PCB radiator assembly tool

Abstract

The utility model relates to a PCB radiator assembly tool which is arranged on a PCB, a heat conduction pad A is arranged at the bottom of the PCB, a plurality of first isolation columns are arranged at the bottom of the heat conduction pad A, and a radiator A is arranged at the bottoms of the first isolation columns; the bottom of the radiator A is provided with a jig, and the top of the jig is provided with a plurality of compressible probes. According to the utility model, the PCB does not need to be turned over, the assembly efficiency is effectively improved, and the problems that the isolation columns are easy to fall off, the radiator is easy to deviate and the assembly efficiency is low are solved.

Description

Technical Field

[0001] The utility model relates to the field of PCB radiators, in particular to a PCB radiator assembly tool. Background Art

[0002] MOS is a commonly used current switch and overcurrent device. Due to the impedance of MOS itself, it will also generate heat when overcurrent occurs. Excessive heat generation will cause MOS to burn out, so thermal pads and heat sinks are needed to transfer the heat away. The assembly process of existing products requires the product to be turned over, which has low assembly efficiency and the possibility of parts falling off.

[0003] Therefore, we proposed a PCB heat sink assembly tooling, which effectively improved the assembly efficiency and eliminated the problem of parts falling off. Utility Model Content

[0004] The purpose of the utility model is to overcome the shortcomings of the prior art, meet actual needs, and provide a PCB heat sink assembly tool to solve the technical problems that the assembly process of the current existing products requires the product to be turned over, the assembly efficiency is relatively low, and there is a possibility of parts falling off.

[0005] In order to achieve the purpose of the utility model, the technical solution adopted by the utility model is: designing a PCB heat sink assembly tool, which is arranged on a PCB board, a thermal pad A is arranged at the bottom of the PCB board, a plurality of first isolation columns are arranged at the bottom of the thermal pad A, and a heat sink A is arranged at the bottom of the plurality of first isolation columns;

[0006] A fixture is provided at the bottom of the heat sink A, and a plurality of compressible probes are installed on the top of the fixture.

[0007] Preferably, a thermal pad B is arranged on the top of the PCB board, a plurality of second isolation columns are arranged on the top of the thermal pad B, and a heat sink B is arranged on the top of the plurality of second isolation columns.

[0008] Preferably, a plurality of bolts are provided on the top of the radiator B.

[0009] Preferably, a MOS is provided on one side of the top of the PCB board.

[0010] Compared with the prior art, the beneficial effects of the utility model are:

[0011] 1. The utility model does not need to turn over the PCB board, which effectively improves the assembly efficiency. There are no problems such as the isolation column being easy to fall off, the radiator being easy to deviate, and the assembly efficiency being low. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the explosion structure of the utility model;

[0013] Figure 2 This is a schematic diagram of the bottom structure of the PCB board of the present utility model.

[0014] In the figure: 1. PCB board; 2. MOS; 3. Thermal pad B; 4. Second isolation column; 5. Radiator B; 6. Bolt; 7. Thermal pad A; 8. First isolation column; 9. Radiator A; 10. Compressible probe; 11. Fixture. DETAILED DESCRIPTION

[0015] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0016] Example 1: PCB heat sink assembly tool, see Figure 1 to Figure 2 , arranged on a PCB board 1, a thermal pad A7 is arranged at the bottom of the PCB board 1, a plurality of first isolation columns 8 are arranged at the bottom of the thermal pad A7, and a heat sink A9 is arranged at the bottom of the plurality of first isolation columns 8; a fixture 11 is arranged at the bottom of the heat sink A9, and a plurality of compressible probes 10 are installed on the top of the fixture 11.

[0017] For details, see Figure 1 A thermal pad B3 is arranged on the top of the PCB board 1, a plurality of second isolation columns 4 are arranged on the top of the thermal pad B3, and a heat sink B5 is arranged on the top of the plurality of second isolation columns 4.

[0018] For further information, see Figure 1 , a plurality of bolts 6 are provided on the top of the radiator B5.

[0019] It is worth noting that see Figure 1 MOS 2 is arranged on one side of the top of PCB board 1.

[0020] When using the PCB heat sink assembly tool:

[0021] 1. Place the heat sink A9 on the fixture 11;

[0022] 2. Place the first isolation column 8 on the fixture 11;

[0023] 3. Place thermal pad A7 on heat sink A9;

[0024] 4. Place PCB 1 on thermal pad A7;

[0025] 5. Place the second isolation column 4 on the PCB board 1;

[0026] 6. Place the thermal pad B3 on the PCB board 1;

[0027] 7. Place heat sink B5 on top of thermal pad B3;

[0028] 8. Use bolts 6 to connect and fix radiator A9 and radiator B5 to PCB board 1.

[0029] Among them, in steps 1-7, the probe plays a guiding role. In the eighth step, when the bolt 6 is tightened downward, the probe shrinks as the bolt 6 is tightened.

[0030] In addition, the components designed in the present invention are all universal standard parts or components known to technical personnel in the field. Their structures and principles can be known to technical personnel through technical manuals or through conventional experimental methods. They can be fully implemented by technical personnel in the field, and there is no need to elaborate. The content protected by the present invention does not involve improvements to internal structures and methods.

[0031] The embodiments of the present invention disclose preferred embodiments, but are not limited thereto. A person skilled in the art can easily understand the spirit of the present invention based on the above embodiments and make different extensions and changes. However, as long as they do not deviate from the spirit of the present invention, they are all within the protection scope of the present invention.

Claims

1. A PCB heat sink assembly tool, arranged on a PCB board (1), characterized in that: A thermal pad A (7) is arranged at the bottom of the PCB board (1), a plurality of first isolation columns (8) are arranged at the bottom of the thermal pad A (7), and a heat sink A (9) is arranged at the bottom of the plurality of first isolation columns (8); A jig (11) is provided at the bottom of the heat sink A (9), and a plurality of compressible probes (10) are installed on the top of the jig (11).

2. The PCB heat sink assembly tool as claimed in claim 1, characterized in that: A heat conducting pad B (3) is arranged on the top of the PCB board (1), a plurality of second isolation columns (4) are arranged on the top of the heat conducting pad B (3), and a heat sink B (5) is arranged on the top of the plurality of second isolation columns (4).

3. The PCB heat sink assembly tool as claimed in claim 2, characterized in that: A plurality of bolts (6) are arranged on the top of the radiator B (5).

4. The PCB heat sink assembly tool as claimed in claim 1, characterized in that: A MOS (2) is arranged on one side of the top of the PCB board (1).

Images