Electroplating device

Abstract

The utility model belongs to the technical field of packaging electroplating, and discloses an electroplating device. The electroplating device comprises a first containing part, a first transition plate, a second transition plate and a liquid inlet pipeline. A first containing cavity is formed in the first containing part, and the workpiece and the anode plate are both arranged in the first containing cavity; the first transition plate is arranged in the first containing cavity in the width direction of the first containing part and divides the first containing cavity into a first chamber and a second chamber, the first chamber is located at the bottom end of the second chamber, the workpiece and the anode plate are both arranged in the second chamber, and a plurality of first through holes are evenly distributed in the first transition plate; the second transition plate is arranged between the workpiece and the anode plate, and a plurality of second through holes are uniformly distributed in the second transition plate; and one end of the liquid inlet pipeline communicates with the liquid supply part, and the other end of the liquid inlet pipeline communicates to the first cavity, so that the electroplating liquid can enter the first cavity, can sequentially pass through the first through hole and the second through hole and flows to the outer surface of the workpiece. The electroplating device can ensure the stability of a flow field.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging electroplating, in particular to an electroplating device. Background Art

[0002] Advanced packaging electroplating is one of the essential processes for semiconductors. It involves circulating the corresponding plating solution to the process chamber and performing uniform electrochemical deposition on the product surface under process conditions such as controlled flow field, temperature, and flow rate. The flow field is one of the decisive factors in packaging electroplating, and the stability of the flow field will affect the quality of electroplating to the greatest extent. However, in vertical hanging plating packaging technology, the bottom jet circulation method still has shortcomings such as poor flow field control. Existing technologies usually use baffles, pump circulation, and oscillation plates to control the flow field, but this method has limited control over the flow field and is not suitable for double-sided electroplating.

[0003] Therefore, there is an urgent need for an electroplating device that can control the balance of the field to improve the electroplating quality. Utility Model Content

[0004] The utility model aims to provide an electroplating device, which can control the balance of the field and thus improve the electroplating quality.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] An electroplating device, comprising:

[0007] A first accommodating member, having a first accommodating cavity formed therein, wherein the workpiece and the anode plate are both arranged in the first accommodating cavity;

[0008] a first transition plate, arranged in the first accommodating cavity along the width direction of the first accommodating member, and dividing the first accommodating cavity into a first chamber and a second chamber, wherein the first chamber is located at the bottom end of the second chamber, the workpiece and the anode plate are both arranged in the second chamber, and the first transition plate is uniformly provided with a plurality of first through holes;

[0009] A second transition plate is disposed between the workpiece and the anode plate, and the second transition plate is evenly distributed with a plurality of second through holes;

[0010] The liquid inlet pipeline has one end connected to the liquid supply part and the other end connected to the first chamber, so that the electroplating liquid can enter the first chamber and can sequentially pass through the first through hole and the second through hole and flow to the outer surface of the workpiece.

[0011] Preferably, the second transition plates are symmetrically arranged on both sides of the workpiece along the width direction.

[0012] Preferably, an oscillating member is disposed between both sides of the workpiece along the width direction and the second transition plate, and the oscillating member can reciprocate along the vertical direction.

[0013] Preferably, the liquid inlet pipeline includes a liquid inlet main pipe and a plurality of liquid inlet branch pipes which are interconnected, the plurality of liquid inlet branch pipes being arranged at intervals along the width direction of the first chamber, and the liquid inlet main pipe being connected to the liquid supply member so that the electroplating liquid can flow out from the plurality of liquid inlet branch pipes.

[0014] Preferably, the plurality of liquid inlet branches are provided with a plurality of liquid inlet holes along their axial direction, and the electroplating liquid can flow out from the plurality of liquid inlet holes.

[0015] Preferably, the plurality of liquid inlet branches are each provided with a plurality of liquid inlet holes on a side away from the first transition plate.

[0016] Preferably, a clamp is further provided in the second chamber, and the clamp is used to clamp the workpiece.

[0017] Preferably, the clamp is coaxially arranged with the first receiving member.

[0018] Preferably, the electroplating device also includes a second container, a second container having a second accommodating cavity formed therein, the first container being arranged in the second accommodating cavity, and the top height of the first container being lower than the top height of the second container, so that the second accommodating cavity can accommodate the electroplating liquid overflowing from the top of the first container.

[0019] Preferably, a reflux pipe is provided at the bottom end of the second accommodating member, and the reflux pipe is connected to the second accommodating chamber, so that the electroplating liquid in the second accommodating chamber can be discharged from the reflux pipe.

[0020] Beneficial effects of the utility model:

[0021] The utility model discloses an electroplating device. The electroplating device comprises a first accommodating member, a first transition plate, a second transition plate and a liquid inlet pipeline. A first accommodating chamber is formed inside the first accommodating member, and the workpiece and the anode plate are both arranged in the first accommodating chamber; the first transition plate is arranged in the first accommodating chamber along the width direction of the first accommodating member, and the first accommodating chamber is divided into a first chamber and a second chamber, the first chamber is located at the bottom end of the second chamber, the workpiece and the anode plate are both arranged in the second chamber, and a plurality of first through holes are evenly distributed on the first transition plate; the second transition plate is arranged between the workpiece and the anode plate, and a plurality of second through holes are evenly distributed on the second transition plate; one end of the liquid inlet pipeline is connected to the liquid supply member, and the other end is connected to the first chamber, so that the electroplating liquid can enter the first chamber, and can pass through the first through hole and the second through hole in sequence and flow to the outer surface of the workpiece.

[0022] This liquid inlet method can effectively reduce the impact force of the electroplating liquid, allowing the electroplating liquid to flow smoothly and gradually raise the liquid level until the workpiece is completely immersed, thereby ensuring the stability of the flow field formed by the electroplating liquid and further ensuring a good electroplating effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is an isometric view of the electroplating device provided by the utility model;

[0024] Figure 2 It is a schematic diagram of the top structure of the electroplating device provided by the utility model;

[0025] Figure 3 The utility model provides Figure 2 The cross-sectional view along the AA direction;

[0026] Figure 4 It is a schematic diagram of the internal structure provided by the utility model;

[0027] Figure 5 The utility model provides Figure 4 A partial enlarged view of part A;

[0028] Figure 6 The utility model provides Figure 4 A partial enlarged view of part B.

[0029] In the figure:

[0030] 10. first accommodating member; 11. first accommodating cavity; 111. first chamber; 112. second chamber;

[0031] 20. Liquid inlet pipeline; 21. Liquid inlet main pipe; 22. Liquid inlet branch pipe; 221. Liquid inlet hole

[0032] 30. first transition plate; 31. first through hole;

[0033] 40. second transition plate; 41. second through hole;

[0034] 50. Anode plate; 51. Connector;

[0035] 60. Oscillating member; 61. Spoiler;

[0036] 70. Clamp;

[0037] 80. second accommodating member; 81. second accommodating chamber; 82. reflux pipe;

[0038] 90. Workpiece. DETAILED DESCRIPTION

[0039] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0040] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0042] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0043] This embodiment provides an electroplating device, such as Figure 1-Figure 5As shown, the electroplating device includes a first receiving member 10 , a first transition plate 30 , a second transition plate 40 and a liquid inlet pipeline 20 . Among them, a first accommodating cavity 11 is formed inside the first accommodating member 10, and the workpiece 90 and the anode plate 50 are both arranged in the first accommodating cavity 11; the first transition plate 30 is arranged in the first accommodating cavity 11 along the width direction of the first accommodating member 10, and divides the first accommodating cavity 11 into a first chamber 111 and a second chamber 112, the first chamber 111 is located at the bottom end of the second chamber 112, the workpiece 90 and the anode plate 50 are both arranged in the second chamber 112, and a plurality of first through holes 31 are evenly distributed on the first transition plate 30; the second transition plate 40 is arranged between the workpiece 90 and the anode plate 50, and a plurality of second through holes 41 are evenly distributed on the second transition plate 40; one end of the liquid inlet pipeline 20 is connected to the liquid supply member, and the other end is connected to the first chamber 111, so that the plating solution can enter the first chamber 111, and can pass through the first through hole 31 and the second through hole 41 in sequence and flow to the outer surface of the workpiece 90.

[0044] The electroplating solution enters the first chamber 111 through the liquid inlet pipeline 20, and the liquid level gradually rises in the first chamber 111. When the liquid level is at the same level as the first transition plate 30, the electroplating solution can enter the second chamber 112 through the first through hole 31, and after entering the second chamber 112, a part of the electroplating solution directly enters the gap between the second transition plate 40 and the workpiece 90 and contacts the workpiece 90, and another part of the electroplating solution enters the gap between the second transition plate 40 and the anode plate 50, and enters the gap between the second transition plate 40 and the workpiece 90 through the second through hole 41 and contacts the workpiece 90. This liquid inlet method can effectively reduce the impact force of the electroplating solution, so that the electroplating solution can flow smoothly, and the liquid level gradually rises until the workpiece 90 is completely immersed, thereby ensuring the stability of the flow field formed by the electroplating solution, and further ensuring a good electroplating effect.

[0045] It should be noted that in this embodiment, Figure 2 As shown, the anode plate 50 is connected to the positive pole of the external power supply through the connector 51, and the workpiece 90 is connected to the negative pole of the power supply. When the electroplating solution is located between the workpiece 90 and the anode plate 50, power is supplied to complete the ionization process.

[0046] like Figure 2 and Figure 3 As shown, anode plates 50 are provided on both sides of the workpiece 90 along the width direction, and correspondingly, second transition plates 40 are provided on both sides of the workpiece 90 along the width direction (between the anode plates 50 and the workpiece 90), that is, after the electroplating solution enters the second chamber 112, it can contact the workpiece 90 from both sides of the workpiece 90 along the width direction, thereby ensuring that a stable flow field can be formed on both sides of the workpiece 90, and further ensuring that a good electroplating effect can be produced on both sides of the workpiece 90.

[0047] What needs to be explained here is that Figure 2 and Figure 3 As shown, the anode plates 50 on both sides of the workpiece 90 along the width direction are connected to the first transition plate 30, and the corresponding first transition plate 30 is only provided with a first through hole 31 in the portion located between the two anode plates 50. This structure can ensure that the electroplating liquid only flows between the two anode plates 50 after entering the second chamber 112, thereby ensuring a good electroplating effect. At the same time, it also avoids the problem of having to pass a large amount of electroplating liquid to fill the entire first container 10 before electroplating can be carried out, thereby reducing the overall cost.

[0048] To ensure better electroplating effect, Figure 2 and Figure 3 As shown, an oscillating member 60 is disposed between both sides of the workpiece 90 along the width direction and the second transition plate 40, and the oscillating member 60 can be moved in the vertical direction ( Figure 1 and Figure 3 The oscillating member 60 is provided with a plurality of spoilers 61 at intervals along the vertical direction. During the up and down reciprocating motion of the oscillating member 60, the plurality of spoilers 61 can keep the ions involved in ionization in the electroplating solution uniform, thereby ensuring a good electroplating effect.

[0049] like Figure 3-Figure 6 As shown, the liquid inlet pipeline 20 includes a liquid inlet main pipe 21 and a plurality of liquid inlet branches 22 that are interconnected. The plurality of liquid inlet branches 22 are arranged at intervals along the width direction of the first chamber 111. The liquid inlet main pipe 21 is connected to the liquid supply member so that the electroplating liquid can flow out from the plurality of liquid inlet branches 22. This arrangement can ensure that the electroplating liquid will not be sprayed out from the liquid inlet main pipe 21 in a centralized manner, but will be branched out from the plurality of liquid inlet branches 22, thereby reducing the impact force of the electroplating liquid when it flows out, thereby ensuring that the electroplating liquid can enter the first chamber 111 at a lower flow rate, thereby preliminarily ensuring the stability of the flow field.

[0050] like Figure 4 and Figure 6 As shown, the plurality of liquid inlet branches 22 are provided with a plurality of liquid inlet holes 221 along their axial direction, and the electroplating liquid can flow out from the plurality of liquid inlet holes 221. This arrangement can avoid the problem of the electroplating liquid having a large energy and a too fast speed when being ejected from the liquid inlet branch 22, and the rapid accumulation of the electroplating liquid causing the liquid level to rise rapidly, and further ensures the stability of the flow field.

[0051] like Figure 4 and Figure 6As shown, the multiple liquid inlet branches 22 are all provided with multiple liquid inlet holes 221 on the side away from the first transition plate 30. This structure can ensure that when the electroplating liquid flows out from the liquid inlet holes 221, it directly flows to the bottom of the first chamber 111 and gradually accumulates from the bottom until the liquid level of the first chamber 111 is flush with the height of the first transition plate 30, and the electroplating liquid can enter the second chamber 112 and contact the workpiece 90, thereby ensuring the stability of the entire flow field.

[0052] like Figure 2 and Figure 3 As shown, a fixture 70 is also provided in the second chamber 112, and the fixture 70 is used to clamp the workpiece 90. The fixture 70 is coaxially arranged with the first receiving member 10. Firstly, the fixture 70 can ensure that the workpiece 90 does not shake during the electroplating process, thereby ensuring a good electroplating effect; in addition, the fixture 70 is coaxially arranged with the first receiving member 10, which can facilitate the symmetrical arrangement of the anode plate 50 and the oscillating member 60 on both sides of the workpiece 90, thereby reducing the difficulty of processing and installation, and can also facilitate the electroplating of both sides of the workpiece 90 along the width direction.

[0053] However, the electroplating liquid needs to gradually rise from the bottom of the second chamber 112 until the workpiece 90 is immersed, so that the electroplating of the outside of the workpiece 90 can be completed. However, if the workpiece 90 is immersed, the electroplating liquid will overflow from the first receiving member 10, and the overflowed electroplating liquid is inconvenient to handle. To solve this problem, Figure 3 As shown, the electroplating device further includes a second accommodating member 80, a second accommodating chamber 81 is formed inside the second accommodating member 80, the first accommodating member 10 is disposed in the second accommodating chamber 81, and the top height of the first accommodating member 10 is lower than the top height of the second accommodating member 80, so that the second accommodating member 80 can accommodate the electroplating liquid overflowing from the top of the first accommodating member 10. By providing the second accommodating member 80, it is possible to ensure that there is enough electroplating liquid in the second chamber 112, and it is also possible to ensure that the overflowed electroplating liquid can be collected.

[0054] In addition, if Figure 1 As shown, a reflux pipe 82 is further provided at the bottom end of the second receiving member 80, and the reflux pipe 82 can be connected to the second receiving chamber 81, so that the electroplating liquid in the second receiving chamber 81 can be discharged from the reflux pipe 82. By providing the reflux pipe 82, the collected electroplating liquid can be discharged into the collection vessel, thereby facilitating centralized treatment or recycling, and ensuring the convenience of treating waste liquid.

[0055] The following is a description of the use process of the electroplating device in this embodiment with reference to the accompanying drawings:

[0056] First, the electroplating solution is introduced into the liquid inlet main pipe 21, so that the electroplating solution flows out from the liquid inlet holes 221 of the plurality of liquid inlet branch pipes 22 into the first chamber 111;

[0057] Secondly, the plating solution is continuously introduced so that the plating solution can enter the second chamber 112 through the first through hole 31 of the first transition plate 30 and immerse the workpiece 90;

[0058] Secondly, the workpiece 90 and the anode plate 50 are connected to the negative and positive electrodes of the power supply respectively, so that the oscillating member 60 reciprocates in the vertical direction to complete the electroplating;

[0059] Finally, the plating solution is recovered through the reflux pipe 82.

[0060] In summary, the use of the electroplating device in this embodiment can not only ensure the stability of the flow field, but also produce good electroplating effects on both sides of the workpiece 90 .

[0061] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. An electroplating device, characterized in that: include: A first accommodating member (10) having a first accommodating cavity (11) formed therein, wherein the workpiece (90) and the anode plate (50) are both arranged in the first accommodating cavity (11); a first transition plate (30) disposed in the first accommodating cavity (11) along the width direction of the first accommodating member (10), and dividing the first accommodating cavity (11) into a first chamber (111) and a second chamber (112), wherein the first chamber (111) is located at the bottom end of the second chamber (112), the workpiece (90) and the anode plate (50) are both disposed in the second chamber (112), and the first transition plate (30) is uniformly provided with a plurality of first through holes (31); A second transition plate (40) is disposed between the workpiece (90) and the anode plate (50), and the second transition plate (40) is evenly distributed with a plurality of second through holes (41); A liquid inlet pipeline (20) is connected to the liquid supply member at one end and to the first chamber (111) at the other end, so that the electroplating liquid can enter the first chamber (111) and can sequentially pass through the first through hole (31) and the second through hole (41) and flow to the outer surface of the workpiece (90).

2. The electroplating device according to claim 1, characterized in that: The second transition plates (40) are symmetrically arranged on both sides of the workpiece (90) in the width direction.

3. The electroplating device according to claim 2, characterized in that: An oscillating member (60) is disposed between both sides of the workpiece (90) along the width direction and the second transition plate (40), and the oscillating member (60) is capable of reciprocating in a vertical direction.

4. The electroplating device according to any one of claims 1 to 3, characterized in that: The liquid inlet pipeline (20) comprises a liquid inlet main pipe (21) and a plurality of liquid inlet branch pipes (22) which are interconnected. The plurality of liquid inlet branch pipes (22) are arranged at intervals along the width direction of the first chamber (111). The liquid inlet main pipe (21) is connected to the liquid supply member so that the electroplating liquid can flow out from the plurality of liquid inlet branch pipes (22).

5. The electroplating device according to claim 4, characterized in that: The plurality of liquid inlet branches (22) are provided with a plurality of liquid inlet holes (221) along their axial direction, and the electroplating liquid can flow out from the plurality of liquid inlet holes (221).

6. The electroplating device according to claim 5, characterized in that: The plurality of liquid inlet branch pipes (22) are each provided with a plurality of liquid inlet holes (221) on a side facing away from the first transition plate (30).

7. The electroplating device according to any one of claims 1 to 3, characterized in that: A clamp (70) is also provided in the second chamber (112), and the clamp (70) is used to clamp the workpiece (90).

8. The electroplating device according to claim 7, characterized in that: The clamp (70) is coaxially arranged with the first receiving member (10).

9. The electroplating device according to any one of claims 1 to 3, characterized in that: The electroplating device further comprises a second container (80), a second container cavity (81) is formed inside the second container (80), the first container (10) is arranged in the second container cavity (81), and the top height of the first container (10) is lower than the top height of the second container (80), so that the second container cavity (81) can accommodate the electroplating liquid overflowing from the top of the first container (10).

10. The electroplating device according to claim 9, characterized in that: A reflux pipe (82) is provided at the bottom end of the second accommodating member (80), and the reflux pipe (82) is connected to the second accommodating chamber (81), so that the electroplating liquid in the second accommodating chamber (81) can be discharged from the reflux pipe (82).

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