LED appliance

Abstract

The utility model provides an LED appliance, which comprises a light bar, an LED chip arranged above the light bar and a fluorescent silica gel lens arranged above the light bar and the LED chip, a heat dissipation cavity is arranged between the fluorescent silica gel lens and the LED chip, a plurality of heat dissipation grooves are arranged on the upper surface of the light bar, the heat dissipation grooves are positioned in the vertical direction of the heat dissipation cavity, and the fluorescent silica gel lens is arranged above the light bar and the LED chip. A reflecting colloid layer is prepared in the groove wall of the heat dissipation groove, the position, located in the vertical direction of the LED chip, of the upper surface of the fluorescent silica gel lens is sunken downwards to be in an arc shape, the arc-shaped part of the upper surface of the fluorescent silica gel lens is arranged in a sawtooth shape, and the heat dissipation groove is in a trapezoid shape. The groove walls on the two sides of the heat dissipation groove incline in the direction away from the bottom groove wall of the heat dissipation groove from bottom to top. The LED appliance can improve the overall light-emitting effect of the final LED lamp strip.

Description

Technical Field

[0001] The utility model relates to the technical field of LED production and manufacturing, in particular to an LED device. Background Art

[0002] As LED green light sources are applied to various industries, the cost requirements for LEDs are getting lower and lower. Conventional SMD LED products use blue light chips + fluorescent glue technology, which are applied to modules. After being equipped with lenses, they are transformed from point light sources to surface light sources; they go through the packaging process and the module lens mounting process.

[0003] Specifically, the LED chip needs to go through a series of processes such as packaging and die bonding, wire bonding, glue dispensing, spectrometry, and taping to make the LED an independent component, and then be mounted on the light strip to become a module. This structure has a long production cycle and relatively high production costs. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of the present utility model is to provide an LED device, aiming to solve the technical problem in the prior art that the LED chip needs to go through a series of processes such as packaging and crystal bonding, wire bonding, glue dispensing, light splitting, and taping to make the LED an independent component, and then be mounted on a light strip to become a module. This structure has a long production cycle and relatively high production costs.

[0005] In order to achieve the above purpose, the utility model is implemented through the following technical solutions:

[0006] An LED device comprises a light bar, an LED chip arranged above the light bar, and a fluorescent silicone lens arranged above the light bar and the LED chip, a heat dissipation cavity is arranged between the fluorescent silicone lens and the LED chip, a plurality of heat dissipation grooves are opened on the upper surface of the light bar, the heat dissipation grooves are located in the vertical direction of the heat dissipation cavity, a reflective colloid layer is prepared in the groove wall of the heat dissipation groove, the upper surface of the fluorescent silicone lens is located in the vertical direction of the LED chip and is concave downward in an arc shape, the arc-shaped portion of the upper surface of the fluorescent silicone lens is serrated, the heat dissipation groove is trapezoidal, and the groove walls on both sides of the heat dissipation groove are inclined from bottom to top in a direction away from the bottom groove wall of the heat dissipation groove.

[0007] According to one aspect of the above technology, there are a plurality of LED chips, and the plurality of LED chips are arranged at intervals on the light bar.

[0008] According to one aspect of the above technology, the side of the fluorescent silicone lens facing the LED chip is in a trapezoidal shape, and the two inner side walls of the fluorescent silicone lens are inclined from top to bottom in a direction away from the LED chip.

[0009] According to one aspect of the above technology, a plurality of heat dissipation holes are formed through the light bar, and the heat dissipation holes are located directly below the LED chip.

[0010] According to one aspect of the above technology, an electrode is provided under the LED chip, and the electrode is connected to the light bar.

[0011] According to one aspect of the above technology, a soldering pad is provided below the LED chip, and the LED chip is fixedly connected to the light bar via the soldering pad.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] By setting a light bar and directly setting an LED chip on the light bar, the step of encapsulating lamp beads in the conventional preparation method is eliminated, reducing the production cycle and cost; by setting a fluorescent silicone lens made of a mixture of silicone and fluorescent powder, it also plays a white light role in combination with the LED chip, and the effect is better than that of a general acrylic lens, and by making the fluorescent silicone lens have an arc-shaped upper surface, the diffusion of white light is better, the white light range is adjustable, and the uniformity is better controlled; because the LED chip emits a lot of heat when it emits light, a heat dissipation cavity is left between the LED chip and the fluorescent silicone lens to avoid direct contact between the LED chip and the fluorescent silicone lens, which can effectively reduce the heat, and at the same time, a heat dissipation groove is set at the heat dissipation cavity of the light bar, which further increases The heat dissipation space improves the luminous efficiency and service life of the LED chip, and a reflective colloid layer is set on the groove wall of the heat dissipation groove. In the propagation path of light, the light reflected to the bottom of the heat dissipation groove will be reflected back to the fluorescent silicone layer due to the existence of the reflective alternating layer, which can improve the overall luminous effect of the final LED light strip. When the light enters the heat dissipation groove, the inclined side groove wall will better contact the light, and at the same time reflect the light back to the fluorescent silicone lens at a certain angle, thereby improving the scattering efficiency of the light in the heat dissipation cavity and the fluorescent silicone lens. When the light is emitted through the fluorescent silicone lens, the light efficiency is improved; the arc-shaped fluorescent silicone lens can improve the scattering efficiency of light, and the serrated upper surface can further improve the scattering efficiency of light, so that the final LED light strip presents better light efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the structure of the LED device in the embodiment of the utility model;

[0015] Figure 2 for Figure 1 A magnified view of part A;

[0016] Figure 3 for Figure 1 A magnified view of part B;

[0017] Figure 4 for Figure 1 Enlarged view of part C;

[0018] Description of main component symbols:

[0019] Fluorescent Silicone Lens 10 Light Bar 20 Heat dissipation cavity 30 LED Chips 40 Heat sink 31 Reflective colloid layer 32 Cooling holes 21 electrode 41 Pads 42

[0020] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0021] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0022] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0024] See also Figures 1 to 4 , shown is an LED device in the first embodiment of the utility model, including a light bar 20, an LED chip 40 arranged above the light bar 20, and a fluorescent silicone lens 10 arranged above the light bar 20 and the LED chip 40, a heat dissipation cavity 30 is provided between the fluorescent silicone lens 10 and the LED chip 40, a plurality of heat dissipation grooves 31 are opened on the upper surface of the light bar 20, the heat dissipation grooves 31 are located in the vertical direction of the heat dissipation cavity 30, a reflective colloid layer 32 is prepared in the groove wall of the heat dissipation groove 31, and the upper surface of the fluorescent silicone lens 10 is located in the vertical direction of the LED chip 40 and is concave downward in an arc shape.

[0025] It can be understood that the utility model provides a light bar 20 and directly provides an LED chip 40 on the light bar 20, thereby eliminating the step of encapsulating lamp beads in the conventional preparation method, reducing the production cycle and cost; by providing a fluorescent silicone lens 10 made of a mixture of silicone and fluorescent powder, in combination with the LED chip 40, the white light effect is also achieved, and the effect is better than that of a general acrylic lens, and by making the upper surface of the fluorescent silicone lens 10 arc-shaped, the diffusion of white light is better, the range of white light is adjustable, and the uniformity is better controlled; because the LED chip 40 emits a large amount of heat when emitting light By leaving a heat dissipation cavity 30 between the LED chip 40 and the fluorescent silicone lens 10 to avoid direct contact between the LED chip 40 and the fluorescent silicone lens 10, the heat can be effectively reduced. At the same time, a heat dissipation groove 31 is arranged at the heat dissipation cavity 30 of the light bar 20, which further increases the heat dissipation space and improves the luminous efficiency and service life of the LED chip 40. A reflective colloid layer 32 is arranged on the groove wall of the heat dissipation groove 31. In the propagation path of the light, the light reflected to the bottom of the heat dissipation groove 31 will be reflected back to the fluorescent silicone layer due to the existence of the reflective alternating layer, which can improve the overall luminous effect of the final LED light bar.

[0026] Specifically, there are multiple LED chips 40, and the multiple LED chips 40 are arranged at intervals on the light bar 20. The upper surface of the fluorescent silicone lens 10 is arranged in a serrated shape, wherein in the vertical direction of each LED chip 40, the upper surface of the fluorescent silicone lens 10 is in an arc shape.

[0027] It can be understood that with this design structure, when the LED chip 40 emits light, the arc-shaped fluorescent silicone lens 10 can improve the light scattering efficiency, and the serrated upper surface can further improve the light scattering efficiency, so that the final LED light bar presents better lighting effect, and the fluorescent silicone lens 10 made of fluorescent powder and silicone has better flexibility and heat dissipation effect, which is quite different from the traditional acrylic lens. At the same time, the LED chip 40 is directly arranged on the light bar 20, and different chip sizes and spacings can be selected according to the design of the size of the light bar 20.

[0028] It should be noted that the fluorescent silicone lens 10 made of fluorescent powder and silicone is a material already available in the prior art. The inventive point of the utility model is to directly set it on the light bar 20 and the LED chip 40 to achieve a better effect.

[0029] Furthermore, the heat dissipation slot 31 is in a trapezoidal shape, and the slot walls on both sides of the heat dissipation slot 31 are inclined from bottom to top toward a direction away from the bottom slot wall of the heat dissipation slot 31 .

[0030] It can be understood that through this design structure, when light enters the heat dissipation groove 31, the inclined side groove wall will better contact the light, and at the same time reflect the light back to the fluorescent silicone lens 10 at a certain angle, thereby improving the scattering efficiency of the light in the heat dissipation cavity 30 and the fluorescent silicone lens 10. When the light is emitted through the fluorescent silicone lens 10, the light effect is improved.

[0031] Furthermore, a surface of the fluorescent silicone lens 10 facing the LED chip 40 is in a trapezoidal shape, and two inner side walls of the fluorescent silicone lens 10 are inclined from top to bottom toward a direction away from the LED chip 40 .

[0032] It can be understood that through this design structure, when the light emitted by the LED chip 40 enters the fluorescent silicone lens 10, it will be refracted at a certain angle due to its inclined inner wall, thereby improving the scattering efficiency of the light in the fluorescent silicone lens 10, thereby improving the lighting effect of the final LED light strip.

[0033] Furthermore, the light strip 20 is penetrated by a plurality of heat dissipation holes 21, and the heat dissipation holes 21 are located directly below the LED chip 40. By providing the heat dissipation holes 21, the bottom of the LED chip 40 can be effectively dissipated. Together with the heat dissipation cavity 30 and the heat dissipation groove 31, the service life of the LED chip 40 can be further improved.

[0034] Furthermore, an electrode 41 is provided below the LED chip 40 , and the electrode 41 is connected to the light bar 20 ; a soldering pad 42 is provided below the LED chip 40 , and the LED chip 40 is fixedly connected to the light bar 20 via the soldering pad 42 .

[0035] In summary, the LED device in the above-mentioned embodiment of the utility model, by setting a light bar and directly setting the LED chip on the light bar, eliminates the step of encapsulating lamp beads in the conventional preparation method, and reduces the production cycle and cost; by setting a fluorescent silicone lens made of a mixture of silicone and fluorescent powder, it also plays a white light role in combination with the LED chip, and the effect is better than that of the general acrylic lens, and by making the fluorescent silicone lens have an arc-shaped upper surface, the diffusion of white light is better, the white light range is adjustable, and the uniformity is better controlled; because the LED chip emits a lot of heat when it emits light, a heat dissipation cavity is left between the LED chip and the fluorescent silicone lens to avoid direct contact between the LED chip and the fluorescent silicone lens, which can effectively reduce the heat, and at the same time, a heat dissipation groove is set at the heat dissipation cavity of the light bar, which further increases the heat dissipation space, improves the light efficiency and service life of the LED chip, and a reflective colloid layer is set on the groove wall of the heat dissipation groove. In the propagation path of the light, the light reflected to the bottom of the heat dissipation groove will be reflected back to the fluorescent silicone layer due to the existence of the reflective alternating layer, which can improve the overall luminous effect of the final LED light bar.

[0036] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0037] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An LED device, characterized in that: The invention comprises a light bar, an LED chip arranged above the light bar, and a fluorescent silicone lens arranged above the light bar and the LED chip, a heat dissipation cavity is arranged between the fluorescent silicone lens and the LED chip, a plurality of heat dissipation grooves are opened on the upper surface of the light bar, the heat dissipation grooves are located in the vertical direction of the heat dissipation cavity, a reflective colloid layer is prepared in the groove wall of the heat dissipation groove, the upper surface of the fluorescent silicone lens is located in the vertical direction of the LED chip and is concave downward in an arc shape, the arc-shaped part of the upper surface of the fluorescent silicone lens is serrated, the heat dissipation groove is trapezoidal, and the groove walls on both sides of the heat dissipation groove are inclined from bottom to top in a direction away from the bottom groove wall of the heat dissipation groove.

2. The LED device according to claim 1, characterized in that: There are a plurality of LED chips, and the plurality of LED chips are arranged at intervals on the light bar.

3. The LED device according to claim 1, characterized in that: The fluorescent silicone lens has a trapezoidal shape on one side facing the LED chip, and two inner side walls of the fluorescent silicone lens are inclined from top to bottom in a direction away from the LED chip.

4. The LED device according to claim 1, characterized in that: The light bar is provided with a plurality of heat dissipation holes, and the heat dissipation holes are located directly below the LED chip.

5. The LED device according to claim 1, characterized in that: An electrode is provided below the LED chip, and the electrode is connected to the light bar.

6. The LED device according to claim 1, characterized in that: A soldering pad is provided below the LED chip, and the LED chip is fixedly connected to the light bar via the soldering pad.

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