2U server L-type PCB mainboard based on board splitting scheme

Abstract

The utility model provides a 2U server L-type PCB mainboard based on a board splitting scheme, which relates to the technical field of server design, and comprises a main body board, a rear IO part and a connecting part, and the main body board and the rear IO part are separately arranged and are connected through the connecting part. The main body board and the rear IO part are arranged in a split mode through the connecting part, so that in the production process, a board of the main body board can be improved to be a 968GSE / 988GSE high-speed board, meanwhile, the rear IO part is made of an IT170GT board with higher cost performance, the PCB cost is reduced on the whole, meanwhile, the delivery time of the PCB board is also superior, material preparation is convenient, and the progress of a project can be accelerated.

Description

Technical Field

[0001] The utility model relates to the technical field of server design, in particular to an L-shaped PCB mainboard of a 2U server based on a board splitting solution. Background Art

[0002] With the continuous advancement of science and technology, high-speed interconnect bus technology is experiencing unprecedented development. Especially when standards such as PCIe5.0 are introduced with a rate of up to 32GT / S, we have to face a severe challenge: maintaining signal integrity. With such fast data transmission, any slight signal distortion or interference may lead to data loss or transmission errors, which is absolutely intolerable for modern electronic devices that pursue high precision and high reliability.

[0003] In order to meet this high requirement, the industry began to seek higher performance board materials. In this context, 968GSE / 988GSE high-speed boards came into being. With its excellent electrical performance and signal transmission stability, this type of board has become the key to solving the signal integrity problem in high-speed data transmission. However, as we know, high performance often comes with high costs. The price of high-speed boards is much more expensive than traditional boards, which undoubtedly increases the manufacturing cost of electronic equipment.

[0004] In addition, the production cycle of high-speed plates is relatively long. Due to its complex manufacturing process, the quality and precision of raw materials are extremely high, which leads to extended delivery time. For the market that urgently needs new products, this is undoubtedly a big challenge. Utility Model Content

[0005] The purpose of the utility model is to solve the technical problems in the prior art of manufacturing the overall PCB board, such as complex process, high cost and easy impact on delivery time.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A 2U server L-shaped PCB mainboard based on a split-board solution comprises a main board, a rear IO part and a connecting part. The main board and the rear IO part are separately arranged and connected through the connecting part.

[0008] Preferably, the main body plate is a main body plate of 968GSE / 988GSE high-speed plate material.

[0009] Preferably, the rear IO part is the rear IO part of the IT170GT board.

[0010] Preferably, a central processing unit and a PCI expansion slot are provided on the main board.

[0011] Preferably, the connecting portion is a PCIe splint connector, and the rear IO portion and the main board are connected via the PCIe splint connector.

[0012] Preferably, the rear IO portion is provided with a serial port, a network interface and a USB port.

[0013] Preferably, the main body plate includes a main body portion and an interface portion, wherein the main body portion is arranged in a rectangular plate shape, and the width of the interface portion is between the width of the main body portion and the width of the rear IO portion.

[0014] The above-mentioned 2U server L-shaped PCB motherboard based on the split-board solution realizes the split setting of the main board and the rear IO part through the connecting part, so that during the production process, the main board can be upgraded to 968GSE / 988GSE high-speed board, and the rear IO part can use the more cost-effective IT170GT board, thereby reducing the overall PCB cost. At the same time, there are also advantages in the delivery time of PCB boards, and the material preparation is convenient, which can speed up the progress of the project. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the overall structure of a 2U server L-shaped PCB motherboard based on a board splitting solution in one embodiment of the utility model;

[0016] Figure 2 This is a structural schematic diagram from another angle of a 2U server L-shaped PCB motherboard based on a board splitting solution in one embodiment of the utility model.

[0017] Legend:

[0018] 1. Main board; 11. Main body; 111. Central processing unit; 112. Expansion slot; 12. Interface;

[0019] 2. Rear IO part; 21. Serial port; 22. Network interface; 23. USB port; 3. Connection part. DETAILED DESCRIPTION

[0020] The present invention is further described in detail below in conjunction with specific embodiments.

[0021] See also Figure 1 and Figure 2 A 2U server L-shaped PCB motherboard based on a split-board solution includes a main board 1, a rear IO part 2 and a connecting part 3. The main board 1 and the rear IO part 2 are separately arranged and connected through the connecting part 3. By separately arranging the main board 1 and the rear IO part 2, different materials can be used for the main board 1 and the rear IO part 2, which is specifically shown as follows:

[0022] See also Figure 1 In one embodiment, the main body board 1 is a main body board 1 of a 968GSE / 988GSE high-speed board material. The 968GSE / 988GSE high-speed board material is an advanced circuit board material designed for high-speed applications, and they have a series of significant advantages. First, these boards have a low CTE (coefficient of thermal expansion) and can maintain excellent dimensional stability when the temperature changes, which is essential to ensure the integrity of signal transmission. Secondly, high Tg (glass transition temperature) such as TMA 180°C of IT-988GSETC ensures the stability and reliability of the board in high temperature environments. In addition, these boards also have the characteristics of halogen-free, low Dk (dielectric constant) and ultra-low Df (dielectric loss), which can significantly reduce signal attenuation and improve signal integrity during high-frequency and high-speed data transmission. For example, the Dk value of IT-988GSETC at 10GHz is 3.21 and the Df value is 0.0014, which makes it particularly suitable for applications with 56Gbps+ per channel. In summary, 968GSE / 988GSE high-speed boards have been widely used in communications, automobiles, satellite communications and other fields.

[0023] The main board 1 includes a main body portion 11 and an interface portion 12, wherein the main body portion 11 is a rectangular plate, and a central processing unit 111 and an expansion slot 112 are arranged on the main body portion 11. Other electronic components are also arranged on the main body portion 11, including memory, a power connector and a fan structure, etc.; since the prior art has been explained, it will not be repeated here.

[0024] There are two central processing units 111, which are symmetrically arranged. There are four groups of expansion slots 112, which are extended along the height direction of the central processing unit 111. In one embodiment, each central processing unit 111 corresponds to two groups of expansion slots 112, which are respectively located at both ends of the length direction of the central processing unit 111. A partition is arranged between the two central processing units, and the partition is used to separate the expansion slots corresponding to the two central processing units 111. At the same time, through the setting of the partition, during the operation of the server, the heat transfer between the two central processing units 111 can be reduced, ensuring that the central processing unit can operate stably at a relatively low temperature. The partition also plays a role of electromagnetic shielding. Through the setting of the partition, the propagation of electromagnetic radiation can be effectively blocked or reduced, and the CPU can be protected from external electromagnetic interference, ensuring that the CPU can execute instructions accurately and stably.

[0025] In addition, the provision of the partition provides a stable installation position for the central processing unit 111, which can protect the central processing unit 111 from external shocks and vibrations to a certain extent.

[0026] The expansion slot 112 is one of a PCIe (Peripheral Component Interconnect Express) slot, a PCI-X slot, and an AGP (Accelerated Graphics Port) slot. In the embodiment shown in the figure, the expansion slot 112 is a PCIe slot. The expansion slot 112 is used to add additional hardware components, such as a graphics card, a network card, a RAID card, etc. The expansion slot 112 is connected to other electronic components through the circuit on the main board 11 to provide high-speed data transmission and communication capabilities.

[0027] In one embodiment, a power supply component (not shown in the figure) is also provided on the main board 11, and the power supply component is used to connect an external power supply to provide a stable power supply for the main board 11 to ensure that the server can obtain sufficient power during normal operation.

[0028] In other embodiments, a heat dissipation component and a power supply circuit (not shown in the figure) are also arranged on the main board 11 to ensure that the CPU, memory and other components can maintain an appropriate temperature during operation and obtain a stable power supply. The heat dissipation component is a heat sink or a heat dissipation fan or a combination thereof.

[0029] The interface portion 12 is used to be connected to the rear IO portion 2 . In one embodiment, the width of the interface portion 12 is between the width of the main body portion 11 and the width of the rear IO portion 2 .

[0030] See also Figure 1 In one embodiment, the rear IO part 2 is the rear IO part 2 of the IT170GT board. The IT170GT board is a high-performance circuit board material designed to meet the stringent requirements of modern high-speed and high-reliability electronic equipment. It has several notable features: First, the glass transition temperature (Tg) of the IT170GT board is as high as 185°C, which means that it can maintain stable physical and chemical properties even in high-temperature environments, and is particularly suitable for high-temperature processes such as lead-free tin-spraying processes. Secondly, the board has a low dielectric constant (Dk) and dielectric loss (Df), which enables the signal to maintain low attenuation during high-speed transmission, ensuring the integrity and accuracy of the data. In addition, the IT170GT board also has high heat resistance, CAF (conductive anode wire) resistance reliability and environmental protection characteristics, which further enhances its application value and reliability. These excellent properties have made the IT170GT board widely used in high-cost base stations, 3S servers (servers / storage / switches), storage devices, connectors, routers, backplanes, and telecommunications and communication base stations.

[0031] The rear IO unit 2 is provided with a serial port 21, a network interface 22 and a USB port 23.

[0032] The serial port 21 is a communication port between a computer and an external device, and adopts a serial communication mode, which has the characteristics of simple communication lines, low cost but slow transmission speed. The serial port 21 is widely used for data transmission between a computer and external devices such as a printer, a mouse, and a keyboard. In one embodiment, the serial port 21 is one of RS-232, RS-422, and RS-485. In this embodiment, the serial port 21 uses RS-232, which is suitable for some simple data transmission scenarios, such as connecting a computer and a printer, debugging a serial port device, etc.

[0033] The network interface 22 is used to provide a communication interface between the computer and the network. In one embodiment, the network interface 22 is any one of an RJ-45 interface and an optical fiber interface. Computer network communication is achieved through the network interface and is responsible for sending, receiving and processing data.

[0034] The USB port 23 is used to connect external devices, such as a keyboard, a mouse, a camera, etc. In one embodiment, the USB port 23 is at least one of USB 2.0, USB 3.0, USB 3.1 (including USB 3.1Gen 1 and USB 3.1Gen 2), and USB 4.

[0035] In one implementation, the maximum rate of the rear IO unit 2 is 5 Gbps.

[0036] See also Figure 1 In one embodiment, the connection portion 3 is located between the rear IO portion 2 and the interface portion 12, and the connection portion 3 is a PCIe splint connector, and the rear IO portion 2 and the interface portion 12 are connected via the PCIe splint connector.

[0037] In summary, the present application provides a 2U server L-shaped PCB motherboard based on a split-board solution, which realizes the split setting of the main board 1 and the rear IO part 2 through the connecting part 3, so that during the production process, the board material of the main board 1 can be upgraded to a 968GSE / 988GSE high-speed board, and the rear IO part 2 can use a more cost-effective IT170GT board, thereby reducing the overall PCB cost. At the same time, there are also advantages in the delivery time of the PCB board, and the material preparation is convenient, which can speed up the progress of the project.

Claims

1. A 2U server L-shaped PCB motherboard based on a split-board solution, characterized in that: It comprises a main body plate, a rear IO part and a connecting part. The main body plate and the rear IO part are separately arranged and connected through the connecting part.

2. According to the 2U server L-shaped PCB motherboard based on the board splitting solution of claim 1, it is characterized by: The main body plate is a main body plate of 968GSE / 988GSE high-speed plate.

3. The 2U server L-shaped PCB motherboard based on the board splitting solution according to claim 2 is characterized in that: The rear IO part is the rear IO part of the IT170GT board.

4. The 2U server L-shaped PCB motherboard based on the split-board solution according to claim 1 is characterized in that: The main board is provided with a central processing unit and a PCI expansion slot.

5. The 2U server L-shaped PCB motherboard based on the split-board solution according to claim 1 is characterized in that: The connecting part is a PCIe splint connector, through which the rear IO part and the main board are connected.

6. The 2U server L-shaped PCB motherboard based on the board splitting solution according to claim 1 is characterized in that: The rear IO part is provided with a serial port, a network interface and a USB port.

7. The 2U server L-shaped PCB motherboard based on the split-board solution according to claim 6 is characterized in that: The main body plate includes a main body portion and an interface portion, wherein the main body portion is arranged in a rectangular plate shape, and the width of the interface portion is between the width of the main body portion and the width of the rear IO portion.

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