Vacuum adsorption structure for PCB processing

Abstract

The utility model discloses a vacuum adsorption structure for PCB processing, which belongs to the technical field of PCB processing and comprises a mounting mechanism and an adsorption mechanism. The mounting mechanism comprises a connecting assembly and an adjusting assembly, the connecting assembly comprises a mounting bottom plate and a connecting side plate, the mounting bottom plate is in limiting connection with the adjusting assembly, and the connecting side plate is connected with PCB processing equipment; the adsorption mechanism comprises an auxiliary adsorption assembly, the auxiliary adsorption assembly comprises a rubber ring, and the rubber ring and the PCB are correspondingly arranged. According to the utility model, the size of the auxiliary adsorption assembly is adjusted by adjusting the connecting assembly and the adjusting assembly, after the circuit board is transported to a proper position and the vacuum suction nozzle has no pressure, the spring pushes the rubber ring to extrude the circuit board, so that the circuit board falls off, and the circuit board is prevented from inclining or falling off due to secondary carrying. Different groups of auxiliary adsorption assemblies are mounted on the adjusting assembly to adapt to different production lines and circuit boards with different sizes, so that the production efficiency is improved, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the field of PCB processing, in particular to a vacuum adsorption structure used for PCB processing. Background Art

[0002] Printed circuit board (PCB), also known as circuit board, is an important electronic component and is known as the "mother of electronic components".

[0003] During the production process of existing circuit boards, it is usually necessary for an adsorption device to adsorb the circuit board in a negative pressure manner to flip it over or move it to the next process. The currently commonly used adsorption device mainly generates negative pressure through a vacuum generator, so that multiple suction nozzles generate negative pressure suction to suck up the circuit board. However, when multiple circuit boards are produced at the same time, the existing adsorption device can only adsorb and transfer a single circuit board at a time, and the transfer efficiency is relatively low. In addition, the circuit boards produced by different production lines will vary in size, and the size of the suction cup assembly used in the existing adsorption device is relatively fixed. Therefore, when adsorbing circuit boards of different sizes, it is difficult to ensure the stability of adsorption. The stability can only be improved by replacing the suction cup assembly, which increases the production cost. Finally, after the vacuum suction nozzle used by the existing adsorption device transfers the circuit board to the appropriate position, it often cannot put down the circuit board in time, which causes the circuit board to be offset or fall off.

[0004] In summary, how to invent a vacuum adsorption structure for PCB processing to improve these problems has become an urgent problem to be solved by technical personnel in this field. Utility Model Content

[0005] In order to make up for the above shortcomings, the utility model provides a vacuum adsorption structure for PCB processing, which is used to solve the technical problem that the size of the suction cup assembly of the existing adsorption device is relatively fixed and it is difficult to ensure the adsorption stability when adsorbing circuit boards of different sizes.

[0006] The utility model is implemented as follows: a vacuum adsorption structure for PCB processing, comprising:

[0007] An installation mechanism, the installation mechanism includes a connecting component and an adjusting component, the connecting component includes a mounting base plate and a connecting side plate, the mounting base plate is limitedly connected to the adjusting component, and the connecting side plate is connected to the PCB processing equipment;

[0008] The adsorption mechanism comprises an auxiliary adsorption component, and the auxiliary adsorption component comprises a rubber ring, and the rubber ring is arranged corresponding to the PCB board.

[0009] In a preferred technical solution of the present utility model, the adjustment assembly includes a positioning and connecting square rod and an installation square rod, the positioning and connecting square rod is limitedly installed on both sides of the bottom of the installation base plate, and the installation square rod is limitedly installed on the bottom of the two positioning and connecting square rods.

[0010] In a preferred technical solution of the present utility model, the connecting assembly also includes a first connecting bolt and a first adjustment limit block. A strip slide groove matching the first adjustment limit block is provided on the top of the positioning connecting square rod. The strip slide groove limits and passes through both ends of the positioning connecting square rod. The first adjustment limit block is slidingly installed in the strip slide groove on the top of the positioning connecting square rod. The first connecting bolt passes through both sides of the mounting base plate and is threadedly connected to the middle part of the first adjustment limit block.

[0011] In a preferred technical solution of the present utility model, multiple groups of the mounting square rods are arranged at the bottom of the positioning and connecting square rods, and the multiple groups of the mounting square rods are vertically arranged to the positioning and connecting square rods. Angle irons are respectively connected to the two sides of the positioning and connecting square rods in a limiting manner, and the bottoms of the angle irons are respectively connected to the mounting square rods in a limiting manner.

[0012] In a preferred technical solution of the present invention, second connecting bolts are provided through both ends of the angle iron, and the second connecting bolt end is threadedly connected to a second adjustment limit block, and strip slide grooves matching the second adjustment limit block are respectively provided on both sides of the positioning and connecting square rod, and the strip slide grooves pass through both ends of the positioning and connecting square rod.

[0013] In a preferred technical solution of the utility model, the bottom limit of the installation square rod is connected with a positioning plate, and a plurality of positioning plates are equally distributed at the bottom of the installation square rod.

[0014] In a preferred technical solution of the present utility model, the positioning plate is set in an I-shape, a third connecting bolt is arranged through the middle of the positioning plate, the end of the third connecting bolt is threadedly connected with a third adjustment limit block, and a strip slide groove matching the third adjustment limit block is provided at the bottom of the mounting square rod, and the strip slide groove passes through both ends of the mounting square rod.

[0015] In a preferred technical solution of the present utility model, the first adjustment limit block, the second adjustment limit block and the third adjustment limit block are all isosceles trapezoidal settings, and the first adjustment limit block, the second adjustment limit block and the third adjustment limit block respectively slide in the strip-shaped slide grooves of the positioning and connecting square rod and the mounting square rod.

[0016] In a preferred technical solution of the utility model, the auxiliary adsorption component includes a vacuum suction nozzle and an air pipe joint. The vacuum suction nozzle is equally installed at the two ends of the bottom of the positioning plate, and the air pipe joint is respectively installed at the top of the two ends of the positioning plate. The inner bottom of the vacuum suction nozzle is fixedly connected to a spring, and the end of the spring is fixedly connected to a rubber ring.

[0017] In a preferred technical solution of the utility model, the air pipe joint is a three-way pipe, and multiple groups of the air pipe joints are arranged at both ends of the positioning plate, and the multiple groups of the positioning plates are respectively connected to the multiple groups of the vacuum suction nozzles in an alternating manner.

[0018] The utility model has the beneficial effects as follows: the utility model obtains a vacuum adsorption structure for PCB processing through the above design. When the vacuum adsorption structure is used, the position of the installation base plate above the positioning connection square rod is adjusted by adjusting the first connecting bolt and the first adjusting limit block, the position of the installation square rod at the bottom of the positioning connection square rod is adjusted by adjusting the second connecting bolts and the second adjusting limit blocks at both ends of the angle iron, and the required number of positioning plates are installed at the bottom of the installation square rod according to actual needs, and the position of the positioning plate is adjusted by adjusting the third connecting bolt and the third adjusting limit block. After the installation mechanism is adjusted, it is used, and when the circuit board is vacuum adsorbed by the rubber ring by pressing down the vacuum suction nozzle, the spring will push the rubber ring to push the circuit board. If the vacuum suction nozzle has a small suction force, the circuit board will fall, thereby judging whether the suction force generated by the vacuum pump is sufficient, and preventing the circuit board from falling during the transfer process due to the small suction force of the vacuum suction nozzle. At the same time, after the circuit board is transferred to a suitable position, the spring will push the rubber ring to squeeze the circuit board after the vacuum suction nozzle has no suction, so that the circuit board is separated from the vacuum suction nozzle, and the circuit board is prevented from being lifted up for the second time, causing the circuit board to tilt or fall. The utility model facilitates the adsorption of circuit boards of different sizes by installing different positioning plates, ensures the adsorption stability and improves the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solution of the implementation mode of the utility model, the drawings required for use in the implementation mode will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a schematic diagram of the structure of the installation mechanism and the adsorption mechanism provided in the embodiment of the utility model;

[0021] Figure 2 A bottom view structural schematic diagram provided for an embodiment of the utility model;

[0022] Figure 3 A schematic diagram of the installation mechanism structure provided by the embodiment of the utility model;

[0023] Figure 4 A schematic diagram of the structure of the adsorption mechanism provided in the embodiment of the utility model;

[0024] Figure 5 This is a schematic diagram of the structure of the auxiliary adsorption component provided in an embodiment of the utility model.

[0025] In the figure: 100-installation mechanism; 110-connection assembly; 111-installation base plate; 112-connection side plate; 113-first connection bolt; 114-first adjustment limit block; 120-adjustment assembly; 121-positioning connection square rod; 122-installation square rod; 123-angle iron; 124-second connection bolt; 125-second adjustment limit block; 126-positioning plate; 127-third connection bolt; 128-third adjustment limit block; 200-adsorption mechanism; 210-auxiliary adsorption assembly; 211-vacuum suction nozzle; 212-trachea joint; 213-spring; 214-rubber ring. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the implementation of the utility model clearer, the technical solution in the implementation of the utility model will be clearly and completely described below in conjunction with the drawings in the implementation of the utility model. Obviously, the described implementation is a part of the implementation of the utility model, not all of the implementations. Based on the implementation of the utility model, all other implementations obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] See also Figure 1 and Figure 2 The utility model provides a vacuum adsorption structure for PCB processing, including: a mounting mechanism 100 and an adsorption mechanism 200.

[0028] The mounting mechanism 100 includes a connecting component 110 and an adjusting component 120. The connecting component 110 includes a mounting base plate 111 and a connecting side plate 112. The mounting base plate 111 is limitedly connected to the adjusting component 120, and the connecting side plate 112 is connected to a PCB processing device.

[0029] The adsorption mechanism 200 includes an auxiliary adsorption component 210, and the auxiliary adsorption component 210 includes a rubber ring 214. The rubber ring 214 is arranged corresponding to the PCB board. The size of the auxiliary adsorption component 210 is changed by adjusting the connecting component 110 and the adjusting component 120. By installing different numbers of auxiliary adsorption components 210 on the adjusting component 120, stable adsorption of circuit boards of different sizes can be achieved, thereby improving production efficiency and reducing production costs.

[0030] See also Figures 2 to 4 The adjustment assembly 120 includes a positioning connecting square rod 121 and a mounting square rod 122 . The positioning connecting square rod 121 is limitedly installed at both sides of the bottom of the mounting base plate 111 , and the mounting square rod 122 is limitedly installed at the bottom of the two positioning connecting square rods 121 .

[0031] The connecting assembly 110 also includes a first connecting bolt 113 and a first adjustment limit block 114. A strip slide groove matching the first adjustment limit block 114 is provided at the top of the positioning connecting square rod 121. The strip slide groove passes through both ends of the positioning connecting square rod 121. The first adjustment limit block 114 is slidingly installed in the strip slide groove at the top of the positioning connecting square rod 121. The first connecting bolt 113 passes through both sides of the mounting base 111 and is threadedly connected to the middle part of the first adjustment limit block 114.

[0032] A plurality of installation square rods 122 are arranged at the bottom of the positioning and connecting square rod 121, and the plurality of installation square rods 122 are arranged vertically with the positioning and connecting square rod 121. Angle irons 123 are respectively connected to the two sides of the positioning and connecting square rod 121, and the bottoms of the angle irons 123 are respectively connected to the installation square rod 122. Second connection bolts 124 are provided through the two ends of the angle iron 123, and the second adjustment limit block 125 is threadedly connected through the end of the second connection bolt 124. Strip slide grooves matching the second adjustment limit block 125 are respectively provided on the two sides of the positioning and connecting square rod 121, and the strip slide grooves pass through the two ends of the positioning and connecting square rod 121.

[0033] The bottom limit of the installation square rod 122 is connected with a positioning plate 126, and a plurality of positioning plates 126 are equally arranged at the bottom of the installation square rod 122. The positioning plates 126 are arranged at the bottom of the installation square rod 122 to facilitate the assembly of components for adsorbing circuit boards of different sizes. The positioning plate 126 is arranged in an I-shaped configuration, and a third connecting bolt 127 is arranged through the middle of the positioning plate 126, and a third adjustment limit block 128 is threadedly connected through the end of the third connecting bolt 127. A strip slide matched with the third adjustment limit block 128 is provided at the bottom of the installation square rod 122, and the strip slide passes through both ends of the installation square rod 122. The first adjustment limit block 114, the second adjustment limit block 125 and the third adjustment limit block 128 are all isosceles trapezoidal settings. The first adjustment limit block 114, the second adjustment limit block 125 and the third adjustment limit block 128 are respectively limited and slid in the strip slide grooves of the positioning and connecting square rod 121 and the installing square rod 122. Multiple groups of installing square rods 122 are fixedly connected to the bottom of the positioning and connecting square rod 121 through the limit of the second adjustment limit block 125. When the first adjustment limit block 114, the second adjustment limit block 125 and the third adjustment limit block 128 slide inside the positioning and connecting square rod 121 and the installing square rod 122, the first adjustment limit block 114, the second adjustment limit block 125 and the third adjustment limit block 128 will not fall off, and are all stuck inside the positioning and connecting square rod 121 and the installing square rod 122.

[0034] See also Figure 4 and Figure 5 The auxiliary adsorption assembly 210 includes a vacuum suction nozzle 211 and an air pipe joint 212. The vacuum suction nozzle 211 is respectively and equally installed at the two ends of the bottom of the positioning plate 126. The air pipe joint 212 is respectively installed at the top of the two ends of the positioning plate 126. The inner bottom of the vacuum suction nozzle 211 is fixedly connected with a spring 213, and the end of the spring 213 is fixedly connected with a rubber ring 214. The air pipe joint 212 is a three-way pipe. There are multiple groups of air pipe joints 212 at both ends of the positioning plate 126. The multiple groups of positioning plates 126 are respectively connected with the multiple groups of vacuum suction nozzles 211 in an interlaced manner. When the vacuum suction nozzle 211 is pressed down, the rubber ring 214 at the bottom of the vacuum suction nozzle 211 will be attached to the circuit board, and the spring 213 will be compressed, so that the vacuum suction nozzle 211 is closely attached to the circuit board. When there is no pressure on the vacuum suction nozzle 211, the spring 213 will drive the rubber ring 214 to push the circuit board, so that the circuit board is closely attached to the placement position such as the workbench, and effectively prevent the vacuum suction nozzle 211 from lifting the circuit board twice.

[0035] Working principle: Assemble the installation square rod 122 and the positioning plate 126 according to the size of the production line and the circuit board, adjust the position of the installation base plate 111 above the positioning connection square rod 121 by adjusting the first connecting bolt 113 and the first adjusting stop block 114, adjust the position of the installation square rod 122 at the bottom of the positioning connection square rod 121 by adjusting the second connecting bolts 124 and the second adjusting stop block 125 at both ends of the angle iron 123, and install the required number of positioning plates 126 at the bottom of the installation square rod 122 according to actual needs, and adjust the position of the positioning plate 126 by adjusting the third connecting bolt 127 and the third adjusting stop block 128. After the installation mechanism 100 is adjusted, it is used. When the vacuum suction nozzle 211 is pressed down and the rubber ring 214 is used to vacuum the circuit board, the spring 213 will push the rubber ring 214 to push the circuit board. If the vacuum suction nozzle 211 has a small suction force, the circuit board will fall, thereby judging whether the suction force generated by the vacuum pump is sufficient to prevent the circuit board from falling during the transfer process due to the small suction force of the vacuum suction nozzle. At the same time, after the circuit board is transferred to a suitable position, the spring 213 will push the rubber ring 214 to squeeze the circuit board after the vacuum nozzle 211 has no suction, so that the circuit board is separated from the vacuum nozzle, thereby preventing the circuit board from being lifted up again and causing the circuit board to tilt or fall.

[0036] The above description is only the preferred implementation of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A vacuum adsorption structure for PCB processing, characterized in that: include: A mounting mechanism (100), the mounting mechanism (100) comprising a connecting assembly (110) and an adjusting assembly (120), the connecting assembly (110) comprising a mounting base plate (111) and a connecting side plate (112), the mounting base plate (111) being position-limitingly connected to the adjusting assembly (120), and the connecting side plate (112) being connected to a PCB processing device; The adsorption mechanism (200) comprises an auxiliary adsorption component (210), the auxiliary adsorption component (210) comprises a rubber ring (214), and the rubber ring (214) is arranged corresponding to a PCB board.

2. A vacuum adsorption structure for PCB processing as claimed in claim 1, characterized in that: The adjustment assembly (120) comprises a positioning and connecting square rod (121) and a mounting square rod (122); the positioning and connecting square rod (121) is position-limitedly mounted on both sides of the bottom of the mounting base plate (111); and the mounting square rod (122) is position-limitedly mounted on the bottoms of the two positioning and connecting square rods (121).

3. A vacuum adsorption structure for PCB processing as claimed in claim 2, characterized in that: The connecting assembly (110) further comprises a first connecting bolt (113) and a first adjusting limit block (114); a strip-shaped slide groove cooperating with the first adjusting limit block (114) is provided at the top of the positioning connecting square rod (121); the strip-shaped slide groove passes through both ends of the positioning connecting square rod (121); the first adjusting limit block (114) is slidably installed in the strip-shaped slide groove at the top of the positioning connecting square rod (121); the first connecting bolt (113) passes through both sides of the mounting base plate (111) and is threadedly connected to the middle of the first adjusting limit block (114).

4. A vacuum adsorption structure for PCB processing as claimed in claim 3, characterized in that: The installation square rod (122) is provided with a plurality of groups at the bottom of the positioning and connecting square rod (121), and the plurality of groups of the installation square rod (122) are vertically arranged with the positioning and connecting square rod (121). Angle irons (123) are respectively connected to the two sides of the positioning and connecting square rod (121) in a limiting manner, and the bottoms of the angle irons (123) are respectively connected to the installation square rod (122) in a limiting manner.

5. A vacuum adsorption structure for PCB processing as claimed in claim 4, characterized in that: Second connecting bolts (124) are provided through both ends of the angle iron (123); the ends of the second connecting bolts (124) are threadedly connected with second adjustment limit blocks (125); and strip-shaped sliding grooves matching the second adjustment limit blocks (125) are respectively provided on both sides of the positioning and connecting square rod (121); the strip-shaped sliding grooves pass through both ends of the positioning and connecting square rod (121).

6. A vacuum adsorption structure for PCB processing as claimed in claim 5, characterized in that: The bottom limit of the installation square rod (122) is connected with a positioning plate (126), and a plurality of positioning plates (126) are equally spaced at the bottom of the installation square rod (122).

7. A vacuum adsorption structure for PCB processing as claimed in claim 6, characterized in that: The positioning plate (126) is arranged in an I-shape, a third connecting bolt (127) is arranged through the middle of the positioning plate (126), the end of the third connecting bolt (127) is threadedly connected with a third adjustment limit block (128), and a strip slide groove matching the third adjustment limit block (128) is provided at the bottom of the installation square rod (122), and the strip slide groove passes through both ends of the installation square rod (122).

8. A vacuum adsorption structure for PCB processing as claimed in claim 7, characterized in that: The first adjustment limit block (114), the second adjustment limit block (125) and the third adjustment limit block (128) are all arranged in an isosceles trapezoidal shape. The first adjustment limit block (114), the second adjustment limit block (125) and the third adjustment limit block (128) are respectively limited and slidable in the strip-shaped sliding grooves of the positioning and connecting square rod (121) and the installation square rod (122).

9. A vacuum adsorption structure for PCB processing as claimed in claim 6, characterized in that: The auxiliary adsorption component comprises a vacuum suction nozzle (211) and an air pipe joint (212); the vacuum suction nozzle (211) is equally mounted at the two ends of the bottom of the positioning plate (126); the air pipe joint (212) is mounted at the tops of the two ends of the positioning plate (126); the inner bottom of the vacuum suction nozzle (211) is fixedly connected to a spring (213); and the end of the spring (213) is fixedly connected to a rubber ring (214).

10. A vacuum adsorption structure for PCB processing as claimed in claim 9, characterized in that: The air pipe joint (212) is a three-way pipe, and multiple groups of the air pipe joint (212) are provided at both ends of the positioning plate (126). The multiple groups of positioning plates (126) are respectively connected to the multiple groups of vacuum suction nozzles (211) in an alternating manner.

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