Temperature control device and photoetching equipment

Abstract

The utility model provides a temperature control device and photoetching equipment. The temperature control device comprises a first assembly and a second assembly, the first assembly comprises a heat exchange mechanism and an adsorption mechanism; the adsorption mechanism comprises a plurality of suction cups, all the suction cups are located on the same side of the heat exchange mechanism, and all the suction cups are arranged in an array mode; the second assembly comprises a driving part, and the driving part is connected with the adsorption mechanism and used for driving the adsorption mechanism to move in the preset direction relative to the heat exchange mechanism so that the suction cup can be close to or away from the heat exchange mechanism. The suction cup of the suction mechanism is used for sucking the substrate, the driving part is used for driving the suction cup to drive the substrate to move so that the substrate can be close to the heat exchange mechanism, the heat exchange mechanism can be used for conducting heat treatment on the substrate, and the temperature of the substrate can meet the requirement of follow-up operation.

Description

Technical Field

[0001] The utility model belongs to the technical field of photolithography, and in particular relates to a temperature control device and photolithography equipment. Background Art

[0002] When a photolithography device is used to perform certain predetermined operations on a substrate, the substrate is required to reach a predetermined temperature. In other words, the substrate needs to be pre-treated. Therefore, a temperature control device needs to be provided to implement the pre-treatment operation of the substrate. Utility Model Content

[0003] The utility model aims to provide a temperature control device and a photolithography device, aiming to realize the pre-processing operation of a substrate.

[0004] To achieve the above-mentioned purpose, the utility model provides a temperature control device, comprising a first component and a second component; wherein:

[0005] The first component includes a heat exchange mechanism and an adsorption mechanism; the adsorption mechanism includes a plurality of suction cups, all of which are located on the same side of the heat exchange mechanism, and all of which are arranged in an array;

[0006] The second component includes a driving part, which is connected to the adsorption mechanism and is used to drive the adsorption mechanism to move in a predetermined direction relative to the heat exchange mechanism so that the suction cup approaches or moves away from the heat exchange mechanism.

[0007] Optionally, the number of the first components is two, the heat exchange mechanisms of the two first components are symmetrically arranged about a predetermined plane, the adsorption mechanisms of the two first components are symmetrically arranged about the predetermined plane, and the adsorption mechanisms of the two first components are both connected to the driving part; the predetermined plane is perpendicular to the predetermined direction;

[0008] The temperature control device is configured such that when the driving unit drives the suction cup of one of the first components to move in a direction close to the corresponding heat exchange mechanism, the driving unit also drives the suction cup of another first component to move in a direction away from the corresponding heat exchange mechanism.

[0009] Optionally, the number of the first components is at least two, and at least two of the first components are arranged at intervals along the predetermined direction; the number of the driving parts is at least two, and at least two of the driving parts correspond one-to-one to at least two of the first components, and each of the driving parts is connected to the adsorption mechanism of the corresponding first component and is used to drive the adsorption mechanism of the corresponding first component to move relative to the heat exchange mechanism along the predetermined direction.

[0010] Optionally, the second component also includes a guide member, which extends along the predetermined direction; the driving part includes a driving part body and a coupling member, the coupling member is movably connected to the guide member, the coupling member is connected to the driving part body, and the driving part body can drive the coupling member to move along the guide member in the predetermined direction; the adsorption mechanism is connected to the coupling member.

[0011] Optionally, the heat exchange mechanism includes a heat exchange plate and a contact block; a flow channel for heat exchange medium to flow is opened in the heat exchange plate; the contact block is arranged on the heat exchange plate and is located on the same side of the heat exchange plate as the suction cup.

[0012] Optionally, the first component further comprises a temperature monitoring mechanism, and the temperature monitoring mechanism is used to monitor the temperature of the substrate adsorbed on the corresponding adsorption mechanism.

[0013] Optionally, the temperature monitoring mechanism comprises a first temperature monitoring element and a second temperature monitoring element, and the first temperature monitoring element and the second temperature monitoring element are respectively arranged on opposite sides of the corresponding suction cup in the predetermined direction.

[0014] Optionally, the plurality of suction cups of the same adsorption mechanism are arranged in an M×N array, where M and N are both positive integers greater than 1.

[0015] Optionally, the temperature control device also includes a controller and a negative pressure generator, the negative pressure generator is connected to the adsorption mechanism, the controller is communicatively connected to the negative pressure generator, and is configured to control the operation of the negative pressure generator so that the multiple suction cups of the same adsorption mechanism form negative pressure in the predetermined order.

[0016] Optionally, the driving part is at least partially located on a side of the heat exchange mechanism away from the corresponding suction cup; the heat exchange mechanism is provided with a plurality of avoidance holes extending through the predetermined direction;

[0017] The adsorption mechanism further includes a support seat and a plurality of coupling tubes; the support seat is arranged on a side of the corresponding heat exchange mechanism away from the suction cup and connected to the driving part; the coupling tube extends along the predetermined direction, one end of the coupling tube is connected to the support seat, and the other end passes through the corresponding avoidance hole and extends to a side of the heat exchange mechanism away from the support seat and connected to the corresponding suction cup; or,

[0018] The adsorption mechanism also includes a support seat, a plurality of coupling tubes and a plurality of elastic members; the support seat is arranged on a side of the corresponding heat exchange mechanism away from the suction cup, and is connected to the driving part; a coupling hole extending through along the predetermined direction is provided on the support seat; the coupling tube extends along the predetermined direction, the coupling tube is partially penetrated at the coupling hole, and one end of the coupling tube passes through the avoidance hole and extends to a side of the heat exchange mechanism away from the support seat, and is connected to a corresponding one of the suction cups; the elastic member is provided on the outer periphery of each of the coupling tubes, and the two ends of the elastic member are respectively abutted against the support seat and the corresponding suction cup.

[0019] To achieve the above-mentioned purpose, the utility model also provides a lithography device, including a robot, a substrate storage unit, a workpiece table and the temperature control device as described above; the robot is configured to allow the substrate to flow between the substrate storage unit, the workpiece table and the temperature control device.

[0020] Compared with the prior art, the temperature control device and photolithography equipment of the utility model have the following advantages:

[0021] The aforementioned temperature control device includes a first component and a second component; the first component includes a heat exchange mechanism and an adsorption mechanism; the adsorption mechanism includes a plurality of suction cups, all of which are located on the same side of the heat exchange mechanism, and all of which are arranged in an array; the second component includes a driving unit, which is connected to the adsorption mechanism and is used to drive the adsorption mechanism to move relative to the heat exchange mechanism along the predetermined direction so that the suction cup approaches or moves away from the heat exchange mechanism. By using the suction cup of the adsorption mechanism to adsorb the substrate, and using the driving unit to drive the suction cup to move the substrate so that the substrate approaches the heat exchange mechanism, the heat exchange mechanism can be used to heat treat the substrate so that the temperature of the substrate reaches the requirements of subsequent operations.

[0022] Furthermore, the temperature control device includes two first components, the heat exchange mechanisms of the two first components are symmetrically arranged about a predetermined plane, the adsorption mechanisms of the two first components are also symmetrically arranged about the predetermined plane, and the adsorption mechanisms of the two first components are both connected to the driving unit; the predetermined plane is perpendicular to the predetermined direction; when the driving unit drives the suction cup of one first component to move closer to the corresponding heat exchange mechanism, the driving unit also drives the suction cup of the other first component to move away from the corresponding heat exchange mechanism. In this way, the temperature control mechanism can perform heat treatment on the two substrates at the same time, thereby improving the substrate treatment efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are used to better understand the present invention and do not constitute an improper limitation on the present invention.

[0024] Figure 1 is a schematic structural diagram of a temperature control device provided by the utility model according to an embodiment, and shows a first component;

[0025] Figure 2 is a partial structural schematic diagram of a temperature control device provided by the utility model according to an embodiment, Figure 2 and Figure 1 The observation direction is different;

[0026] Figure 3 1 is a result schematic diagram of a temperature control device provided by the utility model according to an embodiment, wherein two first components are shown in the figure, and the two first components are arranged at intervals along a predetermined orientation;

[0027] Figure 4 1 is a schematic diagram of the structure of a temperature control device provided by the utility model according to an embodiment, wherein two first components are shown in the figure, and the two first components are symmetrically arranged;

[0028] Figure 5 It is a structural schematic diagram of a first component of a temperature control device provided by the utility model according to an embodiment;

[0029] Figure 6 yes Figure 5 A partial cross-sectional view of a first component of the temperature control device shown, wherein the connecting rod and the cantilever of the bracket and the second temperature monitoring element are not shown;

[0030] Figure 7 It is a structural schematic diagram of an adsorption mechanism of a temperature control device provided by the utility model according to one embodiment;

[0031] Figure 8 It is a schematic diagram of a part of the suction cups of the adsorption mechanism of the temperature control device provided by the utility model according to one embodiment forming a negative pressure to adsorb the substrate;

[0032] Fig. 9 1 is a schematic diagram of the working process of the temperature control device provided by the utility model according to an embodiment. In the figure, the driving unit drives the suction cup to move in a direction away from the heat exchange mechanism to a handover position;

[0033] Fig.10 1 is a schematic diagram of the working process of the temperature control device provided by the utility model according to an embodiment. In the figure, the adsorption mechanism adsorbs the substrate, and all the suction cups of the adsorption mechanism in the figure form a negative pressure to adsorb and flatten the substrate;

[0034] Fig.11 It is a schematic diagram of the working process of the temperature control device provided by the utility model according to one embodiment. In the figure, the suction cup of the driving part moves to the base and contacts the heat exchange mechanism;

[0035] Fig.12 1 is a schematic diagram of the working process of the temperature control device provided by the utility model according to an embodiment. In the figure, the driving unit drives the suction cup with the substrate adsorbed thereon to move to a position away from the heat exchange mechanism;

[0036] Fig.13 is a schematic diagram of an adsorption mechanism of a temperature control device provided by the utility model according to another embodiment when adsorbing a substrate, in which a part of the suction cups of the adsorption mechanism form a negative pressure;

[0037] Fig.14 It is a schematic diagram of a partial structure of a lithography device provided by the utility model according to an embodiment;

[0038] Fig.15 It is a schematic diagram of a manipulator of a lithography device provided by the utility model according to an embodiment.

[0039] [Description of reference numerals is as follows]:

[0040] 1-temperature control device, 2-substrate, 3-manipulator, 31-grasping part, 4-substrate storage unit, 5-workpiece table;

[0041] 10-first component, 20-second component;

[0042] 100-heat exchange mechanism, 110-heat exchange plate, 120-contact block, 101-first avoidance hole, 200-adsorption mechanism, 210-suction cup, 220-support seat, 230-joining tube, 240-elastic member, 300-driving unit, 310-driving unit body, 320-joining member, 400-guide member, 500-temperature monitoring mechanism, 510-first temperature monitoring element, 520-second temperature monitoring element, 600-bracket, 610-fixing plate, 611-second avoidance hole, 620-connecting rod, 630-cantilever. DETAILED DESCRIPTION

[0043] The following describes the implementation of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the illustrations provided in this embodiment only illustrate the basic concept of the present invention in a schematic manner, so the diagram only shows the components related to the present invention rather than drawing according to the number, shape and size of the components in the actual implementation. The type, quantity and proportion of each component in the actual implementation can be a random change, and the component layout type may also be more complicated.

[0044] In addition, each embodiment of the following description has one or more technical features, but this does not mean that the user of the present invention must implement all the technical features in any embodiment at the same time, or can only implement part or all of the technical features in different embodiments separately. In other words, under the premise of being possible to implement, those skilled in the art can selectively implement part or all of the technical features in any embodiment according to the disclosure of the present invention and according to the design specifications or implementation requirements, or selectively implement a combination of part or all of the technical features in multiple embodiments, thereby increasing the flexibility of the implementation of the present invention.

[0045] As used in this specification, the singular forms "one", "an" and "the" include plural objects, and the plural form "multiple" includes more than two objects, unless the content clearly indicates otherwise. As used in this specification, the term "or" is usually used in the sense of including "and / or", unless the content clearly indicates otherwise, and the terms "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. Relational terms such as the terms "first", "second", etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor do they indicate or imply relative importance or implicitly indicate the number of technical features indicated. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0046] The utility model aims to provide a temperature control device and a photolithography device comprising the temperature control device, aiming to utilize the temperature control device substrate for heat treatment so that the substrate entering the workpiece stage is at a predetermined temperature.

[0047] In order to make the purpose, advantages and features of the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings. It should be noted that the drawings are all in a very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model. The same or similar reference numerals in the drawings represent the same or similar components.

[0048] Figure 1 and Figure 2 FIG. 1 is a schematic diagram showing the structure of a temperature control device 1 provided in an embodiment of the present invention. Figure 1 and Figure 2As shown, the temperature control device 1 includes a first component 10 and a second component 20, and the number of the first component 10 is at least one. Figure 1 and Figure 2 , and combined with Figures 5 to 7 Each of the first components 10 includes a heat exchange mechanism 100 and an adsorption mechanism 200. In the same first component 10, the adsorption mechanism 200 includes a plurality of suction cups 210, all of which are located on the same side of the heat exchange mechanism 100 and arranged in an array. Figure 1 The second component 20 includes a driving unit 300, which is connected to the adsorption mechanism 200 and is used to drive the adsorption mechanism 200 to move relative to the heat exchange mechanism 100 along the predetermined direction so that the suction cup 210 is close to or away from the heat exchange mechanism 100. The predetermined direction is indicated by a double-headed arrow Z in the figure. In an exemplary embodiment, the predetermined direction is a vertical direction. In other embodiments, the predetermined direction can also be a horizontal direction. In addition, all the suction cups 210 of the same adsorption mechanism 200 are aligned in the predetermined direction.

[0049] The adsorption mechanism 200 is used to adsorb the substrate 2 to be heat exchanged (such as Figure 8 As shown), the heat exchange mechanism 100 is used to perform heat exchange on the substrate 2 to achieve heat treatment of the substrate 2. The heat exchange here may be heating the substrate 2 or cooling the substrate 2 according to actual conditions; the substrate 2 includes but is not limited to any one of a silicon wafer and a substrate. In some cases, when the temperature control device 1 is in the initial state, the suction cup 210 is located at a heat exchange position close to the heat exchange mechanism 100. Therefore, when the temperature control device 1 includes the first component 10, the working process of the temperature control device 1 is as follows Figures 9 to 12 As shown, the following steps are included:

[0050] Step S1, controlling the driving unit 300 to drive all the suction cups 210 of the adsorption mechanism 200 to move in a direction away from the corresponding heat exchange mechanism 100 until all the suction cups 210 of the adsorption mechanism 200 arrive at the handover position (such as Fig. 9 shown).

[0051] Step S2: using a robot 3 (such as Fig.14 As shown) from a base storage unit 4 (as Fig.14 As shown in the figure, take out one of the substrates 2 to be heat exchanged, and move the substrate 2 to be heat exchanged to the handover position.

[0052] Step S3, forming negative pressure on all the suction cups 210 at the junction position to adsorb the substrate 2 (such as Fig.10 shown).

[0053] Step S4: Control the driving unit 300 to drive the suction cup 210 of the adsorption mechanism 200 to move in a direction close to the heat exchange mechanism 100 until the substrate 2 reaches the heat exchange position (such as Fig.11 shown).

[0054] Step S5: utilizing the heat exchange mechanism 100 to perform heat exchange on the substrate 2 .

[0055] When the temperature of the substrate 2 reaches a predetermined temperature, the step S1 (as shown in FIG. Fig.12 Then, step S6 is performed.

[0056] Step S6, releasing the pressure on the suction cup 210, and taking away the substrate 2 that has completed the heat treatment by the robot 3.

[0057] The suction cups 210 of the same suction mechanism 200 may be arranged in an M×N matrix, where M and N are both positive integers greater than 1. In an optional embodiment, M is equal to N. That is, the suction mechanism 200 includes N 2 The suction cups 210, and N 2 The suction cups 210 are arranged in an N×N matrix.

[0058] Optionally, the temperature control device 1 further includes a negative pressure generator (not shown in the figure) and a controller (not shown in the figure), which is referred to as a first controller. The negative pressure generator is connected to the adsorption mechanism 200, and the first controller is in communication connection with the negative pressure generator, and is configured to control the operation of the negative pressure generator so that the multiple suction cups 210 of the same adsorption mechanism 200 form negative pressure in a predetermined order. Here, the first controller can control the negative pressure generator to form negative pressure on each suction cup 210 in sequence, and may also include multiple sub-control modules, each of which controls the negative pressure generator and forms negative pressure on one suction cup 210. Those skilled in the art will understand that after the multiple suction cups 210 of the same adsorption mechanism 200 form negative pressure in the predetermined order, the adsorption mechanism 200 can firmly adsorb the substrate 2.

[0059] Preferably, please refer back to Figure 1, the second component 20 also includes a guide member 400, and the guide member 400 extends along the predetermined direction. The driving part 300 includes a driving part body 310 and a coupling member 320 that are transmission-connected, and the coupling member 320 is connected to the adsorption mechanism 200 and is also movably connected to the guide member 400. The coupling member 320 can move along the guide member 400 under the drive of the driving part body 310 to drive the adsorption mechanism 200 to move along the predetermined direction. The adsorption mechanism 200 has a large span on a plane perpendicular to the predetermined direction (i.e., the XY plane). By using the guide member 400 to guide the movement of the adsorption mechanism 200 in the predetermined direction, the movement stability and reliability of the adsorption mechanism 200 can be ensured. The embodiment of the utility model has no special limitation on the specific configuration of the driving part 300 and the guiding member 400. The driving part 300 can be any suitable linear motion mechanism, such as a combination of a motor and a lead screw nut, or a mechanism such as a cylinder, a hydraulic cylinder, or an electric cylinder, and the guiding member 400 can be a component such as a guide rail.

[0060] In some embodiments, Figure 3 As shown, the number of the first components 10 is at least two, and the at least two first components 10 are arranged at intervals along the predetermined direction. The number of the driving parts 300 is at least two, and the at least two driving parts 300 correspond to the at least two first components 10 one by one, and each driving part 300 is connected to the adsorption mechanism 200 of the corresponding first component 10, and is used to drive the adsorption mechanism 200 of the corresponding first component 10 to move relative to its heat exchange mechanism 100 along the predetermined direction. The engaging members 320 of all the driving parts 300 are connected to the same guide member 400.

[0061] by Figure 3As shown in the example, the number of the first components 10 is two, the predetermined direction is the vertical direction, and the suction cup 210 is preferably located above the heat exchange mechanism 100. The two first components 10 are respectively referred to as the first component a and the first component b, the first component a is located above, and the first component b is located below. The two driving parts 300 include a first driving part a corresponding to the first component a and a first driving part b corresponding to the first component b. Thus, the first driving part a is connected to the adsorption mechanism 200 of the first component a, and is used to drive the adsorption mechanism 200 of the first component a to move in the up and down direction equivalent to the heat exchange mechanism 100 of the first component a, so that the suction cup 210 of the first component a is close to or away from the heat exchange mechanism 100 of the first component a; the first driving part b is connected to the adsorption mechanism 200 of the first component b, and drives the adsorption mechanism 200 of the first component b to move up and down relative to the heat exchange mechanism 100 of the first component b, so that the suction cup 210 of the first component b is close to or away from the heat exchange mechanism 100 of the first component b. The advantage of such a configuration is that at least two of the first components 10 can be used to heat treat a plurality of the substrates 2 at the same time, thereby improving the working efficiency of the temperature control device. Moreover, since each of the first components 10 is equipped with a driving unit 300, the movement of the adsorption mechanism 200 of each of the first components 10 is independent and does not interfere with each other. Therefore, each of the first components 10 and the corresponding driving unit 300 cooperate to independently perform the aforementioned steps S1 to S6, which is conducive to further improving the working efficiency of the temperature control device.

[0062] It should be understood that in these embodiments, the specific number of the first components 10 is determined according to actual needs and working space.

[0063] In an alternative embodiment, if Figure 4 As shown, the number of the first components 10 is two, the heat exchange mechanisms 100 of the two first components 10 are symmetrically arranged about a predetermined plane perpendicular to the predetermined direction, and the adsorption mechanisms 200 of the two first components 10 are also symmetrically arranged about the predetermined plane. The adsorption mechanisms 200 of the two first components 10 are both connected to the same driving part 300. It can be understood that when the predetermined direction is a vertical direction, the predetermined plane is a horizontal plane, and one of the two first components 10 is located above and the other is located below.

[0064] One of the two first components 10 is still referred to as the first component a, and the other is referred to as the first component b, and the adsorption mechanism 200 of the first component a is referred to as the adsorption mechanism a (not marked in the figure), the heat exchange mechanism 100 of the first component a is referred to as the heat exchange mechanism a (not marked in the figure), the adsorption mechanism 200 of the first component 10b is referred to as the adsorption mechanism b (not marked in the figure), and the heat exchange mechanism 100 of the first component b is referred to as the heat exchange mechanism b (not marked in the figure).

[0065] In the embodiment of the utility model, when the driving unit 300 drives the suction cup 210 of the adsorption mechanism a to move in a direction close to the heat exchange mechanism a, the driving unit 300 also drives the suction cup 210 of the adsorption mechanism b to move in a direction away from the heat exchange mechanism b. Conversely, when the driving unit 300 drives the suction cup 210 of the adsorption mechanism a to move in a direction away from the heat exchange mechanism a, the driving unit 300 also drives the suction cup 210 of the adsorption mechanism b to move in a direction close to the heat exchange mechanism b.

[0066] In this way, when the heat exchange mechanism a performs heat treatment on the substrate 2 adsorbed by the adsorption mechanism a (i.e., the first component a performs the step S5), the first component b can perform the step S2 and the step S3; when the first component a performs the step S1, the first component a can perform the step S4 at the same time; when the first component a performs the step S6, the step S2 and the step S3, the first component b can perform the step S5 at the same time (i.e., the heat exchange mechanism b performs heat treatment on the substrate 2 adsorbed by the adsorption mechanism b). In other words, two of the first components 10 can be used to operate the two substrates 2 at the same time, which greatly improves the working efficiency of the temperature control device 1.

[0067] In a preferred embodiment, if Figure 4 As shown, the driving part 300 is at least partially located between the two first components 10, for example, the joint 320 is located between the two first components 10, so as to facilitate the connection of the two first components 10 with the driving part 300. It should be understood that the driving part 300 is at least partially located between the two first components 10, which means that the driving part 300 is located on a side of the heat exchange mechanism 100 of one of the first components 10 away from the corresponding suction cup 210.

[0068] In the case where the predetermined direction is a vertical direction, when the driving unit 300 drives the adsorption mechanisms 200 of the two first components 10 to move upward, the adsorption mechanism 200 of the first component 10 at the upper position moves in a direction away from the corresponding heat exchange mechanism 100, and the adsorption mechanism 200 of the first component 10 at the lower position moves in a direction close to the corresponding heat exchange mechanism 100. Conversely, when the driving unit 300 drives the adsorption mechanisms 200 of the two first components 10 to move downward, the adsorption mechanism 200 of the first component 10 at the upper position moves in a direction close to the corresponding heat exchange mechanism 100, and the adsorption mechanism 200 of the first component 10 at the lower position moves in a direction away from the corresponding heat exchange mechanism 100.

[0069] Next, the detailed configuration of the first assembly 10 will be described. It should be understood that the following description is about the relative positions and connection relationships of the various components of the heat exchange mechanism 100 and the adsorption mechanism 200 of the same first assembly 10.

[0070] like Figure 6 As shown, the heat exchange mechanism 100 is provided with an avoidance hole extending through along the predetermined direction, and the avoidance hole can be referred to as a first avoidance hole 101. It should be understood that the number of the first avoidance holes 101 is not less than the number of the suction cups 210, and each suction cup 210 is arranged corresponding to one first avoidance hole 101. The adsorption mechanism 200 partially passes through the first avoidance hole 101, and is connected to the joint member 320 on the side of the heat exchange mechanism 100 away from the suction cup 210.

[0071] Alternatively, if Figure 1 , Figures 4 to 12 As shown, in some embodiments, the adsorption mechanism 200 further includes a support seat 220 and a plurality of coupling tubes 230. The support seat 220 is disposed on a side of the heat exchange mechanism 100 away from the suction cup 210 and is connected to the coupling member 320. The number of coupling tubes 230 is not less than the number of suction cups 210, and one end of each coupling tube 230 is fixedly connected to the support seat 220, and the other end passes through one of the first avoidance holes 101 and is connected to the corresponding suction cup 210. It should be understood that the coupling tube 230 is also connected to the negative pressure generator so that the corresponding suction cup 210 can form a negative pressure. Such an arrangement can reduce the complexity of the temperature control device 1 and is conducive to reducing the distance between the heat exchange position and the heat exchange plate 100.

[0072] In other embodiments, Fig.13As shown, the adsorption mechanism 200 not only includes a support seat 220 and a plurality of coupling tubes 230, but also includes a plurality of elastic members 240. In these embodiments, the support seat 220 is arranged on a side of the heat exchange mechanism 100 away from the suction cup 210, and is connected to the coupling member 320. The support seat 220 is also provided with a coupling hole (not shown in the figure) extending through along the predetermined direction. The number of the coupling holes is multiple and is arranged one-to-one corresponding to the plurality of suction cups 210. The number of the coupling tubes 230 is not less than the number of the suction cups 210, and each of the coupling tubes 230 can be movably inserted into one of the coupling holes. One end of the coupling tube 230 passes through the first avoidance hole 101 and is connected to the corresponding suction cup 230, and the other end passes through the corresponding coupling hole and extends to the support. The support seat 220 is away from the side of the heat exchange mechanism 100. The elastic member 240 is provided on the outer periphery of each of the joint tubes 230, and the two ends of the elastic member 240 are respectively abutted against the suction cup 210 and the support seat 220. The arrangement of the elastic member 240 enables the joint tube 230 to drive the corresponding suction cup 210 to move up and down, so as to facilitate the adsorption mechanism 100 to firmly adsorb the substrate 2. The elastic member 240 is, for example, a spring, and is coaxially sleeved on the outer peripheral surface of the joint tube 230.

[0073] Optionally, please refer to Figure 2 and Figure 6 The heat exchange mechanism 100 includes a heat exchange plate 110 and a contact block 120. The heat exchange plate 110 is provided with the first avoidance hole 101, and the heat exchange plate 110 is also provided with a flow channel (not shown in the figure) for the heat exchange medium to flow. The contact block 120 is connected to the heat exchange plate 110, and the contact block 120 and the suction cup 210 are located on the same side of the heat exchange plate 110 to allow the substrate 2 adsorbed on the suction cup 210 to contact the contact block 120. When the substrate 2 contacts the contact block 120, the substrate 2 reaches the heat exchange position. In actual operation, the heat exchange medium flows in the flow channel, and the energy carried by the heat exchange medium (when the heat exchange medium is a heat medium, the energy carried by the heat exchange medium is heat, and when the heat exchange medium is a refrigerant, the energy carried by the heat exchange medium is cold) is transferred to the heat exchange plate 110, and the heat exchange between the heat exchange plate 110 and the substrate 2 is performed by heat radiation to achieve heat treatment of the substrate 2. The heat exchange medium includes, but is not limited to, water or oil at a predetermined temperature.

[0074] It should be noted that, in some embodiments, the contact block 120 is not heat-conductive, and in other embodiments, the contact block 120 is heat-conductive, so that the energy carried by the heat exchange medium can be transferred to the contact block 120, and the substrate 2 can also exchange heat with the contact block 120 in a contact manner.

[0075] Please focus on Figure 1 , Figure 3 and Figure 4 The first component 10 further includes a temperature monitoring mechanism 500 , and the temperature monitoring mechanism 500 is configured to monitor the temperature of the substrate 2 adsorbed on the adsorption mechanism 200 .

[0076] It should be noted that Figure 4 In the illustrated embodiment, the temperature monitoring mechanisms 500 of the two first components 10 may be arranged symmetrically or asymmetrically with respect to the predetermined plane.

[0077] Optionally, the temperature monitoring mechanism 500 may include a first temperature monitoring element 510 and a second temperature monitoring element 520, and the first temperature monitoring element 510 and the second temperature monitoring element 520 are respectively disposed on opposite sides of the suction cup 210 in the predetermined direction to monitor the temperature of the substrate 2 at both sides of the substrate 2. It can be understood that when the predetermined direction is a vertical direction, the first temperature monitoring element 510 and the second temperature monitoring element 520 monitor the temperature of the substrate 2 at the upper and lower sides of the substrate 2 respectively.

[0078] Specifically, the first temperature monitoring element 510 can be connected to the heat exchange plate 110 to monitor the temperature of the side of the substrate 2 facing the heat exchange plate 110. In an optional embodiment, the first temperature monitoring element 510 indirectly monitors the temperature of the side of the substrate 2 away from the heat exchange plate 110 by monitoring the temperature of the air near the surface of the substrate 2 facing the heat exchange plate 110. Therefore, when the substrate 2 is in the heat exchange position, in the predetermined direction, the distance between the second temperature monitoring element 520 and the surface of the substrate 2 away from the heat exchange plate 110 is generally not greater than 0.5 mm. In addition, the number of the first temperature monitoring elements 510 is multiple, and the multiple first temperature monitoring elements 510 are evenly distributed on the heat exchange plate 110.

[0079] The first component 10 further includes a bracket 600, and the second temperature monitoring element 520 is disposed on a side of the suction cup 210 away from the heat exchange plate 110 through the bracket 600 to monitor the temperature of the side of the substrate 2 away from the heat exchange plate 110. The second temperature monitoring element 520 may be an infrared temperature sensor, which may directly monitor the temperature of the surface of the substrate 2 on a side close to the heat exchange plate 110.

[0080] The bracket 600 may include a fixing plate 610, a connecting rod 620 and a cantilever 630. The fixing plate 610 is disposed on a side of the heat exchange plate 110 away from the suction cup 210 and remains relatively stationary with the heat exchange plate 110. The fixing plate 610 is provided with a second avoidance hole 611 extending through along the predetermined direction. The adsorption mechanism 200 is partially penetrated in the second avoidance hole 611. One end of the connecting rod 620 is connected to the fixing plate 620, and the other end of the connecting rod 620 extends along the predetermined direction and reaches the side of the suction cup 210 away from the heat exchange plate 110. The cantilever 630 is connected to one end of the connecting rod 620 away from the fixing plate 620. The second temperature monitoring element 520 is connected to the cantilever 630 , and when the second temperature monitoring element 520 and the heat exchange plate 110 are both projected onto a plane perpendicular to the predetermined direction, the projection of the heat exchange plate 110 covers the projection of the second temperature monitoring element 520 .

[0081] Fig.14 FIG. 2 is a schematic diagram showing a partial structure of a lithography device provided by an embodiment of the utility model. Fig.14 As shown, the lithography equipment includes a robot 3, a substrate storage unit 4, a worktable 5 and the aforementioned temperature control device 1, wherein the temperature control device 1 is used to perform heat treatment on the substrate 2, the substrate storage unit 4 is used to store the substrate 2, and the worktable 5 is used to perform a predetermined operation on the substrate 2. The robot 3 is configured to transfer the substrate 2 between the substrate storage unit 4, the temperature control device 1 and the worktable 5. Specifically, the robot 3 transfers the substrate 2 stored in the substrate storage unit 4 to the temperature control device 1, transfers the substrate 2 after heat treatment by the temperature control device 1 to the worktable 5, and transfers the substrate 2 after the predetermined operation on the worktable 5 to the substrate storage unit 4.

[0082] Next, Figure 4Taking the temperature control device 1 shown as an example, the circulation process of the substrate 2 in the lithography equipment is explained. For the convenience of description, the handover position corresponding to the first component a is referred to as the handover position a, the handover position corresponding to the first component b is referred to as the handover position b, the heat exchange position corresponding to the first component a is referred to as the heat exchange position a, and the heat exchange position corresponding to the second component b is referred to as the heat exchange position b. Before the following process starts, the suction cup 210 of the adsorption mechanism a is at the handover position a. Therefore, the circulation process of the substrate 2 is as follows:

[0083] First, the robot 3 takes out the first substrate 2 from one of the substrate storage units 4 and moves the first substrate 2 to the handover position a.

[0084] Next, the adsorption mechanism a is made to adsorb the first substrate 2 .

[0085] Next, the adsorption mechanism a is moved in a direction close to the heat exchange mechanism a until it reaches the heat exchange position a. At this time, the first substrate 2 reaches the heat exchange position a. At the same time, the suction cup 210 of the adsorption mechanism b moves to the handover position b.

[0086] Next, the heat exchange mechanism a performs heat treatment on the first substrate 2. At the same time, the robot 3 takes out the second substrate 2 from another substrate storage unit 4 and transfers it to the handover position b, and the adsorption mechanism b adsorbs the second substrate 2.

[0087] Next, after the first substrate 2 reaches the predetermined temperature, the adsorption mechanism a is moved in a direction away from the heat exchange mechanism a until the suction cup 210 of the adsorption mechanism a and the first substrate 2 adsorbed thereon arrive at the handover position a. At the same time, the suction cup 210 of the adsorption mechanism b and the second substrate 2 adsorbed thereon arrive at the heat exchange position b.

[0088] Next, the suction cup 210 of the adsorption mechanism a is depressurized, and the robot 3 transfers the first substrate 2 to the workpiece stage 5 .

[0089] Next, a predetermined operation is performed on the first substrate 2 on the workpiece stage 5; at the same time, the robot 3 takes out the third substrate 2 from another substrate storage unit 4 and transfers it to the handover position a, and the adsorption mechanism a adsorbs the third substrate 2. At the same time, the heat exchange mechanism b performs heat treatment on the second substrate 2.

[0090] After completing the predetermined operation on the first substrate 2 , the robot 3 transfers the first substrate 2 to the corresponding substrate storage unit 4 .

[0091] Understandably, Figure 3 For the temperature-controlled loading 1 shown, the substrate 2 that has completed the heat treatment at each of the first components 10 will be transferred by the robot 3 to the workpiece table 5 to perform the predetermined operation, and will not be transferred by the robot 3 to the corresponding substrate storage unit 4 after completing the predetermined operation.

[0092] The present invention has no special restrictions on the configuration of the manipulator 3, which may include a manipulator arm (not marked in the figure) and a gripping portion 31 (such as Fig.15 The gripping portion 31 is used to grip the substrate 2. The robotic arm can be any suitable multi-axis robotic arm in the prior art, and is in communication with a second controller. The second controller is used to control the movement of the robotic arm according to a predetermined program to drive the gripping portion 31 to move, thereby realizing the circulation of the substrate 2.

[0093] It should be understood that the robot can perform motion compensation according to the offset of the substrate 2 in various directions during the movement, so that the substrate 2 can accurately reach the target position. The target position here is, for example, any one of the handover position a, the handover position b, and the base library 4.

[0094] It should also be understood that the substrate storage unit 4 includes an information acquisition module (not shown in the figure), which can automatically scan the substrate 2 and obtain the status information of the substrate 2. The information acquisition module is connected to the first controller in communication and transmits the status information of the substrate 2 to the first controller, so that the first controller can control the operation of the negative pressure generator according to the status information of the substrate 2, so that each suction cup 210 of each adsorption mechanism 200 forms negative pressure in a predetermined order corresponding to the status information.

[0095] The first controller and the second controller may be separate structures or integrated into one, which is not limited in the embodiment of the present utility model.

[0096] Although the utility model is disclosed as above, it is not limited thereto. Those skilled in the art may make various modifications and variations to the utility model without departing from the spirit and scope of the utility model. Thus, if these modifications and variations of the utility model fall within the scope of the claims of the utility model and their equivalents, the utility model is also intended to include these modifications and variations.

Claims

1. A temperature control device, characterized in that: It includes a first component and a second component; wherein, The first component includes a heat exchange mechanism and an adsorption mechanism; the adsorption mechanism includes a plurality of suction cups, all of which are located on the same side of the heat exchange mechanism, and all of which are arranged in an array; The second component includes a driving part, which is connected to the adsorption mechanism and is used to drive the adsorption mechanism to move in a predetermined direction relative to the heat exchange mechanism so that the suction cup approaches or moves away from the heat exchange mechanism.

2. The temperature control device according to claim 1, characterized in that: The number of the first components is two, the heat exchange mechanisms of the two first components are symmetrically arranged about a predetermined plane, the adsorption mechanisms of the two first components are symmetrically arranged about the predetermined plane, and the adsorption mechanisms of the two first components are both connected to the driving part; the predetermined plane is perpendicular to the predetermined direction; The temperature control device is configured such that when the driving unit drives the suction cup of one of the first components to move in a direction close to the corresponding heat exchange mechanism, the driving unit also drives the suction cup of another first component to move in a direction away from the corresponding heat exchange mechanism.

3. The temperature control device according to claim 1, characterized in that: The number of the first components is at least two, and at least two of the first components are arranged at intervals along the predetermined direction; the number of the driving parts is at least two, and at least two of the driving parts correspond one-to-one to at least two of the first components, and each of the driving parts is connected to the adsorption mechanism of the corresponding first component and is used to drive the adsorption mechanism of the corresponding first component to move along the predetermined direction relative to the heat exchange mechanism.

4. The temperature control device according to any one of claims 1 to 3, characterized in that: The second component also includes a guide member, which extends along the predetermined direction; the driving part includes a driving part body and a coupling member, the coupling member is movably connected to the guide member, the coupling member is connected to the driving part body, and the driving part body can drive the coupling member to move along the guide member in the predetermined direction; the adsorption mechanism is connected to the coupling member.

5. The temperature control device according to any one of claims 1 to 3, characterized in that: The heat exchange mechanism comprises a heat exchange plate and a contact block; a flow channel for heat exchange medium to flow is provided in the heat exchange plate; the contact block is arranged on the heat exchange plate and is located on the same side of the heat exchange plate as the suction cup.

6. The temperature control device according to any one of claims 1 to 3, characterized in that: The first component further includes a temperature monitoring mechanism, and the temperature monitoring mechanism is used to monitor the temperature of the substrate adsorbed on the corresponding adsorption mechanism.

7. The temperature control device according to claim 6, characterized in that: The temperature monitoring mechanism comprises a first temperature monitoring element and a second temperature monitoring element, and the first temperature monitoring element and the second temperature monitoring element are respectively arranged on opposite sides of the corresponding suction cup in the predetermined direction.

8. The temperature control device according to claim 1 or 2, characterized in that: The multiple suction cups of the same adsorption mechanism are arranged in an M×N array, where M and N are both positive integers greater than 1.

9. The temperature control device according to claim 8, characterized in that: The temperature control device also includes a controller and a negative pressure generator, the negative pressure generator is connected to the adsorption mechanism, the controller is in communication connection with the negative pressure generator, and is configured to control the operation of the negative pressure generator so that the multiple suction cups of the same adsorption mechanism form negative pressure in a predetermined order.

10. The temperature control device according to any one of claims 1 to 3, characterized in that: The driving part is at least partially located on a side of the heat exchange mechanism away from the corresponding suction cup; the heat exchange mechanism is provided with a plurality of avoidance holes extending through the predetermined direction; The adsorption mechanism further includes a support seat and a plurality of coupling tubes; the support seat is arranged on a side of the corresponding heat exchange mechanism away from the suction cup and connected to the driving part; the coupling tube extends along the predetermined direction, one end of the coupling tube is connected to the support seat, and the other end passes through the corresponding avoidance hole and extends to a side of the heat exchange mechanism away from the support seat and connected to the corresponding suction cup; or, The adsorption mechanism also includes a support seat, a plurality of coupling tubes and a plurality of elastic members; the support seat is arranged on a side of the corresponding heat exchange mechanism away from the suction cup, and is connected to the driving part; a coupling hole extending through along the predetermined direction is provided on the support seat; the coupling tube extends along the predetermined direction, the coupling tube is partially penetrated at the coupling hole, and one end of the coupling tube passes through the avoidance hole and extends to a side of the heat exchange mechanism away from the support seat, and is connected to a corresponding one of the suction cups; the elastic member is provided on the outer periphery of each of the coupling tubes, and the two ends of the elastic member are respectively abutted against the support seat and the corresponding suction cup.

11. A lithography apparatus, characterized in that: It comprises a robot, a substrate storage unit, a workpiece table and a temperature control device as described in any one of claims 1 to 10; the robot is configured to transfer the substrate between the substrate storage unit, the workpiece table and the temperature control device.

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