Integrated circuit testing device with high precision

By designing an automated integrated circuit test device, using electric lifting rods and drive motors to realize automatic detection and classification of integrated circuit boards, the problem of low automation in the existing technology is solved and the work efficiency is improved.

CN222872754UActive Publication Date: 2025-05-16SHENZHEN LIGHTCHIP ELECTRONICS CO LTD
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Patent Information

Application Number
CN202421629252.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-10
Publication Date
2025-05-16
Estimated Expiration
2034-07-10

AI Technical Summary

Technical Problem

The existing integrated circuit testing devices have low degree of automation and cannot automatically classify qualified and unqualified circuit boards, resulting in slower manual classification efficiency and affecting work efficiency.

Method used

An integrated circuit testing device is designed, including a box, a drive motor, a rotating disk, a transfer mechanism, an adjustment mechanism, an adsorption assembly and a placement frame. By controlling the electric lift rod and the drive motor, automatic detection, adsorption, detection and classification of the integrated circuit board is realized.

Benefits of technology

After testing, it realizes that the qualified and unqualified circuit boards are automatically separated and collected, which improves classification efficiency and improves work efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an integrated circuit testing device with high precision, which comprises a box body, and a driving motor is arranged above the box body; and the rotating disc is connected to the driving motor, and a first station, a second station, a third station and a fourth station are arranged on the rotating disc. By controlling the first electric lifting rod to work, the adsorption assembly can be driven to move horizontally, the integrated circuit board can be sucked up and put down through the adsorption assembly, the integrated circuit board is detected through the detection head, and after detection is completed, the first electric lifting rod drives the adsorption assembly to move to suck up the detected integrated circuit board on the second station. The circuit boards are moved to the first placing frame or the second placing frame to be put down, qualified products are stored through the first placing frame, unqualified products are stored through the second placing frame, qualified and unqualified circuit boards can be automatically separated and collected after testing, the classification efficiency is high, and the working efficiency is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit testing, in particular to an integrated circuit testing device with high precision. Background Art

[0002] An integrated circuit is a miniature electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit are interconnected and made on a small piece or several small pieces of semiconductor wafers or dielectric substrates to form a circuit board, which becomes a miniature structure with the required circuit function. After production, the integrated circuit boards need to be tested and unqualified samples are marked to avoid wasting packaging costs.

[0003] The integrated circuit comprehensive test device has the publication number CN218938336U. The integrated circuit comprehensive test device comprises a frame, on which a circuit board detector and a detection pen are provided, and an installation frame is provided on the frame; a fixed component, which is arranged in the installation frame, and the fixed component comprises a limit bar, and the limit bars are provided in a plurality and evenly distributed, and a fixedly connected extrusion plate is provided at the bottom of the limit bar, and an extrusion bar that is abutted and slidably connected is provided above the extrusion plate, and a connecting bar is provided on the outer wall of the extrusion bar, and an extrusion spring is provided between the outer wall of the limit bar and the installation frame. By using the detection pen to detect the circuit board, the detection operation can be carried out stably. However, these detection devices have a low degree of automation, and the integrated circuit boards cannot be classified after the test. Since the qualified and unqualified circuit boards need to be separated after the test, the manual classification efficiency is slow, which affects the work efficiency. Utility Model Content

[0004] The utility model aims to solve the shortcomings existing in the prior art, and comprises: a box body, a driving motor is arranged above the box body; a rotating disk, the rotating disk is connected to the driving motor, and a first station, a second station, a third station and a fourth station are arranged on the rotating disk; a transfer mechanism, the transfer mechanism is arranged on one side of the rotating disk, and the transfer mechanism is used to transfer the integrated circuit placed on the second station; an adjustment mechanism, the adjustment mechanism is connected to the box body, and a detection head is connected below the adjustment mechanism; a first placement frame and a second placement frame are arranged below the transfer mechanism; the transfer mechanism comprises a mounting frame, the mounting frame is connected above the box body, the mounting frame is slidably connected to the adsorption assembly through a slide, the adsorption assembly is connected to one end of the first electric lifting rod, and the first electric lifting rod is detachably connected to the mounting frame.

[0005] As a further description of the above technical solution: the adsorption assembly includes an adsorption plate, the top of the adsorption plate is connected to the second electric lifting rod, the second electric lifting rod is slidably connected to the slide plate through a slider, the top of the adsorption plate is connected to the vacuum negative pressure machine through a connecting pipe, and a plurality of adsorption holes are arranged at the bottom of the adsorption plate.

[0006] As a further description of the above technical solution: the adjustment mechanism includes a mounting seat, which is detachably connected to the box body, a third electric lifting rod is arranged above the mounting seat, a mounting plate is connected above the third electric lifting rod, and the mounting plate is detachably connected to the detection head.

[0007] As a further description of the above technical solution: fixed disks are provided on the first workstation, the second workstation, the third workstation and the fourth workstation.

[0008] As a further description of the above technical solution: the first station is located directly below the detection head, and the second station is located on one side of the first station and below the adsorption plate.

[0009] As a further description of the above technical solution: the first workstation, the second workstation, the third workstation and the fourth workstation are circumferentially arranged on the rotating disk at equal intervals.

[0010] As a further description of the above technical solution: the first placement frame and the second placement frame are both slidably connected to the limit frame, and the limit frame is detachably connected to the box body at the bottom.

[0011] As a further description of the above technical solution: a control box is arranged inside the box, and a control panel is arranged on the surface of the box.

[0012] The above technical solution has the following advantages or beneficial effects:

[0013] The utility model can drive the adsorption component to move horizontally by controlling the operation of the first electric lifting rod, and the integrated circuit board can be sucked up and put down by the adsorption component, and the integrated circuit board is inspected by the detection head. After the inspection is completed, the first electric lifting rod drives the adsorption component to move, and sucks up the integrated circuit board that has been inspected on the second workstation, and then moves it to the first placement frame or the second placement frame and puts it down. The products that pass the inspection are stored in the first placement frame, and the products that fail the inspection are stored in the second placement frame. After the test, the qualified and unqualified circuit boards can be automatically separated and collected, and the classification efficiency is high, thereby improving the work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a structural schematic diagram of an integrated circuit testing device in one embodiment of the utility model;

[0015] Figure 2This is a front view of a clamping integrated circuit test device in one embodiment of the utility model;

[0016] Figure 3 for Figure 1 A schematic diagram of the structure of a transfer mechanism in an integrated circuit test device;

[0017] Figure 4 for Figure 1 Schematic diagram of the structure of the rotating disk in the integrated circuit test device;

[0018] Figure 5 for Figure 3 Schematic diagram of the structure of the adsorption component in the transfer mechanism.

[0019] Legend:

[0020] 1. Box body; 2. Driving motor; 3. Rotating disk; 4. Transfer mechanism; 5. Adjustment mechanism; 6. First station; 7. Second station; 8. Third station; 9. Fourth station; 10. Detection head; 11. First placement frame; 12. Second placement frame; 13. Fixed disk; 14. Limiting frame; 15. Control panel; 41. Mounting frame; 42. Slide plate; 43. Adsorption assembly; 44. First electric lifting rod; 45. Adsorption plate; 46. Second electric lifting rod; 47. Connecting pipe; 48. Adsorption hole; 49. Slider; 51. Mounting seat; 52. Third electric lifting rod; 53. Mounting plate. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] In the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0023] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "set", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] like Figure 1-5 As shown, the utility model is a high-precision integrated circuit testing device, comprising: a box body 1, a driving motor 2 is arranged above the box body 1; a rotating disk 3, the rotating disk 3 is connected to the driving motor 2, and the rotating disk 3 is provided with a first station 6, a second station 7, a third station 8 and a fourth station 9; a transfer mechanism 4, the transfer mechanism 4 is arranged on one side of the rotating disk 3, and the transfer mechanism 4 is used to transfer the integrated circuit placed on the second station 7; an adjustment mechanism 5, the adjustment mechanism 5 is connected to the box body 1, and a detection head 10 is connected below the adjustment mechanism 5; a first placement frame 11 and a second placement frame 12 are arranged below the transfer mechanism 4; the transfer mechanism 4 includes a mounting frame 41, the mounting frame 41 is connected above the box body 1, the mounting frame 41 is slidably connected to the adsorption component 43 through a slide plate 42, the adsorption component 43 is connected to one end of a first electric lifting rod 44, and the first electric lifting rod 44 is detachably connected to the mounting frame 41.

[0025] In this embodiment, by controlling the operation of the first electric lifting rod 44, the adsorption component 43 can be driven to move horizontally, and the integrated circuit board can be sucked up and put down by the adsorption component 43, and the integrated circuit board is inspected by the detection head 10. After the inspection is completed, the first electric lifting rod 44 drives the adsorption component 43 to move, and the integrated circuit board that has been inspected on the second workstation 7 is sucked up, and then moved to the first placement frame 11 or the second placement frame 12 and put down. The qualified products are stored in the first placement frame 11, and the unqualified products are stored in the second placement frame 12. After the test, the qualified and unqualified circuit boards can be automatically separated and collected, and the classification efficiency is high, which improves the work efficiency.

[0026] like Figure 1 and Figure 3 As shown, specifically, the adsorption assembly 43 includes an adsorption plate 45, which is connected to a second electric lifting rod 46 at the top, and the second electric lifting rod 46 is slidably connected to the slide plate 42 through a slider 49. The top of the adsorption plate 45 is connected to a vacuum negative pressure machine through a connecting pipe 47, and a plurality of adsorption holes 48 are provided below the adsorption plate 45. By controlling the operation of the vacuum negative pressure machine, the adsorption plate 45 can be evacuated through the connecting pipe 47, so that the adsorption plate 45 can conveniently absorb and put down the integrated circuit board through the adsorption holes 48.

[0027] It should also be noted that, in actual use, although air leakage may occur between the integrated circuit board and the adsorption hole 48, the negative pressure that the adsorption hole 48 can provide can be adjusted by an external vacuum negative pressure pump. Therefore, even if there is a small amount of air leakage, the required adsorption force can still be generated on the back of the integrated circuit board through the adsorption hole 48.

[0028] like Figure 1 and Figure 2 As shown, specifically, the adjustment mechanism 5 includes a mounting base 51, which is detachably connected to the box body 1, a third electric lifting rod 52 is arranged above the mounting base 51, a mounting plate 53 is connected above the third electric lifting rod 52, and the mounting plate 53 is detachably connected to the detection head 10; the third electric lifting rod 52 can drive the mounting plate 53 and the detection head 10 to move up and down, so as to facilitate the adjustment of the height of the detection head 10 and facilitate the detection of integrated circuits of different specifications.

[0029] like Figure 1 and Figure 4 As shown, specifically, fixed disks 13 are provided on the first station 6, the second station 7, the third station 8 and the fourth station 9. The first station 6 is located directly below the detection head 10, the second station 7 is located on one side of the first station 6 and below the adsorption plate 45, and the first station 6, the second station 7, the third station 8 and the fourth station 9 are circumferentially arranged at equal intervals on the rotating disk 3; by controlling the operation of the drive motor 2, the rotating disk 3 can be driven to rotate, so that the four fixed disks 13 pass through the first station 6 and the second station 7 in turn, and loading is carried out on the third station 8 and the fourth station 9, detection is carried out on the first station 6, and unloading is carried out on the second station 7, so that loading, burning and unloading can be carried out simultaneously, which saves a lot of time in large-scale detection, has high work efficiency and high degree of automation.

[0030] like Figure 1 and Figure 2 As shown, specifically, the first placement frame 11 and the second placement frame 12 are both slidably connected to the limiting frame 14 , and the limiting frame 14 is detachably connected to the box body 1 at the bottom; the first placement frame 11 and the second placement frame 12 can be limited by the limiting frame 14 .

[0031] like Figure 1 and Figure 2 As shown, specifically, a control box is arranged inside the box body 1, and a control panel 15 is arranged on the surface of the box body 1; the device can be controlled to work through the control panel 15.

[0032] Working principle: the staff controls the first electric lifting rod 44 to drive the adsorption component 43 to move horizontally. The integrated circuit board can be sucked up and put down by the adsorption component 43, and the integrated circuit board is inspected by the detection head 10. After the inspection is completed, the first electric lifting rod 44 drives the adsorption component 43 to move, sucks up the integrated circuit board that has been inspected on the second workstation 7, and then moves it to the first placement frame 11 or the second placement frame 12 and puts it down. The qualified products are stored in the first placement frame 11, and the unqualified products are stored in the second placement frame 12. After the test, the qualified and unqualified circuit boards can be automatically separated and collected, with high classification efficiency, thereby improving work efficiency.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0034] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A high-precision integrated circuit testing device, characterized in that: include: A box body (1), wherein a driving motor (2) is arranged above the box body (1); A rotating disk (3), the rotating disk (3) being connected to the driving motor (2), and the rotating disk (3) being provided with a first station (6), a second station (7), a third station (8) and a fourth station (9); A transfer mechanism (4), the transfer mechanism (4) being arranged on one side of the rotating disk (3), and the transfer mechanism (4) being used to transfer the integrated circuit placed on the second workstation (7); An adjusting mechanism (5), the adjusting mechanism (5) being connected to the box body (1), and a detection head (10) being connected below the adjusting mechanism (5); A first placement frame (11) and a second placement frame (12) are arranged below the transfer mechanism (4); The transfer mechanism (4) comprises a mounting frame (41), the mounting frame (41) is connected above the box body (1), the mounting frame (41) is slidably connected to an adsorption assembly (43) via a slide plate (42), the adsorption assembly (43) is connected to one end of a first electric lifting rod (44), and the first electric lifting rod (44) is detachably connected to the mounting frame (41).

2. The high-precision integrated circuit testing device according to claim 1, characterized in that: The adsorption assembly (43) comprises an adsorption plate (45), the top of the adsorption plate (45) is connected to a second electric lifting rod (46), the second electric lifting rod (46) is slidably connected to a slide plate (42) via a slider (49), the top of the adsorption plate (45) is connected to a vacuum negative pressure machine via a connecting pipe (47), and a plurality of adsorption holes (48) are provided at the bottom of the adsorption plate (45).

3. The high-precision integrated circuit testing device according to claim 1, characterized in that: The adjustment mechanism (5) comprises a mounting seat (51), the mounting seat (51) is detachably connected to the box body (1), a third electric lifting rod (52) is arranged above the mounting seat (51), a mounting plate (53) is connected above the third electric lifting rod (52), and the mounting plate (53) is detachably connected to the detection head (10).

4. The high-precision integrated circuit testing device according to claim 1, characterized in that: The first workstation (6), the second workstation (7), the third workstation (8) and the fourth workstation (9) are all provided with a fixed disk (13).

5. The high-precision integrated circuit testing device according to claim 2, characterized in that: The first workstation (6) is located directly below the detection head (10), and the second workstation (7) is located on one side of the first workstation (6) and below the adsorption plate (45).

6. The high-precision integrated circuit testing device according to claim 1, characterized in that: The first workstation (6), the second workstation (7), the third workstation (8) and the fourth workstation (9) are circumferentially arranged at equal intervals on the rotating disk (3).

7. The high-precision integrated circuit testing device according to claim 1, characterized in that: The first placement frame (11) and the second placement frame (12) are both slidably connected to the limiting frame (14), and the lower part of the limiting frame (14) is detachably connected to the box body (1).

8. The high-precision integrated circuit testing device according to claim 1, characterized in that: A control box is arranged inside the box (1), and a control panel (15) is arranged on the surface of the box (1).

Citation Information

Patent Citations

  • Integrated circuit comprehensive test device

    CN218938336U