Semiconductor drying equipment with built-in rotating assembly

Abstract

The utility model relates to the field of semiconductor drying, in particular to semiconductor drying equipment with a built-in rotating assembly, which comprises a box body and a box cover hinged on the outer wall of the box body, fixing structures are arranged on the inner walls of the two sides of the box body, and a drying structure is arranged at one end of the inner wall of the bottom of the box body; the fixing structure comprises guide rings installed on the inner walls of the two sides of the box body, main shafts rotationally connected to the centers of the guide rings, and first fixing frames welded to the ends, close to each other, of the main shafts. According to the utility model, the semiconductors are sequentially adsorbed on the suckers in the fixed frame I and are fixed by the lock catches, and the suckers between the fixed frame I and the fixed frame II extrude each other to adsorb and fix the semiconductors, so that the semiconductors are convenient to fix and are prevented from being damaged; the heated gas is sprayed out from the conveying pipe and the spray head after passing through the valve under the action of pressure, and the sprayed gas blows and dries the rotating semiconductor, so that the drying efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor drying, in particular to semiconductor drying equipment with a built-in rotating component. Background Art

[0002] Matter exists in various forms, such as solid, liquid, gas, plasma, etc. We usually call materials with poor conductivity, such as coal, artificial crystal, amber, ceramics, etc., insulators. Metals with good conductivity, such as gold, silver, copper, iron, tin, aluminum, etc., are called conductors. Materials between conductors and insulators can be simply called semiconductors;

[0003] Drying equipment is required in the production and manufacturing process of semiconductors. Some drying equipment is direct drying, and the semiconductor is locally heated for a long time, resulting in uneven drying of the semiconductor, affecting the yield rate of the semiconductor. Utility Model Content

[0004] The utility model aims to solve the above-mentioned problems and shortcomings and proposes a semiconductor drying device with a built-in rotating component: a heating wire heats the gas injected into the gas tank, and the heated gas is ejected from the delivery pipe and the nozzle after passing through the valve under pressure, and the ejected gas blows and dries the rotating semiconductor, thereby improving the drying efficiency, and the servo motor starts to solve the problem of uneven drying of semiconductors during drying.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A semiconductor drying device with a built-in rotating component comprises a box body and a box cover hinged on the outer wall of the box body, wherein the inner walls on both sides of the box body are installed with a fixed structure, and one end of the bottom inner wall of the box body is installed with a drying structure; the fixed structure comprises a guide ring installed on the inner walls on both sides of the box body, a main shaft rotatably connected at the center of the guide ring, a fixed frame 1 welded to one end of the main shaft close to each other, a fixed frame 2 hinged at one end of the top outer wall of the fixed frame 1, and a cross bar equidistantly installed on the outer walls of the fixed frame 1 and the fixed frame 2.

[0007] Preferably, suction cups distributed at equal distances are installed on the outer wall of one side where the cross bars are close to each other, and matching lock buckles are installed at the center of the outer wall of one side of the fixing frame 1 and the fixing frame 2.

[0008] Preferably, a sliding groove is provided on an outer wall of one side of the guide ring, and auxiliary rods are installed on the outer walls of both ends of the fixing frame at the sliding groove, and one end of the auxiliary rod is slidably connected to the sliding groove.

[0009] Preferably, a through hole is opened on one side outer wall of the box body at the main shaft, and a servo motor is installed on the outer wall of the box body at the through hole, and the output shaft of the servo motor is connected to one end of the main shaft.

[0010] Preferably, the drying structure includes a gas tank and an air pump installed on the bottom inner wall of the box, an air inlet pipe connected to the air pump input end, a delivery pipe connected to the outer wall of one side of the gas tank, nozzles installed equidistantly on the top outer wall of the delivery pipe, and a heating wire installed on the inner wall of the gas tank.

[0011] Preferably, the output end of the air pump is connected to the gas tank, and valves are installed on the delivery pipe and the output end of the air pump, a temperature sensor and a pressure sensor are installed in the gas tank, and a filter is installed in the air inlet pipe.

[0012] Preferably, the heating wire, valve, air pump and servo motor are connected to a switch via wires, and the switch is connected to a power source via wires.

[0013] The beneficial effects of the utility model are:

[0014] 1. The semiconductors are sequentially adsorbed on the suction cups in the fixing frame 1, and the locks are used to fix them. At this time, the suction cups between the fixing frame 1 and the fixing frame 2 squeeze each other to adsorb and fix the semiconductors, which facilitates fixation while avoiding damage to the semiconductors.

[0015] 2. The heating wire heats the gas rushing into the gas tank. The heated gas passes through the valve under pressure and is ejected from the delivery pipe and nozzle. The ejected gas blows and dries the rotating semiconductor, thereby improving the drying efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of a semiconductor drying device with a built-in rotating component proposed by the utility model;

[0017] Figure 2 This is a structural schematic diagram of a fixed frame of a semiconductor drying device with a built-in rotating component proposed by the utility model;

[0018] Figure 3 This is a schematic diagram of the internal structure of a gas tank of a semiconductor drying device with a built-in rotating component proposed by the utility model;

[0019] Figure 4 The utility model discloses a schematic diagram of the internal structure of a box of a semiconductor drying device with a built-in rotating component.

[0020] In the figure: 1 box body, 2 fixed structure, 3 drying structure, 4 box cover, 5 guide ring, 6 main shaft, 7 fixed frame 1, 8 fixed frame 2, 9 cross bar, 10 suction cup, 11 lock, 12 sliding groove, 13 auxiliary rod, 14 servo motor, 15 gas tank, 16 air pump, 17 heating wire, 18 delivery pipe, 19 nozzle, 20 air inlet pipe. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0022] Embodiment 1:

[0023] Reference Figure 1-2 and Figure 3 A semiconductor drying device with a built-in rotating assembly comprises a box body 1 and a box cover 4 hinged to the outer wall of the box body 1, a fixing structure 2 is installed on the inner walls of both sides of the box body 1, and a drying structure 3 is installed on one end of the bottom inner wall of the box body 1;

[0024] The fixing structure 2 includes a guide ring 5 installed on the inner walls of both sides of the box body 1, a main shaft 6 rotatably connected to the center of the guide ring 5, a fixing frame 7 welded to one end of the main shaft 6 close to each other, a fixing frame 8 hinged to one end of the top outer wall of the fixing frame 7, and a cross bar 9 installed at equal distances on the outer walls of the fixing frame 7 and the fixing frame 8. The suction cups 10 between the fixing frame 7 and the fixing frame 8 squeeze each other to adsorb and fix the semiconductor, which is convenient for fixing while avoiding damage to the semiconductor;

[0025] The outer wall of one side of the cross bar 9 close to each other is installed with suction cups 10 distributed at equal distances, and the center of the outer wall of one side of the fixing frame 7 and the fixing frame 8 is installed with a matching lock 11, the lock 11 fixes the fixing frame 7 and the fixing frame 8, and the fixing frame 7 and the fixing frame 8 adsorb and clamp the semiconductor through the suction cups 10 on the cross bar 9, which is convenient for fixing the semiconductor, avoiding damage, and maintaining the fixing stability;

[0026] A sliding groove 12 is provided on the outer wall of one side of the guide ring 5, and auxiliary rods 13 are installed on the outer walls of both ends of the fixed frame 7 at the sliding groove 12. One end of the auxiliary rod 13 is slidably connected in the sliding groove 12. The output shaft of the servo motor 14 is connected to the main shaft 6, and the fixed frame 1 7 and the fixed frame 2 8 are driven to rotate through the main shaft 6. The auxiliary rod 13 slides in the guide ring 5 to maintain the stability of the rotation, facilitate reversal, and improve the drying efficiency.

[0027] A through hole is opened on the outer wall of one side of the box body 1 at the main shaft 6, and a servo motor 14 is installed on the outer wall of the box body 1 at the through hole. The output shaft of the servo motor 14 is connected to one end of the main shaft 6. After the servo motor 14 is started, the main shaft 6 drives the fixed frame 1 7 and the fixed frame 2 8 to rotate, and the air flow sprayed by the nozzle 19 is coordinated to facilitate drying of the semiconductor, facilitate use, and improve drying efficiency.

[0028] Embodiment 2:

[0029] Reference Figure 3-4The drying structure 3 includes a gas tank 15 and an air pump 16 installed on the inner wall of the bottom of the box body 1, an air inlet pipe 20 connected to the input end of the air pump 16, a delivery pipe 18 connected to the outer wall of one side of the gas tank 15, a nozzle 19 installed at an equal distance on the outer wall of the top of the delivery pipe 18, and a heating wire 17 installed on the inner wall of the gas tank 15. The heated gas passes through the valve under pressure and is ejected from the delivery pipe 18 and the nozzle 19. The ejected gas blows and dries the rotating semiconductor to improve the drying efficiency.

[0030] The output end of the air pump 16 is connected to the gas tank 15, and the delivery pipe 18 and the output end of the air pump 16 are both installed with valves. The gas tank 15 is installed with a temperature sensor and a pressure sensor, and the air inlet pipe 20 is installed with a filter. The filter in the air inlet pipe 20 filters the gas drawn in by the air pump 16, which is convenient for use and prevents impurities from entering the interior. The temperature sensor detects the temperature inside the gas tank 15, and the pressure sensor monitors the principle of the gas tank 15, which is convenient for timely opening of the valve, convenient for controlling the temperature and pressure, and convenient for exhaust and drying;

[0031] The heating wire 17, the valve, the air pump 16 and the servo motor 14 are connected to the switch through wires, and the switch is connected to the power supply through wires.

[0032] Working principle: When in use, open the box cover 4, unlock the lock 11 between the fixing frame 1 7 and the fixing frame 2 8, open the fixing frame 2 8, and adsorb the semiconductors to be dried on the suction cups 10 in the fixing frame 1 7 in turn. Finally, merge the fixing frame 2 8 into the fixing frame 1 7, and fix it with the lock 11. At this time, the suction cups 10 between the fixing frame 1 7 and the fixing frame 2 8 squeeze each other to adsorb and fix the semiconductor, which is convenient for fixing and avoids damage to the semiconductor. Start the servo motor 14, the heating wire 17 and the air pump 16, and the servo motor 14, the heating wire 17 and the air pump 16 are turned on. The output shaft of the servo motor 14 is connected to the main shaft 6, which drives the fixed frame 1 7 and the fixed frame 2 8 to rotate. The auxiliary rod 13 slides in the guide ring 5 to maintain the stability of rotation, facilitate reversal, and improve the drying efficiency. The air pump 16 inflates the interior of the gas tank 15, and the heating wire 17 heats the gas rushing into the gas tank 15. The heated gas passes through the valve under pressure and is ejected from the delivery pipe 18 and the nozzle 19. The ejected gas blows and dries the rotating semiconductor, thereby improving the drying efficiency.

[0033] The exemplary implementation of the utility model is described in detail with reference to the examples, however, it is understood by those skilled in the art that, without departing from the concept of the utility model, various modifications and alterations may be made to the above-mentioned specific embodiments, and various combinations of the various technical features and structures proposed in the utility model may be made without exceeding the scope of protection of the utility model, which is determined by the attached claims. The foregoing description of the specific exemplary implementation of the utility model is not intended to limit the utility model to the precise form disclosed, and it is obvious that many changes and variations can be made according to the above teachings. The purpose of selecting and describing the exemplary embodiments is to explain the specific principles of the utility model and its practical application, so that those skilled in the art can realize and utilize various different exemplary implementations of the utility model and various different choices and changes. The scope of the utility model is intended to be defined by the claims and their equivalents.

Claims

1. A semiconductor drying device with a built-in rotating assembly, comprising a box body (1) and a box cover (4) hinged to the outer wall of the box body (1), characterized in that: The inner walls on both sides of the box body (1) are installed with a fixing structure (2), and one end of the bottom inner wall of the box body (1) is installed with a drying structure (3); The fixed structure (2) comprises guide rings (5) mounted on the inner walls of both sides of the box body (1), a main shaft (6) rotatably connected to the center of the guide ring (5), a fixed frame (7) welded to one end of the main shaft (6) close to each other, a fixed frame (8) hinged to one end of the top outer wall of the fixed frame (7), and a cross bar (9) mounted at equal distances on the outer walls of the fixed frame (7) and the fixed frame (8).

2. The semiconductor drying equipment with a built-in rotating component according to claim 1, characterized in that: The outer wall of one side of the crossbar (9) close to each other is installed with suction cups (10) distributed at equal distances, and a matching lock (11) is installed at the center of the outer wall of one side of the fixing frame (7) and the fixing frame (8).

3. The semiconductor drying equipment with a built-in rotating component according to claim 1, characterized in that: A sliding groove (12) is provided on the outer wall of one side of the guide ring (5), and auxiliary rods (13) are installed on the outer walls of both ends of the fixed frame (7) at the sliding groove (12), and one end of the auxiliary rod (13) is slidably connected in the sliding groove (12).

4. The semiconductor drying equipment with a built-in rotating component according to claim 1, characterized in that: A through hole is provided on one side outer wall of the box body (1) at the main shaft (6), and a servo motor (14) is installed on the outer wall of the box body (1) at the through hole, and an output shaft of the servo motor (14) is connected to one end of the main shaft (6).

5. The semiconductor drying equipment with a built-in rotating component according to claim 1, characterized in that: The drying structure (3) comprises an air tank (15) and an air pump (16) mounted on the inner wall of the bottom of the box (1), an air inlet pipe (20) connected to the input end of the air pump (16), a delivery pipe (18) connected to the outer wall of one side of the air tank (15), a nozzle (19) mounted at equal distances on the outer wall of the top of the delivery pipe (18), and a heating wire (17) mounted on the inner wall of the air tank (15).

6. The semiconductor drying equipment with a built-in rotating component according to claim 5, characterized in that: The output end of the air pump (16) is connected to the air tank (15), and valves are installed on the delivery pipe (18) and the output end of the air pump (16). A temperature sensor and a pressure sensor are installed in the air tank (15), and a filter is installed in the air inlet pipe (20).

7. The semiconductor drying equipment with a built-in rotating component according to claim 5, characterized in that: The heating wire (17), valve, air pump (16) and servo motor (14) are connected to a switch via a wire, and the switch is connected to a power source via a wire.

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