Integrated heat dissipation module convenient to disassemble and assemble
By designing an integrated heat dissipation module that is easy to disassemble and assemble, it is quickly fixed and installed on the motherboard by using a gear system, which solves the problem of installation in the prior art and achieves the effect of rapid installation and disassembly.
Patent Information
- Application Number
- CN202421810622.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-30
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2034-07-30
AI Technical Summary
The existing heat dissipation module requires multiple screws during installation and disassembly and needs to be supported by another hand, which makes it inconvenient to quickly fix the installation.
An integrated heat dissipation module is designed for easy disassembly and assembly. By setting screws, positioning plates, gears and knobs on the heat dissipation module and mounting frame, four sets of screws are quickly inserted into the positioning plate through the gear system, and thus fixedly installed on the motherboard.
It reduces the time for the heat dissipation module to be installed on the motherboard, facilitates quick installation and disassembly, reduces the squeeze pressure on the motherboard, and avoids scratches through rubber protective pads.
Smart Images

Figure CN222867053U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation, in particular to an integrated heat dissipation module which is easy to disassemble and assemble. Background Art
[0002] The central processing unit, graphics card, etc. are important components of the computer. They generate a lot of heat when they are running. If this heat cannot be dissipated in time, it will affect the performance of the device and even cause damage to the device itself, affecting the service life of the device. In order to dissipate the heat of devices with high heat generation, a heat dissipation device is generally provided for them. A cooling fan is a commonly used heat dissipation device. They accelerate the air flow around the heat-generating device, thereby taking away the heat generated during the operation of the heat-generating device. Existing heat dissipation modules are usually fixed by gluing or screws. When installing and disassembling the heat dissipation module, the installation method using screws requires the use of multiple screws to install and tighten one by one, and the other hand is required to support the installation of the screws on the heat dissipation module, which is not convenient for fast fixing and installing the heat dissipation module. For this reason, we propose an integrated heat dissipation module that is easy to disassemble and assemble to solve the above problems. Utility Model Content
[0003] The purpose of the utility model is to provide an integrated heat dissipation module that is easy to disassemble and assemble, so as to solve the problem that when installing with screws proposed in the above background technology, multiple screws need to be used one by one to install and tighten, and the heat dissipation module needs to be supported by another hand when installing the screws.
[0004] To achieve the above object, the utility model provides the following technical solution: an integrated heat dissipation module that is easy to disassemble and assemble, comprising a heat dissipation module and a first mounting frame, wherein the first mounting frame is mounted at a height on the rear side of the heat dissipation module.
[0005] A second mounting frame is movably mounted at the front end of the heat dissipation module, four groups of screws are fixedly mounted on the second mounting frame, four groups of through holes are opened on the first mounting frame, a locking assembly is arranged on the rear side of the first mounting frame, the locking assembly is fitted with the rear side of the mainboard, and the rear ends of the four groups of screws are connected to the locking assembly.
[0006] Preferably, the locking assembly includes a positioning plate, which is movably mounted on the rear end of multiple groups of screw rods, and four groups of first gears are rotatably mounted in the positioning plate, and the four groups of first gears are threadedly sleeved on the rear end of the four groups of screw rods, and a second gear is rotatably mounted in the positioning plate, and the second gear is meshed with the four groups of first gears, and a knob is fixedly mounted on the rear side of the second gear.
[0007] Preferably, the rear ends of the four groups of screw rods are all sleeved with springs, the rear ends of the four groups of screw rods are all sleeved with gaskets, and the four groups of springs and the four groups of gaskets are all located at the rear side of the first mounting frame.
[0008] Preferably, protective pads are glued to the rear sides of the four groups of gaskets and the front sides of the positioning plates, and the four groups of protective pads are all made of rubber material.
[0009] Preferably, a through opening is provided in the second mounting frame, the through opening is located at the front side of the heat dissipation module, and the through opening is in contact with the front side of the heat dissipation module.
[0010] Preferably, two groups of card slots are provided at the right end of the second mounting frame, and the opening widths of the right ends of the two groups of card slots are smaller than the diameter widths of the inner walls of the two groups of card slots.
[0011] Compared with the prior art, the beneficial effect of the utility model is as follows: when the utility model installs the heat dissipation module and the first mounting frame on the computer motherboard, the four sets of screws on the rear side of the second mounting frame pass through the first mounting frame, and the positioning plate is fitted with the rear side of the motherboard. When the four sets of screws are inserted into the positioning plate, the second gear drives the four sets of first gears to rotate and sleeve on the rear ends of the four sets of screws, so that the heat dissipation module and the first mounting frame can be fixedly installed on the computer motherboard, reducing the time required for installing the heat dissipation module and the first mounting frame on the computer motherboard using multiple sets of screws, and facilitating the rapid installation and disassembly of the heat dissipation module and the first mounting frame. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0013] Figure 1 It is a schematic diagram of the structure of the utility model;
[0014] Figure 2 It is a schematic diagram of the structure of the utility model from the right side;
[0015] Figure 3 It is a rear cross-sectional schematic diagram of the structure of the utility model;
[0016] Figure 4 For this utility model Figure 2 A is a partial enlarged schematic diagram of the middle part.
[0017] In the figure: 1. heat dissipation module; 2. first mounting frame; 3. second mounting frame; 4. through port; 5. screw; 6. positioning plate; 7. through hole; 8. first gear; 9. second gear; 10. knob; 11. spring; 12. gasket; 13. protective pad; 14. slot. DETAILED DESCRIPTION
[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0019] See also Figure 1-4 The utility model provides an embodiment: an integrated heat dissipation module that is easy to disassemble and assemble, comprising a heat dissipation module 1 and a first mounting frame 2, wherein the first mounting frame 2 is highly mounted on the rear side of the heat dissipation module 1,
[0020] A second mounting frame 3 is movably mounted at the front end of the heat dissipation module 1, and four sets of screws 5 are fixedly mounted on the second mounting frame 3. Four sets of through holes 7 are opened on the first mounting frame 2. A locking assembly is arranged at the rear side of the first mounting frame 2, and the locking assembly is fitted with the rear side of the motherboard. The rear ends of the four sets of screws 5 are connected to the locking assembly. The heat dissipation module 1 and the first mounting frame 2 can be quickly mounted on the computer motherboard by passing the four sets of screws 5 at the rear side of the second mounting frame 3 through the first mounting frame 2, and the rear ends of the four sets of screws 5 are inserted into the locking assembly. The heat dissipation module 1 and the first mounting frame 2 are closely fitted with the chip.
[0021] Furthermore, the locking assembly includes a positioning plate 6, which is movably mounted on the rear end of the multiple groups of screws 5. Four groups of first gears 8 are rotatably mounted in the positioning plate 6, and the four groups of first gears 8 are threadedly sleeved on the rear end of the four groups of screws 5. A second gear 9 is rotatably mounted in the positioning plate 6, and the second gear 9 is meshed with the four groups of first gears 8. A knob 10 is fixedly mounted on the rear side of the second gear 9. After this structure aligns the rear end of the four groups of screws 5 with the positioning plate 6, the four groups of first gears 8 are driven to rotate on the rear end of the four groups of screws 5 by rotating the second gear 9, so that the rear end of the four groups of screws 5 can be inserted into the positioning plate 6, thereby quickly fixing the heat dissipation module 1 and the first mounting frame 2 on the computer motherboard, reducing the time required for installing the heat dissipation module 1 and the first mounting frame 2.
[0022] Furthermore, springs 11 are sleeved on the rear ends of the four groups of screws 5, and gaskets 12 are sleeved on the rear ends of the four groups of screws 5. The four groups of springs 11 and the four groups of gaskets 12 are all located on the rear side of the first mounting frame 2. When the heat dissipation module 1 and the first mounting frame 2 are installed on the computer motherboard through the four groups of springs 11 and the four groups of gaskets 12, the squeezing force of the heat dissipation module 1 and the first mounting frame 2 on the chip on the computer motherboard is reduced.
[0023] Furthermore, protective pads 13 are glued to the rear side of the four groups of gaskets 12 and the front side of the positioning plate 6. The four groups of protective pads 13 are all made of rubber material. This structure prevents the four groups of springs 11 and the positioning plate 6 from being squeezed and scratched when they are fitted to the computer motherboard through the protective pads 13 glued to the rear side of the four groups of gaskets 12 and the front side of the positioning plate 6.
[0024] Furthermore, a through opening 4 is opened in the second mounting frame 3, and the through opening 4 is located on the front side of the heat dissipation module 1. The through opening 4 is in contact with the front side of the heat dissipation module 1. This structure allows the front end of the heat dissipation module 1 to be viewed through the through opening 4, which is convenient for using the heat dissipation module 1 with a display screen.
[0025] Furthermore, two groups of card slots 14 are provided at the right end of the second mounting frame 3, and the opening width of the right ends of the two groups of card slots 14 is smaller than the diameter width of the inner walls of the two groups of card slots 14. This structure clamps the water-cooling pipes connected to the heat dissipation module 1 through the two groups of card slots 14 to avoid the water-cooling pipes on the heat dissipation module 1 being too messy during installation.
[0026] Working principle: When installing the heat dissipation module 1, Figure 2 , Figure 3 and Figure 4 As shown, first, the four groups of screws 5 on the rear side of the second mounting frame 3 are passed through the four groups of through holes 7 on the first mounting frame 2, and the four groups of springs 11 and the four groups of gaskets 12 are sleeved on the rear ends of the four groups of screws 5. Then, the rear ends of the four groups of screws 5 are inserted into the computer motherboard, and the heat dissipation module 1 and the rear sides of the first mounting frame 2 are fitted with the chip on the computer motherboard, and the positioning plate 6 is fitted with the rear side of the computer motherboard. The rear ends of the four groups of screws 5 on the rear side of the second mounting frame 3 are inserted into the positioning plate 6, and the knob 10 is turned to drive the second gear 9 to rotate. The rotation of the second gear 9 drives the four groups of first gears 8 to rotate, and the four groups of first gears 8 are sleeved on the rear ends of the four groups of screws 5 inserted into the positioning plate 6 in the positioning plate 6, so that the second mounting frame 3 can be fixedly connected with the positioning plate 6, and the heat dissipation module 1 and the first mounting frame 2 can be quickly installed on the computer motherboard. The above is the entire working principle of the utility model.
[0027] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-limiting from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.
Claims
1. An integrated heat dissipation module that is easy to disassemble and assemble, comprising a heat dissipation module (1) and a first mounting frame (2), wherein the first mounting frame (2) is mounted at a height on the rear side of the heat dissipation module (1), characterized in that: A second mounting frame (3) is movably mounted on the front end of the heat dissipation module (1), four groups of screw rods (5) are fixedly mounted on the second mounting frame (3), four groups of through holes (7) are opened on the first mounting frame (2), a locking component is arranged on the rear side of the first mounting frame (2), the locking component is fitted with the rear side of the mainboard, and the rear ends of the four groups of screw rods (5) are connected to the locking component.
2. The integrated heat dissipation module that is easy to disassemble and assemble according to claim 1, characterized in that: The locking assembly comprises a positioning plate (6), the positioning plate (6) being movably mounted on the rear ends of the plurality of screw rods (5), four groups of first gears (8) being rotatably mounted in the positioning plate (6), the four groups of first gears (8) being threadedly sleeved on the rear ends of the four groups of screw rods (5), a second gear (9) being rotatably mounted in the positioning plate (6), the second gear (9) being meshed with the four groups of first gears (8), and a knob (10) being fixedly mounted on the rear side of the second gear (9).
3. The integrated heat dissipation module that is easy to assemble and disassemble according to claim 1, characterized in that: The rear ends of the four groups of screw rods (5) are sleeved with springs (11), the rear ends of the four groups of screw rods (5) are sleeved with washers (12), and the four groups of springs (11) and the four groups of washers (12) are all located at the rear side of the first mounting frame (2).
4. The integrated heat dissipation module that is easy to disassemble and assemble according to claim 3 is characterized in that: The rear sides of the four groups of gaskets (12) and the front sides of the positioning plates (6) are all glued with protective pads (13), and the four groups of protective pads (13) are all made of rubber material.
5. The integrated heat dissipation module that is easy to disassemble and assemble according to claim 1, characterized in that: A through opening (4) is provided in the second mounting frame (3), the through opening (4) is located at the front side of the heat dissipation module (1), and the through opening (4) is in contact with the front side of the heat dissipation module (1).
6. The integrated heat dissipation module that is easy to disassemble and assemble according to claim 1, characterized in that: Two groups of card slots (14) are arranged at the right end of the second mounting frame (3), and the width of the openings at the right ends of the two groups of card slots (14) is smaller than the width of the inner wall diameters of the two groups of card slots (14).