Annular electroplating device

Abstract

The utility model discloses an annular electroplating device. A mounting frame is annularly arranged; the plurality of first electroplating heads are arranged at equal angles, are respectively arranged on the mounting rack and downwards extend into the electroplating bath; the second electroplating head is arranged on the rotating frame in a manner of moving up and down back and forth and moves back and forth along with the rotating frame, so that the plurality of first electroplating heads which are arranged at equal angles are arranged, and the second electroplating head moves to the middle of the plurality of first electroplating heads along with the rotating frame; according to the multi-direction electroplating device, the first electroplating head and the second electroplating head are arranged, so that a product on the second electroplating head can be electroplated in multiple directions, the functionality is higher, the electroplating process of a plate-shaped product can be met, and the multi-direction electroplating process of other products in different shapes can also be met; and the use limitation is smaller.

Description

Technical Field

[0001] The utility model relates to the electroplating field technology, in particular to a ring-shaped electroplating device. Background Art

[0002] Alloy electroplating is the process of plating a thin layer of alloy on certain metal surfaces using the principle of electrolysis to obtain better material properties. It is a process that uses electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation, improve wear resistance, conductivity, reflectivity, corrosion resistance and enhance aesthetics. Electroplating requires a low-voltage, high-current power supply to supply power to the electroplating tank and an electrolytic device consisting of a plating solution, parts to be plated (cathode) and an anode. The composition of the plating solution varies depending on the coating, but all contain a main salt that provides metal ions, a complexing agent that can complex the metal ions in the main salt to form a complex, a buffer for stabilizing the pH of the solution, an anode activator and special additives. The electroplating process is a process in which the metal ions in the plating solution are reduced to metal atoms through electrode reactions under the action of an external electric field, and metal deposition is carried out on the cathode.

[0003] Existing electroplating devices all use electroplating heads on both sides to electroplate the two side walls of the metal plate, but they can only electroplate the two side walls of the product, and their functionality is relatively single. Therefore, they can only be used for the electroplating process of plate-shaped products, and their use is relatively limited, and they cannot meet the electroplating process of different products. Therefore, it is necessary to further improve the structure of the existing electroplating device. Utility Model Content

[0004] In view of this, the present invention aims to address the deficiencies in the prior art, and its main purpose is to provide a ring-shaped electroplating device that can effectively solve the problems of the existing electroplating devices having single functionality, large usage limitations, and being unable to meet the electroplating processing requirements of different products.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A ring-shaped electroplating device comprises a plating rack, a mounting rack, a first plating head, a rotating rack, a second plating head and a driving mechanism; the plating rack has a plating tank for containing a plating solution; the mounting rack is arranged on the plating rack and is located in the plating tank, and the mounting rack is arranged in a ring; the first plating heads are arranged in a plurality at equal angles, and the plurality of first plating heads are respectively arranged on the mounting rack and extend downward into the plating tank; the rotating rack is rotatably arranged on the plating rack and is located above the plating tank; the second plating head is arranged on the rotating rack so as to be movable up and down and back and forth and moves back and forth with the rotating rack; the driving mechanism is arranged on the rotating rack and drives the plating head to move up and down.

[0007] As a preferred solution, the electroplating rack is provided with two feed pipes connected to the outside, and there are two feed pipes, and the output ends of the feed pipes extend inward into the electroplating tank; the electroplating rack is also provided with a discharge pipe connected to the bottom of the electroplating tank, and the output end of the discharge pipe is connected to an external waste pool.

[0008] As a preferred solution, the mounting frame is a regular octagon, and the number of the first electroplating heads is four, which are arranged on the mounting frame at equal angles.

[0009] As a preferred solution, first hooks are respectively extended outward from the inner side walls of the electroplating tank, and the mounting frame is provided with side walls extending up and down and cooperating with the first hooks.

[0010] As a preferred solution, the first electroplating head is arranged on the mounting frame through a second hook that cooperates with the side wall of the mounting frame, and the lower end of the second hook is provided with a guide portion that is bent outward.

[0011] As a preferred solution, the lower end of the second electroplating head is integrally bent to form a third hook.

[0012] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0013] The mounting frame is arranged in a ring shape; the first electroplating heads are arranged at equal angles, and the multiple first electroplating heads are respectively arranged on the mounting frame and extend downward into the electroplating tank; and the second electroplating head is arranged on the rotating frame so as to be movable up and down and back and forth and move back and forth with the rotating frame, so that the multiple first electroplating heads arranged at equal angles and the second electroplating head moves to the middle of the multiple first electroplating heads with the rotating frame, thereby satisfying the electroplating processing of the product on the second electroplating head in multiple directions, and having stronger functionality, it can not only satisfy the electroplating process of plate-shaped products, but also satisfy the multi-directional electroplating process of other products of different shapes; and has smaller limitations on use.

[0014] In order to more clearly illustrate the structural features and functions of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional structural schematic diagram of a preferred embodiment of the utility model.

[0016] Description of the accompanying drawings:

[0017] 10. Plating rack 101. Plating tank

[0018] 11. Feed pipe 12. Discharge pipe

[0019] 13. First hook 20. Mounting frame

[0020] 21. Side wall 30. First electroplating head

[0021] 31. Second hook 311. Guide portion

[0022] 40. Rotating frame 50. Second electroplating head

[0023] 51. Third hook 60. Driving mechanism. DETAILED DESCRIPTION

[0024] Please refer to Figure 1 As shown, it shows the specific structure of a preferred embodiment of the utility model, which includes a plating rack 10, a mounting rack 20, a first plating head 30, a rotating rack 40, a second plating head 50 and a driving mechanism 60.

[0025] The plating rack 10 has a plating tank 101 for containing plating liquid; in this embodiment, the plating rack 10 is provided with two feed pipes 11 connected to the outside, and there are two feed pipes 11, the output end of the feed pipe 11 extends inwardly into the plating tank 101, and the feed pipe 11 is used to complete the process of feeding the plating liquid inside the plating tank 101; the plating rack 20 is also provided with a discharge pipe 12 connected to the bottom of the plating tank 101, and the output end of the discharge pipe 12 is connected to the external waste pool, and the discharge pipe 12 is used to discharge the waste plating liquid in the plating tank 101, and through the cooperation with the two feed pipes 11, the circulation and replacement process of the plating liquid in the plating tank 101 is convenient. The inner side walls of the plating tank 101 extend outward with first hooks 13 respectively.

[0026] The mounting frame 20 is arranged on the electroplating rack 10 and is located in the electroplating tank 101. The mounting frame 20 is arranged in a ring shape. In this embodiment, the mounting frame 20 is a regular octagon. The mounting frame 20 is provided with a side wall 21 extending up and down and cooperating with the first hook 13. The mounting frame 20 is detachably mounted on the electroplating rack 10 through the cooperation between the side wall 21 and the first hook 13, so that different mounting frames 20 can be replaced according to actual products, so that different numbers of first electroplating heads 30 can be arranged on the mounting frame 20.

[0027] The first electroplating heads 30 are arranged at equal angles, and the multiple first electroplating heads 30 are respectively arranged on the mounting frame 20 and extend downward into the electroplating tank 101; the multiple first electroplating heads 30 arranged at equal angles are used to realize the electroplating processing in different directions of the ring, and the functionality is stronger. The first electroplating heads 30 are connected to the external electrode when performing the electroplating processing. In this embodiment, the first electroplating heads 30 are set as 4, and the 4 first electroplating heads 30 are arranged at equal angles on the mounting frame 20. At the same time, the first electroplating heads 30 can also be set as multiple according to actual conditions, without limitation. The first electroplating head 30 is set on the mounting frame 20 through a second hook 31 and the side wall 21 of the mounting frame 20. The lower end of the second hook 31 is provided with a guide portion 311 formed by bending outward, so that the first electroplating head 30 can be detachably set on the mounting frame 20 through the cooperation between the second hook 31 and the side wall 21, so that different numbers of first electroplating heads 30 can be set according to actual conditions. At the same time, the setting of the guide part 311 is used to facilitate the installation process between the first electroplating head 30 and the mounting frame 20.

[0028] The rotating frame 40 is rotatably disposed on the electroplating frame 10 and is located above the electroplating tank 101 .

[0029] The second electroplating head 50 can be movably arranged on the rotating frame 40 up and down and move back and forth with the rotating frame 40. The second electroplating head 50 is connected to the external electrode during processing. In this embodiment, the lower end of the second electroplating head 50 is integrally bent to form a third hook 51, so that the external product can be directly hung on the point hook 51 and connected to the second electroplating head 50, making the overall electroplating process more convenient.

[0030] The driving mechanism 60 is disposed on the rotating frame 40 and drives the second electroplating head 50 to move up and down. The driving mechanism 60 drives the second electroplating head 50 to move upward, and cooperates with the rotation of the rotating frame 40 to facilitate the second electroplating head 50 and the product on the second electroplating head 50 to be taken out from the electroplating tank 101.

[0031] The design focus of the utility model is that: the mounting frame is arranged in a ring shape; the first electroplating heads are arranged at equal angles, and the multiple first electroplating heads are respectively arranged on the mounting frame and extend downward into the electroplating tank; and the second electroplating head is arranged on the rotating frame so as to be movable up and down and back and forth and move back and forth with the rotating frame, so that the multiple first electroplating heads arranged at equal angles and the second electroplating head moves with the rotating frame to the middle of the multiple first electroplating heads, thereby satisfying the electroplating processing of the product on the second electroplating head in multiple directions, the functionality is stronger, and it can not only meet the electroplating process of plate-shaped products, but also meet the multi-directional electroplating process of other products of different shapes; the limitation of use is smaller.

[0032] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A ring-shaped electroplating device, characterized in that: It includes an electroplating rack, a mounting rack, a first electroplating head, a rotating rack, a second electroplating head and a driving mechanism; the electroplating rack has an electroplating tank for containing electroplating liquid; the mounting rack is arranged on the electroplating rack and located in the electroplating tank, and the mounting rack is arranged in a ring shape; the first electroplating heads are arranged in a plurality at equal angles, and the plurality of first electroplating heads are respectively arranged on the mounting rack and extend downward into the electroplating tank; the rotating rack is rotatably arranged on the electroplating rack and located above the electroplating tank; the second electroplating head is arranged on the rotating rack so as to be movable up and down and back and forth and moves back and forth with the rotating rack; the driving mechanism is arranged on the rotating rack and drives the electroplating head to move up and down.

2. The annular electroplating device according to claim 1, characterized in that: The electroplating rack is provided with two feed pipes connected to the outside, and there are two feed pipes, and the output ends of the feed pipes extend inwardly into the electroplating tank; the electroplating rack is also provided with a discharge pipe connected to the bottom of the electroplating tank, and the output end of the discharge pipe is connected to the external waste pool.

3. The annular electroplating device according to claim 1, characterized in that: The mounting frame is a regular octagon, and the first electroplating heads are provided in four numbers, and the four first electroplating heads are arranged on the mounting frame at equal angles.

4. The annular electroplating device according to claim 1, characterized in that: The inner side walls of the electroplating tank are respectively provided with first hooks extending outward, and the mounting frame is provided with side walls extending up and down and cooperating with the first hooks.

5. The annular electroplating device according to claim 4, characterized in that: The first electroplating head is arranged on the mounting frame through a second hook that cooperates with the side wall of the mounting frame, and the lower end of the second hook is provided with a guide portion that is bent outward.

6. The annular electroplating device according to claim 1, characterized in that: The lower end of the second electroplating head is integrally bent to form a third hook.

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