Constant temperature device of electronic chip

Abstract

The utility model relates to the technical field of constant temperature devices, in particular to a constant temperature device of an electronic chip, which comprises a first vapor chamber, a semiconductor chilling plate and an electric heater, the first vapor chamber is adhered on the chip, a mounting groove is arranged at the bottom of the first vapor chamber, and the electric heater is mounted in the mounting groove. The cold surface of the semiconductor chilling plate is adhered to the top of the first vapor chamber; according to the constant temperature device of the electronic chip, when the temperature of the chip is too high, the temperature of the chip can be transmitted to the first vapor chamber, and then the first vapor chamber is refrigerated through the semiconductor chilling plate, so that the temperature of the chip is reduced, and the working temperature of the chip is prevented from being too high; when the chip works in a field extremely cold environment, heating of the first vapor chamber can be achieved through heating of the electric heater, the first vapor chamber transmits heat to the chip, and therefore the temperature of the chip is increased, the situation that the chip cannot operate due to the fact that the temperature of the chip is too low is avoided, and the chip works within a constant temperature range in the working process.

Description

Technical Field

[0001] The utility model relates to the technical field of constant temperature devices, in particular to a constant temperature device for an electronic chip. Background Art

[0002] Today is a period of rapid technological development, and the application of electronic equipment has higher quality and reliability requirements. When it comes to electronic equipment, chips are indispensable. Quality and reliability depend to a large extent on whether the chip runs stably and reliably, and the premise of reliable operation is largely related to the environment in which the equipment is used, such as temperature, humidity, noise, vibration, etc., among which temperature is the most prominent. For example, power chips, processor chips, computing chips, field programmable gate array chips, etc. in electronic equipment. The power consumption and heat of these chips will be very high during operation. If the temperature is not well controlled, the performance of the chip will be reduced or damaged, making the entire device or system unstable or paralyzed. In addition, the extremely cold environment in the wild will cause some chips to fail to operate normally, which will cause some equipment or systems to fail to operate. If these situations occur, it will cause great economic losses or serious accidents to a large extent. For example, if a server CPU radiator has a problem, the temperature will rise rapidly. Mildly: if the server has CPU chip over-temperature protection, the whole system will be shut down as a result; seriously: the chip will burn and the server will be unusable; it may also cause data damage, so it needs to be improved. Utility Model Content

[0003] The purpose of the utility model is to provide a constant temperature device for an electronic chip to solve the problems raised in the above background technology.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] A constant temperature device for an electronic chip comprises a chip and a constant temperature device arranged on the chip, wherein the constant temperature device comprises a first heat spreader, a semiconductor cooling sheet, a second heat spreader, a heat exchanger and an electric heater, wherein the first heat spreader is bonded to the chip, a mounting groove is arranged at the bottom of the first heat spreader, the electric heater is mounted in the mounting groove, the cold surface of the semiconductor cooling sheet is bonded to the top of the first heat spreader, the hot surface of the semiconductor cooling sheet is bonded to the second heat spreader, and a heat exchanger is bonded to the side of the second heat spreader away from the semiconductor cooling sheet.

[0006] It is worth noting that the electric heater is an electric heating plate or an electric heating tube.

[0007] It is worth noting that it also includes a chip mainboard, on which the chip is mounted.

[0008] It is worth noting that the chip also includes a chip with a built-in temperature sensor.

[0009] Compared with the prior art, the beneficial effects of the utility model are:

[0010] The constant temperature device of the electronic chip can transfer its own temperature to the first heat spreader when the temperature of the chip is too high, and then cool the first heat spreader through the semiconductor refrigeration sheet, so as to reduce the temperature of the chip and avoid the chip operating temperature being too high; when the chip is working in an extremely cold environment outdoors, the first heat spreader can be heated by the electric heater, and the first heat spreader transfers the heat to the chip, so as to heat the chip and avoid the chip temperature being too low to operate, thereby achieving the chip working within a constant temperature range when working. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the overall explosion structure of the utility model.

[0012] Figure 2 It is a schematic diagram of the structure of the first heat sink and the electric heater in the utility model.

[0013] The meanings of the numbers in the figure are: 1. chip main board; 2. chip; 3. first heat spreader; 30. mounting slot; 4. electric heater; 5. semiconductor cooling plate; 6. second heat spreader; 7. heat exchanger. DETAILED DESCRIPTION

[0014] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0015] The utility model provides a technical solution:

[0016] A constant temperature device for electronic chips, see Figure 1-Figure 2 , comprising a chip mainboard 1 and a chip 2, wherein the chip 2 is mounted on the chip mainboard 1, and a constant temperature device is arranged on a side of the chip 2 away from the chip mainboard 1;

[0017] Specifically, the constant temperature device includes a first vapor chamber 3, a semiconductor cooling sheet 5, a second vapor chamber 6, a heat exchanger 7 and an electric heater 4; the first vapor chamber 3 is bonded to the chip 2 by a thermally conductive adhesive, a mounting groove 30 is provided at the bottom of the first vapor chamber 3, and the electric heater 4 is mounted in the mounting groove 30, and the electric heater 4 fits the first vapor chamber 3. When the electric heater 4 is working, the heat can be transferred to the first vapor chamber 3, and then the heat is transferred to the chip 2 through the first vapor chamber 3, so that the normal operation of the chip can be maintained in an extremely cold environment outdoors;

[0018] The cold surface of the semiconductor cooling sheet 5 is bonded to the top of the first heat spreader 3 by thermally conductive adhesive, and the hot surface of the semiconductor cooling sheet 5 is bonded to the second heat spreader 6 by thermally conductive adhesive. The side of the second heat spreader 6 away from the semiconductor cooling sheet 5 is bonded with a heat exchanger 7 by thermally conductive adhesive.

[0019] The electric heater 4 in the present invention is an electric heating plate or an electric heating tube.

[0020] The chip 2 in the utility model is a chip with a built-in temperature sensor. At present, temperature sensors are integrated in the cores of large chips, which belongs to the mature existing technology.

[0021] It is worth noting that a controller is also included, and the controller is electrically connected to the temperature sensor, semiconductor cooling sheet and electric heater of the chip 2; when the temperature sensor on the chip detects that the temperature of the chip is lower than the first set value, the temperature sensor transmits a signal to the controller, and the controller controls the electric heater to work for heating. At this time, the semiconductor cooling sheet does not work, and the electric heater heats and transfers the heat to the first heat spreader 3. The heat can be evenly transferred to the chip 2 through the first heat spreader 3, so as to avoid the chip 2 from being too low in temperature and unable to operate normally. When the temperature sensor detects that the chip temperature rises to a second set value, the controller controls the electric heater to stop heating, and the temperature value under the second set value is greater than the temperature value under the first set value.

[0022] When the temperature sensor on the chip detects that the temperature of the chip is higher than the fourth set value, the temperature sensor transmits a signal to the controller, and the controller controls the semiconductor refrigeration plate to work. At this time, the electric heater does not work, and the heat generated by the chip will be transferred to the first heat spreader 3. Since the first heat spreader 3 is in contact with the cold surface of the semiconductor refrigeration plate, the first heat spreader 3 can be cooled well, and the hot surface of the semiconductor refrigeration plate transfers the temperature to the second heat spreader 6. Finally, the second heat spreader 6 exchanges heat with the heat exchanger 7, thereby realizing the overall cooling work. When the temperature sensor detects that the temperature of the chip drops to the third set value, the controller controls the semiconductor refrigeration plate to stop working; the temperature interval from the temperature value under the second set value to the temperature value under the third set value is the suitable temperature for the chip to work, and the working temperature of the chip is always kept in the constant temperature range of the suitable temperature, thereby ensuring the normal and stable operation of the chip.

[0023] It should be added that it also includes a device for introducing a refrigerant into the heat exchanger 7. When the semiconductor refrigeration plate is working, the device allows the refrigerant to enter from the inlet of the heat exchanger 7 and then flow out from the outlet of the heat exchanger 7, thereby achieving heat exchange between the second heat spreader 6 and the heat exchanger 7.

[0024] The heat exchanger 7 and the device for introducing the refrigerant into the heat exchanger 7 in the present invention are both commonly used devices in the prior art, and will not be described in detail here.

Claims

1. A thermostat for an electronic chip, comprising a chip (2), the thermostat being arranged on the chip (2), characterized in that: The constant temperature device comprises a first heat spreader (3), a semiconductor cooling sheet (5), a second heat spreader (6), a heat exchanger (7) and an electric heater (4); the first heat spreader (3) is bonded to the chip (2); a mounting groove (30) is provided at the bottom of the first heat spreader (3); the electric heater (4) is installed in the mounting groove (30); the cold surface of the semiconductor cooling sheet (5) is bonded to the top of the first heat spreader (3); the hot surface of the semiconductor cooling sheet (5) is bonded to the second heat spreader (6); and the heat exchanger (7) is bonded to the side of the second heat spreader (6) away from the semiconductor cooling sheet (5).

2. The constant temperature device for an electronic chip according to claim 1, characterized in that: The electric heater (4) is an electric heating plate or an electric heating tube.

3. The constant temperature device for an electronic chip according to claim 1, characterized in that: It also includes a chip mainboard (1), on which the chip (2) is mounted.

4. The constant temperature device for an electronic chip according to claim 1, characterized in that: The chip (2) is also provided with a temperature sensor.

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