Base plate edge breaking mechanism

Abstract

The utility model provides a base plate edge breaking mechanism which is used for conducting edge breaking on a base plate and comprises a support, a clamping assembly arranged on the support and a plate pushing assembly arranged on one side of the clamping assembly, and the clamping assembly comprises a first clamping plate, a second clamping plate and a clamping plate driving piece. The clamping plate driving part is used for adjusting the distance between the first clamping plate and the second clamping plate so as to clamp the base plate, the push plate assembly comprises a push plate driving part and a push plate, the push plate driving part drives the push plate to move towards the base plate, and the push plate pushes the edge of the base plate in the moving process. Through the arrangement, the accuracy of substrate processing is improved, the generation rate of cracks in the edge breaking process is reduced, and the production efficiency and the automation level are further improved.

Description

Technical Field

[0001] The utility model relates to the field of electronic technology, in particular to a substrate edge bending mechanism. Background Art

[0002] The advancement of ceramic substrate technology is closely related to the development of the semiconductor industry. In particular, with the increasing demand for high-performance microwave, millimeter-wave devices and light-emitting devices, traditional first-generation and second-generation semiconductor materials are gradually unable to meet the use requirements of high frequency, high temperature, high power, etc. In addition, as the equipment develops towards smaller size and higher integration, higher requirements are put forward for the flatness, surface roughness, dimensional stability, etc. of the substrate, which poses challenges to the molding process of ceramic substrates.

[0003] In the production process of ceramic substrates, molding is a key link that affects the quality and cost of the substrate. In order to improve production efficiency, ceramic copper-clad substrates (DBC substrates) are usually produced in large pieces, and then manually broken into small pieces after laser cutting. Therefore, ceramic substrate edge bending is an essential process in ceramic substrates and related products. Because ceramics are hard, manual operation is difficult, and manual operation is uneven, resulting in a high rate of cracking and substrate breakage.

[0004] Therefore, it is necessary to design a substrate edge bending mechanism to solve the above problems. Utility Model Content

[0005] The utility model aims to provide a substrate edge breaking mechanism to improve the accuracy of substrate processing and reduce the generation of cracks during the edge breaking process, thereby further improving production efficiency and automation level.

[0006] To achieve the above-mentioned purpose, the utility model adopts the following technical solutions: a substrate bending mechanism for bending the edge of a substrate, which includes a bracket, a clamping assembly arranged on the bracket and a push plate assembly arranged on one side of the clamping assembly, the clamping assembly includes a first clamping plate, a second clamping plate and a clamping plate driving member, the clamping plate driving member is used to adjust the distance between the first clamping plate and the second clamping plate to clamp the substrate, the push plate assembly includes a push plate driving member and a push plate, the push plate driving member drives the push plate to move toward the substrate, and the push plate pushes the edge of the substrate during the movement.

[0007] As a further improved technical solution of the utility model, the push plate is wedge-shaped, and the inclination angle of the wedge-shaped inclined surface is 15 to 75 degrees.

[0008] As a further improved technical solution of the utility model, the length of the push plate is greater than or equal to the length of the edge of the substrate.

[0009] As a further improved technical solution of the utility model, the clamping plate driving member is dynamically connected to the first clamping plate.

[0010] As a further improved technical solution of the utility model, the clamping assembly also includes a second clamping plate driving member dynamically connected to the second clamping plate.

[0011] As a further improved technical solution of the utility model, gaskets are respectively provided on one side of the first clamping plate that is opposite to the second clamping plate.

[0012] As a further improved technical solution of the utility model, the clamping assembly also includes a guide rod connected to the first clamping plate and a guide sleeve arranged on the bracket, the guide rod is inserted into the guide sleeve, and when the clamping plate driving member drives the first clamping plate to move, the guide rod moves along the guide sleeve.

[0013] As a further improved technical solution of the utility model, the push plate assembly also includes a guide rod connected to the push plate and a guide sleeve on the bracket, the guide rod is inserted into the guide sleeve, and when the push plate driving member drives the push plate to move, the guide rod moves along the guide sleeve.

[0014] As a further improved technical solution of the utility model, it also includes a material receiving assembly, and the upper opening of the material receiving assembly is located below the edge of the substrate.

[0015] As a further improved technical solution of the utility model, it also includes a conveying component, which is used to convey the substrate to the clamping component so that the edge of the substrate is located between the first clamping plate and the second clamping plate.

[0016] It can be seen from the above technical scheme that the substrate bend mechanism of the utility model can effectively fix the substrate and accurately push its edge through the cooperation of the clamping assembly and the push plate assembly, thereby realizing the bend operation of the substrate; in addition, the setting of the clamping plate driving member allows the distance between the clamping plates to be adjusted to adapt to substrates of different sizes, thereby increasing the versatility and flexibility of the equipment; in addition, the push plate driving member drives the push plate to move toward the substrate, thereby ensuring the stability and controllability of the bend process and reducing product damage caused by improper operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional diagram of a substrate edge bending mechanism according to an embodiment of the utility model.

[0018] Figure 2 for Figure 1 Side view of the middle substrate edge bending mechanism.

[0019] Figure 3 for Figure 2Enlarged view of the circled area. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0021] Please refer to Figure 1 and Figure 2 As shown, the utility model provides a substrate edge bending mechanism, which specifically includes a bracket 10, a push plate assembly 20, a clamping assembly 30, a material receiving assembly 40 and a conveying assembly (not shown). The conveying assembly is used to transfer the substrate 100 to the clamping assembly 30, so that the substrate 100 is located at a position that can be clamped by the clamping assembly 30. After the clamping assembly 30 clamps and fixes the substrate, the push plate assembly 20 acts on the edge of the substrate 100 to bend the substrate; the material receiving assembly 40 is used to collect the waste material that has been bent.

[0022] The bracket 10 is used to support the push plate assembly 20 and the clamping assembly 30, and specifically includes four legs and a support plate disposed on the legs, and the push plate assembly 20 and the clamping assembly 30 are vertically disposed on the support plate.

[0023] The clamping assembly 30 includes a first clamping plate 32, a first clamping plate driving member 31 for driving the first clamping plate 32 to move in the vertical direction, a second clamping plate 34, and a second clamping plate driving member 33 for driving the second clamping plate 34 to move in the vertical direction. The first clamping plate driving member 31 and the second clamping plate driving member 33 are used to adjust the distance between the first clamping plate 32 and the second clamping plate 34 to clamp the substrate 100. The first clamping plate 32 and the second clamping plate 34 are provided with gaskets on the opposite sides. Please refer to Figure 3 As described above, the first clamping plate 32 and the second clamping plate 34 are clamped at the inner side of the cutting slit 101 at the edge of the substrate 100 and are close to the cutting slit 101. The clamping assembly 30 also includes a guide rod 35 connected to the first clamping plate 32 and a guide sleeve 12 provided on the bracket 10. The guide rod 35 is inserted into the guide sleeve 12. When the first clamping plate driving member 31 drives the first clamping plate 32 to move, the guide rod 35 moves along the guide sleeve 12. The guide rod 35 and the guide sleeve 12 are provided in two groups, which are symmetrically provided on both sides of the first clamping plate driving member 31.

[0024] The push plate assembly 20 is arranged on one side of the clamping assembly 30. The push plate assembly 20 includes a push plate driving member 21, a push plate mounting plate 22 and a push plate 23. The push plate driving member 21 drives the push plate 23 to move toward the substrate 100, and the push plate 23 pushes the edge of the substrate 100 during the movement. The push plate 23 is wedge-shaped. With such a configuration, the push plate 23 can provide sufficient force to break off the edge of the substrate while preventing damage to the main body of the substrate; and the wedge shape can provide more controlled and smooth force transmission during the breaking process through a gradually increasing contact area. Preferably, the inclination angle of the wedge-shaped bevel is 15 to 75°. The length of the push plate 23 is greater than or equal to the length of the edge of the substrate.

[0025] The push plate assembly 20 further includes a guide rod 24 provided on the push plate mounting plate 22 and a guide sleeve 11 on the bracket 10, wherein the guide rod 24 is inserted into the guide sleeve 11. When the push plate driving member 21 drives the push plate 23 to move, the guide rod 24 moves along the guide sleeve 11. There are preferably two guide rods 24, which are provided on the push plate mounting plate 22 along the length direction and are symmetrically located on both sides of the push plate driving member 21.

[0026] The upper opening of the material receiving assembly 40 is located below the edge of the substrate 100 to collect the substrate waste broken off by the push plate assembly 20 to prevent it from scattering and affecting the operation of the equipment. Specifically, the material receiving assembly 40 includes two baffles 41 and 42 arranged opposite to each other, and the two baffles 41 are arranged staggered up and down, and the baffles 41 are arranged close to the baffle 23. The upper ends of the baffles 41 and 42 are inclined outward.

[0027] Terms such as "upper" and "lower" used herein to indicate spatial relative positions are used for the purpose of convenience to describe the relationship of one feature relative to another feature as shown in the drawings. It is understood that, depending on the placement of the product, the terms of spatial relative positions may be intended to include different orientations other than those shown in the drawings, and should not be construed as limitations on the claims.

[0028] In addition, the above embodiments are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. The understanding of this specification should be based on the technical personnel in the relevant technical field. Although this specification has described the present invention in detail with reference to the above embodiments, ordinary technical personnel in the field should understand that the technical personnel in the relevant technical field can still modify or make equivalent substitutions to the present invention, and all technical solutions and improvements thereof that do not depart from the spirit and scope of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A substrate edge bending mechanism, used for bending the edge of a substrate, characterized in that: It includes a bracket, a clamping assembly arranged on the bracket and a push plate assembly arranged on one side of the clamping assembly, the clamping assembly includes a first clamping plate, a second clamping plate and a clamping plate driving member, the clamping plate driving member is used to adjust the distance between the first clamping plate and the second clamping plate to clamp the substrate, the push plate assembly includes a push plate driving member and a push plate, the push plate driving member drives the push plate to move toward the substrate, and the push plate pushes the edge of the substrate during the movement.

2. The substrate edge bending mechanism according to claim 1, characterized in that: The push plate is wedge-shaped, and the inclination angle of the wedge-shaped inclined surface is 15-75 degrees.

3. The substrate edge bending mechanism according to claim 1, characterized in that: The length of the push plate is greater than or equal to the length of the edge of the substrate.

4. The substrate edge bending mechanism according to claim 1, characterized in that: The clamping plate driving member is dynamically connected to the first clamping plate.

5. The substrate edge bending mechanism according to claim 4, characterized in that: The clamping assembly also includes a second clamping plate driving member dynamically connected to the second clamping plate.

6. The substrate edge bending mechanism according to claim 1, characterized in that: Gaskets are respectively provided on one side of the first clamping plate and the other side of the second clamping plate that are opposite to each other.

7. The substrate edge bending mechanism according to claim 1, characterized in that: The clamping assembly also includes a guide rod connected to the first clamping plate and a guide sleeve arranged on the bracket, the guide rod is inserted into the guide sleeve, and when the clamping plate driving member drives the first clamping plate to move, the guide rod moves along the guide sleeve.

8. The substrate edge bending mechanism according to claim 1, characterized in that: The push plate assembly also includes a guide rod connected to the push plate and a guide sleeve on the bracket, the guide rod is inserted into the guide sleeve, and when the push plate driving member drives the push plate to move, the guide rod moves along the guide sleeve.

9. The substrate edge bending mechanism according to claim 1, characterized in that: It also includes a material receiving component, wherein the upper opening of the material receiving component is located below the edge of the substrate.

10. The substrate edge bending mechanism according to claim 1, characterized in that: The system further comprises a conveying assembly, wherein the conveying assembly is used to convey the substrate to the clamping assembly so that an edge of the substrate is located between the first clamping plate and the second clamping plate.

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