Flexible display module, cover tape and flexible display device

Abstract

The embodiment of the utility model provides a flexible display module, a cover tape and a flexible display device, which are applied to the technical field of display. A printed circuit board is arranged on the back face of a flexible display module of the flexible display screen, and electronic elements are arranged on the printed circuit board. The cover tape covers all areas, except for devices needing to be exposed, of the back face of the flexible display module; the cover tape comprises a main body area and a punching area, the punching area is provided with a punching structure, so that the punching area deforms under the action of tension; the area, without the punching structure, of the cover tape is a main body area; the punching area comprises a first punching area and a second punching area; the first punching area covers a first peripheral area of each electronic component. According to the scheme, when the cover tape is subjected to the pulling force from the PCB, the first punching area deforms, part of the pulling force is reduced, the counter-acting force of the cover tape to the PCB is reduced, and the problem that the medium-size flexible display module is stressed to be warped due to the counter-acting force generated by the cover tape under the pulling force effect is further solved.

Description

Technical Field

[0001] The utility model relates to the field of display technology, in particular to a flexible display module, a cover tape and a flexible display device. Background Art

[0002] In the related art, the flexible display module mainly includes: flexible display panel (Panel, PNL), printed circuit board (Printed Circuit Board, PCB), flexible printed circuit (Flexible Printed Circuit, FPC) and integrated circuit (Integrated Circuit, IC) and other components. Among them, the non-display area of ​​the PNL is bent to the back of the flexible display module, and the PCB, electronic components on the PCB, FPC and IC and other electronic devices are also located on the back of the flexible display module, making the back of the flexible display module uneven.

[0003] In the related art, a PCB cover tape is used as a shielding and heat dissipation component for electronic components on the PCB, covering the back side of the flexible display module to achieve good shielding and heat dissipation effects.

[0004] However, when the PCB cover tape is applied to the flexible display module of medium-sized products such as laptop computers, due to the high height between the PCB and the electronic components on the PCB of such products, there will be a large height difference between the PCB and the electronic components on the PCB and between the PCB and other electronic components of the flexible display module, resulting in a large height difference between the concave and convex surfaces on the back of the flexible display module. Therefore, when the PCB cover tape is attached to the back of the flexible display module, the flexible display module will exert a large pulling force on the PCB cover tape. At the same time, the PCB cover tape will also generate a reaction force on the PCB and other electronic components of the flexible display module. When the reaction force is large, the flexible display module will be deformed. Utility Model Content

[0005] The purpose of the embodiment of the utility model is to provide a flexible display module, a cover tape and a flexible display device to improve the problem of warping of the flexible display module. The specific technical solution is as follows:

[0006] First, an embodiment of the present application provides a flexible display module, wherein a printed circuit board is disposed on the back of the flexible display module, and electronic components are disposed on the printed circuit board;

[0007] A cover tape covering all areas of the back side of the flexible display module except for the devices that need to be exposed;

[0008] The cover tape comprises: a main body area and a perforated area; the perforated area is provided with a perforated structure, so that the perforated area is deformed when subjected to a tensile force; the area of ​​the cover tape without the perforated structure is the main body area;

[0009] The perforated area includes: a first perforated area; the first perforated area covers a first peripheral area of ​​each electronic component.

[0010] In some embodiments of the present application, the printed circuit board protrudes from the back side of the flexible display module;

[0011] The perforated area of ​​the cover tape further includes: a second perforated area; the second perforated area covers a second peripheral area of ​​the printed circuit board.

[0012] In some embodiments of the present application, the cover tape is a rectangular tape;

[0013] The perforated area of ​​the cover tape further includes: at least two third perforated areas; the third perforated areas are respectively arranged at two opposite corners of the rectangular tape on the same side.

[0014] In some embodiments of the present application, the third perforated area is in the shape of an oblique strip, which has a preset angle with the long side and the wide side of the rectangular band.

[0015] The present application also provides a cover tape, which is applied to the flexible display module described in any one of the above embodiments, including:

[0016] The cover tape comprises: a main body area and a perforated area; the perforated area is provided with a perforated structure, so that the perforated area is deformed when subjected to a tensile force; the area of ​​the cover tape without the perforated structure is the main body area;

[0017] The punching area includes: a first punching area; the first punching area is used to cover the first peripheral area of ​​each electronic component on the printed circuit board on the back of the flexible display module.

[0018] In some embodiments of the present application, the perforated area of ​​the cover tape further includes: a second perforated area; the second perforated area is used to cover a second peripheral area of ​​the printed circuit board.

[0019] In some embodiments of the present application, the cover tape is a rectangular tape;

[0020] The perforated area of ​​the cover tape further includes: at least two third perforated areas; the third perforated areas are respectively arranged at two opposite corners of the rectangular tape on the same side.

[0021] In some embodiments of the present application, the third perforated area is in the shape of an oblique strip, which has a preset angle with the long side and the wide side of the rectangular band.

[0022] In some embodiments of the present application, the cover tape has a bottom insulating layer, a middle conductive layer and a surface insulating layer arranged in sequence;

[0023] A fixed connection is formed between the bottom insulating layer, the middle conductive layer and the surface insulating layer;

[0024] Wherein, at least one of the bottom insulating layer, the middle conductive layer and the surface insulating layer is a perforated layer having a perforated structure.

[0025] In some embodiments of the present application, the thickness of the cover tape is 0.06-0.15 mm (millimeter);

[0026] The thickness of the bottom insulating layer is 0.03-0.06 mm; the thickness of the middle conductive layer is 0.02-0.05 mm; and the thickness of the surface insulating layer is 0.01-0.03 mm.

[0027] In some embodiments of the present application, the hole shape of the punching area is diamond; or, circular.

[0028] An embodiment of the present application further provides a flexible display device, comprising the flexible display module described in any one of the above embodiments.

[0029] Beneficial effects:

[0030] The embodiment of the utility model provides a flexible display module, a cover tape and a flexible display device, wherein a cover tape covering all areas of the back of the flexible display module except for the devices that need to be exposed is provided on the back of the flexible display module. At the same time, the cover tape is divided into a perforated area with a perforated structure and a main area without a perforated structure, and a first perforated area is provided on the cover tape at a corresponding position of the first peripheral area around the electronic components on the PCB. In this way, when the position corresponding to the first peripheral area on the cover tape is subjected to a tensile force from the PCB, the first perforated area can be deformed to reduce the tensile force. Compared with the solution in which the conventional cover tape is attached to the flexible display module. When the cover tape in the embodiment of the present application is subjected to a tensile force from the PCB, the perforated structure of the first perforated area is deformed, thereby reducing a part of the tensile force from the PCB, and further reducing the reaction force of the cover tape on the PCB, thereby improving the problem of warping of the medium-sized flexible display module caused by the reaction force of the cover tape.

[0031] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0033] Figure 1 A bottom view of a cover tape covering a flexible display module in the related art;

[0034] Figure 2 It is a structural schematic diagram of a cover tape covering a flexible display module in the related art;

[0035] Figure 3 It is a structural schematic diagram of a cover tape in the related art;

[0036] Figure 4 A bottom view of the first embodiment of the flexible display module provided by the present application;

[0037] Figure 5 for Figure 4 A partial cross-sectional schematic diagram of the flexible display module shown;

[0038] Figure 6 A bottom view of a second embodiment of the flexible display module provided by the present application;

[0039] Figure 7 for Figure 6 A partial cross-sectional schematic diagram of the flexible display module shown;

[0040] Figure 8 for Figure 7 A partial schematic diagram of the flexible display module before the cover tape covers the flexible display module;

[0041] Fig. 9 for Figure 8 A partial schematic diagram of the embodiment shown after the cover tape covers the flexible display module;

[0042] Fig.10 A bottom view of a third embodiment of the flexible display module provided by the present application;

[0043] Fig.11 A schematic structural diagram of a first embodiment of the cover tape provided by the present application;

[0044] Fig.12 A schematic structural diagram of a second embodiment of the cover tape provided by the present application;

[0045] Fig.13 A schematic structural diagram of a third embodiment of the cover tape provided in the present application;

[0046] Fig.14 for Fig.13 A first cross-sectional view of the cover tape shown;

[0047] Fig.15 for Fig.13 A second cross-sectional view of the cover tape shown;

[0048] Fig.16 for Fig.13 A third cross-sectional view of the cover tape shown;

[0049] Fig.17 for Fig.13 The enlarged view of the part of the cover tape M1 is shown;

[0050] Fig.18 A schematic structural diagram of a fourth embodiment of the cover tape provided by the present application;

[0051] Fig.19 for Fig.18 A partial enlarged view of the cover tape M2 is shown.

[0052] Reference numerals:

[0053] Flexible display module 100, flexible circuit board 101, integrated circuit 102, flexible display panel 103, epoxy resin thermosetting adhesive 104 (AD), spacer 105 (spacer), super clean foam structure 106 (super clean foam, SCF), high temperature polyester film (PET) 107, polarizer (POL) 108, thermosetting optical transparent hot melt adhesive film (TOCA) 109, glass cover (coverglass, CG) 110, connector (CNT) 111, flexible display panel binding end (PNL Pad) 112, pad bending glue (pad bending glue, PBG) 113;

[0054] Electronic component 120, first peripheral region 121;

[0055] Printed circuit board 130, second peripheral area 131;

[0056] Cover tape 140 , main body area 141 , perforated area 142 , first perforated area 1421 , second perforated area 1422 , third perforated area 1423 , perforated structure 143 , bottom insulating layer 144 , middle conductive layer 145 , surface insulating layer 146 . DETAILED DESCRIPTION

[0057] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field based on this application belong to the scope of protection of the utility model.

[0058] like Figures 1 to 3 As shown, Figure 1 This is a bottom view of the cover tape covering the flexible display module in the related art. Figure 2 Schematic diagram of the structure of the cover tape covering the flexible display module in the related art. Figure 3 Schematic diagram of the structure of the cover tape in the related art. In the related art, the flexible display module 100 includes a flexible FPC 101, an IC 102, a PNL 103, an AD 104, a gasket 105, a SCF 106, a PET 107, a POL 108, a TOCA 109, a CG 110, a CNT 111, a flexible display panel binding end 112, a PCB 130, an electronic component 120 on the PCB 130, and a cover tape 140. The cover tape 140 includes a bottom insulating layer 144, an intermediate conductive layer 145, and a surface insulating layer 146. The cover tape 140 is covered on the back of the flexible display module 100 except for the devices that need to be exposed (for example: Figure 1 Take the 10-layer PCB 130 as an example: the thickness of the PCB 130 is 0.8 mm, while the height of the electronic component 120 can reach 1.3 mm or higher. Since the thickness of the PCB 130 and the electronic component 120 is larger than that of other electronic devices, the peripheral areas of the PCB 130 and the electronic component 120 have a large height difference.

[0059] Therefore, when the cover tape 140 covers the back side of the flexible display module 100, due to the large height difference between the peripheral areas of the PCB 130 and the electronic component 120, the flexible display module 100 will generate a large pulling force on the cover tape 140. Therefore, the cover tape 140 will generate a corresponding reaction force on the flexible display module 100, resulting in the problem of warping of the medium-sized flexible display module 100.

[0060] In order to reduce the reaction force of the cover tape 140 on the flexible display module 100, the problem of warping of the medium-sized flexible display module 100 caused by the reaction force generated by the tensile force on the cover tape 140 is improved. The embodiment of the present application provides a flexible display module, a cover tape and a flexible display device, which are described in detail below with reference to the accompanying drawings.

[0061] In the first embodiment of the present application, Figure 4 and Figure 5 As shown, Figure 4This is a bottom view of the first embodiment of the flexible display module provided by the present application. Figure 5 for Figure 4 A partial cross-sectional schematic diagram of the flexible display module shown. The flexible display module 100 provided in the embodiment of the present application is provided with a PCB 130 on the back, and the electronic components 120 are provided on the PCB 130; a cover tape 140 covers all areas on the back of the flexible display module 100 except for the devices that need to be exposed; wherein the cover tape 140 includes: a main body area 141 and a perforated area 142; the perforated area 142 is provided with a perforated structure 143, so that the perforated area 142 is deformed when subjected to tension; the area of ​​the cover tape 140 without the perforated structure 143 is the main body area 141; the perforated area 142 includes: a first perforated area 1421; the first perforated area 1421 covers the first peripheral area 121 of each electronic component 120.

[0062] In this embodiment, Figure 4 and Figure 5 As shown, the flexible display module 100 mainly includes: FPC 101, IC 102, PNL 103, AD 104, gasket 105, SCF 106, PET 107, POL 108, TOCA 109, CG 110, CNT 111, flexible display panel binding end 112 and PBG 113. Figure 4 and Figure 5 As shown, the cover tape 140 is divided into a main body area 141 and a punching area 142, wherein the punching area 142 includes a first punching area 1421, and the first punching area 1421 is correspondingly arranged at a position on the cover tape 140 corresponding to the first peripheral area 121 of each electronic component 120, and the first peripheral area 121 is located around the electronic component 120, that is, a position where the electronic component 120 and the PCB 130 have a large height difference. Since the height of the electronic component 120 is relatively high, the height of the electronic component 120 can reach 1.3 mm or higher, and there is a large height difference between the upper surface of the electronic component 120 and the upper surface of the PCB 130, therefore, the PCB 130 will generate a pulling force on the cover tape 140 covering the back of the flexible display module 100, and at the same time, the cover tape 140 will also generate a corresponding reaction force on the PCB 130. At this time, since the punching area 142 has a punching structure 143, when the cover tape 140 covers the back of the flexible display module 100 and the first punching area 1421 is subjected to the pulling force from the PCB 130, the punching structure 143 of the first punching area 1421 is deformed. The deformation of the punching structure 143 reduces a part of the pulling force from the PCB 130, and the reaction force of the cover tape 140 on the PCB 130 is also reduced accordingly. Further, the problem that the cover tape 140 generates a reaction force while being subjected to the pulling force from the PCB 130, which causes the PCB 130 in the flexible display module 100 to be warped due to the force, is effectively improved.

[0063] In the second embodiment of the present application, Figure 6 to Figure 7 As shown, Figure 6 This is a bottom view of the second embodiment of the flexible display module provided by the present application. Figure 7 for Figure 6 The PCB 130 protrudes from the back of the flexible display module 100 , and the punching area 142 of the cover tape 140 , based on the first embodiment, further includes: a second punching area 1422 ; the second punching area 1422 covers the second peripheral area 131 of the PCB 130 .

[0064] In this embodiment, the cover tape 140 adds a second punching area 1422 corresponding to the second peripheral area 131 on the upper side, left side and right side of the PCB 130 on the basis that the punching area 142 includes the first punching area 1421. The second peripheral area 131 is the position on the upper side, left side and right side of the PCB 130, that is, the position where the PCB 130 has a large height difference with other electronic components in the flexible display module 100. Since the PCB 130 has a large height, taking the PCB 130 of a 10-layer board as an example: the thickness of the PCB 130 is 0.8 mm, and there is a large height difference between the PCB 130 and other electronic components of the flexible display module 100. Therefore, the other electronic components of the flexible display module 100 will generate a pulling force on the cover tape 140 covering the back of the flexible display module 100, and at the same time, the cover tape 140 will also generate a corresponding reaction force on the other electronic components of the flexible display module 100. At this time, since the perforated area 142 has a perforated structure 143, when the cover tape 140 covers the back of the flexible display module 100, when the second perforated area 1422 is subjected to the pulling force from other electronic devices of the flexible display module 100, the perforated structure 143 of the second perforated area 1422 is deformed. The deformation of the perforated structure 143 reduces a part of the pulling force, and the reaction force of the cover tape 140 on other electronic devices of the flexible display module 100 is also reduced accordingly. Further, the problem that the cover tape 140 generates a reaction force when subjected to the pulling force from other electronic devices of the flexible display module 100, causing the other electronic devices of the flexible display module 100 to be warped due to the force, is effectively improved. In actual applications, if the second peripheral area 131 on the lower side of PCB130 is also subjected to tension and generates a reaction force, a second punching area 1422 can also be set on the cover tape 140 at a position corresponding to the second peripheral area 131 below PCB130 to improve other components of the flexible display module 100, such as: FPC101, IC102, PNL103, AD104, gasket 105, SCF106, PET107, POL108, TOCA109, CG110, CNT111, flexible display panel binding end 112 and PBG113. The problem of warping due to force.

[0065] refer to Figure 7 When a relatively high FPC 101 is used, there is a large height difference between the contact surface between the FPC 101 and the PCB 130 and the contact surface between the FPC 101 and the PNL 103, so that the cover tape 140 has a large height difference at the corresponding position of the position. At this time, a punching area 142 can be added to the cover tape 140 at the corresponding position of the position with a large height difference with the FPC 101, thereby effectively improving the problem of the flexible display module 100 being warped by the reaction force generated by the tensile force on the cover tape 140.

[0066] Furthermore, when the height difference between other electronic devices in the area covered by the cover tape 140 on the back of the flexible display module 100 is ≥1 mm, a perforated area 142 can be set on the cover tape 140 at a position with a larger height difference to improve the problem of warping of the flexible display module 100 caused by the reaction force generated by the tension on the cover tape 140.

[0067] See also Figure 8 and Fig. 9 , Figure 8 for Figure 7 The partial schematic diagram of the flexible display module before the cover tape covers the flexible display module is shown. Fig. 9 for Figure 8 The partial schematic diagram of the cover tape after covering the flexible display module in the illustrated embodiment. In the present embodiment, the cover tape 140 is in a flat state before being attached, and the cover tape 140 will be flattened and then pressed downward, so that the cover tape 140 is pasted and fixed at the projection position. Therefore, after being fixed, the cover tape 140 will be subjected to the tensile force from the flexible display module 100, and the flexible display module 100 will also be subjected to the reaction force of the cover tape 140. By adding the first perforated area 1421 and the second perforated area 1422 to the cover tape 140, when the cover tape 140 is subjected to the tensile force from the flexible display module 100, the perforated area 142 of the cover tape 140 is deformed, reducing a part of the tensile force from the flexible display module 100, thereby reducing the reaction force of the cover tape 140 on the flexible display module 100, and effectively improving the problem of warping of the medium-sized flexible display module 100 caused by the reaction force generated by the tensile force on the cover tape 140.

[0068] In addition, in the related art, when the cover tape 140 covers the back of the flexible display module 100, the two opposite corners of the cover tape 140 on the same side are simultaneously subjected to the effects of lateral and longitudinal forces. Therefore, the cover tape 140 is prone to wrinkles at this position, and the height of the wrinkles is relatively high.

[0069] Therefore, in the third embodiment of the present application, a perforated area 142 may also be provided at two opposite corners on the same side of the cover tape 140, that is, at a position where concentrated forces are applied in the transverse and longitudinal directions. Fig.10 As shown, Fig.10 This is a bottom view of the third embodiment of the flexible display module provided by the present application.

[0070] The cover tape 140 is a rectangular tape. The perforated area 142 of the cover tape 140, in addition to the first perforated area 1421 and the second perforated area 1422 in the above two embodiments, also includes: at least two third perforated areas 1423, the third perforated areas 1423 are respectively arranged at two opposite corners of the rectangular tape on the same side, and the third perforated areas 1423 are oblique strips, and have a preset angle with the long side and the wide side of the rectangular tape.

[0071] In this embodiment, on the basis that the punching area 142 includes the first punching area 1421 or includes the first punching area 1421 and the second punching area 1422, a third punching area 1423 is added, which is arranged at two opposite corners on the same side of the rectangular cover tape 140. Since the two opposite corners on the same side of the cover tape 140 are simultaneously subjected to the lateral and longitudinal forces in the plane where the cover tape 140 is located, the cover tape 140 at this position will generate a corresponding reaction force. At this time, the third punching area 1423 at the two opposite corners on the same side of the cover tape 140 is deformed, and a part of the lateral and longitudinal tension is reduced by the punching structure 143, and the reaction force generated by the cover tape 140 is also reduced accordingly. Further, the problem that the cover tape 140 generates a reaction force while being subjected to the lateral and longitudinal forces along the plane where the cover tape 140 is located, causing the flexible display module 100 to be warped and the cover tape 140 to be wrinkled, is effectively improved.

[0072] At the same time, the third punching area 1423 is designed to be an oblique strip, and a preset angle is set at the angle between the long side and the short side of the rectangular band, so that the main body area 141 is still left at the two opposite corners of the cover tape 140 on the same side, thereby increasing the structural strength at this position and effectively avoiding the problem of breakage of the cover tape 140 due to the excessive size of the punching area 142.

[0073] In the above three embodiments, the cover tape may be provided with a first punching area 1421, a second punching area 1422 and a third punching area 1423. In practical applications, the punching areas may also be provided at other locations, for example, at a location where the FPC 101 has a large height difference, thereby effectively improving the warping problem of the flexible display module 100 caused by the reaction force generated by the tensile force on the cover tape 140.

[0074] The present application also provides a cover tape 140. In the first embodiment of the cover tape 140 provided in the present application, as shown in FIG. Figure 5 and Fig.11 As shown, Fig.11 A schematic diagram of the structure of the first embodiment of the cover tape provided in the present application. The cover tape 140 includes: a main body area 141 and a perforated area 142, wherein the perforated area 142 is provided with a perforated structure 143, so that the perforated area 142 is deformed when subjected to a tensile force; the area of ​​the cover tape 140 without the perforated structure 143 is the main body area 141, and the perforated area 142 includes: a first perforated area 1421, and the first perforated area 1421 is used to cover the first peripheral area 121 of each electronic component 120 on the PCB 130 on the back of the flexible display module 100.

[0075] In this embodiment, the cover tape 140 is divided into a main body area 141 and a perforated area 142, wherein the perforated area 142 includes a first perforated area 1421, which is arranged at a position on the cover tape 140 corresponding to the first peripheral area 121 of each electronic component 120. When the perforated area 142 in the cover tape 140 is subjected to tension, the first perforated area 1421 is deformed, reducing a part of the tension, thereby reducing the reaction force applied to the outside by the cover tape 140, further improving the problem of warping of the medium-sized flexible display module 100 caused by the reaction force generated by the tensile force on the cover tape 140. The main body area 141 ensures the overall structural strength of the cover tape 140, and avoids the problem of the cover tape 140 breaking due to the excessive range of the perforated area 142.

[0076] In the second embodiment of the cover tape 140 provided in the present application, as shown in FIG. Figure 7 and Fig.12 As shown, Fig.12 The cover tape 140 has a second peripheral region 131 of the second peripheral region 131 of the PCB 130 .

[0077] In this embodiment, the cover tape 140 has a second punching area 1422 disposed corresponding to the second peripheral area 131 on the upper side, left side, and right side of the PCB 130, on the basis that the punching area 142 includes the first punching area 1421. When the punching area 142 in the cover tape 140 is subjected to tension, the first punching area 1421 and the second punching area 1422 are deformed, reducing a portion of the tension, thereby reducing the reaction force applied to the outside by the cover tape 140, further improving the problem of warping of the medium-sized flexible display module 100 caused by the reaction force generated by the tensile force on the cover tape 140.

[0078] In the third embodiment of the cover tape 140 provided in the present application, as Fig.13 As shown, Fig.13The schematic diagram of the structure of the third embodiment of the cover tape provided by the present application. The cover tape 140 is a rectangular tape, and the perforated area 142 of the cover tape 140, in addition to the first perforated area 1421 and the second perforated area 1422, also includes: at least two third perforated areas 1423; the third perforated areas 1423 are respectively arranged at two opposite corners of the rectangular tape on the same side, and the third perforated areas 1423 are in the shape of oblique strips, and have a preset angle with the long side and the wide side of the rectangular tape.

[0079] In the present application, on the basis that the punching area 142 includes the first punching area 1421 or includes the first punching area 1421 and the second punching area 1422, a third punching area 1423 is added, which is arranged at two opposite corners on the same side of the rectangular cover tape 140. When the positions of the two opposite corners on the same side of the cover tape 140 are simultaneously subjected to the lateral and longitudinal forces in the plane where the cover tape 140 is located, the third punching area 1423 at the positions of the two opposite corners on the same side of the cover tape 140 is deformed, and the deformation is generated by the punching structure 143, thereby reducing a part of the lateral and longitudinal tensile forces, and the reaction force generated by the cover tape 140 is also reduced accordingly, further improving the problem that the medium-sized flexible display module 100 is warped and the cover tape 140 is wrinkled due to the reaction force generated by the tensile force while being subjected to the lateral and longitudinal forces.

[0080] At the same time, the third punching area 1423 is designed to be an oblique strip and has a preset angle with the long side and the short side of the rectangular band, so that the main body area 141 is still retained at the two opposite corners of the cover tape 140 on the same side, thereby increasing the structural strength at this position and effectively avoiding the problem of breakage of the cover tape 140 due to the excessive size of the punching area 142.

[0081] In the above embodiment, according to the structure of the cover tape 140 , a cover tape 140 having different numbers of perforated layers may be selected.

[0082] In some implementations of the present application, such as Figures 14 to 16 As shown, Fig.14 for Fig.13 A first cross-sectional view of the cover tape is shown, Fig.15 for Fig.13 A second cross-sectional view of the cover tape is shown, Fig.16 for Fig.13 The third cross-sectional view of the cover tape is shown. The cover tape 140 has a bottom insulating layer 144, an intermediate conductive layer 145 and a surface insulating layer 146 arranged in sequence, and a fixed connection is formed between the bottom insulating layer 144, the intermediate conductive layer 145 and the surface insulating layer 146, wherein at least one layer of the bottom insulating layer 144, the intermediate conductive layer 145 and the surface insulating layer 146 is a perforated layer having a perforated structure 143.

[0083] In this embodiment, the cover tape 140 is composed of a bottom insulating layer 144, an intermediate conductive layer 145, and a surface insulating layer 146 which are arranged in sequence. In order to reduce the tensile force on the cover tape 140 by deforming the perforated area 142, at least one of the bottom insulating layer 144, the intermediate conductive layer 145, and the surface insulating layer 146 should be set as a perforated layer with a perforated structure 143. The more perforated layers there are, the greater the reduction in tensile force. This ensures that the perforated area 142 can deform when subjected to tensile force, reducing the tensile force on the cover tape 140, and further reducing the reaction force applied to the outside by the cover tape 140.

[0084] In the process of manufacturing the cover tape 140 with a single perforated layer, first, holes are punched at the perforated area 142, and a characteristic shape is cut, and then the two non-perforated layers with the cut characteristic shapes are compositely fixedly connected, and finally a unified shape is cut.

[0085] In the process of manufacturing the cover tape 140 with double perforated layers, when the perforated structures 143 of each perforated layer have the same shape and the two perforated layers are adjacent, first, the two selected perforated layers are fixedly connected, and holes are punched at the perforated area 142, and the characteristic shape is cut, and then the non-perforated layer with the characteristic shape cut is compositely fixedly connected, and finally a unified shape is cut.

[0086] In the process of manufacturing the cover tape 140 with double perforated layers, when the perforated structures 143 of each perforated layer are not in the same shape and / or the two perforated layers are not adjacent, firstly, holes are punched at the perforated areas 142 respectively, and characteristic shapes are cut, and then they are compositely fixedly connected with the non-perforated layer with the characteristic shapes cut, and finally they are cut into a unified shape.

[0087] In the process of manufacturing the cover tape 140 with three perforated layers, when the perforated structures 143 of each perforated layer have the same shape, first, the three perforated layers are fixedly connected, and holes are punched at the perforated area 142, and the characteristic shapes are cut, and finally the uniform shapes are cut.

[0088] In the process of manufacturing the cover tape 140 with three perforated layers, when the perforated structures 143 of each perforated layer have different shapes, firstly, holes are punched at the perforated areas 142 respectively, and the characteristic shapes are cut, then the layers are fixed and connected, and finally the uniform shapes are cut.

[0089] In this embodiment, the bottom insulating layer 144, the middle conductive layer 145 and the surface insulating layer 146 can be fixedly connected by coating the entire surface with adhesive for gluing. Since the perforated area 142 has a perforated structure 143, the area of ​​the adhesive area of ​​the perforated area 142 is smaller than the area of ​​the adhesive area of ​​the overall area 141, so that the perforated area 142 is more likely to deform than the main area 141 when subjected to tension, thereby reducing the tension of the flexible display module 100 on the cover tape 140, thereby reducing the reaction force of the cover tape 140 on the flexible display module 100, and further effectively improving the problem that the cover tape 140 generates a reaction force when subjected to lateral and longitudinal forces along the plane where the cover tape is located, causing the flexible display module 100 to be warped and the cover tape 140 to be wrinkled.

[0090] When a multi-layer cover tape 140 having an interlayer structure greater than three layers is used, for example, a cover tape 140 having a four-layer interlayer structure or a cover tape 140 having a five-layer interlayer structure, different numbers of perforated layers may be provided in the cover tape according to actual conditions, for example, a cover tape 140 having four perforated layers or a cover tape 140 having five perforated layers.

[0091] In some implementations of the present application, such as Figures 14 to 16 As shown, the thickness H1 of the cover tape 140 is 0.06-0.15 mm, the thickness H2 of the bottom insulating layer 144 is 0.03-0.06 mm, the thickness H3 of the middle conductive layer 145 is 0.02-0.05 mm, and the thickness H4 of the surface insulating layer 146 is 0.01-0.03 mm.

[0092] In this embodiment, the thickness H1 of the cover tape 140 is 0.06-0.15 mm, the thickness H2 of the bottom insulating layer 144 is 0.03-0.06 mm, the thickness H3 of the middle conductive layer 145 is 0.02-0.05 mm, and the thickness H4 of the surface insulating layer 146 is 0.01-0.03 mm. Since the bottom insulating layer 144 is in direct contact with the electronic device, the thickness H2 of the bottom insulating layer 144 is set to 0.03-0.06 mm, which is larger than the thickness H3 of the middle conductive layer 145 and the thickness H4 of the surface insulating layer 146, thereby preventing the bottom insulating layer 144 from being pierced by the electronic devices. At the same time, the overall thickness H1 of the cover tape 140 is 0.06-0.15 mm, which increases the structural strength of the cover tape 140 and effectively avoids the problem of the cover tape 140 being pierced or broken by the electronic device during use.

[0093] Fig.17 for Fig.13 The enlarged view of the part of the cover tape M1 is shown. In this embodiment, the perforation structure 143 of the perforation area 142 of the cover tape 140 is a diamond shape. Of course, other shapes are also possible.

[0094] In the present embodiment, a diamond shape is selected as the shape of the perforation structure 143 of the perforation area 142. In practical applications, other shapes of perforation structures 143 can also be selected to meet the requirement that the perforation structure 143 of the perforation area 142 can be deformed when subjected to tension, thereby reducing the tension of the flexible display module 100 on the cover tape 140, thereby reducing the reaction force of the cover tape 140 on the flexible display module 100, and reducing the lateral and longitudinal forces applied to the cover tape 140 at the two opposite corners on the same side. Furthermore, the purpose of effectively improving the cover tape 140, when subjected to lateral and longitudinal forces along the plane where the cover tape 140 is located, generating a reaction force, causing the flexible display module 100 to be warped and the cover tape 140 to be wrinkled, can be achieved.

[0095] It is sufficient to ensure that the cover tape 140 is provided with the punching area 142 at a position with a large height difference, and the punching area 142 is deformed to reduce the pulling force and the influence of the reaction force on the flexible display module 100 .

[0096] Refer to Table 1, which is a comparison table of the relationship between the warpage optimization amount and the use of different numbers of perforated layers or different areas of perforated structures 143 when the perforated structure 143 of the present application is a diamond. The warpage optimization amount in the table is the difference between the warpage amount of the flexible display module 100 after using the cover tape 140 provided by the present application and the warpage amount of the flexible display module 100 using the conventional cover tape 140. A in Table 1 is Fig.17 The long diagonal length of the diamond-shaped perforated structure 143 in FIG. Fig.17 The short diagonal length of the diamond-shaped perforated structure 143 in the embodiment is C. Fig.17 The distance between adjacent diamond-shaped perforated structures 143 in .

[0097]

[0098] Table 1 (unit: mm)

[0099] In this embodiment, the number of perforated layers of the cover tape 140 is positively correlated with the warpage optimization amount, that is, when the area of ​​the perforated structure 143 and the spacing between adjacent perforated structures 143 are the same, the more perforated layers of the cover tape 140, the higher the warpage optimization amount.

[0100] In this embodiment, the area of ​​the perforated structure 143 of the cover tape 140 is positively correlated with the warping optimization amount, that is, when the number of perforated layers 143 and the spacing between adjacent perforated structures 143 are the same, the longer the long diagonal A and / or the short diagonal B of the cover tape 140, the higher the warping optimization amount.

[0101] In this embodiment, the distance C between adjacent perforated structures 143 of the cover tape 140 is negatively correlated with the warpage optimization amount, that is, when the number of perforated layers 143 and the area of ​​the perforated structures 143 are the same, the larger the distance C between adjacent perforated structures 143, the lower the warpage optimization amount.

[0102] In the fourth embodiment of the cover tape 140 provided in the present application, as Fig.18 and Fig.19 As shown, Fig.18 This is a schematic structural diagram of a fourth embodiment of the cover tape provided in the present application. Fig.19 for Fig.18 A partial enlarged view of the cover tape M2 is shown.

[0103] In this embodiment, the cover tape 140 includes: a first perforated area 1421, a second perforated area 1422 and a third perforated area 1423. The specific positions can be Fig.13 The cover tape 140 of the embodiment shown is located in the same position. Fig.18 As shown, the three perforated areas of the cover tape 140 of this embodiment all adopt a circular perforated structure 143 .

[0104] In the above embodiment, the shapes of the punching structures 143 of the first punching area 1421, the second punching area 1422 and the third punching area 1423 are the same. Those skilled in the art can understand that in other embodiments, the shapes of the punching structures 143 of the first punching area 1421, the second punching area 1422 and the third punching area 1423 may also be different. Specifically, they can be set according to the actual stress conditions of the cover tape 140, and there is no limitation here.

[0105] At the same time, in the above-mentioned embodiments, the perforated structures 143 of the first perforated area 1421, the second perforated area 1422 and the third perforated area 1423 adopt mesh structures of different shapes. Those skilled in the art will understand that in other embodiments, the perforated structures 143 of the first perforated area 1421, the second perforated area 1422 and the third perforated area 1423 may also select other structures as the perforated areas 142 of the cover tape 140, as long as the deformation of the perforated areas 142 is achieved to reduce the stress on the cover tape 140, and there is no limitation here.

[0106] The embodiment of the present application further provides a flexible display device, comprising the flexible display module 100 described in any one of the above embodiments.

[0107] The above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.

Claims

1. A flexible display module, characterized in that: A printed circuit board is arranged on the back of the flexible display module, and electronic components are arranged on the printed circuit board; A cover tape covering all areas of the back of the flexible display module except for the devices that need to be exposed; The cover tape comprises: a main body area and a perforated area; the perforated area is provided with a perforated structure, so that the perforated area is deformed when subjected to a tensile force; the area of ​​the cover tape without the perforated structure is the main body area; The perforated area includes: a first perforated area; the first perforated area covers a first peripheral area of ​​each electronic component.

2. The flexible display module according to claim 1, characterized in that: The printed circuit board protrudes from the back side of the flexible display module; The perforated area of ​​the cover tape further includes: a second perforated area; the second perforated area covers a second peripheral area of ​​the printed circuit board.

3. The flexible display module according to claim 1 or 2, characterized in that: The cover tape is a rectangular tape; The perforated area of ​​the cover tape further includes: at least two third perforated areas; the third perforated areas are respectively arranged at two opposite corners of the rectangular tape on the same side.

4. The flexible display module according to claim 3, characterized in that: The third perforated area is in the shape of an oblique strip, and has a preset angle with the long side and the wide side of the rectangular band.

5. A cover tape, characterized in that: The flexible display module used in any one of claims 1 to 4 comprises: The cover tape comprises: a main body area and a perforated area; the perforated area is provided with a perforated structure, so that the perforated area is deformed when subjected to a tensile force; the area of ​​the cover tape without the perforated structure is the main body area; The punching area includes: a first punching area; the first punching area is used to cover the first peripheral area of ​​each electronic component on the printed circuit board on the back of the flexible display module.

6. The cover tape according to claim 5, characterized in that The perforated area of ​​the cover tape further includes: a second perforated area; the second perforated area is used to cover a second peripheral area of ​​the printed circuit board.

7. The cover tape according to claim 5 or 6, characterized in that: The cover tape is a rectangular tape; The perforated area of ​​the cover tape further includes: at least two third perforated areas; the third perforated areas are respectively arranged at two opposite corners of the rectangular tape on the same side.

8. The cover tape according to claim 7, characterized in that The third perforated area is in the shape of an oblique strip, and has a preset angle with the long side and the wide side of the rectangular band.

9. The cover tape according to claim 8, characterized in that The cover tape comprises a bottom insulating layer, a middle conductive layer and a surface insulating layer which are arranged in sequence; A fixed connection is formed between the bottom insulating layer, the middle conductive layer and the surface insulating layer; Wherein, at least one of the bottom insulating layer, the middle conductive layer and the surface insulating layer is a perforated layer having a perforated structure.

10. A flexible display device, characterized in that: A flexible display module comprising any one of claims 1 to 4.

Images