and the sticky roller 1 10, and through the stickiness of the sticky roller 2 13 and the sticky roller 1 10, the two sets of sticky rollers are between the PI film 8 for copper plating, so as to pick up dust and impurities on the surface of the PI film 8.
[0042] The model of the heating wire 24 is Ni-Cr 80 / 20 nickel-chromium alloy wire, which is responsible for heat treatment of the surface of the PI film 8 .
[0043] The heating wire 24 bakes the copper-plated PI film 8 to make it dry and less likely to adhere to dust and impurities.
[0044] The working principle and use process of this utility model:
[0045] When the surface of the PI film 8 needs to be coated, the staff first rolls up the PI film 8 on the surface of the feeding roller 6, and then lifts the adhesive roller 13, and passes one end of the PI film 8 through the adhesive roller 10 and the adhesive roller 13 and the two sets of copper-plated rollers 15, and finally fixes it on the outer wall of the winding roller 19. When the adhesive roller 13 is lifted, the two sets of sliders 12 will move upward along the guide rod 11 and squeeze the spring 14. After the fixation is completed, the staff releases the adhesive roller 13, and through the elastic potential energy of the spring 14, the adhesive roller 13 and the adhesive roller 10 tightly fit the surface of the PI film 8, and then the staff starts the motor 20 and the motor 18. The rotation of motor 18 drives two groups of copper plating rollers 15 to rotate through two groups of gears 17. The rotation of copper plating rollers 15 will perform copper plating on the upper and lower surfaces of PI film 8. At the same time, the rotation of motor 20 will drive the winding roller 19 to rotate. The rotation of winding roller 19 will rewind the copper-plated PI film 8. When rewinding, winding roller 19 will pull PI film 8, so that PI film 8 slowly passes between sticky roller 2 13 and sticky roller 1 10, and through the viscosity of sticky roller 2 13 and sticky roller 1 10, the two groups of sticky rollers will pick up dust and impurities on the surface of PI film 8 during copper plating on PI film 8, so that the surface of PI film 8 is clean, and the quality of copper plating is higher.
[0046] When copper plating is performed, the staff starts the motor three 23 and connects the external power cord to the power interface 25. At this time, the power supply will cause the heating wire 24 to start heating itself. At the same time, the operation of the motor three 23 drives the fan blades 22 to rotate, and the copper-plated PI film 8 is baked through the fan blades 22 and the heating wire 24 to make it dry and not easy to adhere to dust and impurities.
[0047] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0048] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A PI film surface chemical copper plating device, comprising a workbench (1), characterized in that: A copper plating bin (2) is fixedly mounted on the top of the workbench (1); an observation window (3) is provided on the front side of the copper plating bin (2); a discharge port (4) is provided on the left side of the copper plating bin (2); and a feed port (5) is provided on the right side of the copper plating bin (2); A feeding roller (6) is arranged on the top of the workbench (1), and the feeding roller (6) is located on the right side of the copper plating bin (2). A PI film (8) is rolled up on the outer surface of the feeding roller (6). A baffle (7) is fixedly installed on the right side of the copper plating bin (2). A fixed platform (9) is fixedly installed on both the front and rear sides of the inner wall of the baffle (7). An adhesive roller 1 (10) is rotatably installed between the two groups of the fixed platforms (9). A guide rod (11) is fixedly installed inside the two groups of the fixed platforms (9). A slider (12) is movably sleeved on the outer wall of the guide rod (11). The two groups of the sliders (12) are movably installed inside the fixed platforms (9). An adhesive roller 2 (13) is rotatably installed between the two groups of the sliders (12). One end of the two groups of the sliders (12) and the inner wall of the fixed platform (9) are elastically connected by a spring (14). Two groups of copper plating rollers (15) are rotatably mounted inside the copper plating bin (2), a winding roller (19) is rotatably mounted on the left side of the workbench (1), and a second motor (20) is fixedly mounted on the rear wall of the workbench (1), and the output shaft of the second motor (20) is fixedly connected to the winding roller (19).
2. A PI film surface chemical copper plating device according to claim 1, characterized in that: A drying table (21) is fixedly installed on the left side of the copper plating bin (2); A motor three (23) is fixedly mounted on the rear side of the drying table (21); a fan blade (22) is rotatably mounted on the rear side wall of the drying table (21); an output shaft of the motor three (23) and the fan blade (22) are fixedly connected; a heating wire (24) is fixedly laid on the top of the drying table (21); and a power supply interface (25) is fixedly provided at the front end of the drying table (21).
3. A PI film surface chemical copper plating device according to claim 1, characterized in that: One end of the PI film (8) is located on the outer surface of the feed roller (6), and the other end thereof passes through between the first adhesive roller (10) and the second adhesive roller (13) and between the two sets of copper-plated rollers (15), and is finally fixed to the outer wall of the winding roller (19).
4. The PI film surface chemical copper plating device according to claim 1, characterized in that: A dust cover (16) is fixedly mounted on the rear side wall of the copper plating bin (2), two sets of gears (17) are rotatably mounted inside the dust cover (16), and the two sets of gears (17) are respectively fixedly connected to the two sets of copper plating rollers (15).
5. A PI film surface chemical copper plating device according to claim 4, characterized in that: A motor 1 (18) is fixedly mounted on the outer wall of the dustproof housing (16), and an output shaft of the gear (17) is fixedly connected to one group of the gears (17), and the two groups of gears (17) are meshed with each other.
6. The PI film surface chemical copper plating device according to claim 1, characterized in that: The elastic potential energy of the spring (14) is used between the second adhesive roller (13) and the first adhesive roller (10), so that the second adhesive roller (13) and the first adhesive roller (10) are respectively in contact with the upper and lower surfaces of the PI film (8).
7. The PI film surface chemical copper plating device according to claim 2, characterized in that: The model of the heating wire (24) is Ni-Cr 80 / 20 nickel-chromium alloy wire, which is responsible for heat treatment of the surface of the PI film (8).