Air guide component and server

Abstract

The utility model discloses an air guide component and a server, and relates to the technical field of servers, the air guide component is arranged on a plate assembly, the air guide component comprises an air baffle set and an air guide plate set, the air baffle set is arranged on the side, away from the plate assembly, of the air guide plate set and connected with the air guide plate set, and the air guide plate set comprises an air guide channel; an air outlet of the air guide channel faces a to-be-cooled part on the plate assembly, the air baffle set is provided with a windward side, and airflow reaching the windward side is blocked by the windward side and then flows to the to-be-cooled part through the air guide channel; the problem that the unused memory slot area of the server cannot properly guide the heat dissipation air flow in the related technology is at least solved, and the heat dissipation air flow is prevented from directly flowing away in the direction of the air baffle plate group and finally being lost; and the technical effect of meeting the heat dissipation requirement of the to-be-cooled part, close to the plate surface of the plate assembly, on the plate assembly is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of servers, and in particular to an air guide component and a server. Background Art

[0002] In the field of server technology, especially for two-way or multi-way server systems with multiple processors and a large number of memory slots, heat dissipation management is a key factor in ensuring stable operation of the server and extending the life of the equipment. When the server is running, the processor and memory module will generate a lot of heat, which needs to be dissipated in a timely and effective manner to avoid affecting the performance and stability of the server.

[0003] When the server is configured in single-processor mode, the unused memory slot area will not be able to properly direct the cooling airflow. If not properly managed, the airflow may gather in this area instead of flowing to the high-power components at the back end that need cooling, such as PCIe cards, etc., resulting in uneven cooling within the server, thereby affecting the overall efficiency of the server. Utility Model Content

[0004] The present application provides an air guide component and a server, so as to at least solve the problem in the related art that the unused memory slot area of ​​the server cannot properly guide the heat dissipation airflow.

[0005] The present application provides an air guide component, which is arranged on a plate assembly. The air guide component includes an air shield plate group and an air guide plate group. The air shield plate group is arranged on a side of the air guide plate group away from the plate assembly and is connected to the air guide plate group. The air guide plate group includes an air guide channel. The air outlet of the air guide channel is arranged toward the heat dissipation component to be cooled on the plate assembly. The air shield plate group has a windward surface. The airflow reaching the windward surface flows to the heat dissipation component to be cooled through the air guide channel after being blocked by the windward surface.

[0006] Furthermore, the air guide component is an injection molded part, and the air guide component is integrally formed.

[0007] Furthermore, the wind shield group includes a first baffle and two second baffles, the first baffle extends along the first direction, and the second baffle is arranged at a predetermined angle to the first baffle; the two second baffles are arranged at intervals along the first direction and are located on the same side of the first baffle, and the first ends of the two second baffles are respectively connected to the two ends of the first baffle.

[0008] Furthermore, the two second baffles are located on the side of the first baffle close to the windward direction; and / or each second baffle extends along a second direction, which is perpendicular to the first direction; and / or the first baffle and each second baffle are perpendicular to the board surface of the board assembly.

[0009] Further, the predetermined angle is an acute angle or an obtuse angle; and / or the first baffle plate and the second baffle plate are both inclined to the plate surface of the plate assembly.

[0010] Furthermore, the air guide plate group includes a plurality of side plates extending along the second direction, the plurality of side plates are arranged at intervals along the first direction, and an air guide channel is formed between any two adjacent side plates.

[0011] Furthermore, the end of the side panel is used to be plugged into or separated from the installation slot on the installation component located on the plate assembly for installing the air guide component, and a card slot is provided on the side panel, and the card slot is used to be plugged into or separated from the buckle on the installation component.

[0012] Furthermore, the wind guide plate group also includes a supporting vertical plate extending along the first direction, the supporting vertical plate is located on the side of the wind shield plate group close to the plate assembly, the supporting vertical plate is perpendicular to the plate surface of the plate assembly, and a plurality of side plates divide the supporting vertical plate into a plurality of supporting sub-plates arranged at intervals along the first direction; wherein each supporting sub-plate is provided with ventilation holes.

[0013] Furthermore, the air guide plate group also includes a supporting bottom plate arranged at one end of the supporting vertical plate close to the plate assembly, and the supporting bottom plate is parallel to the plate surface of the plate assembly.

[0014] Furthermore, each side panel includes a first panel segment and a second panel segment located on opposite sides of the wind shield group, and the first panel segment and the second panel segment are connected in sequence along the second direction; wherein, one end of the first panel segment away from the second panel segment and one end of the second panel segment away from the first panel segment are respectively used to be plugged into or separated from two oppositely arranged mounting grooves on the mounting component, and one end of the first panel segment away from the second panel segment is provided with a card slot, and one end of the second panel segment away from the first panel segment is provided with a card slot.

[0015] Furthermore, the wind guide plate group also includes a wind guide plate arranged between two adjacent side plates, the wind guide plate is located on the leeward side of the wind shielding plate group, and the wind guide plate extends toward the heat element to be cooled.

[0016] Further, the multiple side panels include a first side panel and a second side panel arranged at intervals along a first direction to form a first wind guide channel, a second wind guide channel and a third wind guide channel arranged at intervals along the first direction; the wind guide plate group also includes: a first wind guide plate, the first wind guide plate is arranged on a side of the first side panel away from the second side panel to form a first wind guide channel; and / or a second wind guide plate, the second wind guide plate is arranged between the first side panel and the second side panel to form a second wind guide channel.

[0017] Further, the first wind guide plate extends in a direction away from the wind shield plate group, and at least a portion of the first wind guide plate is inclined to the plate surface of the plate assembly, so that the flow area of ​​the first wind guide channel gradually increases in the direction approaching the wind shield plate group; and / or the second wind guide plate extends in a direction away from the wind shield plate group, and at least a portion of the second wind guide plate is inclined to the plate surface of the plate assembly, so that at least a portion of the flow area of ​​the second wind guide channel gradually increases in the direction approaching the wind shield plate group; and / or the width of the second wind guide plate gradually decreases in the direction away from the wind shield plate group.

[0018] Furthermore, the first end of the second air guide plate is connected to the first side plate, and the second end of the second air guide plate is spaced apart from the second side plate; the air guide plate group also includes an air guide support plate, which is located on the side of the second air guide plate close to the plate assembly and is connected to the second end of the second air guide plate, and the air guide support plate divides the second air guide channel into two channel sections.

[0019] Further, at least a portion of the wind guide support plate is inclined to the first side plate, and a distance between at least a portion of the wind guide support plate and the first side plate gradually increases in a direction approaching the wind shielding plate group.

[0020] Furthermore, a positioning hole is provided on the second air guide plate for being connected to or separated from a guide positioning pin on the plate assembly.

[0021] Furthermore, the wind guide component also includes an intermediate plate, which extends from the windward side of the wind shield plate group to the leeward side of the wind shield plate group, and the intermediate plate is located between the wind shield plate group and the wind guide plate group.

[0022] Furthermore, an avoidance groove is provided on the side panel, which is located on the side of the card slot close to the plate assembly; and / or an insertion protrusion is provided on one end of the side panel close to the plate assembly, which is used to plug in or separate from a groove on an installation component located on the plate assembly for installing an air guide component.

[0023] The present application also provides a server, including a board assembly and the above-mentioned air guide component, wherein the air guide component is arranged on the board assembly.

[0024] Furthermore, a plurality of memory sockets are arranged at intervals on the board assembly, and the air guide component is arranged on at least one of the memory sockets.

[0025] Through the present application, since the wind guide component arranged on the plate assembly includes a wind shield plate group and a wind guide plate group, the wind shield plate group is arranged on the side of the wind guide plate group away from the plate assembly and is connected to the wind guide plate group, the wind guide plate group includes an wind guide channel, and the air outlet of the wind guide channel is arranged toward the heat dissipation component to be cooled on the plate assembly, and the wind shield plate group has a windward surface, and the airflow reaching the windward surface flows to the heat dissipation component to be cooled through the wind guide channel after being blocked by the windward surface. In this way, the air guide component of the present application integrates the wind shielding and wind guiding functions, realizes the guidance and control of the airflow, and enables the airflow to flow more effectively to the heat dissipation components to be cooled that need heat dissipation, ensures that the airflow is concentrated on the high-power consumption heating components, improves the heat dissipation efficiency, and solves the problem in the related technology that the unused memory slot area of ​​the server cannot properly guide the heat dissipation airflow, thereby achieving the technical effect of preventing the heat dissipation airflow from flowing directly toward the direction of the wind shield plate group and finally dissipating, and meeting the heat dissipation requirements of the heat dissipation components on the board surface closer to the board assembly on the board assembly, so that the server system can dissipate heat more evenly and efficiently during operation, thereby improving the heat dissipation efficiency and stability of the server, which not only simplifies maintenance operations and improves usability, but also significantly reduces material costs. It can be widely used in server products of various specifications, thereby enhancing the market competitiveness of servers. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 A schematic diagram of the structure of an air guide component in one direction provided in an embodiment of the present application;

[0028] Figure 2 for Figure 1 A schematic diagram of the structure of the air guide component shown in another direction;

[0029] Figure 3 The embodiments of the present application include Figure 1 The structural diagram of the server of the air guide component shown is when the chassis is not included;

[0030] Figure 4 for Figure 3 The structure diagram of the server shown includes a chassis.

[0031] The above drawings include the following reference numerals:

[0032] 1. Windshield assembly; 11. First baffle; 12. Second baffle;

[0033] 2. Wind guide plate group; 20. Wind guide channel; 201. First wind guide channel; 202. Second wind guide channel; 203. Third wind guide channel; 21. Side plate; 210. Card slot; 211. First side plate; 212. Second side plate; 2101. First plate section; 2102. Second plate section; 2103. Avoidance slot; 213. Insertion convex part; 22. Support vertical plate; 221. Support sub-plate; 222. Ventilation hole; 23. Support bottom plate; 24. Wind guide plate; 241. First wind guide plate; 242. Second wind guide plate; 2420. Positioning hole; 25. Wind guide support plate;

[0034] 3. Middle plate;

[0035] 100, board assembly; 200, air guide component; 300, memory socket; 400, guide positioning pin; 500, buckle; 600, processor; 700, memory; 800, chassis. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0037] It should be noted that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. The terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. The terms "parallel", "perpendicular" and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement being discussed and the errors associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either one. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0038] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0039] like Figures 1 to 4As shown, the present application provides a wind guide component, which is arranged on a plate assembly, and the wind guide component includes a wind shield plate group 1 and a wind guide plate group 2, the wind shield plate group 1 is arranged on a side of the wind guide plate group 2 away from the plate assembly and is connected to the wind guide plate group 2, the wind guide plate group 2 includes an wind guide channel 20, and an air outlet of the wind guide channel 20 is arranged toward the heat dissipation component to be cooled on the plate assembly, the wind shield plate group 1 has a windward surface, and the airflow reaching the windward surface flows to the heat dissipation component to be cooled through the wind guide channel 20 after being blocked by the windward surface. In this way, the air guide component of the present application integrates the wind shielding and wind guiding functions, realizes the guidance and control of the airflow, and enables the airflow to flow more effectively to the heat dissipation parts to be cooled that need heat dissipation, ensures that the airflow flows concentratedly to the high-power consumption heating elements, improves the heat dissipation efficiency, and avoids the heat dissipation airflow directly flowing toward the direction of the wind shield plate group 1 and finally dissipating, meets the heat dissipation requirements of the heat dissipation parts on the board assembly that are closer to the board assembly, and solves the problem in the related technology that the unused memory slot area of ​​the server cannot properly guide the heat dissipation airflow, thereby replacing the processor and memory when the processor and memory are not set in the area where the memory socket is located to achieve auxiliary heat dissipation of the heat dissipation parts at a lower position, so that the server system can dissipate heat more evenly and efficiently during operation, thereby improving the heat dissipation efficiency and stability of the server, which not only simplifies maintenance operations and improves usability, but also significantly reduces material costs. It can be widely used in server products of various specifications, thereby enhancing the market competitiveness of the server.

[0040] The main application scenarios of the air guide component of the present application include data centers, cloud computing servers, high-performance computing servers, etc., and are particularly suitable for high-density, low-production-cost, and high-power-consumption server environments. By optimizing the airflow, it can effectively improve the heat dissipation performance and ensure the long-term and stable operation of the server.

[0041] Specifically, the air guide component is an injection molded part, and the air guide component is integrally formed, that is, the wind shield plate group 1 and the air guide plate group 2 are combined into a whole by using an injection molding process, which simplifies the manufacturing process, improves the manufacturing efficiency of the air guide component, reduces the difficulty of disassembly and assembly, and at the same time ensures the structural stability and consistency of the air guide component, reduces the production cost, and can be produced quickly and in large quantities to meet the needs of large-scale deployment of servers, while reducing maintenance and replacement costs.

[0042] like Figure 1 and Figure 2 As shown, the wind shield group 1 includes a first baffle 11 and two second baffles 12. The first baffle 11 extends along the first direction, and the second baffle 12 is arranged at a predetermined angle to the first baffle 11; the two second baffles 12 are arranged at intervals along the first direction and are located on the same side of the first baffle 11, and the first ends of the two second baffles 12 are respectively connected to the two ends of the first baffle 11.

[0043] The wind shield plate group 1 of the wind guide component of the present application utilizes a combination of a first baffle plate 11 and a second baffle plate 12 to form a stable wind guide structure, which can effectively block and guide the airflow, and at the same time optimize the flow direction of the airflow by setting a predetermined angle. When the airflow passes through the wind shield plate group, it can be effectively guided, reducing the disordered flow of the airflow and improving the cooling effect on the heat sink.

[0044] Specifically, by reasonably setting the positions and angles of the first baffle 11 and the second baffle 12, it is possible to adapt to different internal structures of servers, achieve optimal distribution of airflow, and ensure the heat dissipation requirements of the servers.

[0045] like Figure 1 and Figure 2 As shown, the two second baffles 12 are located on the side of the first baffle 11 close to the windward direction; and / or each second baffle 12 extends along the second direction, which is perpendicular to the first direction; and / or the first baffle 11 and each second baffle 12 are perpendicular to the plate surface of the plate assembly 100.

[0046] The present application precisely controls the direction of the airflow by setting the position and direction of the first baffle 11 and the second baffle 12, further optimizes the guidance of the airflow, ensures that the airflow can be perpendicular to the wind shield group 1, contact the wind shield group 1 and be stopped, and then be guided by the wind shield group 1 to the air guide plate group 2, and flow to the corresponding heat dissipation component to be cooled through the air guide channel 20 of the air guide plate group 2, thereby reducing the loss of the heat dissipation airflow and improving the heat dissipation efficiency, thereby improving the overall performance of the server and ensuring the stable operation of the server under high load.

[0047] In an embodiment not shown in the figure of the present application, the predetermined angle is an acute angle or an obtuse angle; and / or the first baffle 11 and the second baffle 12 are both inclined to the board surface of the board assembly 100. In this way, by using the inclined structural setting, by controlling the size of the predetermined angle, the airflow guide is precisely adjusted, and the airflow can be better stopped and guided, so that the airflow can more effectively cover and cool the heat dissipation component, so that the server can achieve more efficient and uniform heat dissipation when running, reduce the system temperature, and improve the system performance.

[0048] like Figure 1 and Figure 2As shown, the air guide plate group 2 includes a plurality of side plates 21 extending along the second direction, and the plurality of side plates 21 are arranged at intervals along the first direction, and an air guide channel 20 is formed between any two adjacent side plates 21. In this way, the plurality of air guide channels 20 are formed by using the plurality of side plates 21 arranged at intervals, so that multi-path flow diversion and guidance of the airflow is realized. When the airflow passes through the air guide plate group 2, it can be effectively distributed to the plurality of air guide channels 20, so that the heat dissipation of the plurality of heat dissipating parts to be dissipated one by one is realized, the cooling effect of the heat dissipating parts is improved, and the internal structure of different servers can be adapted to realize the optimized distribution of the airflow, and the heat dissipation requirements of the servers are guaranteed.

[0049] like Figure 1 and Figure 2 As shown, the end of the side panel 21 is used to be plugged into or separated from the mounting slot on the mounting component on the board assembly 100 for mounting the air guide component. The side panel 21 is provided with a slot 210, which is used to be engaged with or separated from the buckle 500 on the mounting component. In this way, by using the cooperation between the slot 210 and the buckle, the air guide component can be quickly engaged with or separated from the mounting component on the board assembly 100, which simplifies the installation operation of the air guide component. When the user is performing server maintenance, the air guide component can be quickly and accurately installed or removed, which realizes the rapid installation and removal of the air guide component, simplifies the maintenance operation, improves the maintenance efficiency, is conducive to the on-site maintenance and upgrade of the server, can significantly reduce the maintenance time and cost, and improves the maintainability of the server.

[0050] Specifically, the board assembly 100 is a mainboard, and the mounting component is a memory socket 300 of the board assembly 100 disposed on the board assembly 100 .

[0051] like Figure 1 and Figure 2 As shown, the wind deflector assembly 2 further includes a support vertical plate 22 extending along the first direction, the support vertical plate 22 is located on a side of the wind deflector assembly 1 close to the board assembly 100, the support vertical plate 22 is perpendicular to the board surface of the board assembly 100, and a plurality of side plates 21 divide the support vertical plate 22 into a plurality of support sub-plates 221 spaced apart along the first direction; wherein each support sub-plate 221 is provided with a ventilation hole 222. In this way, through the combination of the support vertical plate 22 and the ventilation hole 222, while providing structural support for the wind deflector assembly 1, the airflow can pass through the ventilation hole 222 from the windward side of the wind deflector assembly 1 to the leeward side when passing through the support sub-plate 221, thereby improving the auxiliary heat dissipation efficiency of the wind deflector component, and ensuring the stability and reliability of the wind deflector component, improving the overall performance of the server, and ensuring the stable operation of the server under high load, while reducing the weight of the overall structure of the server, and improving the mobility and deployment flexibility of the server.

[0052] Optionally, the vent 222 includes a polygonal hole; and / or the vent 222 includes a circular hole; and / or the vent 222 includes an elliptical hole; and / or the vent 222 includes an oblong hole. The diverse form selection of these vents 222, including but not limited to polygonal holes, circular holes, elliptical holes and oblong holes, can optimize the heat dissipation performance of the server system. Ventilation holes of different shapes can specifically adjust the wind resistance and wind flow distribution to ensure that the cold air flows to the high power consumption and heating components to the greatest extent, improve the heat dissipation efficiency, and reduce noise, so that the air guide components can adapt to the aerodynamic requirements inside servers of different specifications, enhance the applicability and competitiveness of the server, achieve effective heat dissipation inside the server, and maintain the stable operation of the server.

[0053] Preferably, the number of ventilation holes 222 on each supporting sub-board 221 is multiple. By providing multiple ventilation holes 222 on each supporting sub-board 221, air circulation is effectively enhanced, the heat dissipation efficiency inside the server is improved, and the airflow can be distributed more evenly to ensure that the cold air can cover each heat dissipation component, especially the high-power consumption component, thereby avoiding local overheating and extending the life of the hardware. At the same time, the provision of multiple ventilation holes 222 also helps to reduce wind resistance, reduce the speed of the server fan, and thus reduce operating noise, create a quieter working environment, significantly improve the thermal performance of the server, and enhance the market competitiveness of the server.

[0054] Specifically, the number, shape and flow area of ​​the ventilation holes 222 on each supporting sub-plate 221 can be set according to different heat dissipation requirements to achieve the best heat dissipation effect.

[0055] like Figure 1 and Figure 2 As shown, the air guide plate group 2 also includes a supporting base plate 23 arranged at one end of the supporting vertical plate 22 close to the plate assembly 100, and the supporting base plate 23 is parallel to the plate surface of the plate assembly 100. Through the setting of the supporting base plate 23, the air guide component can be firmly fixed on the plate assembly 100 after installation, providing bottom support for the air guide component, ensuring the stability and reliability of the air guide component during installation. At the same time, the supporting base plate 23 is parallel to the plate surface of the plate assembly 100, which can reduce the resistance of the airflow during the flow process, improve the penetration of the airflow, and ensure the stability and heat dissipation requirements of the server during operation, while reducing the maintenance and replacement costs of the air guide components and improving the maintainability and reliability of the server.

[0056] like Figure 1 and Figure 2As shown, each side panel 21 includes a first panel segment 2101 and a second panel segment 2102 located on opposite sides of the wind deflector group 1, and the first panel segment 2101 and the second panel segment 2102 are connected in sequence along the second direction; wherein, one end of the first panel segment 2101 away from the second panel segment 2102 and one end of the second panel segment 2102 away from the first panel segment 2101 are respectively used to be plugged into or separated from two oppositely arranged mounting grooves on the mounting component, and one end of the first panel segment 2101 away from the second panel segment 2102 is provided with a card slot 210, and one end of the second panel segment 2102 away from the first panel segment 2101 is provided with a card slot 210.

[0057] In this way, through the connection between the first plate segment 2101 and the second plate segment 2102, the wind shield plate group 1 can be located in the middle position of each side panel 21, thereby improving the stability of the wind guide component and facilitating the operator to take and disassemble the wind guide component. In addition, by respectively providing the card slots 210 on the first plate segment 2101 and the second plate segment 2102, the relative sides of each side panel 21 of the wind guide component can respectively cooperate with the two relatively arranged groups of buckles 500 on the installation component, thereby further improving the stability and reliability of the installation of the wind guide component, which can significantly reduce maintenance time and cost, improve the maintainability of the server, and ensure the efficient operation of the server.

[0058] like Figure 1 and Figure 2 As shown, the air guide plate group 2 also includes an air guide plate 24 arranged between two adjacent side plates 21. The air guide plate 24 is located on the leeward side of the wind shield plate group 1, and the air guide plate 24 extends toward the heat dissipation component. When the airflow passes through the air guide plate group, it can be guided by the air guide plate 24 and flow directly to the heat dissipation component, thereby reducing the disorderly flow of the airflow, achieving further guidance and control of the airflow, ensuring that the airflow can flow directly to the heat dissipation component, improving the cooling effect on the heat dissipation component, and achieving precise guidance of the airflow, thereby ensuring the stable operation of the server under high load, while improving computing efficiency and reducing energy consumption.

[0059] like Figure 1 and Figure 2As shown, the multiple side panels 21 include a first side panel 211 and a second side panel 212 spaced apart along a first direction to form a first wind guide channel 201, a second wind guide channel 202 and a third wind guide channel 203 spaced apart along the first direction; the wind guide plate group 2 also includes: a first wind guide plate 241, the first wind guide plate 241 is arranged on a side of the first side panel 211 away from the second side panel 212 to form the first wind guide channel 201; and / or a second wind guide plate 242, the second wind guide plate 242 is arranged between the first side panel 211 and the second side panel 212 to form the second wind guide channel 202. In this way, by setting the first side panel 211, the second side panel 212 and the first air guide plate 241 and the second air guide plate 242 to form a plurality of air guide channels, when the airflow passes through the air guide plate group, it can be effectively distributed to the plurality of air guide channels, thereby realizing multi-path guidance of the airflow, improving the heat dissipation efficiency, improving the cooling effect of the heat dissipation components, being able to adapt to different internal structures of servers, realizing optimal distribution of the airflow, ensuring the heat dissipation needs of the server, and at the same time improving computing efficiency and reducing energy consumption.

[0060] Specifically, the first air guiding channel 201 , the second air guiding channel 202 and the third air guiding channel 203 can guide air to the PCIe card, power supply and VR chip on the board assembly 100 in a one-to-one correspondence.

[0061] like Figure 1 and Figure 2 As shown, the first wind guide plate 241 extends in a direction away from the wind shield group 1, and at least a portion of the first wind guide plate 241 is inclined to the plate surface of the plate assembly 100, so that the flow area of ​​the first wind guide channel 201 gradually increases in the direction approaching the wind shield group 1; and / or the second wind guide plate 242 extends in a direction away from the wind shield group 1, and at least a portion of the second wind guide plate 242 is inclined to the plate surface of the plate assembly 100, so that at least a portion of the flow area of ​​the second wind guide channel 202 gradually increases in the direction approaching the wind shield group 1; and / or the width of the second wind guide plate 242 gradually decreases in the direction away from the wind shield group 1 and / or the width of the first wind guide plate 241 remains unchanged in the direction away from the wind shield group 1.

[0062] The present application achieves optimized guidance of the airflow by adjusting the inclination angle and width of the first air guide plate 241 and the second air guide plate 242. When the airflow passes through the air guide plate group, it can flow to the heat dissipation component to be cooled along an optimized path, reducing the disordered flow of the airflow, ensuring that the airflow can more effectively cover and cool the heat dissipation component to be cooled, while reducing the airflow resistance and improving the heat dissipation efficiency. It can effectively reduce the temperature of the heat dissipation component to be cooled, ensuring the long-term stable operation of the server, while improving computing efficiency and reducing energy consumption.

[0063] like Figure 1 and Figure 2As shown, the first end of the second air guide plate 242 is connected to the first side plate 211, and the second end of the second air guide plate 242 is spaced from the second side plate 212; the air guide plate group 2 also includes an air guide support plate 25, which is located on the side of the second air guide plate 242 close to the plate assembly 100 and connected to the second end of the second air guide plate 242, and the air guide support plate 25 divides the second air guide channel 202 into two channel sections. In this way, through the combination of the second air guide plate 242 and the air guide support plate 25, further guidance and control of the airflow is achieved. When the airflow passes through the second air guide plate 242 and the air guide support plate 25, it can be effectively distributed to the two channel sections, achieving uniform distribution of the airflow, ensuring that the airflow can flow to the heat dissipation element more evenly, while reducing the airflow resistance, improving the cooling effect on the heat dissipation element, improving the heat dissipation efficiency, and ensuring the stable operation of the server under high load.

[0064] like Figure 1 and Figure 2 As shown, at least a portion of the air guide support plate 25 is inclined to the first side plate 211, and the distance between at least a portion of the air guide support plate 25 and the first side plate 211 gradually increases in the direction approaching the wind shield plate group 1, further realizing the optimized guidance of the airflow. When the airflow passes through the air guide support plate 25, it can flow to the heat dissipation component to be cooled along an optimized path, reducing the disordered flow of the airflow, ensuring that the airflow can more effectively cover and cool the heat dissipation component to be cooled, and at the same time reducing the airflow resistance, improving the heat dissipation efficiency, and being able to effectively reduce the temperature of the heat dissipation component to be cooled, thereby ensuring the long-term stable operation of the server.

[0065] In the embodiment not shown in the figure of the present application, the width of the second air guide plate 242 remains unchanged in the direction away from the wind shield group 1, and the air guide support plate 25 is parallel to the first side plate 211. The constant design of the width of the second air guide plate 242 of the present application ensures the stability of the airflow guidance from the processor to the heat dissipation channel, avoids the turbulence of the airflow at the bend, thereby improving the fluid dynamics efficiency of the air duct, ensuring that the airflow can effectively and evenly cover the high-power consumption components, and improving the heat dissipation performance. In addition, the layout of the air guide support plate 25 parallel to the first side plate 211 further promotes the straight-line flow of air, reduces the generation of vortices, reduces wind resistance, and enables the fan to achieve an ideal cooling effect at a lower power, thereby reducing energy consumption, reducing operating noise, and optimizing the thermal management and operating environment of the server.

[0066] like Figure 1 and Figure 2As shown, a positioning hole 2420 is provided on the second air guide plate 242 for connecting or separating with the guide positioning pin 400 located on the plate assembly 100. Through the cooperation of the positioning hole 2420 and the guide positioning pin 400, when the operator is performing server maintenance, the air guide component can be quickly and accurately installed or removed, thereby realizing rapid positioning and disassembly of the air guide component, simplifying maintenance operations, improving maintenance efficiency, facilitating on-site maintenance and upgrading of the server, and can significantly reduce maintenance time and cost, improve the maintainability of the server, and ensure efficient operation of the server.

[0067] Specifically, the guide positioning pin 400 is a component used to position the processor 600 of the board assembly 100 .

[0068] Optionally, the positioning hole 2420 is an oblong hole; or the positioning hole 2420 is a round hole; or the positioning hole 2420 is a polygonal hole. The multi-form design of the positioning hole 2420 of the present application, including an oblong hole, a round hole or a polygonal hole, provides flexibility and positioning accuracy during installation. Among them, the oblong hole allows position adjustment within a certain range, which is convenient for aligning parts that are difficult to accurately match and simplifies the assembly process; the round hole and the polygonal hole can ensure a stable connection. This ensures that the windshield simulation block is accurately fixed inside the server, avoids airflow blockage or uneven heat dissipation due to position offset, thereby optimizing the overall thermal management effect and improving system stability and maintenance efficiency.

[0069] like Figure 1 and Figure 2 As shown, the wind guide component also includes an intermediate plate 3, which extends from the windward side of the wind shield group 1 to the leeward side of the wind shield group 1. The intermediate plate 3 is located between the wind shield group 1 and the wind guide plate group 2, so that the wind shield group 1 and the wind guide plate group 2 can be stably connected, thereby improving the structural strength and stability of the wind guide component, and can further effectively guide the airflow, optimize the heat dissipation path, ensure that the airflow can flow from the air guide channel 20 of the air guide plate group 2 to the heat dissipation component to be dissipated, and at the same time reduce the airflow resistance, improve the heat dissipation efficiency, ensure the stable operation of the server under high load, and at the same time improve the computing efficiency and reduce energy consumption.

[0070] like Figure 1 and Figure 2 As shown, the middle panel 3 includes a plurality of first middle partition panels which are arranged one by one corresponding to the plurality of side panels 21 and a second middle partition panel which is arranged corresponding to the support vertical panels 22; wherein, the width of each first middle partition panel is greater than the thickness of the corresponding side panel 21, and the length of each first middle partition panel is greater than the length of the corresponding side panel 21; the width of the second middle partition panel is greater than the thickness of the support vertical panels 22, and the length of the second middle partition panel is greater than the length of the support vertical panels 22.

[0071] Specifically, one end of the first plate segment 2101 of each side panel 21 away from the second plate segment 2102 and one end of the second plate segment 2102 away from the first plate segment 2101 are respectively protruded from the two ends of the corresponding first middle dividing panel, so that one end of the first plate segment 2101 away from the second plate segment 2102 and one end of the second plate segment 2102 away from the first plate segment 2101 can be respectively plugged into or separated from two oppositely arranged installation grooves on the installation component.

[0072] like Figure 1 and Figure 2 As shown, the side panel 21 is also provided with an avoidance groove 2103, and the avoidance groove 2103 is located on the side of the card slot 210 close to the board assembly 100; wherein, the end of the first board segment 2101 away from the second board segment 2102 and the end of the second board segment 2102 away from the first board segment 2101 are both provided with the avoidance groove 2103. By providing the avoidance groove 2103, the present application reduces the difficulty of plugging or separating the side panel 21 and the mounting slot on the mounting component, realizes the rapid disassembly and assembly of the air guide component and the board assembly 100, improves the disassembly and assembly efficiency of the air guide component, and simplifies the maintenance operation. In addition, the provision of the avoidance groove 2103 also reduces the overall weight of the air guide component, which is conducive to the lightweight setting of the server.

[0073] like Figure 1 and Figure 2 As shown, a plug-in protrusion 213 is provided at one end of the side plate 21 close to the plate assembly 100, and the plug-in protrusion 213 is used to be plugged into or separated from a groove on a mounting component for mounting the air guide component on the plate assembly 100. In this way, the stability and reliability of the air guide component during installation are achieved, and maintenance operations are simplified. After installation, the air guide component can be firmly fixed on the plate assembly 100, which improves the installation stability of the air guide component, ensures the heat dissipation requirements of the server during operation, reduces maintenance and replacement costs, and improves the maintainability and reliability of the server.

[0074] like Figure 3 and Figure 4 As shown, the present application also provides a server, including a board assembly 100 and the above-mentioned air guide component 200, and the air guide component 200 is arranged on the board assembly 100. The present application solves the problem in the related art that the unused memory slot area of ​​the server cannot properly guide the heat dissipation airflow by arranging the air guide component 200 on the board assembly 100, and realizes the guidance and control of the airflow in the unused memory slot area of ​​the server, improves the heat dissipation effect of the heat dissipation component, and ensures the stable operation of the server. When the server is running, it can achieve more efficient and uniform heat dissipation, reduce the server temperature, and improve the maintainability and reliability of the server.

[0075] The server of the present application may be a data center, a cloud computing server, a high performance computing server, etc.

[0076] like Figure 3 and Figure 4 As shown, a plurality of memory sockets 300 are arranged at intervals on the board assembly 100 , and the air guide component 200 is arranged on at least one memory socket 300 .

[0077] This application achieves heat dissipation for key components such as memory and improves the stability and performance of the server by setting an air guide component 200 on the memory socket 300. The implementation effect is that when the server is running, key components such as memory can be effectively cooled, the system temperature can be reduced, and the system performance can be improved. Application scenarios include data centers, cloud computing servers, high-performance computing servers, etc. By setting an air guide component 200 on the memory socket 300, the overall performance of the heat dissipation system can be improved, and the stable operation of the server under high load can be guaranteed, while reducing maintenance and replacement costs, and improving the maintainability and reliability of the server.

[0078] like Figure 3 and Figure 4 As shown, the server also includes a chassis 800, a board assembly 100 is located in the chassis 800, and the board assembly 100 is also provided with a processor 600, a memory 700, and electronic components such as a PCIe card, a power supply, a VR chip and a fan. The memory 700 is inserted into the memory socket 300, and the processor 600 is located in the area where the memory socket 300 is located. The area where the memory socket 300 is located is also provided with a guide positioning pin 400 to guide the processor 600; the fan is located on one side of the memory socket 300 and is arranged toward the top of the memory socket 300, and the PCIe card, the power supply and the VR chip are located on the other side of the memory socket 300. The airflow blown by the fan is guided through the processor 600 and the memory 700 and then flows to the PCIe card, the power supply and the VR chip.

[0079] When the processor 600 and the memory 700 are not set in the area where the memory socket 300 is located, the airflow blown by the fan may flow forward instead of flowing to the lower PCIe card, power supply and VR chip. The air guide component of the present application can simulate the combined structure of the processor 600 and the memory 700 to guide the airflow blown by the fan, thereby achieving auxiliary heat dissipation for the PCIe card, power supply and VR chip when the processor 600 and the memory 700 are not set in the area where the memory socket 300 is located, thereby improving the heat dissipation effect of the PCIe card, power supply and VR chip.

[0080] Specifically, a buckle 500 is provided on the memory socket 300, and a slot 210 is provided on the air guide plate group 2, and the slot 210 is used to be connected or separated with the buckle 500; and / or the server also includes a guide positioning pin 400, the guide positioning pin 400 is located on the board assembly 100 and between two adjacent memory sockets 300, and a positioning hole 2420 is provided on the air guide plate group 2, and the positioning hole 2420 is used to be connected or separated with the guide positioning pin 400.

[0081] PCIe card, the full name is Peripheral Component Interconnect Express card, it is an expansion card based on PCIExpress bus standard. PCIe is a high-speed serial computer expansion bus standard designed to replace the old PCI, PCI-X and AGP bus standards. PCIe card is usually used to expand the functions of the computer, such as adding graphics processing capabilities (graphics card), network connection capabilities (network adapter), storage device connection (such as RAID card) and other high-performance or high-bandwidth devices.

[0082] VR chips usually refer to dedicated processors used to process visual content such as graphics, images, videos, and 3D models in virtual reality (VR) systems, also known as graphics processing units (GPUs). VR technology requires high-resolution, high-frame-rate, and low-latency graphics processing capabilities to provide an immersive virtual reality experience. Therefore, VR chips need to have powerful computing power and efficient graphics processing algorithms to quickly render complex virtual environments, while supporting interactive functions such as head tracking and gesture recognition to ensure that users' actions in the virtual space can be fed back in real time to enhance immersion.

[0083] From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects:

[0084] The present application provides an air guide component, which is arranged on a plate assembly. The air guide component includes an air shield group 1 and an air guide group 2. The air shield group 1 is arranged on a side of the air guide group 2 away from the plate assembly and is connected to the air guide group 2. The air guide group 2 includes an air guide channel 20. The air outlet of the air guide channel 20 is arranged toward the heat dissipation component to be cooled on the plate assembly. The air shield group 1 has a windward surface. The airflow reaching the windward surface flows to the heat dissipation component to be cooled through the air guide channel 20 after being blocked by the windward surface. In this way, the air guide component of the present application integrates the wind shielding and wind guiding functions, realizes the guidance and control of the airflow, and enables the airflow to flow more effectively to the heat dissipation parts to be cooled that need heat dissipation, ensures that the airflow flows concentratedly to the high-power consumption heating elements, improves the heat dissipation efficiency, and avoids the heat dissipation airflow directly flowing toward the direction of the wind shield plate group 1 and finally dissipating, meets the heat dissipation requirements of the heat dissipation parts on the board assembly that are closer to the board assembly, and solves the problem in the related technology that the unused memory slot area of ​​the server cannot properly guide the heat dissipation airflow, thereby replacing the processor and memory when the processor and memory are not set in the area where the memory socket is located to achieve auxiliary heat dissipation of the heat dissipation parts at a lower position, so that the server system can dissipate heat more evenly and efficiently during operation, thereby improving the heat dissipation efficiency and stability of the server, which not only simplifies maintenance operations and improves usability, but also significantly reduces material costs. It can be widely used in server products of various specifications, thereby enhancing the market competitiveness of the server.

[0085] The above is a detailed introduction to an air guide component and a server provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. An air guide component, characterized in that: The wind guide component is arranged on the plate assembly (100), and comprises a wind shielding plate group (1) and a wind shielding plate group (2); the wind shielding plate group (1) is arranged on a side of the wind shielding plate group (2) away from the plate assembly (100) and is connected to the wind shielding plate group (2); the wind shielding plate group (2) comprises a wind guide channel (20); an air outlet of the wind guide channel (20) is arranged toward a heat element to be cooled on the plate assembly (100); the wind shielding plate group (1) has a windward surface; an airflow reaching the windward surface is blocked by the windward surface and then flows toward the heat element to be cooled through the wind guide channel (20).

2. The air guide component according to claim 1, characterized in that: The air guide component is an injection molded part, and the air guide component is integrally formed.

3. The air guide component according to claim 1, characterized in that: The wind shield assembly (1) comprises a first baffle (11) and two second baffles (12), the first baffle (11) extending along a first direction, the second baffle (12) and the first baffle (11) being arranged at a predetermined angle; the two second baffles (12) being arranged at intervals along the first direction and being located on the same side of the first baffle (11), the first ends of the two second baffles (12) being respectively connected to two ends of the first baffle (11).

4. The air guide component according to claim 3, characterized in that: The two second baffles (12) are located on a side of the first baffle (11) close to the windward direction; and / or Each of the second baffles (12) extends along a second direction, the second direction being perpendicular to the first direction; and / or The first baffle (11) and each of the second baffles (12) are perpendicular to the plate surface of the plate assembly (100).

5. The air guide component according to claim 3, characterized in that: The predetermined angle is an acute angle or an obtuse angle; and / or The first baffle (11) and the second baffle (12) are both inclined toward the plate surface of the plate assembly (100).

6. The air guide component according to claim 1, characterized in that: The wind guide plate group (2) comprises a plurality of side plates (21) each extending along the second direction, the plurality of side plates (21) being arranged at intervals along the first direction, and the wind guide channel (20) being formed between any two adjacent side plates (21).

7. The air guide component according to claim 6, characterized in that: The end of the side plate (21) is used to be plugged into or separated from a mounting slot on a mounting component located on the plate assembly (100) for mounting the air guide component, and a clamping slot (210) is provided on the side plate (21), and the clamping slot (210) is used to be clamped into or separated from a buckle (500) on the mounting component.

8. The air guide component according to claim 6, characterized in that: The wind deflector assembly (2) further comprises a supporting vertical plate (22) extending along the first direction, the supporting vertical plate (22) being located on a side of the wind shield assembly (1) close to the plate assembly (100), the supporting vertical plate (22) being perpendicular to a plate surface of the plate assembly (100), and the plurality of side plates (21) dividing the supporting vertical plate (22) into a plurality of supporting sub-plates (221) spaced apart along the first direction; wherein each of the supporting sub-plates (221) is provided with a ventilation hole (222).

9. The air guide component according to claim 8, characterized in that: The wind deflector assembly (2) further comprises a support bottom plate (23) arranged on one end of the support vertical plate (22) close to the plate assembly (100), and the support bottom plate (23) is parallel to the plate surface of the plate assembly (100).

10. The air guide component according to claim 7, characterized in that: Each of the side panels (21) comprises a first panel segment (2101) and a second panel segment (2102) located on opposite sides of the wind deflector group (1), and the first panel segment (2101) and the second panel segment (2102) are sequentially connected along the second direction; wherein an end of the first panel segment (2101) away from the second panel segment (2102) and an end of the second panel segment (2102) away from the first panel segment (2101) are respectively used for plugging into or separating from two oppositely arranged mounting grooves on the mounting component, and an end of the first panel segment (2101) away from the second panel segment (2102) is provided with the clamping groove (210), and an end of the second panel segment (2102) away from the first panel segment (2101) is provided with the clamping groove (210).

11. The air guide component according to claim 6, characterized in that: The wind guide plate group (2) further comprises a wind guide plate (24) arranged between two adjacent side plates (21), the wind guide plate (24) being located on the leeward side of the wind shielding plate group (1), and the wind guide plate (24) extending towards the heat element to be cooled.

12. The air guide component according to claim 6, characterized in that: The plurality of side plates (21) include a first side plate (211) and a second side plate (212) arranged at intervals along a first direction, so as to form a first air guide channel (201), a second air guide channel (202) and a third air guide channel (203) arranged at intervals along the first direction; the air guide plate group (2) further includes: a first air guide plate (241), the first air guide plate (241) being arranged on a side of the first side plate (211) away from the second side plate (212) to form the first air guide channel (201); and / or A second air guide plate (242), the second air guide plate (242) being arranged between the first side plate (211) and the second side plate (212) to form the second air guide channel (202).

13. The air guide component according to claim 12, characterized in that: The first air guide plate (241) extends in a direction away from the air shield plate group (1), and at least a portion of the first air guide plate (241) is arranged obliquely to the plate surface of the plate assembly (100), so that the flow area of ​​the first air guide channel (201) gradually increases in a direction approaching the air shield plate group (1); and / or The second air guide plate (242) extends in a direction away from the air shield plate group (1), and at least a portion of the second air guide plate (242) is arranged obliquely to the plate surface of the plate assembly (100), so that the flow area of ​​at least a portion of the second air guide channel (202) gradually increases in a direction approaching the air shield plate group (1); and / or The width of the second wind guide plate (242) gradually decreases in a direction away from the wind shield plate group (1).

14. The air guide component according to claim 12, characterized in that: The first end of the second air guide plate (242) is connected to the first side plate (211), and the second end of the second air guide plate (242) and the second side plate (212) are arranged at an interval; the air guide plate group (2) further comprises an air guide support plate (25), the air guide support plate (25) being located on a side of the second air guide plate (242) close to the plate assembly (100) and connected to the second end of the second air guide plate (242), the air guide support plate (25) dividing the second air guide channel (202) into two channel sections.

15. The air guide component according to claim 14, characterized in that: At least a portion of the wind guide support plate (25) is inclined toward the first side plate (211), and a distance between at least a portion of the wind guide support plate (25) and the first side plate (211) gradually increases in a direction approaching the wind shielding plate group (1).

16. The air guide component according to claim 12, characterized in that: The second air guide plate (242) is provided with a positioning hole (2420) for being connected to or disconnected from a guide positioning pin (400) located on the plate assembly (100).

17. The air guide component according to claim 6, characterized in that: The wind guide component further comprises an intermediate plate (3), the intermediate plate (3) extending from the windward side of the wind shield plate group (1) to the leeward side of the wind shield plate group (1), the intermediate plate (3) being located between the wind shield plate group (1) and the wind guide plate group (2).

18. The air guide component according to claim 7, characterized in that: The side plate (21) is further provided with an avoidance groove (2103), the avoidance groove (2103) being located on a side of the clamping slot (210) close to the plate assembly (100); and / or An end of the side plate (21) close to the plate assembly (100) is provided with a plug-in protrusion (213), and the plug-in protrusion (213) is used to be plugged into or separated from a groove on a mounting component located on the plate assembly (100) for mounting the air guide component.

19. A server, characterized in that: It comprises a plate assembly (100) and an air guide component according to any one of claims 1 to 18, wherein the air guide component is arranged on the plate assembly (100).

20. The server according to claim 19, characterized in that A plurality of memory sockets (300) are arranged at intervals on the board assembly (100), and the air guide component is arranged on at least one of the memory sockets (300).

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