Temperature vibration sensor

Abstract

The utility model relates to the technical field of sensors, in particular to a temperature vibration sensor, which comprises a shell and a built-in unit arranged in the shell. The cap is used for being connected with the shell; one end of the cap extends into the shell and is detachably connected with the built-in unit; the built-in unit comprises an injection molding ring, a first abutting unit and a second abutting unit; the first abutting unit and the second abutting unit are detachably mounted on the injection molding ring; a cavity is formed in the injection molding ring, the two ends of the injection molding ring are open, and a mainboard unit is placed in the cavity; the first abutting unit and the second abutting unit extend into the cavity from the two ends of the injection molding ring and are used for fixing the mainboard unit, and the problem that a mainboard unit in an existing temperature vibration sensor is inconvenient to replace is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of sensors, in particular to a temperature vibration sensor. Background Art

[0002] In the coal, chemical, metallurgical and other industries, silos are important storage facilities. Their internal environment and equipment operating status are directly related to production efficiency and safety. Materials stored in silos, such as coal, may cause temperature rise during long-term storage due to spontaneous combustion, oxidation, etc., which may lead to safety accidents such as fire or explosion. At the same time, rotating equipment in silos, such as fans and agitators, may also cause equipment damage or failure due to abnormal vibration during operation, affecting production progress. In order to monitor the operating equipment, temperature and vibration sensors are used to monitor its working status to ensure safe production.

[0003] However, traditional temperature and vibration sensors usually adopt an integrated design, in which the main board, as the core control and processing unit, is directly and permanently fixed inside the sensor housing. Although this design simplifies the manufacturing and assembly process to a certain extent, once the main board is damaged due to long-term use, environmental factors (such as high temperature, humidity, etc.) or circuit failure, users will face high maintenance costs or have to directly replace the entire temperature and vibration sensor, which not only increases the complexity and time cost of maintenance, but also causes a waste of resources, especially when other parts of the sensor (such as temperature sensor elements, electronic sensor elements, housing, etc.) are still in good working condition.

[0004] In addition, with the advancement of technology and the miniaturization and modularization of electronic components, the maintainability and scalability of sensor design have become the focus of industry attention. Users are increasingly inclined to choose sensor products that are easy to maintain and can quickly replace faulty parts to reduce downtime and improve production efficiency. Utility Model Content

[0005] The utility model aims to provide a temperature vibration sensor to solve the problem that the mainboard unit in the existing temperature vibration sensor is inconvenient to replace.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0007] A temperature vibration sensor comprises a housing and a built-in unit, wherein the built-in unit is arranged inside the housing;

[0008] A cap is used to be connected to the housing; one end of the cap extends into the housing and is detachably connected to the built-in unit;

[0009] The built-in unit includes an injection molding ring, a first abutting unit and a second abutting unit; the first abutting unit and the second abutting unit are detachably mounted on the injection molding ring;

[0010] A cavity is formed in the injection molding ring, and both ends of the injection molding ring are open, and a mainboard unit is placed in the cavity;

[0011] The first abutting unit and the second abutting unit extend into the cavity from two ends of the injection ring and are used to fix the mainboard unit.

[0012] According to the above technical solution, when the mainboard unit is damaged due to long-term use or environmental factors, the new mainboard unit can be quickly replaced by removing the cap and the first abutment unit and the second abutment unit, without replacing the entire temperature vibration sensor, thereby reducing maintenance costs and time.

[0013] Furthermore, the first abutment unit includes a first abutment block, a first connecting block and a second connecting block, the first abutment block is connected to the first connecting block, the second connecting block is connected to the injection ring, and the second connecting block can drive the first abutment block to move along the length direction of the injection ring.

[0014] Further, the first abutment block comprises an abutment portion and a connection portion, and the abutment portion is disposed in the cavity;

[0015] The connecting portion extends out of the cavity, and a first external thread is formed on the outer periphery of the connecting portion, and a second external thread is formed on one end of the injection molding ring;

[0016] The second connection block is a hollow structure with two ends open. The second connection block is provided with a first internal thread and a second internal thread. The first internal thread is matched with the first external thread, and the second internal thread is matched with the second external thread.

[0017] According to the above technical solution, the first abutment block includes an abutment portion and a connecting portion. The abutment portion is arranged in the cavity of the injection molding ring, and is used to directly abut and fix one end of the mainboard unit. The connecting portion extends out of the cavity to facilitate connection with the external structure; the first connecting block is connected to the connecting portion of the first abutment block, and the second connecting block is a hollow structure with openings at both ends. The second connecting block is provided with a first internal thread and a second internal thread, which are used to connect with the first abutment block and the injection molding ring respectively. The outer periphery of the connecting portion of the first abutment block is provided with a first external thread, which is adapted to the first internal thread of the second connecting block; by rotating the second connecting block, the first abutment block can be driven to move along the length direction of the injection molding ring, thereby adjusting its abutment force against the mainboard unit.

[0018] Further, the second abutment unit comprises a second abutment block and a connecting rod, and the connecting rod is connected to the injection ring;

[0019] One end of the connecting rod extends into the cavity and is detachably connected to the second abutment block.

[0020] Furthermore, a first connection hole is formed on a side of the injection ring facing the connection rod, and a second connection hole is formed on the connection rod, and the first connection hole corresponds to the second connection hole;

[0021] It also includes a fastener, which passes through the first connecting hole and the second connecting hole and is used to fix the injection ring and the connecting rod.

[0022] One end of the injection molding ring is provided with a second external thread, which is matched with the second internal thread of the second connecting block. According to the above technical solution, the second abutment unit includes a second abutment block and a connecting rod. The second abutment block is arranged in the cavity of the injection molding ring, and is used to abut and fix the other end of the mainboard unit. The injection molding ring is provided with a first connecting hole on one side facing the connecting rod, and the connecting rod is provided with a second connecting hole. The first connecting hole corresponds to the second connecting hole, so that the fastener can pass through for fixing.

[0023] Fasteners (such as bolts, screws, etc.) pass through the first connecting hole and the second connecting hole to firmly connect the injection molding ring and the connecting rod. This fixing method is simple and effective, ensuring the stability and reliability of the second abutting unit.

[0024] Furthermore, the mainboard unit includes a protective ring and a circuit board arranged in the protective ring, and the circuit board is detachably connected to the protective ring.

[0025] Furthermore, a mounting groove is provided in the protection ring, and two sides of the circuit board are engaged in the mounting groove.

[0026] According to the above technical solution, the protective ring is the peripheral structure of the mainboard unit, and its main function is to provide support for the mainboard unit. An installation groove is opened in the protective ring, and its function is to fix and support the circuit board. The two sides of the circuit board are snapped into the installation groove. When the circuit board is correctly placed in the installation groove, its two sides will automatically snap into the edge of the groove to achieve stable fixation.

[0027] Furthermore, the cap includes a cap seat and a cap rod, the cap rod is fixed on the cap seat, and the cap seat is connected to the connecting rod.

[0028] Furthermore, the cap seat is provided with a third external thread, the shell is provided with a third internal thread, and the third internal thread is matched with the third external thread.

[0029] According to the above technical solution, the threaded connection between the cap seat and the shell not only provides a stable mechanical connection, but also allows the cap seat to be easily removed when needed, which is convenient for the later maintenance, repair and replacement of internal components of the temperature vibration sensor; when the cap seat needs to be removed, it is only necessary to rotate the cap seat in the opposite direction to easily separate it from the shell. The detachable design improves the flexibility of the sensor and can quickly replace faulty parts of the sensor product to reduce downtime and improve production efficiency.

[0030] Furthermore, a sensor installation cavity is provided on the injection molding ring, and the sensor installation cavity is communicated with the cavity; and a mounting plate is detachably connected to the sensor installation cavity.

[0031] According to the above technical solution, a sensor installation cavity is provided for installing sensor elements, such as temperature sensors, vibration sensors, etc., and the installation plate is used to protect the sensor elements placed in the sensor installation cavity.

[0032] Beneficial effects of the utility model:

[0033] The mainboard unit, the first abutment unit and the second abutment unit of the utility model can be detachably mounted on the injection molding ring, so that when the mainboard unit fails or needs to be upgraded, the mainboard unit can be quickly replaced or upgraded without replacing the entire sensor, which not only reduces maintenance costs, but also improves the flexibility and reusability of the sensor, helping to extend the overall service life of the sensor.

[0034] The sensor of the utility model adopts a variety of flexible installation and disassembly methods, such as threaded connection, bolt tightening, etc., especially the threaded connection between the cover cap and the shell, and the detachable connection between the first abutment unit and the second abutment unit and the injection molding ring, so that when maintenance or repair is required, the relevant parts can be easily disassembled without complicated tools or operations, which not only improves the maintenance efficiency but also reduces the downtime, and has a compact structure and strong practicality.

[0035] Other advantages, objectives and features of the present application will be described to some extent in the subsequent description, and to some extent, will be obvious to those skilled in the art based on the following examination and study, or can be taught from the practice of the present application. The objectives and other advantages of the present application can be achieved and obtained through the following specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 This is a schematic diagram of the overall structure of the temperature vibration sensor of the utility model;

[0037] Figure 2 This is a schematic diagram of the disassembled structure of the temperature vibration sensor of the utility model;

[0038] Figure 3 It is a structural schematic diagram of the built-in unit and the cap of the temperature vibration sensor of the utility model;

[0039] Figure 4 for Figure 3 Schematic diagram of the explosion structure;

[0040] Figure 5 It is a schematic cross-sectional view of the temperature vibration sensor of the utility model;

[0041] Figure 6 The figure is a schematic diagram of the disassembled structure of the mainboard unit in the temperature vibration sensor of the present utility model.

[0042] Among them, the shell 1, the built-in unit 2, the injection ring 21, the cavity 211, the first abutment unit 22, the first abutment block 221, the abutment part 2211, the connecting part 2212, the first connecting block 222, the second connecting block 223, the second abutment unit 23, the second abutment block 231, the connecting rod 232, the second connecting hole 2321, the cover cap 3, the cap seat 31, the sensor mounting cavity 212, the mounting plate 213, the cap rod 32, the main board unit 4, the protective ring 41, the mounting groove 411, and the circuit board 42. DETAILED DESCRIPTION

[0043] The following will describe the implementation of the present invention with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be understood that the preferred embodiments are only for illustrating the present invention, not for limiting the scope of protection of the present invention.

[0044] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention, and thus the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed at will, and the component layout may also be more complicated.

[0045] This embodiment proposes a temperature vibration sensor, such as Figures 1 to 6 As shown, it comprises a shell 1, an opening is provided at the end of the shell 1; a built-in unit 2 is provided inside the shell 1; a cap 3 is provided on one side of the shell 1, and the cap 3 is detachably connected to the shell 1; one end of the cap 3 extends into the shell 1 and is connected to the built-in unit 2;

[0046] like Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the built-in unit 2 includes an injection molding ring 21, a first abutting unit 22 and a second abutting unit 23; the first abutting unit 22 and the second abutting unit 23 are detachably mounted on the injection molding ring 21; a cavity 211 is provided in the injection molding ring 21, both ends of the injection molding ring 21 are open, and the mainboard unit 4 is placed in the cavity 211;

[0047] The first abutting unit 22 and the second abutting unit 23 extend from both ends of the injection ring 21 into the cavity 211 to fix the mainboard unit 4 .

[0048] like Figure 5 As shown, the first abutting unit 22 includes a first abutting block 221, a first connecting block 222 and a second connecting block 223. The first abutting block 221 is connected to the first connecting block 222, and the second connecting block 223 is connected to the injection ring 21. The second connecting block 223 can drive the first abutting block 221 to move along the length direction of the injection ring 21 (that is, Figure 5 lateral) movement.

[0049] Specifically, the first abutting block 221 includes an abutting portion 2211 and a connecting portion 2212. The abutting portion 2211 is disposed in the cavity 211; the connecting portion 2212 extends out of the cavity 211, and a first external thread is provided on the outer periphery of the connecting portion 2212. One end (i.e. Figure 5 In the figure, the left end of the injection ring 21 is provided with a second external thread;

[0050] The second connection block 223 is a hollow structure with two ends opened. The second connection block 223 is provided with a first internal thread and a second internal thread. The first internal thread is matched with the first external thread, and the second internal thread is matched with the second external thread.

[0051] According to the above technical solution, the abutment portion 2211 is arranged in the cavity 211 of the injection molding ring 21, and is used to directly abut one end of the mainboard unit 4, and the connecting portion 2212 extends out of the cavity 211; the first connecting block 222 is connected to the connecting portion 2212 of the first abutment block 221; by rotating the second connecting block 223, the first abutment block 221 can be driven to move along the length direction of the injection molding ring 21, thereby adjusting its abutment force on the mainboard unit 4.

[0052] In a possible implementation manner, the first abutting block 221 and the first connecting block 222 may be fixed by welding, or may be an integrally formed structure.

[0053] like Figure 5 As shown, the second abutment unit 23 includes a second abutment block 231 and a connecting rod 232. The connecting rod 232 is connected to the injection molding ring 21; one end of the connecting rod 232 (i.e. Figure 5The left end of the middle connecting rod 232 extends into the cavity 211 and is detachably connected to the second abutment block 231. Specifically, the detachable connection in this embodiment is connected in the form of bolts tightened and fixed.

[0054] Furthermore, a first connection hole (not shown) is provided on one side of the injection ring 21 facing the connection rod 232, and a second connection hole 2321 is provided on the connection rod 232, and the first connection hole corresponds to the second connection hole 2321;

[0055] It also includes a fastener (not shown), which passes through the first connection hole and the second connection hole 2321, and is used to fix the injection ring 21 and the connecting rod 232. The fastener (such as a bolt, a screw, etc.) passes through the first connection hole and the second connection hole 2321 to firmly connect the injection ring 21 and the connecting rod 232. This fixing method is simple and effective, ensuring the stability and reliability of the second abutment unit 23; in this embodiment, the fastener is preferably a bolt. According to the above technical solution, by setting the second abutment block 231 in the cavity 211 of the injection ring 21, the mainboard unit 4 is clamped and fixed by using the first abutment block 221 and the second abutment block 231.

[0056] When fixing the motherboard unit 4, the second connecting block 223 is rotated to drive the first connecting block 222 and the first abutting block 221 to move, thereby adjusting the abutting force of the abutting portion 2211 on the first abutting block 221 on the motherboard unit 4 to achieve fastening and fixing of the motherboard unit 4.

[0057] As a preferred embodiment, Figure 6 The motherboard unit 4 includes a protective ring 41 and a circuit board 42 disposed in the protective ring 41, and the circuit board 42 is detachably connected to the protective ring 41; specifically, the protective ring 41 is provided with symmetrically arranged mounting grooves 411, and the two sides of the circuit board 42 are snap-fitted and fixed in the mounting grooves 411. According to the above technical solution, the protective ring 41 is the peripheral structure of the motherboard unit 4, and its main function is to provide support for the motherboard unit 4. The protective ring 41 is provided with mounting grooves 411, and its function is to fix and support the circuit board 42. The two sides of the circuit board 42 are snap-fitted in the mounting grooves 411, which is convenient for installation and removal.

[0058] In a possible implementation, in order to increase the degree of firmness with which the circuit board 42 is mounted on the protective ring 41 , the circuit board 42 may be fixed on the protective ring 41 by combining snap-fit ​​fixing with bolt fixing.

[0059] As a preferred embodiment, Figure 3 and Figure 4As shown, the cap 3 includes a cap seat 31 and a cap rod 32, the cap rod 32 is fixed on the cap seat 31, the cap rod 32 is connected to the connecting rod 232, the cap seat 31 is provided with a third external thread, one end of the shell 1 is provided with a third internal thread, and the third internal thread is adapted to the third external thread. The threaded connection between the cap seat 31 and the shell 1 not only provides a stable mechanical connection, but also allows the cap seat 31 to be easily disassembled when necessary, which is convenient for the later maintenance, repair and replacement of internal components of the temperature vibration sensor; when the cap seat 31 needs to be disassembled, it can be easily separated from the shell 1 by rotating the cap seat 31 in the opposite direction. The detachable design improves the flexibility of the sensor, and the sensor product with faulty components can be quickly replaced to reduce downtime and improve production efficiency.

[0060] As a preferred embodiment, Figure 5 As shown, the injection ring 21 is provided with a sensor installation cavity 212, which is interconnected with the cavity 211. The interconnected form of the sensor installation cavity 212 and the cavity 211 facilitates the arrangement of cables; the sensor installation cavity 212 is detachably connected with a mounting plate 213. According to the above technical solution, the sensor installation cavity 212 is provided for mounting a sensor element, such as a temperature sensor, a vibration sensor, etc., and the mounting plate 213 is used to protect the sensor element placed in the sensor installation cavity 212.

[0061] The mainboard unit 4, the first abutment unit 22 and the second abutment unit 23 of the utility model can be detachably mounted on the injection molding ring 21. When the mainboard unit 4 is damaged due to long-term use or environmental factors or needs to be upgraded, the cap 3 and the first abutment unit 22 and the second abutment unit 23 can be removed to quickly replace or upgrade the new mainboard unit 4 without replacing the entire sensor. This not only reduces maintenance costs, but also improves the flexibility and reusability of the sensor, and helps to extend the overall service life of the temperature vibration sensor working in the silo.

[0062] The above embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Any equivalent substitution or modification made by a person skilled in the art based on the present invention is within the protection scope of the present invention.

Claims

1. A temperature vibration sensor, characterized in that: include: A housing (1) and a built-in unit (2), wherein the built-in unit (2) is arranged inside the housing (1); A cover cap (3) used for connecting to the housing (1); one end of the cover cap (3) extends into the housing (1) and is detachably connected to the built-in unit (2); The built-in unit (2) comprises an injection molding ring (21), a first abutment unit (22) and a second abutment unit (23); the first abutment unit (22) and the second abutment unit (23) are detachably mounted on the injection molding ring (21); A cavity (211) is provided in the injection molding ring (21), and both ends of the injection molding ring (21) are open, and a mainboard unit (4) is placed in the cavity (211); The first abutment unit (22) and the second abutment unit (23) extend from two ends of the injection ring (21) into the cavity (211) and are used to fix the mainboard unit (4).

2. The temperature vibration sensor according to claim 1, characterized in that: The first abutment unit (22) comprises a first abutment block (221), a first connecting block (222) and a second connecting block (223); the first abutment block (221) is connected to the first connecting block (222); the second connecting block (223) is connected to the injection molding ring (21); and the second connecting block (223) can drive the first abutment block (221) to move along the length direction of the injection molding ring (21).

3. The temperature vibration sensor according to claim 2, characterized in that: The first abutment block (221) comprises an abutment portion (2211) and a connection portion (2212); the abutment portion (2211) is arranged in the cavity (211); The connecting portion (2212) extends out of the cavity (211), and a first external thread is provided on the outer periphery of the connecting portion (2212), and a second external thread is provided on one end of the injection molding ring (21); The second connection block (223) is a hollow structure with openings at both ends. The second connection block (223) is provided with a first internal thread and a second internal thread, the first internal thread is adapted to the first external thread, and the second internal thread is adapted to the second external thread.

4. The temperature vibration sensor according to claim 3, characterized in that: The second abutment unit (23) comprises a second abutment block (231) and a connecting rod (232), wherein the connecting rod (232) is connected to the injection molding ring (21); One end of the connecting rod (232) extends into the cavity (211) and is detachably connected to the second abutment block (231).

5. The temperature vibration sensor according to claim 4, characterized in that: A first connection hole is provided on a side of the injection molding ring (21) facing the connection rod (232), and a second connection hole (2321) is provided on the connection rod (232), and the first connection hole corresponds to the second connection hole (2321); It also includes a fastener, which passes through the first connecting hole and the second connecting hole (2321) and is used to fix the injection ring (21) and the connecting rod (232).

6. The temperature vibration sensor according to claim 5, characterized in that: The mainboard unit (4) comprises a protective ring (41) and a circuit board (42) arranged in the protective ring (41); the circuit board (42) is detachably connected to the protective ring (41).

7. The temperature vibration sensor according to claim 6, characterized in that: A mounting groove (411) is provided in the protection ring (41), and two sides of the circuit board (42) are engaged in the mounting groove (411).

8. The temperature vibration sensor according to claim 4, characterized in that: The cap (3) comprises a cap seat (31) and a cap rod (32); the cap rod (32) is fixed on the cap seat (31); and the cap rod (32) is connected to the connecting rod (232).

9. The temperature vibration sensor according to claim 8, characterized in that: The cap seat (31) is provided with a third external thread, and the housing (1) is provided with a third internal thread, the third internal thread being adapted to match the third external thread.

10. The temperature vibration sensor according to any one of claims 1 to 9, characterized in that: The injection molding ring (21) is provided with a sensor installation cavity (212), the sensor installation cavity (212) and the cavity (211) are in communication with each other; and a mounting plate (213) is detachably connected to the sensor installation cavity (212).

Images