Cooling device and processing equipment

By designing a cooling device including water-cooling module, fan module and heat exchange module, the problem of long cooling time of copper or silicon wafers and uneven oxide layer under stand-alone cooling mode is solved, and rapid and uniform cooling is achieved, and product quality and production efficiency are improved.

CN222881449UActive Publication Date: 2025-05-16GU RUI SEMICONDUCTOR EQUIPMENT (SHENZHEN) CO LTD
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Patent Information

Application Number
CN202421547156.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-02
Publication Date
2025-05-16
Estimated Expiration
2034-07-02

AI Technical Summary

Technical Problem

In the existing semiconductor device processes, the standstill cooling method causes the copper sheet or silicon wafer to cool for a long time, affects the heat treatment efficiency, and may lead to uneven and damage to the oxide layer, affecting the yield rate of subsequent processing.

Method used

A cooling device is designed, including a water-cooling module, a fan module and a heat exchange module. The circulating air flow is generated through the inner wall of the water-cooling module and the fan module, and the heat exchanger is used to absorb and transfer heat to achieve rapid and uniform cooling.

Benefits of technology

Through this cooling device, the cooling time of the product is significantly shortened, the unevenness and damage of the oxide layer are avoided, the product quality and the yield rate of subsequent processing are improved, and the efficiency of the entire production process is improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of semiconductors, and discloses a cooling device and processing equipment. The cooling device comprises a water cooling module, a fan module and a heat exchange module. A cooling cavity is formed in the water-cooling module, and a water-cooling flow channel is formed in the inner wall of the water-cooling module. The heat exchange module is arranged on the water cooling module and comprises a heat exchanger and an air guide assembly. The fan module is used for generating airflow in the water cooling module, and the air guide assembly is used for limiting the direction of the airflow, so that the airflow circularly flows in the cooling cavity and flows through the heat exchanger. Through the cooling device, the temperature in the cooling cavity can be reduced through the inner wall of the water cooling module, so that the temperature of a product is reduced, meanwhile, circularly flowing airflow can be generated in the cooling cavity and passes through the heat exchanger, so that the temperature in the cooling cavity is uniformly, quickly and comprehensively reduced, and the quality of the product is guaranteed; and the yield of subsequent product processing is improved, and the efficiency of the whole production process is also improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a cooling device and processing equipment. Background Art

[0002] In the existing semiconductor device process, the process of heat treatment of copper sheets or silicon sheets is as follows: the copper sheets or silicon sheets are loaded into a sheet placing boat, and the sheet placing boat is sent into a furnace tube for heat treatment through a transport mechanism in a loading chamber, and after the heat treatment process is completed, the copper sheets or silicon sheets in the material boat are moved out of the furnace tube and transported back to the loading chamber through the transport mechanism, and then the copper sheets and the sheet placing boat are cooled and waited for to return to room temperature, and then other processing processes are performed on the copper sheets or silicon sheets. This method of cooling by standing still not only requires a long cooling time, which affects the efficiency of heat treatment, but also the oxide layer generated during the cooling process of the copper sheets or silicon sheets may become uneven and damaged due to long-term cooling, thereby affecting the yield rate of other subsequent processing processes of the copper sheets or silicon sheets, and failing to meet the quality requirements of other processing processes for the copper sheets.

[0003] Based on the above, a cooling device and processing equipment are urgently needed to solve the above technical problems. Utility Model Content

[0004] One purpose of the utility model is to provide a cooling device, which can quickly cool down the product, improve production efficiency, and ensure the quality of the oxide layer.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A cooling device includes a water cooling module, a fan module and a heat exchange module. A cooling chamber is defined in the water cooling module, and a water cooling channel is provided on the inner wall of the water cooling module. A refrigerant flows in the water cooling channel, and the refrigerant is used to absorb and transfer the heat in the cooling chamber. The heat exchange module is fixedly arranged on the water cooling module, and the heat exchange module includes a heat exchanger and an air guide component. The fan module is used to generate airflow in the cooling chamber, and the air guide component is used to limit the direction of the airflow so that the airflow circulates in the cooling chamber and passes through the heat exchanger during the circulation process. The heat exchanger is used to absorb and transfer the heat carried by the airflow.

[0007] The beneficial effect of the cooling device provided by the utility model is that, through the cooling device, it is possible to reduce the temperature in the cooling chamber by cooling the inner wall of the water cooling module, thereby reducing the temperature of the product, and at the same time, it is possible to generate a circulating airflow in the cooling chamber through the fan module and the air guide component and make the airflow pass through the heat exchanger, so that the temperature in the cooling chamber is uniform, rapid and comprehensive, thereby reducing the time that the product as a whole or the product is in a high temperature state, especially avoiding the phenomenon of uneven oxide layer and damage of products such as copper sheets due to static cooling, thereby ensuring the quality of the product, improving the yield rate of subsequent product processing, and improving the efficiency of the entire production process.

[0008] In some embodiments, the top wall, bottom wall and side wall of the water cooling module are each provided with at least one water cooling channel, and the water cooling module is provided with multiple channel water inlets and multiple channel water outlets, and the multiple channel water inlets and multiple channel water outlets are connected to the water cooling channel, and the refrigerant can enter the water cooling channel located on the top wall, bottom wall and side wall of the water cooling module through the multiple channel water inlets, and flow out from the multiple channel water outlets. This setting can achieve a comprehensive and uniform cooling effect on the cooling chamber, avoiding the phenomenon of rapid cooling of one part of the product and slow cooling of another part, thereby ensuring that the oxide layer on the surface of the product is uniform and complete during the cooling process.

[0009] In some embodiments, the water cooling module includes a first shell and a second shell, a cooling chamber is defined in the first shell, the first shell is inserted into the second shell, and a water cooling chamber is defined between the first shell and the second shell. A plurality of flow-blocking members are also provided between the first shell and the second shell, and the flow-blocking members are used to change the flow direction and / or flow speed of the refrigerant. This arrangement can extend the time required for the refrigerant to flow in the water cooling channel, so that the refrigerant can more fully absorb the heat in the cooling chamber.

[0010] In some embodiments, the fan module includes a fan driver and a fan impeller. The fan impeller is arranged in the cooling chamber, and the fan driver is arranged outside the water cooling module. The fan driver and the fan impeller are transmission connected. The fan driver can drive the fan impeller to rotate to generate airflow in the cooling chamber, and can prevent the fan driver from being damaged by high temperature, thereby extending the service life of the fan module and the entire cooling device.

[0011] In some embodiments, the air guide assembly includes a first air guide, the first air guide is arranged between the fan impeller and the heat exchanger, and the first air guide has a first opening and a second opening. In addition, the first opening is connected to the air outlet of the fan impeller, and the second opening is connected to the air inlet of the heat exchanger, and the airflow flows from the fan impeller to the heat exchanger through the first air guide. Alternatively, the first opening is connected to the air inlet of the fan impeller, and the second opening is connected to the air outlet of the heat exchanger, and the airflow flows from the heat exchanger to the fan impeller through the first air guide. This arrangement allows the airflow generated by the fan module to pass through the heat exchanger, thereby improving the efficiency and uniformity of heat exchange and cooling.

[0012] In some embodiments, one side of the heat exchanger is an air inlet, and the other side is an air outlet, and the heat exchanger divides the cooling chamber into a first area and a second area, the fan impeller is located in the first area, and the second area is used to place the product to be cooled, and the airflow circulates between the first area and the second area. This setting can improve the cooling effect and cooling uniformity of the airflow in the cooling chamber.

[0013] In some embodiments, the heat exchanger is spaced apart from the inner wall of the water cooling module and a ventilation gap is formed, the first area and the second area are directly connected through the ventilation gap, and the airflow is arranged to circulate sequentially between the first area, the fan impeller, the heat exchanger, the second area, and the ventilation gap. Alternatively, the airflow circulates sequentially between the first area, the ventilation gap, the second area, the heat exchanger, and the fan impeller. This arrangement can further improve the cooling effect and uniformity of the airflow on the cooling chamber.

[0014] In some embodiments, the air guide assembly further includes a second air guide, which is fixedly mounted on the heat exchanger, and the second air guide is spaced apart from the inner wall of the water cooling module to form a ventilation gap, the first area and the second area are directly connected via the ventilation gap, and the airflow is arranged to circulate sequentially between the first area, the fan impeller, the heat exchanger, the second area, and the ventilation gap. Alternatively, the airflow circulates sequentially between the first area, the ventilation gap, the second area, the heat exchanger, and the fan impeller. This arrangement can also further improve the cooling effect and uniformity of the airflow in the cooling chamber.

[0015] In some embodiments, the cooling device includes at least one water cooling module, and at least one water cooling module is fixedly connected to at least two fan modules and at least two heat exchange modules, at least two fan modules are arranged in a row, at least two heat exchange modules are arranged in a row, and each fan module and the first air guide of a heat exchange module are connected and arranged one by one. In this way, the number of water cooling modules, fan modules and heat exchange modules can be reasonably set to meet the actual cooling needs.

[0016] Another object of the utility model is to provide a processing device with higher production efficiency and higher production quality.

[0017] To achieve this purpose, the utility model adopts the following technical solutions:

[0018] The processing equipment comprises the above-mentioned cooling device and a reaction furnace, wherein the reaction furnace is connected to the cooling device, and the product in the reaction furnace can be transported to the cooling device for cooling.

[0019] The beneficial effect of the processing equipment provided by the utility model lies in that, by setting a cooling device, it is possible to reduce the temperature in the cooling chamber by cooling the inner wall of the water cooling module, thereby reducing the temperature of the product, and at the same time, it is possible to generate a circulating airflow in the cooling chamber through the fan module and the air guide component and make the airflow pass through the heat exchanger, so that the temperature in the cooling chamber is uniform, rapid and comprehensive, thereby reducing the time that the product as a whole or the product is in a high temperature state, especially avoiding the phenomenon of uneven oxide layer and damage of products such as copper sheets due to static cooling, thereby ensuring the quality of the product, improving the yield rate of subsequent product processing, and improving the efficiency of the entire production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a partial structural stereogram of the cooling device provided by the utility model from the first viewing angle;

[0021] Figure 2 It is a partial structural front view of the cooling device provided by the utility model;

[0022] Figure 3 It is a partial structural left view of the cooling device provided by the utility model;

[0023] Figure 4 is along Figure 3 The internal structure of the cooling device from the perspective of the middle BB;

[0024] Figure 5 It is a schematic diagram of the assembly of the material boat and the copper sheet in the cooling device;

[0025] Figure 6 yes Figure 4 A partial enlarged view of point C in the middle;

[0026] Figure 7 is an assembly stereogram of the spoiler installed on the first housing from a second viewing angle;

[0027] Figure 8 is an assembly stereogram of the spoiler installed on the first housing from a third viewing angle;

[0028] Fig. 9is an assembly stereogram of the spoiler installed on the first housing from a first viewing angle;

[0029] Fig.10 yes Fig. 9 A partial enlarged view of point D in the middle;

[0030] Fig.11 It is an explosion schematic diagram of the cooling device provided by the utility model;

[0031] Fig.12 is along Figure 2 The internal structure of the cooling device from a medium AA perspective;

[0032] Fig.13 It is a schematic diagram of the assembly of the heat exchange module in the utility model.

[0033] In the figure:

[0034] 001, material boat; 002, copper sheet;

[0035] 1. Water cooling module; 100. Water cooling channel; 101. Connecting port; 102. Boat inlet; 103. Channel water inlet; 104. Channel water outlet; 105. First area; 106. Ventilation gap; 107. Second area; 11. First shell; 12. Second shell; 13. First flow blocker; 14. Second flow blocker; 141. Flow limiting groove; 15. Supporting member;

[0036] 2. Fan module; 21. Fan driver; 22. Fan impeller; 23. Coupling; 24. Magnetic fluid; 25. Fan fixing plate;

[0037] 3. heat exchange module; 31. heat exchanger; 32. air guide assembly; 321. first air guide; 3211. first opening; 322. fixed hanging plate; 323. second air guide;

[0038] 4. Water inlet pipe; 41. Water inlet main pipe; 42. Water inlet branch pipe;

[0039] 5. Water outlet pipe; 51. Water outlet main pipe; 52. Water outlet branch pipe. DETAILED DESCRIPTION

[0040] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0041] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0043] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0044] The following is based on the attached Figure 1 To Attachment Fig.13 The cooling device and processing equipment provided by the utility model are introduced. For the convenience of description, in the utility model, the copper sheet 002 is taken as an example to introduce the cooling or processing process of the copper sheet 002 by the cooling device, but the cooling device can also be applied to silicon wafers or other products, and this utility model does not make specific limitations on this.

[0045] In the present invention, the cooling device mainly includes a water cooling module 1, a fan module 2 and a heat exchange module 3. Figures 1 to 3 As shown, the interior of the water cooling module 1 is defined to form a cooling chamber, which can accommodate the product to be cooled and a carrier for transporting the product. In addition, the inner wall of the water cooling module 1 is provided with a water cooling channel 100, in which a refrigerant, such as water, flows. Figure 2 , Figure 3As shown, the water-cooling channel 100 is connected to a water inlet pipe 4 and a water outlet pipe 5. Water can flow into the water-cooling channel 100 from the water inlet pipe 4, absorb the heat in the cooling chamber, thereby lowering the temperature of the product and the carrier, and then flow out of the water-cooling channel 100 from the water outlet pipe 5, thereby transferring the heat in the cooling chamber out of the cooling chamber to achieve a cooling effect.

[0046] like Figure 3 , Figure 4 As shown, the fan module 2 is arranged on the top of the water cooling module 1 and is capable of generating airflow in the cooling chamber. The heat exchange module 3 includes a heat exchanger 31 and an air guide component 32, and the air guide component 32 is used to limit the direction of the above-mentioned airflow so that the airflow circulates in the cooling chamber. Specifically in this embodiment, the airflow passes through the heat exchanger 31 during the circulation process, so that the heat carried by the airflow is absorbed and transferred to the outside of the water cooling module 1 through the heat exchanger 31.

[0047] Through the cooling device, it is possible to lower the temperature in the cooling chamber by cooling the inner wall of the water cooling module 1, thereby lowering the temperature of the product, and at the same time, it is possible to generate a circulating airflow in the cooling chamber through the fan module 2 and the air guide component 32 and make the airflow pass through the heat exchanger 31, so that the temperature in the cooling chamber is uniform, rapid and comprehensive. This reduces the time that the product as a whole or a part of the product is in a high temperature state, and especially avoids the phenomenon of uneven and damaged oxide layer of products such as copper sheet 002 due to static cooling, thereby ensuring the quality of the product, improving the yield rate of subsequent product processing, and improving the efficiency of the entire production process.

[0048] like Figure 1 , Figure 5 As shown, a connection port 101 is provided at one end of the length direction of the water cooling module 1, and the connection port 101 can be connected to the reactor, and a boat inlet 102 is provided on the side of the water cooling module 1. In this embodiment, a boat 001 is used as a carrier of the copper sheet 002, and the boat 001 can carry the copper sheet 002. The operator can put the boat 001 into the water cooling module 1 through the boat inlet 102, and move the boat 001 through the connection port 101 to transfer the copper sheet 002 between the reactor and the cooling device, that is, move it into the reactor for heating, and move it out of the reactor for cooling. The inner wall of the water cooling module 1 is provided with a plurality of supporting members 15 for indirectly supporting the boat 001, so as to facilitate the transfer of the boat 001. Exemplarily, the supporting member 15 can support a transport mechanism (such as a linear module) from bottom to top, and the transport mechanism can drive the paddle and the boat support installed on the paddle to move, so that the material boat 001 and the copper sheet 002 placed on the boat support are sent from the cooling device through the connecting port 101 into the reaction furnace for heating through the paddle, and after the heating is completed, the material boat 001 and the copper sheet 002 can be retrieved through the connecting port 101 to the cooling device for cooling.

[0049] like Figure 6 to Figure 7 As shown, in this embodiment, the top wall, bottom wall and left and right side walls of the water cooling module 1 are each provided with at least one water cooling channel 100 to achieve a comprehensive and uniform cooling effect on the cooling chamber, alleviate the phenomenon of uneven cooling in various areas of the copper sheet 002, and thereby improve the uniformity and integrity of the oxide layer on the surface of the copper sheet 002 during the cooling process.

[0050] Furthermore, if Figure 7 As shown, the water cooling module 1 is provided with a plurality of flow channel water inlets 103 and a plurality of flow channel water outlets 104, and the plurality of flow channel water inlets 103 and the plurality of flow channel water outlets 104 are respectively connected to different water cooling channels 100 located on the top wall, the bottom wall and the left and right side walls of the water cooling module 1. The water inlet pipe 4 has a water inlet main pipe 41 and a plurality of water inlet branches 42, and the water inlet main pipe 41 and the plurality of water inlet branches 42 are connected and arranged, and the water outlet end of each water inlet branch 42 is correspondingly connected to a flow channel water inlet 103. The water outlet pipe 5 has a water outlet main pipe 51 and a plurality of water outlet branches 52, and the water outlet main pipe 51 and the plurality of water outlet branches 52 are connected and arranged, and the water inlet end of each water outlet branch 52 is correspondingly connected to a flow channel water outlet 104. The refrigerant can be evenly distributed into multiple water inlet branches 42 through the water inlet main pipe 41, and correspondingly enter the water cooling flow channel 100 located on the top wall, bottom wall and side wall of the water cooling module 1 through multiple flow channel water inlets 103, and then flow into the corresponding multiple water outlet branches 52 from the multiple flow channel water outlets 104, and finally converge into the water outlet main pipe 51.

[0051] By providing a plurality of channel water inlets 103 and a plurality of channel water outlets 104, different water-cooling channels 100 have similar or equivalent cooling capabilities, so that the top wall, bottom wall and left and right side walls of the water-cooling module 1 can approach the same temperature during the cooling process, thereby achieving a uniform and comprehensive cooling effect on the product to be cooled, further avoiding the phenomenon of a slow local temperature reduction rate of the product, thereby ensuring the quality of the product surface.

[0052] Preferably, continue to refer to Figures 6 to 8 As shown, in this embodiment, the water cooling module 1 includes a first shell 11 and a second shell 12, the first shell 11 defines the above-mentioned cooling chamber, the first shell 11 is inserted into the second shell 12, and a water cooling chamber is defined between the first shell 11 and the second shell 12, and the water cooling channel 100 is formed in the water cooling chamber. Compared with the method of directly setting a plurality of water pipes in the first shell 11 to form the water cooling channel 100, forming the water cooling channel 100 through the water cooling chamber between the first shell 11 and the second shell 12 can increase the flow rate of the refrigerant under the same flow rate, thereby greatly enhancing the cooling capacity of the cooling device.

[0053] Further preferably, in this embodiment, a plurality of flow-blocking members are provided between the first shell 11 and the second shell 12, and the flow-blocking members can limit the flow direction or flow speed of the refrigerant to extend the flow time of the refrigerant in the water-cooling channel 100, so that the refrigerant can more fully absorb the heat in the cooling chamber. Figures 9 and 10 As shown, the baffles include a first baffle 13 and a second baffle 14. A plurality of first baffles 13 are arranged on the top and side surfaces of the first shell 11, arranged along the length direction of the water-cooling module 1, and arranged in an interlaced manner along the width direction or thickness direction of the water-cooling module 1, so as to form a curved S-shaped flow channel in the water-cooling cavity, thereby limiting the flow direction and flow speed of the refrigerant at the same time. A plurality of second baffles 14 are arranged on the side surfaces of the first shell 11, arranged along the length direction of the water-cooling module 1, and extending from the top to the bottom of the side surfaces of the first shell 11 along the thickness direction of the water-cooling module 1. The second baffle 14 is provided with a plurality of flow limiting grooves 141, and a limited flow opening is formed between the flow limiting grooves 141 and the side surfaces of the first shell 11. Water will pass through a plurality of flow limiting openings during the flow of the water-cooling channel 100. The flow limiting openings can reduce the flow speed of the water, thereby further extending the time required for the water to flow in the water-cooling channel 100, so that the water can more fully absorb the heat in the cooling cavity.

[0054] like Figure 11 to Figure 12 As shown, in this embodiment, the fan module 2 includes a fan fixing plate 25, a fan driver 21 and a fan impeller 22, the fan impeller 22 is arranged in the cooling chamber, the fan driver 21 is fixedly arranged on the outside of the water cooling module 1 through the fan fixing plate 25, the fan driver 21 and the fan impeller 22 are transmission-connected, the fan driver 21 can drive the fan impeller 22 to rotate, so as to generate airflow in the cooling chamber, and can prevent the fan driver 21 from being damaged by high temperature. Preferably, the fan module 2 also includes a coupling 23 and a magnetic fluid 24, and the fan driver 21 and the fan impeller 22 are transmission-connected with a coupling 23 and a magnetic fluid 24, so as to form a sealed transmission connection between the fan driver 21 and the fan impeller 22, so as to prevent the cooling chamber from leaking through the position where the fan module 2 passes through the water cooling module 1, and reduce friction loss, thereby extending the service life of the fan module 2 and the entire cooling device.

[0055] like Figures 11 to 13 As shown, the air guide assembly 32 includes a first air guide member 321 and a fixed hanging plate 322. The first air guide member 321 is installed on the inner wall of the water cooling module 1 through the fixed hanging plate 322, and is arranged between the fan impeller 22 and the heat exchanger 31. In this embodiment, the heat exchanger 31 adopts a plate-type water-cooled exchanger, which is connected to the water inlet pipe 4 and the water outlet pipe 5. Fig.12As shown by the dotted arrow in , the airflow can enter the plate-type water-cooled exchanger from the air inlet located on one side of the plate-type water-cooled exchanger in the thickness direction, and flow out of the plate-type water-cooled exchanger from the air outlet located on the other side of the thickness direction. The fan impeller 22 adopts a centrifugal impeller, and the airflow can enter the centrifugal impeller from the air inlet located in the axial direction of the centrifugal impeller, and flow out of the centrifugal impeller along the radial direction of the centrifugal impeller. The first air guide 321 is funnel-shaped, having a smaller first opening 3211 and a larger second opening. The first opening 3211 is used to connect the air inlet of the fan impeller 22, and the second opening is connected to the air outlet of the plate-type water-cooled exchanger, thereby optimizing the air guiding effect, so that the airflow can flow into the centrifugal fan evenly, avoiding airflow turbulence, and the airflow generated from the centrifugal impeller can all pass through the plate-type water-cooled exchanger, avoiding the phenomenon that the airflow only passes through the plate-type water-cooled exchanger locally, thereby improving the efficiency and uniformity of heat exchange and cooling. Of course, in some other embodiments, the heat exchanger 31 may also adopt other various types of structures such as a coil-type fin heat exchanger, and the present invention does not make specific limitations on this.

[0056] Continue to refer to Fig.12 , Fig.13 As shown, in this embodiment, the air guide assembly 32 further includes a second air guide 323, the second air guide 323 is fixedly mounted on the heat exchanger 31, and the second air guide 323 is spaced apart from the inner wall of the water cooling module 1 and a ventilation gap 106 is formed. The first area 105 and the second area 107 are directly connected via the ventilation gap 106, and under the drive of the fan module 2, the airflow circulates sequentially between the first area 105, the ventilation gap 106, the second area 107, the heat exchanger 31 and the fan impeller 22, thereby improving the cooling effect and cooling uniformity in the cooling chamber.

[0057] Preferably, the second air guide 323 is an air guide plate, which is arranged at an angle, and the width of the ventilation gap 106 gradually decreases along the flow direction of the airflow. This inclined arrangement can prevent the airflow in the second area 107 from flowing back to the first area 105, thereby ensuring the sequential circulation of the airflow and improving the cooling effect and cooling uniformity.

[0058] Optionally, in some embodiments, other types of fan impellers 22 may be used to allow the airflow to circulate sequentially between the first area 105, the fan impeller 22, the heat exchanger 31, the second area 107 and the ventilation gap 106. This can also achieve a uniform, rapid and comprehensive cooling effect in the cooling chamber, which is also within the scope of protection of the present utility model.

[0059] Of course, in some other embodiments, the above-mentioned ventilation gap 106 can also be formed directly between the inner wall of the water-cooling tube and the heat exchanger 31, and the above-mentioned airflow circulating sequentially between the first area 105, the ventilation gap 106, the second area 107, the heat exchanger 31 and the fan impeller 22 can also be realized, or the above-mentioned airflow circulating sequentially between the first area 105, the fan impeller 22, the heat exchanger 31, the second area 107 and the ventilation gap 106 can be realized, which also falls within the scope of protection of the present utility model.

[0060] Optionally, in this embodiment, if Fig.11 As shown, the cooling device includes a water cooling module 1, and the water cooling module 1 is fixedly connected to two fan modules 2 and two heat exchange modules 3. The two fan modules 2 are arranged along the length direction of the water cooling module 1, and the two heat exchange modules 3 are also arranged along the length direction of the water cooling module 1. The first air guide 321 of each fan module 2 and a heat exchange module 3 are connected and arranged one by one, so as to meet the synchronous cooling requirements of multiple copper sheets 002 on the longer material boat 001. It can be understood that according to the actual cooling needs, in some embodiments, two or more water cooling modules 1 can be set in the cooling device, and the number of fan modules 2 and heat exchange modules 3 can be reasonably arranged for each water cooling module 1.

[0061] It should be noted that when the first air guide 321 has a first opening 3211 and two second openings, one fan module 2 can also be arranged corresponding to two heat exchange modules 3, or when the first air guide 321 has two first openings 3211 and one second opening, two fan modules 2 and one heat exchange module 3 can also be arranged correspondingly. Therefore, the utility model does not make specific limitations on the correspondence between the fan module 2 and the heat exchange module 3, as long as the cooling requirements can be met.

[0062] The utility model also provides a processing device, which includes the above-mentioned cooling device and a reaction furnace. The reaction furnace is connected to the cooling device and can be used to process products. The products in the reaction furnace can be transported to the cooling device for cooling. The cooling device can reduce the temperature in the cooling chamber, thereby reducing the temperature of the product. At the same time, it can also generate a circulating airflow in the cooling chamber through the fan module 2 and the air guide component 32 and make the airflow pass through the heat exchanger 31, so that the temperature in the cooling chamber is uniform, fast and comprehensive. Reduce the time that the product as a whole or the product is in a high temperature state, especially avoid the phenomenon of uneven oxide layer and damage caused by static cooling of products such as copper sheet 002, thereby ensuring the quality of the product, improving the yield rate of subsequent product processing, and improving the efficiency of the entire production process.

[0063] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A cooling device, characterized in that: include: A water cooling module (1), wherein a cooling chamber is defined in the water cooling module (1), and an inner wall of the water cooling module (1) is provided with a water cooling channel (100), wherein a refrigerant flows in the water cooling channel (100), and the refrigerant is used to absorb and transfer heat in the cooling chamber; A fan module (2), the fan module (2) being used to generate an airflow in the cooling chamber; A heat exchange module (3), the heat exchange module (3) is fixedly arranged on the water cooling module (1), the heat exchange module (3) comprises a heat exchanger (31) and an air guide component (32), the air guide component (32) is used to limit the direction of the airflow so that the airflow circulates in the cooling chamber and passes through the heat exchanger (31) during the circulation process, and the heat exchanger (31) is used to absorb and transfer the heat carried by the airflow.

2. The cooling device according to claim 1, characterized in that: The top wall, bottom wall and side wall of the water cooling module (1) are each provided with at least one water cooling channel (100), and the water cooling module (1) is provided with a plurality of channel water inlets (103) and a plurality of channel water outlets (104), the plurality of channel water inlets (103) and the plurality of channel water outlets (104) being connected to the water cooling channel (100), the refrigerant being able to enter the water cooling channel (100) located on the top wall, bottom wall and side wall of the water cooling module (1) through the plurality of channel water inlets (103), and flow out from the plurality of channel water outlets (104).

3. The cooling device according to claim 1, characterized in that: The water cooling module (1) comprises a first shell (11) and a second shell (12); the cooling chamber is defined in the first shell (11); the first shell (11) is inserted into the second shell (12); and a water cooling chamber is defined between the first shell (11) and the second shell (12); A plurality of flow-blocking components are also provided between the first shell (11) and the second shell (12), and the flow-blocking components are used to change the flow direction and / or flow speed of the refrigerant.

4. The cooling device according to claim 1, characterized in that: The fan module (2) comprises a fan driver (21) and a fan impeller (22); the fan impeller (22) is arranged in the cooling chamber; the fan driver (21) is arranged outside the water cooling module (1); the fan driver (21) and the fan impeller (22) are transmission-connected; the fan driver (21) can drive the fan impeller (22) to rotate, so as to generate the airflow in the cooling chamber.

5. The cooling device according to claim 4, characterized in that: The air guide assembly (32) comprises a first air guide member (321), the first air guide member (321) being arranged between the fan impeller (22) and the heat exchanger (31), the first air guide member (321) having a first opening (3211) and a second opening, and, The first opening (3211) is connected to the air outlet of the fan impeller (22), the second opening is connected to the air inlet of the heat exchanger (31), and the airflow flows from the fan impeller (22) into the heat exchanger (31) through the first air guide (321); or, The first opening (3211) is connected to the air inlet of the fan impeller (22), and the second opening is connected to the air outlet of the heat exchanger (31), and the airflow flows from the heat exchanger (31) into the fan impeller (22) through the first air guide (321).

6. The cooling device according to claim 5, characterized in that: One side of the heat exchanger (31) is an air inlet, and the other side is an air outlet, and the heat exchanger (31) divides the cooling chamber into a first area (105) and a second area (107), the fan impeller (22) is located in the first area (105), and the second area (107) is used to place products to be cooled, and the airflow circulates between the first area (105) and the second area (107).

7. The cooling device according to claim 6, characterized in that: The heat exchanger (31) and the inner wall of the water cooling module (1) are spaced apart to form a ventilation gap (106); the first area (105) and the second area (107) are directly connected via the ventilation gap (106); The airflow is arranged to circulate sequentially between the first area (105), the fan impeller (22), the heat exchanger (31), the second area (107) and the ventilation gap (106); or, The airflow circulates sequentially between the first area (105), the ventilation gap (106), the second area (107), the heat exchanger (31) and the fan impeller (22).

8. The cooling device according to claim 6, characterized in that: The air guide component (32) further comprises a second air guide member (323), the second air guide member (323) being fixedly mounted on the heat exchanger (31), and the second air guide member (323) being spaced apart from the inner wall of the water cooling module (1) to form a ventilation gap (106), the first area (105) and the second area (107) being directly connected via the ventilation gap (106), and the air guide component (32) being such that: The airflow is arranged to circulate sequentially between the first area (105), the fan impeller (22), the heat exchanger (31), the second area (107) and the ventilation gap (106); or, The airflow circulates sequentially between the first area (105), the ventilation gap (106), the second area (107), the heat exchanger (31) and the fan impeller (22).

9. The cooling device according to any one of claims 5 to 8, characterized in that: The cooling device comprises at least one water cooling module (1), and at least one water cooling module (1) is fixedly connected to at least two fan modules (2) and at least two heat exchange modules (3), at least two fan modules (2) are arranged in an array, at least two heat exchange modules (3) are arranged in an array, and each fan module (2) and the first air guide member (321) of one heat exchange module (3) are connected and arranged in a one-to-one correspondence.

10. Processing equipment, characterized in that, It comprises the cooling device and the reaction furnace according to any one of claims 1 to 9, the reaction furnace is docked with the cooling device, and the product in the reaction furnace can be transported to the cooling device for cooling.