Mounting jig for memory slot

Abstract

The embodiment of the utility model provides a mounting jig for a memory slot. The memory slot installation jig comprises a tray and a pressing piece, in the first state, the pressing piece is separated from the tray, the tray can fix a printed circuit board to install the memory slot on the printed circuit board, in the second state, the side, where the memory slot is attached, of the printed circuit board is back to the tray, and the printed circuit board is fixed to the tray. The pressing piece makes contact with the surface of the side, away from the tray, of the memory groove, is fixed to the tray and applies pressure to the memory groove. According to the mounting jig of the memory slot, the memory slot can be mounted on the printed circuit board, and the memory slot can be pressed to enable the pins of the memory slot to be in full contact with the corresponding solder paste and the corresponding bonding pad, so that the yield of products is improved.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to the field of semiconductor technology, and more particularly to a memory slot installation jig. Background Art

[0002] Surface Mount Technology (SMT) is a process of directly mounting electronic components on the surface of a printed circuit board (PCB). Compared with the traditional pin-type assembly method, SMT has higher assembly density, smaller electronic product volume and lighter weight. At the same time, since the components are directly mounted on the PCB surface, the use of connectors is reduced, thereby improving the reliability of the product.

[0003] The existing SMT equipment does not have a sufficient size for placing the memory slot tray. To address this problem, the location of the memory slot tray can be changed. After changing the location of the memory slot tray, the direction of the PCB needs to be adjusted due to interference from the sensor. However, the adjusted PCB exceeds the maximum supported size of the SMT equipment track and cannot meet the production requirements of memory slot mounting.

[0004] Therefore, it is necessary to propose a technical solution for installing a memory slot. Utility Model Content

[0005] The disclosed embodiment provides a memory slot installation jig, which can install the memory slot on a printed circuit board and improve the yield of the product.

[0006] The present disclosure provides a memory slot installation jig, comprising a tray and a pressing piece.

[0007] In the first state, the pressing member is separated from the tray, and the tray is used to fix the printed circuit board so as to install the memory slot on the printed circuit board. In the second state, the side of the printed circuit board on which the memory slot is installed faces away from the tray, and the printed circuit board is fixed on the tray, and the pressing member contacts the surface of the side of the memory slot away from the tray and is fixed on the tray, and applies pressure to the memory slot.

[0008] In some embodiments of the present disclosure, the pressing member includes: a beam mechanism and an elastic column mechanism.

[0009] The extension direction of the elastic column mechanism is perpendicular to the plane where the beam mechanism is located, and the elastic column mechanism is elastically fixed on the beam mechanism. In the second state, the elastic column mechanism contacts the surface of the memory slot away from the tray, and the elastic column mechanism undergoes elastic deformation.

[0010] In some embodiments of the present disclosure, the elastic column mechanism comprises: a column and a sleeve, one side of the sleeve is fixed to a side surface of the beam mechanism, and the column is embedded in the sleeve and is in elastic contact with the sleeve.

[0011] In some embodiments of the present disclosure, the memory slot extends along a first direction, and a first memory stick plug-in interface and a second memory stick plug-in interface are provided on a side surface of the memory slot away from the tray, and a protruding structure is provided between the first memory stick plug-in interface and the second memory stick plug-in interface.

[0012] The elastic column mechanism includes a first elastic column mechanism and a second elastic column mechanism arranged along the first direction. In the second state, the first elastic column mechanism contacts the area of ​​the protruding structure close to the first memory stick plug-in interface, and the second elastic column mechanism contacts the area of ​​the protruding structure close to the second memory stick plug-in interface.

[0013] In some embodiments of the present disclosure, the elastic column mechanism includes a plurality of the first elastic column mechanisms and a plurality of the second elastic column mechanisms, and the distance between two adjacent first elastic column mechanisms and the distance between two adjacent second elastic column mechanisms are equal to the distance between corresponding two adjacent memory slots.

[0014] In some embodiments of the present disclosure, the crossbeam mechanism includes: a first crossbeam and a second crossbeam. The first end of the first crossbeam is connected to the first end of the second crossbeam, the second end of the first crossbeam is connected to the second end of the second crossbeam, the first elastic column mechanism is fixed to the first crossbeam, and the second elastic column mechanism is fixed to the second crossbeam.

[0015] In some embodiments of the present disclosure, the beam mechanism further includes: a third beam connected between the first beam and the second beam.

[0016] In some embodiments of the present disclosure, the memory slot installation fixture further includes a fixing member to fix the opposite sides of the pressing member to the edge area of ​​the tray.

[0017] In some embodiments of the present disclosure, the first end of the fixing member is fixed to the top surface of the edge region, and the second end of the fixing member can rotate around the first end of the fixing member. The height of the elastic column mechanism when it is not deformed is greater than the distance between the memory slot and the beam mechanism in the second state.

[0018] In the technical solution of the embodiment of the present disclosure, the installation fixture of the memory slot includes a tray and a pressing piece. In a first state, the pressing piece is separated from the tray, and the tray can fix the printed circuit board to install the memory slot on the printed circuit board. In a second state, the side of the printed circuit board on which the memory slot is mounted faces away from the tray, and the printed circuit board is fixed on the tray. The pressing piece contacts the surface of the side of the memory slot away from the tray and is fixed on the tray, and pressure is applied to the memory slot. The memory slot can be installed on the printed circuit board, and the memory slot can also be pressed so that the pins of the memory slot can fully contact the corresponding solder paste and pads, thereby improving the yield of the product.

[0019] The above description is only an overview of the technical solution of the embodiment of the present application. In order to more clearly understand the technical means of the embodiment of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the embodiment of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, a brief introduction will be given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 A schematic structural diagram of a memory slot tray provided in an embodiment of the present disclosure.

[0022] Figure 2 (a) and Figure 2 (b) is a schematic diagram of the memory slot mounting direction provided in an embodiment of the present disclosure.

[0023] Figure 3 A schematic diagram of the structure of a memory slot installation fixture provided in an embodiment of the present disclosure.

[0024] Figure 4 A schematic diagram of the side structure of a memory slot provided in an embodiment of the present disclosure.

[0025] Figure 5 A schematic diagram of the structure of a printed circuit board provided in an embodiment of the present disclosure.

[0026] Figure 6 A partial side structural schematic diagram of a pressing member provided in an embodiment of the present disclosure.

[0027] Figure 7 A schematic diagram of the top view structure of a memory slot provided in an embodiment of the present disclosure.

[0028] Figure 8A schematic structural diagram of a beam mechanism provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without creative work also fall within the scope of protection of the present disclosure.

[0030] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by a person skilled in the art to which the subject matter of the present disclosure belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the specification and the relevant art, and will not be interpreted in an idealized or overly formal form unless otherwise explicitly defined herein. As used herein, a statement that two or more parts are "electrically connected" together shall mean that the parts are directly joined together or joined through one or more intermediate components.

[0031] Reference to "embodiments" in this disclosure means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase "embodiments" in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this disclosure may be combined with other embodiments.

[0032] In addition, the terms "first", "second", etc. in the specification and claims of the present disclosure or the above-mentioned drawings are used to distinguish different objects rather than to describe a specific order, and may explicitly or implicitly include one or more of the features.

[0033] The term "and / or" in this disclosure is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists, A and B exist at the same time, and B exists. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0034] In the description of the present disclosure, unless otherwise specified, "plurality" and "at least two" mean more than two (including two), and similarly, "multiple groups" and "at least two groups" mean more than two groups (including two).

[0035] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings.

[0036] Figure 1 A schematic diagram of the structure of a memory slot tray provided in an embodiment of the present disclosure, such as Figure 1 As shown, the size of the memory slot tray is 310mm×150mm. However, the size of the incoming material placement area of ​​the existing SMT equipment is 238mm×210mm, which is obviously not enough to place the memory slot tray.

[0037] There is an area with a size of 370 mm×400 mm in the existing SMT equipment, which can be set as an incoming material placement area to place the memory slot material tray.

[0038] Figure 2 A schematic diagram of the mounting direction of the memory slot provided in the embodiment of the present disclosure, such as Figure 2 As shown in part a of the figure, after the PCB enters the track of the SMT equipment, the memory slot mounting position on the PCB extends along the X direction, so the memory slot mounting direction required by the PCB is the X direction. In fact, after the PCB enters the track of the SMT equipment, the mounting direction of the SMT equipment is the Y direction, so it is necessary to adjust the direction of the PCB or the memory slot so that the mounting direction of the SMT equipment is the same as the memory slot mounting direction required by the PCB.

[0039] If the 370mm×400mm area is used to place the memory slot tray, the direction of the memory slot cannot be adjusted because the area is interfered by the sensor. In other words, only the direction of the PCB can be adjusted. Figure 2 As shown in part b of the figure, the PCB can be rotated 90° so that the mounting direction of the SMT device and the mounting direction of the memory slot required by the PCB are both in the Y direction. However, in actual production, the size of the PCB of model A is 420mm×280mm, and the maximum supported size of the SMT device track is 600×370mm. After rotating 90°, the size of the PCB is 280mm×420mm, which obviously exceeds the maximum supported size of the SMT device track and cannot meet the production requirements for memory slot installation.

[0040] In view of this, the present disclosure provides a memory slot installation jig, including a tray and a pressing piece. In a first state, the pressing piece is separated from the tray, and the tray can fix the printed circuit board to install the memory slot on the printed circuit board. In a second state, the side of the printed circuit board on which the memory slot is mounted faces away from the tray, and the printed circuit board is fixed on the tray. The pressing piece contacts the surface of the side of the memory slot away from the tray and is fixed on the tray, and applies pressure to the memory slot, so that the memory slot can be installed on the printed circuit board, and the memory slot can also be pressed so that the pins of the memory slot can fully contact the corresponding solder paste and pads, thereby improving the yield of the product.

[0041] The technical solution of the present disclosure is described in detail below with reference to several specific embodiments.

[0042] Figure 3 A schematic diagram of a memory slot installation fixture provided in an embodiment of the present disclosure, such as Figure 3 As shown, the memory slot installation fixture 100 includes a tray 110 and a pressing member 120 .

[0043] In the first state, the pressing member 120 is separated from the tray 110, and the tray 110 is used to fix the printed circuit board 210 so as to install the memory slot 220 on the printed circuit board 110. Figure 3 As shown, the side of the printed circuit board 210 on which the memory slot 220 is installed faces away from the tray 110, and the printed circuit board 210 is fixed on the tray 110. The pressing member 120 contacts the surface of the side of the memory slot 220 away from the tray 110 and is fixed on the tray 110, and applies pressure to the memory slot 220.

[0044] For example, Figure 3 As shown, a groove 111 is provided on the surface of the tray 110, and the size of the groove 111 is slightly larger than the size of the printed circuit board 210. When the printed circuit board 210 is not placed on the tray 110 and a printed circuit board 210 enters the memory slot installation station, the memory slot installation jig 100 is in the first state, that is, the pressing member 120 is separated from the tray 110. At this time, the surface of the printed circuit board 210 printed with solder paste is facing away from the bottom of the groove 111, and the printed circuit board 210 is placed in the groove 111.

[0045] In this way, the printed circuit board 210 can be placed at the bottom of the groove 111, and the side wall of the groove 111 can fix the printed circuit board 210, so that the groove 111 can place and fix the printed circuit board 210, which is convenient for the subsequent installation of the memory slot 220.

[0046] Figure 4 A schematic diagram of a side view structure of a memory slot provided in an embodiment of the present disclosure, such as Figure 4As shown, a first positioning member 221 , a second positioning member 222 and a third positioning member 223 are disposed on one side surface of the memory slot 220 .

[0047] Exemplarily, the bottom surface of the memory slot 220 is provided with a first positioning member 221, a second positioning member 222 and a third positioning member 223, the first positioning member 221 and the second positioning member 222 are located at opposite sides of the bottom surface, and the third positioning member 223 is located between the first positioning member 221 and the second positioning member 222. For example, the first positioning member 11, the second positioning member 12 and the third positioning member 13 are all harpoon feet.

[0048] Figure 5 A schematic diagram of the structure of a printed circuit board provided in an embodiment of the present disclosure is shown in FIG. Figure 5 As shown, a first positioning hole 211 , a second positioning hole 212 and a third positioning hole 213 are provided on the surface of the printed circuit board 210 .

[0049] Combination Figure 4 and Figure 5 As shown, the first positioning members 221 of all the memory slots 220 to be installed can be inserted into the corresponding first positioning holes 211, the third positioning members 223 can be inserted into the corresponding third positioning holes 213, and the second positioning members 222 can be inserted into the corresponding second positioning holes 212, so that each memory slot 220 to be installed can be manually installed to the printed circuit board 210 along the first direction. For example, the first direction is the X direction.

[0050] For example, see Figure 3 The memory slot installation jig 100 further includes a fixing member 130. After all the memory slots 220 are installed on the printed circuit board 210, the fixing member 130 can fix the opposite sides of the pressing member 120 to the edge area 112 of the tray 110 to fix the pressing member 120 on the tray 110.

[0051] like Figure 3 As shown, the two edge regions 112 of the fixed pressing member 120 are symmetrically distributed along the second direction at the opposite sides of the tray 110, and the fixing member 130 is symmetrically fixed to the edge regions 112 along the second direction to fix the edge regions 112 on the opposite sides of the pressing member 120 that are symmetrically distributed along the second direction. The second direction is perpendicular to the first direction, for example, the first direction is the X direction, and the second direction is the Y direction.

[0052] In other embodiments, the two edge regions 112 of the fixed pressing member 120 are symmetrically distributed along the first direction on opposite sides of the tray 110, and the fixing member 130 is symmetrically fixed to the edge regions 112 along the first direction to fix the edge regions 112 on opposite sides of the pressing member 120 that are symmetrically distributed along the first direction.

[0053] At this time, the pressing member 120 contacts the surface of the memory slot 220 which is away from the tray 110 , and the memory slot installation fixture 100 is in the second state.

[0054] Figure 6 A partial side view of a pressing member provided in an embodiment of the present disclosure is shown in FIG. Figure 6 As shown, the pressing member 120 includes a beam mechanism 121 and an elastic column mechanism 122. The extension direction of the elastic column mechanism 122 is perpendicular to the plane where the beam mechanism 121 is located, and the elastic column mechanism 122 is elastically fixed on the beam mechanism 121. In the second state, the elastic column mechanism 122 contacts the surface of the side of the memory slot 220 away from the tray, and the elastic column mechanism 122 is elastically deformed.

[0055] For example, Figure 6 As shown, the plane where the beam mechanism 121 is located is the XY plane, and the extension direction of the elastic column mechanism 122 is the Z direction, which is perpendicular to the XY plane. The elastic column mechanism 122 includes a column 1221 and a sleeve 1222, and the extension directions of the column 1221 and the sleeve 1222 are both in the Z direction.

[0056] like Figure 6 As shown, one side of the sleeve 1222 is fixed to one side surface of the beam mechanism 121, and the column 1221 is nested in the sleeve 1222 from the other side of the sleeve 1222 and is in elastic contact with the sleeve 1222. In the second state, at least part of the column 1221 will extend into the sleeve 1222, so that elastic deformation occurs between the column 1221 and the sleeve 1222, and the restoring force generated by the elastic deformation can be transmitted to the memory slot 220 through the column 1221, so that the column 1221 applies pressure directed to the tray 110 to the memory slot 220.

[0057] Continue to see Figure 4 A plurality of memory slot pins 224 are disposed between the first positioning member 221 and the second positioning member 222. Since the pressing member 120 applies pressure directed toward the tray 110 to the memory slot 220, the memory slot pins 224 can fully contact the corresponding solder paste and pad, which is beneficial to improving the subsequent welding quality, thereby improving the yield rate of the product.

[0058] In some embodiments, see Figure 3 The first end of the fixing member 130 is fixed to the top surface of the edge area 112, the second end of the fixing member 130 can rotate around the first end of the fixing member 130, and the height of the elastic column mechanism 122 when it is not deformed is greater than the distance between the memory slot 220 and the beam mechanism 121 in the second state.

[0059] Exemplarily, the fixing member 130 includes a buckle and a threaded fastener, and a threaded hole is provided on the top surface of the edge region 112, and the threaded fastener passes through the first end of the buckle and is screwed into the threaded hole. When the threaded fastener is not tightened, the second end of the buckle can rotate around the threaded fastener, that is, the second end of the buckle can rotate around the first end of the buckle.

[0060] At this time, the side of the pressing member 120 provided with the elastic column mechanism 122 can be directly opposite to the memory slot 220, and the second end of the buckle can be rotated to the top of the pressing member 120 and the threaded fastener can be tightened to fix the pressing member 120 with the buckle. Since the height of the elastic column mechanism 122 when not deformed is greater than the distance between the memory slot 220 and the beam mechanism 121 in the second state, the elastic column mechanism 122 is deformed in the second state, so that pressure applied to the memory slot 220 can be generated.

[0061] In some embodiments, Figure 7 A schematic diagram of a top view of a memory slot provided in an embodiment of the present disclosure is shown in FIG. Figure 3 As shown, the memory slot 220 extends along the first direction. Figure 3 , Figure 4 and Figure 7 As shown, a first memory stick plug-in port 225 and a second memory stick plug-in port 226 are disposed on a side surface of the memory slot 220 away from the tray 110 , and a protrusion structure 227 is disposed between the first memory stick plug-in port 225 and the second memory stick plug-in port 226 .

[0062] Continue to see Figure 6 The elastic column mechanism 122 includes a first elastic column mechanism 122a and a second elastic column mechanism 122b arranged along the first direction. Figure 4 , Figure 6 and Figure 7 As shown, in the second state, the first elastic column mechanism 122 a contacts the area of ​​the protruding structure 227 close to the first memory stick plug-in port 225 , and the second elastic column mechanism 122 b contacts the area of ​​the protruding structure 227 close to the second memory stick plug-in port 226 .

[0063] Exemplarily, the elastic column mechanism 122 includes a first elastic column mechanism 122a and a second elastic column mechanism 122b, and the distance between the first elastic column mechanism 122a and the second elastic column mechanism 122b is less than the length of the protruding structure 227 along the first direction. Thus, in the second state, the first elastic column mechanism 122a and the second elastic column mechanism 122b can both contact the protruding structure 227 without contacting the memory module insertion interface.

[0064] In the embodiment of the present disclosure, the first elastic column mechanism 122a and the second elastic column mechanism 122b are both connected to the protruding structure 227, which can avoid damage to the memory module plug-in interface, thereby improving the product yield.

[0065] In other embodiments, the elastic column mechanism 122 includes multiple first elastic column mechanisms 122a and multiple second elastic column mechanisms 122b, and the distance between two adjacent first elastic column mechanisms 122a and the distance between two adjacent second elastic column mechanisms 122b are equal to the distance between corresponding two adjacent memory slots 220.

[0066] For example, Figure 6 As shown, the elastic column mechanism 122 includes two first elastic column mechanisms 122a and two second elastic column mechanisms 122b, and two memory slots 220 are installed on the printed circuit board 210. The distance between the two memory slots 220, the distance between the two first elastic column mechanisms 122a, and the distance between the two second elastic column mechanisms 122b are all equal to ensure that in the second state, the two first elastic column mechanisms 122a and the two second elastic column mechanisms 122b are in contact with the protruding structures 227 of the two memory slots 220.

[0067] For another example, the elastic column mechanism 122 includes N first elastic column mechanisms 122a and N second elastic column mechanisms 122b, and N memory slots 220 are installed on the printed circuit board 210, where N is an integer greater than 2. The distance between any two adjacent first elastic column mechanisms 122a, the distance between any two adjacent second elastic column mechanisms 122b corresponding to the two adjacent first elastic column mechanisms 122a, and the distance between any two adjacent memory slots 220 corresponding to the two adjacent first elastic column mechanisms 122a are all equal.

[0068] In some embodiments, see Figure 6 The beam mechanism 121 includes a first beam 1211 and a second beam 1212. The first end of the first beam 1211 is connected to the first end of the second beam 1212, and the second end of the first beam 1211 is connected to the second end of the second beam 1212. The first elastic column mechanism 122a is fixed on the first beam 1211, and the second elastic column mechanism 122b is fixed on the second beam 1212.

[0069] For example, Figure 8 A schematic diagram of a crossbeam mechanism provided in an embodiment of the present disclosure is shown in FIG. Figure 8As shown, the first beam 1211 and the second beam 1212 extend along the second direction, and the first beam 1211 and the second beam 1212 are symmetrically distributed along the first direction. The first end of the first beam 1211 is connected to the first end of the second beam 1212, and the second end of the first beam 1211 is connected to the second end of the second beam 1212 to form an annular beam mechanism 121.

[0070] In other embodiments, the first beam 1211 and the second beam 1212 extend along the first direction, and the first beam 1211 and the second beam 1212 are distributed along the second direction.

[0071] In some embodiments, see Figure 8 The beam mechanism 121 also includes a third beam 1213 , and the third beam 1213 is connected between the first beam 1211 and the second beam 1212 .

[0072] For example, Figure 8 As shown, the first beam 1211 and the second beam 1212 extend in the second direction, and the deformation risk of the first beam 1211 and the second beam 1212 in the first direction is relatively large. The third beam 1213 extends in the first direction, one end of the third beam 1213 is connected to the first beam 1211, and the other end of the third beam 1213 is connected to the second beam 1212, which can provide a support between the first beam 1211 and the second beam 1212 to reduce the deformation risk of the first beam 1211 and the second beam 1212, thereby improving the stability of the beam mechanism 121.

[0073] In other embodiments, if the first beam 1211 and the second beam 1212 extend along the first direction, and the first beam 1211 and the second beam 1212 are distributed along the second direction, then the third beam 1213 extends along the second direction.

[0074] Unless the context clearly indicates otherwise, the singular form of the words used herein and in the appended claims includes the plural and vice versa. Thus, when referring to the singular, the plural form of the corresponding term is generally included. Similarly, the words "comprise" and "include" are to be interpreted as inclusive rather than exclusive. Likewise, the terms "include" and "or" should be interpreted as inclusive unless such interpretation is expressly prohibited herein. Where the term "example" is used herein, particularly when it is located after a group of terms, the "example" is merely exemplary and illustrative and should not be considered exclusive or comprehensive.

[0075] Further aspects and scopes of adaptability become apparent from the description provided herein. It should be understood that various aspects of the present application can be implemented individually or in combination with one or more other aspects. It should also be understood that the description and specific embodiments herein are intended for purposes of illustration only and are not intended to limit the scope of the present application.

[0076] Several embodiments of the present disclosure are described in detail above, but it is obvious that those skilled in the art can make various modifications and variations to the embodiments of the present disclosure without departing from the spirit and scope of the present disclosure. The protection scope of the present disclosure is defined by the attached claims.

Claims

1. A memory slot installation fixture, characterized in that: include: Trays and presses; In a first state, the pressing member is separated from the tray, and the tray is used to fix a printed circuit board so as to install the memory slot on the printed circuit board; In the second state, the side of the printed circuit board on which the memory slot is installed faces away from the tray, and the printed circuit board is fixed on the tray. The pressing member contacts the surface of the memory slot away from the tray and is fixed on the tray, and applies pressure to the memory slot.

2. The memory slot installation fixture according to claim 1, characterized in that: The pressing member comprises: a crossbeam mechanism and an elastic column mechanism; The extension direction of the elastic column mechanism is perpendicular to the plane where the beam mechanism is located, and the elastic column mechanism is elastically fixed on the beam mechanism; In the second state, the elastic column mechanism contacts a surface of the memory slot that is away from the tray, and the elastic column mechanism undergoes elastic deformation.

3. The memory slot installation fixture according to claim 2, characterized in that: The elastic column mechanism comprises: a column and a sleeve; One side of the sleeve is fixed to a side surface of the beam mechanism, and the column is embedded in the sleeve and elastically contacts with the sleeve.

4. The memory slot installation fixture according to claim 2, characterized in that: The memory slot extends along a first direction, a first memory stick plug-in interface and a second memory stick plug-in interface are provided on a side surface of the memory slot away from the tray, and a protrusion structure is provided between the first memory stick plug-in interface and the second memory stick plug-in interface; The elastic column mechanism includes a first elastic column mechanism and a second elastic column mechanism arranged along the first direction. In the second state, the first elastic column mechanism contacts the area of ​​the protruding structure close to the first memory stick plug-in interface, and the second elastic column mechanism contacts the area of ​​the protruding structure close to the second memory stick plug-in interface.

5. The memory slot installation fixture according to claim 4, characterized in that: The elastic column mechanism includes a plurality of the first elastic column mechanisms and a plurality of the second elastic column mechanisms, and the distance between two adjacent first elastic column mechanisms and the distance between two adjacent second elastic column mechanisms are equal to the distance between corresponding two adjacent memory slots.

6. The memory slot installation fixture according to claim 4, characterized in that: The crossbeam mechanism comprises: a first crossbeam and a second crossbeam; The first end of the first beam is connected to the first end of the second beam, the second end of the first beam is connected to the second end of the second beam, the first elastic column mechanism is fixed on the first beam, and the second elastic column mechanism is fixed on the second beam.

7. The memory slot installation fixture according to claim 6, characterized in that: The crossbeam mechanism further comprises: a third crossbeam; The third cross beam is connected between the first cross beam and the second cross beam.

8. The memory slot installation fixture according to claim 1, characterized in that: A groove is provided on the surface of the tray, and the groove is used to place and fix the printed circuit board.

9. The memory slot installation fixture according to claim 2, characterized in that: The memory slot installation fixture further includes a fixing member to fix the opposite sides of the pressing member to the edge area of ​​the tray.

10. The memory slot installation fixture according to claim 9, characterized in that: The first end of the fixing member is fixed to the top surface of the edge region, and the second end of the fixing member is rotatable around the first end of the fixing member; The height of the elastic column mechanism when not deformed is greater than the distance between the memory slot and the beam mechanism in the second state.

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