Packaging structure for RGB three-channel LED driving IC

Abstract

The utility model provides a packaging structure for an RGB three-channel LED driving IC, which relates to the field of semiconductor packaging and comprises a plastic packaging body, an IC chip packaged in the plastic packaging body in a plastic mode and an IC frame used for bearing the IC chip and electrically connected with the IC chip, and three pins electrically connected with the IC chip are led out of the plastic packaging body towards the two sides respectively. The base island of the IC frame sinks and is exposed out of the bottom of the plastic package body to serve as an independent functional pin, so that under-screen package is formed; according to the utility model, the under-screen packaging structure is adopted, specifically, the RGB three-channel LED driving IC is packaged in the plastic packaging body, the surface is provided with three pins in two rows, the under-screen is arranged at the bottom, the under-screen base island plays a role of an independent function pin, and the problem that the width of the PCB cannot be less than 8mm is fundamentally solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, and in particular to a packaging structure for an RGB three-channel LED driver IC in the field of LED lighting. Background Art

[0002] Three-channel LED driver IC means that the IC has three signals to independently control three LED lamp beads. According to the color system theory, these three colors are usually: Red, Green, and Blue. These three colors of LED can be mixed into various colors by adjusting their respective grayscales and colors. Existing technologies include Huacaiwei's three-channel constant current LED driver IC, Mingwei's three-channel LED driver control chip, Meisiwei's three-channel LED driver control, and Tianwei's 3-channel LED constant current drive dedicated circuit.

[0003] At present, most of the RGB three-channel IC products use SOP8, a package with 8 pins on the surface. These 8 pins are: R, G, B, Dout, Din, NC (Dib for breakpoint continuation), VDD, GND. The package has relatively complete pins, but often one pin is an empty pin NC, which does not play an actual connection function and is in an idle state. Therefore, at least 7 independent functional pins are required to realize the RGB three-channel function. For example, in the ultra-thin VSOP package disclosed in the Chinese invention patent application with publication number CN103337483A in the prior art, four connecting pins extend from each side of the plastic package. At the same time, in order to be compatible with other types of products, the SOP8 package cannot be modified. Therefore, when SOP8 is used for flexible lighting, due to its body size limitation, when it is actually used in a circuit board, the width of the circuit board cannot be very small, at least it must just exceed the SOP8 body, that is, SOP8 can only be used in batches for PCB boards with a width of 8mm or more, and cannot be used for PCBs with a width of less than 8mm (or PCBs with a width of less than 8mm are difficult to achieve mass production). In addition, since the IC requires at least 7 independent functional pins, even if 7 independent functional pins are realized on the SOP8 body, the SOP8 body is difficult to narrow. Due to the application of SOP8, the PCB cannot be further narrowed, which gradually becomes a major difficulty in LED flexible lighting. The SOP8 body is the root cause of this difficulty (RGB lamp beads, resistors, capacitors and other all other components are smaller than SOP8).

[0004] As PCB boards and copper materials become increasingly expensive, many manufacturers have to consider new ways to reduce costs, increase efficiency and narrow PCB width. Utility Model Content

[0005] In view of the above problems existing in the prior art, the utility model provides a packaging structure for an RGB three-channel LED driver IC with a smaller body and higher PCB space utilization. The width of a PCB board using the package can be reduced to 6.8 mm, which is close to the body width of SOP8.

[0006] The utility model solves the above-mentioned technical problem with the following technical solution: a packaging structure for an RGB three-channel LED driver IC, characterized in that it comprises a plastic package, an IC chip encapsulated in the plastic package, and an IC frame for carrying the IC chip and electrically connected to the IC chip, the plastic package leads to three pins electrically connected to the IC chip on both sides, the base island of the IC frame sinks and leaks out of the bottom of the plastic package as an independent functional pin, that is, a leaky bottom package is formed.

[0007] Wherein, the IC chip is a driver IC chip for RGB three-channel LEDs.

[0008] Furthermore, the base island of the IC frame sinks and leaks out of the bottom of the plastic package in a plane.

[0009] Furthermore, the functional pins are coplanar with the bottom surface of the plastic package body.

[0010] Furthermore, the base island of the IC frame sinks and leaks out of the bottom of the plastic package to serve as a first functional pin.

[0011] Furthermore, three pins extending from two sides of the plastic package body serve as six independent functional pins.

[0012] Furthermore, the IC chip is connected to the base island of the IC frame through its bottom surface, and the top surface of the IC chip is electrically connected to the six pins led out from both sides of the plastic package. Preferably, the top surface of the IC chip is electrically connected to the six pins led out from both sides of the plastic package through metal wires.

[0013] Furthermore, both ends of the IC frame extend to the parting surface of the plastic package body.

[0014] Furthermore, a Z-shaped bending structure is formed between the middle portion and the end portions of the IC frame.

[0015] The beneficial effects of the utility model are as follows: the utility model adopts a leaky bottom packaging structure, specifically an RGB three-channel LED driver IC is packaged in a plastic package, the surface is double-row with three pins each, and the bottom is leaky. The leaky bottom base island plays the role of an independent functional pin, which fundamentally solves the problem that the width of the PCB board cannot be less than 8mm; the package is compatible with the functional pins of the SOP8 RGB three-channel IC, and the body is smaller, and the PCB space utilization rate is higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the external structure of the utility model (front view);

[0017] Figure 2 It is a schematic diagram of the external structure of the utility model (bottom surface);

[0018] Figure 3 It is a schematic diagram of the structure of the utility model (excluding the plastic sealing body);

[0019] Figure 4 It is a schematic diagram of the structure of the utility model (excluding the plastic sealing body);

[0020] In the figure: 1. plastic package, 2. IC chip, 3. IC frame, 30. base island, 4. metal wire, 11. OUTR pin, 12. OUTG pin, 13. OUTB pin, 14. DOUT pin, 15. DIN pin, 16. VDD pin, 17. GND pin. DETAILED DESCRIPTION

[0021] The principles and features of the present invention are described below. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0022] As shown in the accompanying drawings, the present embodiment provides a packaging structure for an RGB three-channel LED driver IC, which is described by taking a SOT23-6 packaging structure as an example. The packaging structure includes a plastic package 1, an IC chip 2 plastic-sealed in the plastic package 1, and an IC frame 3 for carrying the IC chip 2 and electrically connected to the IC chip 2. The IC frame 3 has a base island 30 for placing the IC chip 2. The plastic package 1 leads to three functional pins electrically connected to the IC chip 2 on both sides, which are OUTR pin 11, OUTG pin 12, OUTB pin 13, DOUT pin 14, DIN pin 15, and VDD pin 16 respectively; the bottom surface of the IC chip 2 is connected to the base island 30, and the top surface of the IC chip 2 is electrically connected to the OUTR pin 11, OUTG pin 12, OUTB pin 13, DOUT pin 14, DIN pin 15, and VDD pin 16 through metal wires 4 (such as copper wires).

[0023] Both ends of the IC frame extend to the parting surface of the plastic package body, and the base island 30 of the IC frame 3 sinks and leaks out of the bottom of the plastic package body 1 in a plane and is coplanar with the plastic package body 1, that is, the IC frame 3 is a leaky bottom package, and the base island of the IC frame 3 leaks out of the plastic package body 1 to serve as an independent functional pin, in this embodiment, as a GND functional pin 17, and a Z-shaped bending structure is formed between the end of the IC frame and the middle base island.

[0024] This embodiment adopts a leaky bottom package, and the leaky bottom base island serves as a functional pin, with a total of 7 functional pins, of which: the surface is double-row with three pins each, and the bottom IC frame base island is leaky, and the leaky bottom IC frame serves as an independent functional pin. The pin description is as follows:

[0025]

[0026] The above correspondence between pin names and pin functions is only used as an example. In fact, this is not the only arrangement. As long as the IC package contains the above seven pin functions, this package can achieve the functions.

[0027] The package structure of this embodiment has a plastic package body with no pins and an external dimension of 2.72*1.40*0.85mm, and a plastic package body with pins and an external dimension of 2.72*2.70*0.87mm. The width of a PCB board using this package can be reduced to 6.8mm.

Claims

1. A packaging structure for an RGB three-channel LED driver IC, characterized in that: It includes a plastic package, an IC chip sealed in the plastic package, and an IC frame for carrying the IC chip and electrically connected to the IC chip. The plastic package leads to three pins on both sides that are electrically connected to the IC chip respectively. The base island of the IC frame sinks and leaks out from the bottom of the plastic package as an independent functional pin.

2. The packaging structure for RGB three-channel LED driver IC according to claim 1, characterized in that: The base island of the IC frame sinks and leaks out of the bottom of the plastic package in a plane.

3. The packaging structure for RGB three-channel LED driver IC according to claim 2, characterized in that: The functional pins are coplanar with the bottom surface of the plastic package body.

4. The packaging structure for RGB three-channel LED driver IC according to claim 1, characterized in that: The three pins extending from the two sides of the plastic package body serve as six independent functional pins.

5. The packaging structure for RGB three-channel LED driver IC according to claim 4, characterized in that: The IC chip is connected to the base island of the IC frame through its bottom surface, and the top surface of the IC chip is electrically connected to six pins led out from two sides of the plastic package body respectively.

6. The packaging structure for RGB three-channel LED driver IC according to claim 5, characterized in that: The top surface of the IC chip is electrically connected to six pins led out from two sides of the plastic package body through metal wires.

7. The packaging structure for RGB three-channel LED driver IC according to claim 1, characterized in that: Both ends of the IC frame extend to the parting surface of the plastic package body.

8. The packaging structure for RGB three-channel LED driver IC according to claim 1, characterized in that: A Z-shaped bending structure is formed between the middle portion and the end portions of the IC frame.

Images