Imaging device

Abstract

A camera device comprises a circuit board, a photosensitive assembly and a first reinforcing plate. The circuit board comprises an assembling hole, a first surface and a second surface, the first surface and the second surface are opposite to each other, the assembling hole penetrates through the first surface and the second surface and is provided with an inner ring surface, the first surface is provided with a first groove, and the first groove surrounds the assembling hole. The photosensitive assembly is located in the assembly hole and comprises a front face, a back face and an outer periphery, the outer periphery is fixed to the inner ring face of the assembly hole, and the front face is adjacent to the first surface relative to the back face. The first reinforcing plate is arranged in the first groove of the first surface.

Description

Technical Field

[0001] The utility model relates to an optical device, in particular to a camera device. Background Art

[0002] With the development of technology, camera devices are increasingly used in personal electronic products, automotive fields, medical fields, etc. to obtain external images. For example, most computer devices (such as laptops or tablet computers) have camera devices to support functions such as photography, web video or face recognition.

[0003] Generally speaking, a camera device has a circuit board and a photosensitive component. In order to make the overall thickness of the camera device thinner, the industry will install the photosensitive component in the hole of the circuit board. However, although this structure can achieve the purpose of reducing the thickness, the hole will also cause the circuit board and the photosensitive component to be easily offset or deformed due to force, which will affect the quality of the image sensed by the photosensitive component. Utility Model Content

[0004] In view of the above, in one embodiment, a camera device is provided, including a circuit board, a photosensitive component and a first reinforcement plate. The circuit board includes an assembly hole and a first surface and a second surface opposite to each other, the assembly hole passes through the first surface and the second surface and has an inner annular surface, the first surface has a first groove, and the first groove surrounds the assembly hole. The photosensitive component is located in the assembly hole, the photosensitive component includes a front surface, a back surface and an outer peripheral edge, the outer peripheral edge is fixed to the inner annular surface of the assembly hole, and the front surface is adjacent to the first surface relative to the back surface. The first reinforcement plate is arranged in the first groove of the first surface.

[0005] In another embodiment, a camera device is provided, including a circuit board, a photosensitive component, and a second reinforcement plate. The circuit board includes an assembly hole and a first surface and a second surface opposite to each other, the assembly hole passes through the first surface and the second surface and has an inner annular surface, the second surface has a second groove, and the second groove surrounds the assembly hole. The photosensitive component is located in the assembly hole, the photosensitive component includes a front surface, a back surface, and an outer peripheral edge, the outer peripheral edge is fixed to the inner annular surface of the assembly hole, and the front surface is adjacent to the first surface relative to the back surface. The second reinforcement plate is arranged in the second groove of the second surface.

[0006] In summary, according to the camera device of the embodiment of the utility model, by setting a groove around the assembly hole on the first surface or the second surface, and further setting a reinforcing member in the groove, the structural strength of the circuit board adjacent to the assembly hole can be strengthened, and the photosensitive component can be prevented from being displaced due to force, and the circuit board can be prevented from being deformed or broken due to force, so that the photosensitive component maintains good image sensing quality. In addition, the reinforcement member is set in the groove to avoid increasing the overall thickness of the camera device, which is conducive to the development trend of thinning the camera device. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is a three-dimensional diagram of the first embodiment of the camera device of the present utility model.

[0008] Figure 2 It is an exploded perspective view of the first embodiment of the camera device of the utility model.

[0009] Figure 3 It is a cross-sectional view of the first embodiment of the camera device of the utility model.

[0010] Figure 4 It is a partially enlarged cross-sectional view of the first embodiment of the camera device of the utility model.

[0011] Figure 5 It is a bottom view of the first embodiment of the camera device of the utility model.

[0012] Figure 6 It is an exploded perspective view of the second embodiment of the camera device of the present invention.

[0013] Figure 7 It is a cross-sectional view of the second embodiment of the camera device of the present utility model.

[0014] Figure 8 It is a partially enlarged cross-sectional view of the second embodiment of the camera device of the utility model.

[0015] Fig. 9 It is a partially enlarged cross-sectional view of the third embodiment of the camera device of the utility model.

[0016] Description of reference numerals:

[0017] 1. 1a, 1b: Camera device

[0018] 10: Circuit Board

[0019] 101: First electrical connection portion

[0020] 102: Second electrical connection portion

[0021] 11: First surface

[0022] 111: First groove

[0023] 12: Second Surface

[0024] 121: Second groove

[0025] 13: Long side

[0026] 14: Short side

[0027] 15: Assembly hole

[0028] 151: Inner ring

[0029] 20: Photosensitive components

[0030] 201: First conductive part

[0031] 202: Second conductive part

[0032] 21: Positive

[0033] 211: Photosensitive area

[0034] 212: Non-photosensitive area

[0035] 22: Back

[0036] 23: Outer periphery

[0037] 30: First reinforcement plate

[0038] 31: First outer surface

[0039] 35: First side

[0040] 40: Second reinforcement plate

[0041] 41: Second outer surface

[0042] 42: Inner rim

[0043] 45: Second side

[0044] 50: Fixed shield

[0045] 60: Lens Group

[0046] 61: Pedestal

[0047] 65: Lens

[0048] A: Center axis

[0049] G: Ring glue layer

[0050] L: glue layer DETAILED DESCRIPTION

[0051] Figure 1 This is a three-dimensional diagram of the first embodiment of the camera device of the utility model. Figure 2 This is an exploded perspective view of the first embodiment of the camera device of the utility model. Figure 3 2 is a cross-sectional view of the first embodiment of the camera device of the utility model. Figures 1 to 3 As shown, the camera device 1 includes a circuit board 10 and a photosensitive component 20. In some embodiments, the camera device 1 can be applied to various electronic products to obtain images around the electronic products. For example, the camera device 1 can be applied to mobile devices (such as smart phones, tablet computers or laptops) or electronic products such as cameras.

[0052] Figure 4 This is a partially enlarged cross-sectional view of the first embodiment of the camera device of the utility model. Figures 1 to 4 As shown, the circuit board 10 includes a first surface 11 and a second surface 12 opposite to each other and an assembly hole 15, wherein the assembly hole 15 penetrates the first surface 11 and the second surface 12 and has an inner annular surface 151. In this embodiment, the assembly hole 15 is a rectangular hole, but this is not limited. In other embodiments, the assembly hole 15 can also be a circular hole, an elliptical hole or a square hole, etc., depending on actual product requirements.

[0053] like Figures 2 to 4 As shown, the photosensitive component 20 is disposed inside the assembly hole 15, and the photosensitive component 20 includes a front surface 21, a back surface 22, and an outer periphery 23, and the outer periphery 23 is connected between the front surface 21 and the back surface 22, wherein the front surface 21 and the first surface 11 of the circuit board 10 face the same direction, the back surface 22 and the second surface 12 of the circuit board 10 face the same direction, and the front surface 21 is adjacent to the first surface 11 of the circuit board 10 relative to the back surface 22. In some embodiments, the shape of the photosensitive component 20 can be the same as the shape of the assembly hole 15, for example Figure 2 As shown, here, the photosensitive component 20 and the assembly hole 15 are both rectangular in shape, but this is not limited thereto, and the photosensitive component 20 may also be other shapes (such as circular, oval or square).

[0054] In some embodiments, the photosensitive component 20 may be a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS), or a complementary metal-oxide semiconductor active pixel sensor (CMOS Active pixel sensor).

[0055] like Figures 2 to 4 As shown, the camera device 1 includes a lens group 60, which is disposed on the first surface 11 of the circuit board 10 and covers the assembly hole 15. The lens group 60 includes a base 61 and a lens 65, and the lens 65 is disposed on the base 61. The lens group 60 is fixed to the first surface 11 of the circuit board 10 through the base 61. For example, in this embodiment, the base 61 is adhered and fixed to the first surface 11 of the circuit board 10 through the adhesive layer L. In addition, the position of the lens 65 of the lens group 60 corresponds to the position of the photosensitive component 20, so that the external light can be focused on the photosensitive component 20 after entering the base 61 through the lens 65.

[0056] like Figures 2 to 4As shown, the outer periphery 23 of the photosensitive component 20 is fixed to the inner annular surface 151 of the assembly hole 15. For example, in the present embodiment, the outer periphery 23 of the photosensitive component 20 is fixed to the inner annular surface 151 of the assembly hole 15 by the annular adhesive layer G. Thus, in the manufacturing process of the camera device 1, the photosensitive component 20 can be pre-set inside the assembly hole 15, and the influence of dust, water vapor or dirt in the external environment on the photosensitive component 20 can be reduced before the assembly hole 15 has not yet become a closed loop environment. Moreover, the photosensitive component 20 is not stacked on the surface of the circuit board 10, and the overall thickness of the camera device 1 can be reduced. Later, when the photosensitive component 20 is adhered to the inner annular surface 151 and the assembly hole 15 is covered by the lens group 60, the assembly hole 15 and the inside of the lens group 60 can form a closed loop environment.

[0057] In some embodiments, the camera device 1 may further include a first reinforcement plate 30 or a second reinforcement plate 40 , or the camera device 1 may also include both the first reinforcement plate 30 and the second reinforcement plate 40 , which are described below with reference to the accompanying drawings.

[0058] Figure 5 This is a bottom view of the first embodiment of the camera device of the utility model. Figures 2 to 5 As shown, in the present embodiment, the second surface 12 of the circuit board 10 has a second groove 121, which is an annular groove and surrounds the assembly hole 15. The camera device 1 includes a second reinforcement plate 40, which is an annular plate and is disposed in the second groove 121 of the second surface 12 and surrounds the assembly hole 15. For example, the second reinforcement plate 40 can be fixed in the second groove 121 by adhesive. In this way, the second reinforcement plate 40 can strengthen the structural strength of the area of ​​the circuit board 10 adjacent to the assembly hole 15. Specifically, due to the opening of the assembly hole 15, the area of ​​the circuit board 10 adjacent to the assembly hole 15 is prone to bending due to force, causing the photosensitive component 20 to be offset and affecting the imaging focal length, or causing the circuit board 10 to deform or break. Therefore, the embodiment of the utility model can strengthen the structural strength of the circuit board 10 and improve the stability of the combination of the photosensitive component 20 and the circuit board 10 by fixing the second reinforcement plate 40 in the second groove 121 of the second surface 12 of the circuit board 10, so as to increase the overall strength of the camera device 1, thereby preventing the photosensitive component 20 from being displaced due to force and preventing the circuit board 10 from being deformed or broken due to force, so that the photosensitive component 20 maintains good image sensing quality. In addition, since the second reinforcement plate 40 is accommodated in the second groove 121 and does not protrude from the second surface 12, it can also avoid increasing the overall thickness of the camera device 1 while strengthening the strength of the lens group 60, which is conducive to the development trend of thinning.

[0059] like Figures 2 to 5As shown, in this embodiment, the circuit board 10 is rectangular and has two opposite long sides 13 and two opposite short sides 14, and the second reinforcing plate 40 has two opposite second side edges 45, and the two second side edges 45 can be respectively adjacent to or aligned with the two long sides 13 of the circuit board 10 (such as Figure 5 As shown), the coverage of the second reinforcing plate 40 is increased as much as possible, thereby further improving the overall structural strength of the camera device 1.

[0060] like Figures 2 to 5 As shown, at least one fixed shield 50 may be provided on the first surface 11 of the circuit board 10. In this embodiment, two fixed shields 50 are provided on the first surface 11. For example, each fixed shield 50 may be fixed on the first surface 11 by adhesion, snapping or locking, etc., to protect the electronic components on the circuit board 10. In addition, in this embodiment, the two fixed shields 50 are respectively located on opposite sides of the lens group 60, the photosensitive component 20 has a central axis A, and a partial area of ​​the fixed shield 50 and a partial area of ​​the second reinforcement plate 40 overlap each other in the direction of the central axis A. Here, the side of each fixed shield 50 close to the lens group 60, the partial area of ​​the second reinforcement plate 40, and the partial area of ​​the circuit board 10 close to the assembly hole 15 are stacked on each other in the direction of the central axis A, so that the circuit board 10, each fixed shield 50 and the second reinforcement plate 40 can further improve the overall structural strength of the camera device 1 after being combined.

[0061] like Figure 5 As shown, in this embodiment, the second reinforcement plate 40 has a second outer surface 41, and the second outer surface 41 of the second reinforcement plate 40, the second surface 12 of the circuit board 10 and the back surface 22 of the photosensitive component 20 can be located in the same plane, so that the side of the camera device 1 away from the lens group 60 can be flattened and conveniently installed on the surface of other components, and the second reinforcement plate 40 can improve the reinforcement effect as much as possible without increasing the thickness without protruding from the second surface 12.

[0062] like Figure 2 and Figure 4 As shown, in the present embodiment, the second reinforcing plate 40 has an inner annular edge 42. In addition to being adhered to the outer peripheral edge 23 of the photosensitive component 20 and the inner annular surface 151 of the assembly hole 15, the annular adhesive layer G is also adhered to the inner annular edge 42 of the second reinforcing plate 40, so that the photosensitive component 20 is further connected and fixed to the second reinforcing plate 40, so that the circuit board 10, the photosensitive component 20, and the second reinforcing plate 40 can be bonded to each other through the annular adhesive layer G, so as to improve the overall structural strength of the camera device 1 and prevent the photosensitive component 20 from being displaced or deformed due to force.

[0063] For example Figures 2 to 4As shown, the front side 21 of the photosensitive component 20 has a photosensitive area 211 and a non-photosensitive area 212. The non-photosensitive area 212 surrounds the photosensitive area 211. Figure 2 In the figure, the photosensitive area 211 and the non-photosensitive area 212 are distinguished by dotted lines for ease of explanation and understanding. In some embodiments, the photosensitive element 20 may be made of semiconductor materials, and the photosensitive area 211 may have tiny photosensitive units for sensing external light and generating images. The non-photosensitive area 212 is an area that does not participate in light sensing and image generation. For example, the non-photosensitive area 212 can be used to electrically connect the circuit on the circuit board 10 to transmit signals.

[0064] For example, if Figure 2 As shown, the non-photosensitive area 212 of the photosensitive component 20 has a first conductive portion 201 and a second conductive portion 202, and the first conductive portion 201 and the second conductive portion 202 are respectively located on opposite sides of the photosensitive area 211. The first surface 11 of the circuit board 10 has a first electrical connection portion 101 and a second electrical connection portion 102, and the first electrical connection portion 101 and the second electrical connection portion 102 are respectively located on opposite sides of the assembly hole 15, wherein the first electrical connection portion 101 is used to electrically connect to the first conductive portion 201, and the second electrical connection portion 102 is used to electrically connect to the second conductive portion 202, so that signals can be transmitted between the photosensitive component 20 and the circuit board 10. For example, in this embodiment, the first conductive portion 201, the second conductive portion 202, the first electrical connection portion 101 and the second electrical connection portion 102 may respectively include multiple conductive contacts. The conductive contacts corresponding to the first conductive portion 101 and the first conductive portion 201 may be electrically connected through a conductive circuit, and the conductive contacts corresponding to the second electrical connection portion 102 and the second conductive portion 202 may also be electrically connected through a conductive circuit.

[0065] Figure 6 This is an exploded perspective view of the second embodiment of the camera device of the utility model. Figure 7 is a cross-sectional view of a second embodiment of the camera device of the utility model, Figure 8 This is a partially enlarged cross-sectional view of the second embodiment of the camera device of the utility model. Figures 6 to 8As shown, the difference between this embodiment and the first embodiment is at least that the circuit board 10 of the camera device 1a of this embodiment has only the first groove 111 on the first surface 11, and the first groove 111 is an annular groove and surrounds the assembly hole 15. The camera device 1a includes a first reinforcing plate 30, which is an annular plate and is disposed in the first groove 111 of the first surface 11 and surrounds the assembly hole 15. For example, the first reinforcing plate 30 can be fixed in the first groove 111 by adhesive. In this way, the first reinforcing plate 30 can also strengthen the structural strength of the circuit board 10 and improve the stability of the combination of the photosensitive component 20 and the circuit board 10, so as to increase the overall strength of the camera device 1a, so as to prevent the photosensitive component 20 from being displaced due to force and prevent the circuit board 10 from being deformed or broken due to force. In addition, since the first reinforcing plate 30 is accommodated in the first groove 111 and does not protrude from the first surface 11 , the strength of the lens assembly 60 can be enhanced while avoiding increasing the overall thickness of the camera device 1 a , which is conducive to the development trend of thinning.

[0066] like Figure 6 As shown, in the present embodiment, the first electrical connection portion 101 and the second electrical connection portion 102 on the first surface 11 of the circuit board 10 are respectively located on opposite sides of the assembly hole 15, and the first groove 111 surrounds the first electrical connection portion 101 and the second electrical connection portion 102. That is, the first electrical connection portion 101 and the second electrical connection portion 102 are not located in the first groove 111 to avoid the first reinforcement plate 30 covering the first electrical connection portion 101 and the second electrical connection portion 102 and failing to electrically connect with the first conductive portion 201 and the second conductive portion 202 of the photosensitive component 20.

[0067] like Figures 6 to 8 As shown, in this embodiment, the first reinforcement plate 30 has two opposite first side edges 35, and the two first side edges 35 can be respectively adjacent to or aligned with the two long sides 13 of the circuit board 10 to increase the coverage of the first reinforcement plate 30 as much as possible, thereby further improving the overall structural strength of the camera device 1a.

[0068] like Figures 6 to 8 As shown, two fixed shields 50 are also provided on the first surface 11 of the circuit board 10, and the first reinforcement plate 30 has a first outer surface 31, and a part of the area of ​​each fixed shield 50 contacts the first outer surface 31. For example, in this embodiment, the side of each fixed shield 50 close to the lens group 60 abuts against the first outer surface 31 of the first reinforcement plate 30, so that the circuit board 10, each fixed shield 50 and the first reinforcement plate 30 can further improve the overall structural strength of the camera device 1 after being combined.

[0069] like Figures 6 to 8As shown, the first outer surface 31 of the first reinforcing plate 30 and the first surface 11 of the circuit board 10 can be located in the same plane, so that the first reinforcing plate 30 can improve the reinforcing effect without increasing the thickness as much as possible without protruding from the first surface 11.

[0070] In some embodiments, the structural strength of the first reinforcing plate 30 and the second reinforcing plate 40 may be greater than the structural strength of the circuit board 10. For example, the materials of the first reinforcing plate 30 and the second reinforcing plate 40 may be different from the materials of the circuit board 10, and the tensile strength, compressive strength or bending strength of the first reinforcing plate 30 and the second reinforcing plate 40 are greater than the tensile strength, compressive strength or bending strength of the circuit board 10. For example, the material of the first reinforcing plate 30 and the second reinforcing plate 40 may be metal or plastic steel, and the material of the circuit board 10 may be glass fiber or epoxy resin, so that the first reinforcing plate 30 and the second reinforcing plate 40 can withstand greater pressure relative to the circuit board 10 without being easily broken, deformed or damaged.

[0071] Fig. 9 This is a partially enlarged cross-sectional view of the third embodiment of the camera device of the utility model. Fig. 9 As shown, the difference between this embodiment and the first embodiment and the second embodiment is at least that the circuit board 10 of the camera device 1b of this embodiment has a first groove 111 on the first surface 11, and the circuit board 10 also has a second groove 121 on the second surface 12. The camera device 1b includes a first reinforcement plate 30 and a second reinforcement plate 40. The first reinforcement plate 30 is disposed in the first groove 111 on the first surface 11, and the second reinforcement plate 40 is disposed in the second groove 121 on the second surface 12. In this way, the first surface 11 and the second surface 12 of the circuit board 10 can be reinforced at the same time, and the structural strength of the circuit board 10 can be further enhanced to prevent the photosensitive component 20 from being displaced due to force and to prevent the circuit board 10 from being deformed or broken due to force.

[0072] Although the technical content of the present invention has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Any slight changes and modifications made by any technical personnel in this field without departing from the spirit of the present invention should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be based on the scope defined in the appended claims.

Claims

1. A camera device, characterized in that: include: A circuit board comprises an assembly hole and a first surface and a second surface opposite to each other, wherein the assembly hole penetrates the first surface and the second surface and has an inner annular surface, and the first surface has a first groove, and the first groove surrounds the assembly hole; A photosensitive component is located in the assembly hole, the photosensitive component includes a front surface, a back surface and an outer periphery, the outer periphery is fixed to the inner annular surface of the assembly hole, and the front surface is adjacent to the first surface relative to the back surface; as well as The first reinforcing plate is disposed in the first groove of the first surface.

2. The imaging device according to claim 1, wherein: The circuit board has two opposite long sides and two opposite short sides, and the first reinforcing plate has two opposite first side sides, and the two first side sides are respectively adjacent to or aligned with the two long sides.

3. The imaging device according to claim 1, wherein: A fixed shield is disposed on the first surface. The first reinforcing plate has a first outer surface. A partial area of ​​the fixed shield contacts the first outer surface.

4. The imaging device according to claim 1, wherein: The first reinforcing plate has a first outer surface, and the first outer surface and the first surface of the circuit board are located in the same plane.

5. The imaging device according to claim 1, wherein: The second surface has a second groove, the second groove surrounds the assembling hole, and a second reinforcing plate is arranged in the second groove.

6. A camera device, characterized in that: include: A circuit board comprises an assembly hole and a first surface and a second surface opposite to each other, wherein the assembly hole penetrates the first surface and the second surface and has an inner annular surface, and the second surface has a second groove, and the second groove surrounds the assembly hole; A photosensitive component is located in the assembly hole, the photosensitive component includes a front surface, a back surface and an outer periphery, the outer periphery is fixed to the inner annular surface of the assembly hole, and the front surface is adjacent to the first surface relative to the back surface; as well as The second reinforcing plate is disposed in the second groove of the second surface.

7. The imaging device according to claim 6, wherein: The circuit board has two opposite long sides and two opposite short sides, and the second reinforcing plate has two opposite second side sides, which are respectively adjacent to or aligned with the two long sides.

8. The imaging device according to claim 6, wherein: A fixed shield is disposed on the first surface. The photosensitive component has a central axis. A partial area of ​​the fixed shield and a partial area of ​​the second reinforcement plate overlap each other in the direction of the central axis.

9. The imaging device according to claim 6, wherein: The second reinforcing plate has a second outer surface, and the second outer surface and the second surface are located in the same plane.

10. The imaging device according to claim 9, wherein: The second outer surface of the second reinforcing plate, the second surface of the circuit board and the back surface of the photosensitive component are located on the same plane.

11. The imaging device according to claim 6, wherein: The outer periphery of the photosensitive component and the inner annular surface of the assembly hole are adhered and fixed to each other by an annular adhesive layer.

12. The imaging device according to claim 11, wherein: The second reinforcing plate has an inner ring edge, and the annular adhesive layer is also adhered to the inner ring edge.

Images