Vehicle-mounted equipment with heat dissipation waterproof structure

Abstract

The utility model provides vehicle-mounted equipment with a heat dissipation waterproof structure. The vehicle-mounted equipment comprises a display device, a semiconductor module and a heat dissipation assembly. The display device comprises a shell module, a display screen module arranged on the shell module and a mainboard assembly arranged in the shell module, the mainboard assembly is electrically connected with the display screen module and attached to the shell module, and heat can be generated when the mainboard assembly works. The semiconductor module is fixed outside the shell module and electrically connected with the mainboard assembly, the semiconductor module is provided with a refrigeration face and a heating face, and the refrigeration face is attached to the shell module. The heat dissipation assembly is fixed outside the shell module and is attached to the heating surface. The heat transferred from the mainboard assembly to the shell module can be transferred to the heat dissipation assembly through the semiconductor module, and the heat dissipation assembly is used for transferring the heat to the outside. The problem of heat dissipation of the vehicle-mounted tablet computer in a high-power-consumption and high-temperature environment is solved, and the waterproof problem of an active heat dissipation structure is synchronously improved.

Description

Technical Field

[0001] The present application belongs to the technical field of vehicle-mounted equipment, and in particular relates to a vehicle-mounted equipment with a heat dissipation and waterproof structure. Background Art

[0002] At present, the vehicle-mounted tablets used in industry and agriculture have high power consumption. The CPU heat source components will cause the internal temperature of the whole machine to rise, thus affecting the performance of electronic components. Therefore, the heat dissipation performance of the product is relatively high, so it is necessary to open heat dissipation holes. However, the vehicle-mounted tablet needs to run stably even on rainy days, so the waterproof performance of the product is relatively high. Therefore, it is necessary to carry out active heat dissipation and waterproof design for the vehicle-mounted tablet to increase the heat dissipation performance of the whole machine and improve the overall waterproof performance. Utility Model Content

[0003] In view of this, the present application provides a vehicle-mounted device with a heat dissipation and waterproof structure, the vehicle-mounted device comprising:

[0004] The display device comprises a housing module, a display screen module mounted on the housing module, and a mainboard assembly disposed in the housing module, wherein the mainboard assembly is electrically connected to the display screen module and is attached to the housing module, and the mainboard assembly can generate heat when in operation;

[0005] A semiconductor module, fixed outside the housing module and electrically connected to the mainboard assembly, the semiconductor module having a cooling surface and a heating surface, the cooling surface being in contact with the housing module; and

[0006] A heat dissipation component is fixed outside the housing module and is in contact with the heat-generating surface;

[0007] The heat transferred from the mainboard component to the housing module can be transferred to the heat dissipation component through the semiconductor module, and the heat dissipation component is used to transfer the heat to the outside.

[0008] The vehicle-mounted device with a heat dissipation and waterproof structure provided by the present application, by setting a semiconductor module and utilizing the active cooling function of the semiconductor module, can transfer the heat generated by the mainboard component to the semiconductor module through the housing module, and then transfer it to the heat dissipation component by the semiconductor module, and finally dissipate it into the air through the heat dissipation component to achieve the heat dissipation function. In addition, the present application separates the mainboard component from the heat dissipation component, the mainboard component is arranged in a sealed housing module, and the heat dissipation component is arranged outside the housing, and the mainboard component forms a separate sealed body structure to prevent rainwater from penetrating into the interior of the vehicle-mounted device, achieve waterproof performance, and improve the thermal conductivity stability of the heat dissipation component.

[0009] In summary, the present application separates the mainboard component from the heat dissipation component by design, and on the basis of achieving the waterproof function, utilizes the semiconductor module to transfer heat to the heat dissipation component for heat dissipation, thereby achieving the heat dissipation function, solving the heat dissipation problem of the vehicle-mounted tablet in a high power consumption and high temperature environment, and simultaneously improving the waterproof problem of the active heat dissipation structure.

[0010] Among them, the shell module includes a front shell component and a rear shell component, the display screen module is arranged on the front shell component, the front shell component and the rear shell component are surrounded by a sealed space, and the mainboard component is arranged in the sealed space; the mainboard component includes a mainboard CPU module that is fitted with the rear shell component, and the mainboard CPU module is arranged correspondingly to the semiconductor module.

[0011] Among them, a rear shell CPU step is provided on the side of the rear shell component close to the sealed space, and the mainboard CPU module is attached to the rear shell CPU step; a receiving groove is provided on the side of the rear shell component away from the sealed space, and the semiconductor module is arranged in the receiving groove and the cooling surface of the semiconductor module is attached to the bottom wall of the receiving groove.

[0012] The rear shell component has a rear shell power lead via hole, and the semiconductor module includes a power lead, and the power lead passes through the rear shell power lead via hole to be electrically connected to the mainboard component.

[0013] Wherein, a sealing filler is provided in the rear shell power lead hole to seal the rear shell power lead hole.

[0014] The heat dissipation assembly includes a heat sink fixed to the rear shell assembly, and the heat sink includes a heat sink heat absorbing platform in contact with the heating surface of the semiconductor module, and a plurality of heat sink fins arranged on the periphery of the heat sink heat absorbing platform and arranged in an array.

[0015] Wherein, the heat dissipation assembly further comprises a fan installed on the heat dissipation element away from the semiconductor module, the fan comprises a fan power lead, and the fan power lead passes through the rear shell assembly and is electrically connected to the mainboard assembly.

[0016] Wherein, the rear shell component is an aluminum rear shell component, and the rear shell component is an integrated structure.

[0017] Wherein, the vehicle-mounted device also includes a protective cover arranged on the heat dissipation component, and the protective cover is fixed to the housing module.

[0018] Wherein, the protective cover includes a top wall and a side wall bent and connected to the periphery of the top wall, the side wall is fixed to the shell module, the top wall is provided with a plurality of air outlets arranged in an array, and the side wall is provided with a plurality of air inlets arranged in an array. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the implementation modes of the present application, the drawings required for use in the implementation modes of the present application will be described below.

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the vehicle-mounted equipment in one embodiment of the present application.

[0021] Figure 2 for Figure 1 An exploded view of the vehicle-mounted equipment is shown.

[0022] Figure 3 FIG. 1 is a schematic diagram of a semiconductor module in one embodiment of the present application.

[0023] Figure 4 for Figure 1 A cross-sectional schematic diagram of the vehicle-mounted equipment is shown.

[0024] Figure 5 It is a schematic diagram of the three-dimensional structure of the mainboard assembly in one embodiment of the present application.

[0025] Figure 6 It is a schematic diagram of the three-dimensional structure of the rear shell component from one perspective in one embodiment of the present application.

[0026] Figure 7 for Figure 6 A schematic diagram of the three-dimensional structure of the rear shell assembly from another perspective is shown.

[0027] Figure 8 Schematic diagram of the three-dimensional structure of a heat sink in one embodiment of the present application.

[0028] Fig. 9 It is a schematic diagram of the three-dimensional structure of a fan in one embodiment of the present application.

[0029] Fig.10 It is a schematic diagram of the three-dimensional structure of the protective cover in one embodiment of the present application.

[0030] Description of labels:

[0031] Vehicle-mounted device 1, display device 100a, display screen module 100, front shell assembly 200, sealed space 200a, mainboard assembly 300, mainboard CPU module 310, mainboard screw hole 320, housing module 400a, rear shell assembly 400, receiving groove 410, rear shell power lead through hole 420, rear shell protective cover screw position 430, rear shell heat dissipation assembly screw position 440, rear shell CPU step 450, rear shell mainboard screw position 460, rear shell waterproof slot 4 70, sealing filler 480, semiconductor module 500, heating surface 510, cooling surface 520, power lead 530, heat dissipation assembly 600, heat sink 610, heat sink heat absorption platform 611, heat sink fin 612, heat sink screw column 613, fan 620, fan blade 621, fan power lead 622, protective cover 700, air outlet 710, air inlet 720, rear shell screw position 730, top wall 740, side wall 750, sealing ring 800. DETAILED DESCRIPTION

[0032] The following are preferred implementations of the present application. It should be noted that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application, and these improvements and modifications are also considered to be within the scope of protection of the present application.

[0033] Before introducing the technical solution of the present application, the technical problems in the related technology are introduced in detail.

[0034] According to big data statistics, more than 40% of reliability (lifespan) failures of electronic products are caused by temperature problems. For every 10-degree rise in the temperature of electronic parts, the lifespan is reduced by half, with capacitors having the most significant impact. At present, the power consumption of the vehicle-mounted flat panel used in industry and agriculture is large, and the LCD screen and CPU heat source components will cause the internal temperature of the whole machine to rise, thereby affecting the performance of electronic components, so the heat dissipation performance of the product is relatively high.

[0035] Active cooling tablet waterproofing is the main design difficulty. The active cooling fan assembly requires air inlets and outlets, and the vehicle-mounted tablet needs to operate stably even on rainy days, which places high demands on the product's waterproof performance. Therefore, heat dissipation and waterproofing are two mutually restrictive factors. In order to enable the vehicle-mounted 5G terminal to work stably in high temperature and rainy environments, it is necessary to carry out active heat dissipation and waterproofing design on the vehicle-mounted 5G terminal to increase the heat dissipation performance of the whole machine and improve the overall waterproofing performance.

[0036] In view of this, in order to solve the above problems, this embodiment provides a vehicle-mounted device with a heat dissipation and waterproof structure, please refer to Figure 1-Figure 4 , Figure 1 It is a schematic diagram of the three-dimensional structure of the vehicle-mounted equipment in one embodiment of the present application. Figure 2 for Figure 1An exploded view of the vehicle-mounted equipment is shown. Figure 3 FIG. 1 is a schematic diagram of a semiconductor module in one embodiment of the present application. Figure 4 for Figure 1 The cross-sectional schematic diagram of the vehicle-mounted device shown. The vehicle-mounted device provided in this embodiment includes a display device 100a, a semiconductor module 500, and a heat dissipation component 600. The display device 100a includes a housing module 400a, a display screen module 100 installed in the housing module 400a, and a mainboard component 300 arranged in the housing module 400a, the mainboard component 300 is electrically connected to the display screen module 100 and fits with the housing module 400a, and the mainboard component 300 can generate heat when working. The semiconductor module 500 is fixed to the outside of the housing module 400a and electrically connected to the mainboard component 300, the semiconductor module 500 has a cooling surface 520 and a heating surface 510, and the cooling surface 520 fits with the housing module 400a. The heat dissipation component 600 is fixed to the outside of the housing module 400a and fits with the heating surface 510. The heat transferred from the mainboard assembly 300 to the housing module 400 a can be transferred to the heat dissipation assembly 600 through the semiconductor module 500 . The heat dissipation assembly 600 is used to transfer the heat to the outside.

[0037] The vehicle-mounted device 1 referred to in this embodiment is mainly used for vehicles, such as cars, industrial and agricultural vehicles and other vehicles as terminal equipment installed. This embodiment is only schematically illustrated with a vehicle-mounted tablet, so this embodiment can also be understood as an agricultural machinery vehicle-mounted semiconductor active heat dissipation waterproof structure used in industrial and agricultural electronic products.

[0038] The display device 100a is the main component of the vehicle-mounted device 1, that is, the vehicle-mounted device 1 is a device with a display function, and the display device includes a housing module 400a and a display screen module 100 mounted on the housing module 400a. The housing module 400a has a sealed space 200a, and various structural parts can be installed in the sealed space 200a, such as a mainboard assembly 300, a camera assembly, a battery, etc. The mainboard assembly 300 can be arranged in the sealed space 200a in the housing module 400a, so as to achieve a waterproof function for the mainboard assembly 300.

[0039] It is worth noting that the mainboard assembly 300 is electrically connected to the display screen module 100. When the mainboard assembly 300 is working, it controls the display screen module 100 to display images. At the same time, the mainboard assembly 300 also generates heat. In the related art, heat is continuously accumulated inside the display device 100a, thereby increasing the temperature of the vehicle-mounted device 1, which affects the life of the vehicle-mounted device 1. In addition, the mainboard assembly 300 fits the inner side of the housing module 400a, so that the heat generated by the mainboard assembly 300 can be transferred to the housing module 400a, thereby achieving the purpose of preliminary heat dissipation.

[0040] The semiconductor module 500 is a component made of semiconductor material and uses semiconductor refrigeration technology for refrigeration, wherein semiconductor refrigeration is a technology that uses the thermoelectric effect of semiconductor materials to achieve refrigeration. Its basic principle is that when direct current passes through a thermocouple made of semiconductor material, one end of the thermocouple will absorb heat and the other end will release heat, thereby generating a temperature difference and achieving a refrigeration effect. Therefore, the semiconductor module 500 has a cooling surface 520 and a heating surface 510. Optionally, the cooling surface 520 and the heating surface 510 can be arranged opposite to each other or adjacent to each other, or can be arranged in other ways.

[0041] In this embodiment, the semiconductor module 500 can be fixed on the outside of the housing module 400a, and electrically connected to the mainboard assembly 300, so that the semiconductor module 500 is energized, and the mainboard assembly 300 can be used to adjust the current size of the semiconductor module 500, thereby adjusting the cooling effect. In addition, in this embodiment, the cooling surface 520 of the semiconductor module 500 can be fitted with the housing module 400a. When the mainboard assembly 300 is working, the heat generated by it can be first transferred to the housing module 400a. At this time, the cooling surface 520 of the semiconductor module 500 can absorb the heat on the housing module 400a to the semiconductor module 500, thereby transferring the heat to the semiconductor module 500. In other words, the semiconductor module 500 contacts the rear housing assembly 400 through the thermoelectric effect, cools the rear housing assembly 400, balances the hot spots, and achieves the purpose of active heat dissipation. The surface temperature of the rear housing assembly 400 is adjusted by the semiconductor module 500 to protect the user from being scalded.

[0042] The heat dissipation component 600 is mainly used to achieve the purpose of heat dissipation. The heat dissipation component 600 can be first fixed to the outside of the shell module 400a and at the same time fit with the heating surface 510 of the semiconductor module 500, so that the heat transferred to the semiconductor module 500 can be transferred to the heat dissipation component 600 through the heating surface 510, and then transferred to the outside air by the heat dissipation component 600, and finally the heat generated by the mainboard component 300 is dissipated into the air to achieve the purpose of heat dissipation. In other words, the semiconductor module 500 cools the contact surface with the rear shell component 400 and heats the contact surface with the heat dissipation component 600 through the thermoelectric effect. Optionally, the heat dissipation component 600 is filled with water for sealing and protection to prevent external rainwater from infiltrating.

[0043] From the above content, it can be seen that the vehicle-mounted device 1 with a heat dissipation and waterproof structure provided in this embodiment, by setting a semiconductor module 500 and utilizing the active cooling function of the semiconductor module 500, can transfer the heat generated by the mainboard component 300 to the semiconductor module 500 through the shell module 400a, and then transfer it to the heat dissipation component 600 by the semiconductor module 500, and finally dissipate it into the air through the heat dissipation component 600, thereby realizing the heat dissipation function. In addition, the present application separates the mainboard component 300 and the heat dissipation component 600 through the rear shell component 400, the mainboard component 300 is arranged in the sealed shell module 400a, and the heat dissipation component 600 is arranged outside the shell, and the mainboard component 300 forms a separate sealed body structure, forming a waterproof sealed closed loop, preventing rainwater from penetrating into the interior of the vehicle-mounted device 1, realizing waterproof performance, and improving the thermal conductivity stability of the heat dissipation component 610.

[0044] In summary, this embodiment provides an agricultural machinery vehicle-mounted semiconductor active heat dissipation waterproof structure, which separates the mainboard component 300 from the heat dissipation component 600, and uses the semiconductor module 500 to transfer heat to the heat dissipation component 600 for heat dissipation on the basis of realizing the waterproof function, thereby realizing the heat dissipation function, solving the heat dissipation problem of the vehicle-mounted tablet in a high power consumption and high temperature environment, and simultaneously improving the waterproof problem of the active heat dissipation structure.

[0045] Please refer again Figure 2 , Figure 4-Figure 6 , Figure 5 It is a schematic diagram of the three-dimensional structure of the mainboard assembly in one embodiment of the present application. Figure 6 The three-dimensional structure diagram of the rear shell assembly 400 from one perspective in one embodiment of the present application. In this embodiment, the housing module 400a includes a front shell assembly 200 and a rear shell assembly 400, the display screen module 100 is mounted on the front shell assembly 200, the front shell assembly 200 and the rear shell assembly 400 are surrounded to form a sealed space 200a, and the mainboard assembly 300 is arranged in the sealed space 200a. The mainboard assembly 300 includes a mainboard CPU module 310 that fits the rear shell assembly 400, and the mainboard CPU module 310 is arranged correspondingly to the semiconductor module 500.

[0046] The housing module 400a can be divided into a front housing assembly 200 and a rear housing assembly 400. The front housing assembly 200 and the rear housing assembly 400 each have a certain accommodation space. The front housing assembly 200 and the rear housing assembly 400 can be assembled together to form a sealed space 200a, and the motherboard assembly 300 can be arranged in the sealed space 200a. The display assembly is installed on the front housing assembly 200, and the motherboard CPU module 310 in the motherboard assembly 300 is fitted with the rear housing assembly 400. When the motherboard assembly 300 is working, the motherboard CPU module 310 will generate heat, which is then transferred to the rear housing assembly 400, and then transferred to the semiconductor module 500 through the rear housing assembly 400.

[0047] Optionally, the display screen module 100 may be fixed and sealed to the front housing assembly 200 by foam adhesive, and the jig is pressurized for 15 seconds.

[0048] Optionally, the mainboard assembly 300 can be locked and fixed via mainboard screw holes 320 on the mainboard assembly 300 and rear shell mainboard screw positions 460 on the rear shell assembly 400 .

[0049] Optionally, a rear shell waterproof groove 470 is provided around the circumference of the rear shell assembly 400, and the sealing ring 800 can be sleeved in the rear shell waterproof groove 470, thereby improving the sealing performance of the housing module 400a.

[0050] In addition, the present embodiment also provides an assembly process of the whole machine: 1. First assemble the display screen module 100 onto the front shell assembly 200, and keep the pressure of the fixture for 15 seconds. 2. Then install the mainboard assembly 300 onto the rear shell assembly 400, tighten the screws to fix it, and then put the sealing ring 800 into the rear shell waterproof groove 470 of the rear shell assembly 400. 3. First assemble the semiconductor module 500 onto the rear shell assembly 400, and then install the heat dissipation assembly 600 onto the rear shell assembly 400, and tighten the screws to fix it. Then assemble the protective cover 700 onto the rear shell assembly 400, and tighten the screws to fix it. 4. Finally, install the front shell assembly 200 with the assembled display screen module 100 onto the rear shell assembly 400, tighten the screws to fix it, and the whole machine structure assembly of the vehicle-mounted tablet is completed.

[0051] In this embodiment, the rear shell assembly 400 is an aluminum rear shell assembly 400, and the rear shell assembly 400 is an integrated structure. The rear shell assembly 400 is made of pure aluminum and is formed by one-piece machining. The thermal conductivity of the shell is increased from 0.2 (W / mK) of the plastic shell to 210W (m·K), which enhances the overall thermal conductivity. In addition, the rear shell assembly 400 is a full metal structure, and the back of the rear shell assembly 400 is in contact with the external air over a large area, which improves the overall heat dissipation performance, improves the external impact stress, and protects the internal motherboard assembly 300 and other components.

[0052] Please refer to Figure 6-Figure 7 , Figure 7for Figure 6 A three-dimensional structural diagram of the rear shell assembly from another perspective is shown. In this embodiment, a rear shell CPU step 450 is provided on the side of the rear shell assembly 400 close to the sealed space 200a, and the mainboard CPU module 310 is attached to the rear shell CPU step 450. A receiving groove 410 is provided on the side of the rear shell assembly 400 away from the sealed space 200a, and the semiconductor module 500 is arranged in the receiving groove 410 and the cooling surface 520 of the semiconductor module 500 is attached to the bottom wall of the receiving groove 410.

[0053] A raised rear shell CPU step 450 is provided on one side of the rear shell assembly 400 close to the sealed space 200a, i.e., on the inner side of the rear shell assembly 400, and the mainboard CPU module 310 can be attached to the rear shell CPU step 450, thereby reducing the difficulty of attaching the mainboard CPU module 310 to the rear shell assembly 400. Optionally, if there is a gap between the mainboard CPU module 310 and the rear shell CPU step 450, the gap is filled with thermal conductive silicone to exclude air, and the heat source is conducted through the rear shell. At this time, the mainboard CPU module 310 is not directly attached to the rear shell CPU step 450, but is indirectly attached to the rear shell CPU step 450 through the thermal conductive silicone.

[0054] A receiving groove 410 may be provided on the side of the rear shell component 400 that is away from the sealed space 200a, and the semiconductor module 500 may be provided in the receiving groove 410, which reduces the difficulty of assembling the semiconductor module 500 and also reduces the distance between the semiconductor module 500 and the mainboard CPU module 310. The bottom wall of the receiving groove 410 is the semiconductor cooling surface of the rear shell, and the cooling surface 520 of the semiconductor module 500 may be fixed on the semiconductor cooling surface of the rear shell by adding thermal conductive solder paste. At this time, the semiconductor module 500 is not directly attached to the semiconductor cooling surface of the rear shell, but is indirectly attached to the semiconductor cooling surface of the rear shell through the thermal conductive solder paste.

[0055] Please refer to Figure 3 and Figure 7 In this embodiment, the rear shell component 400 has a rear shell power lead via 420, and the semiconductor module 500 includes a power lead 530, and the power lead 530 passes through the rear shell power lead via 420 to be electrically connected to the mainboard component 300.

[0056] In this embodiment, a rear shell power lead via hole 420 can be opened on the bottom wall of the receiving groove 410 in the rear shell component 400, and the power lead 530 of the semiconductor module 500 can pass through the rear shell power lead via hole 420 to be electrically connected to the mainboard component 300, and the mainboard component 300 provides power. In addition, the semiconductor module 500 can cover the rear shell power lead via hole 420, so the rear shell power lead via hole 420 will not be exposed on the outer surface, which not only improves the appearance effect, but also improves the sealing and waterproof performance.

[0057] Please refer again Figure 4 In this embodiment, a sealing filler 480 is provided in the rear shell power lead through hole 420 to seal the rear shell power lead through hole 420 .

[0058] After the rear shell component 400 opens the rear shell power lead through hole 420 to allow the power lead 530 to pass through, a sealing filler 480 such as silicone can be set in the rear shell power lead through hole 420 for sealing, thereby improving the waterproof performance of the rear shell component 400 and improving the active heat dissipation stability.

[0059] Please refer to Figure 7-Figure 8 , Figure 8 Schematic diagram of the three-dimensional structure of a heat sink in one embodiment of the present application. In this embodiment, the heat sink assembly 600 includes a heat sink 610 fixed to the rear housing assembly 400, and the heat sink 610 includes a heat sink heat absorbing platform 611 that is attached to the heating surface 510 of the semiconductor module 500, and a plurality of heat sink fins 612 that are arranged on the periphery of the heat sink heat absorbing platform 611 and arranged in an array.

[0060] The heat dissipation assembly 600 may include a heat sink 610, and the heat sink 610 is fixed to the rear shell assembly 400. Optionally, the heat sink screw column 613 on the heat sink 610 is limitedly assembled with the rear shell heat sink assembly screw position 440 on the rear shell assembly 400, and fixed by screw locking. The heat sink 610 includes a heat sink heat absorbing platform 611, and the heat sink heat absorbing platform 611 can press the heating surface 510 of the semiconductor module 500, so that the heat sink 610 and the semiconductor module 500 fit. The heat sink 610 also includes a plurality of heat sink fins 612, and the plurality of heat sink fins 612 are arranged on the periphery of the heat sink heat absorbing platform 611, and the heat is dissipated by heat conduction through the heat sink fins 612, and the heat is dissipated by air convection in the gaps between the heat sink fins 612.

[0061] Please refer to Figure 7 and Fig. 9 , Fig. 9Schematic diagram of the three-dimensional structure of a fan in one embodiment of the present application. In this embodiment, the heat dissipation assembly 600 further includes a fan 620 installed on the heat dissipation element 610 away from the semiconductor module 500, and the fan 620 includes a fan power lead 622, and the fan power lead 622 passes through the rear housing assembly 400 and is electrically connected to the motherboard assembly 300.

[0062] In addition to the heat sink 610, the heat sink assembly 600 may also include a fan 620, which is located on the back of the heat sink 610 and can be fixed on the heat sink 610 by riveting. The fan 620 includes a fan power lead 622, which can also pass through the rear shell assembly 400 to be electrically connected to the motherboard assembly 300. The motherboard assembly 300 provides electrical energy, which is converted into mechanical energy to drive the fan 620 to operate. The semiconductor module 500 can adjust the cooling surface 520 effect by the speed of the fan 620, and the speed of the fan 620 is controlled by the motherboard assembly 300.

[0063] Optionally, the fan power lead 622 may also pass through the rear shell assembly 400 through the rear shell power lead via 420. The fan blades 621 of the fan 620 rotate to drive air circulation, changing the natural convection to forced air convection heat dissipation, thereby achieving the purpose of active heat dissipation, improving the heat exchange coefficient between the semiconductor module 500 heating surface 510 and the heat sink 610 and the outside world, and further improving the heat dissipation performance. In other words, the semiconductor module 500 actively cools down, and the fan 620 forces air convection to dissipate heat, thereby improving the heat exchange efficiency and the overall thermal conductivity.

[0064] Please refer to Figure 7 and Fig.10 , Fig.10 Schematic diagram of the three-dimensional structure of the protective cover in one embodiment of the present application. In this embodiment, the vehicle-mounted device 1 further includes a protective cover 700 covering the heat dissipation assembly 600, and the protective cover 700 is fixed to the housing module 400a.

[0065] In addition to the above components, the vehicle-mounted device 1 may also include a protective cover 700, which may be arranged outside the heat dissipation assembly 600 to protect the heat dissipation assembly 600. In other words, the protective cover 700 may be located on the back of the fan 620 in the heat dissipation assembly 600 and fixed to the housing module 400a to prevent damage to the heat dissipation assembly 600. Therefore, the agricultural machinery vehicle-mounted semiconductor active heat dissipation waterproof structure provided in this embodiment mainly consists of a display screen module 100, a front housing assembly 200, a mainboard assembly 300, a rear housing assembly 400, a semiconductor module 500, a heat dissipation assembly 600, and a protective cover 700.

[0066] Optionally, the side of the rear shell assembly 400 facing away from the sealed space 200a is recessed inward, and the receiving groove 410 is arranged in the recess, so the semiconductor module 500, the heat dissipation assembly 600, and the protective cover 700 are also arranged in the recess, and the top surface of the protective cover 700 is flush with the top surface of the rear shell assembly 400, thereby improving the flatness of the rear shell assembly 400.

[0067] In this embodiment, the protective cover 700 includes a top wall 740 and a side wall 750 bent and connected to the periphery of the top wall 740, the side wall 750 is fixed to the shell module 400a, the top wall 740 is provided with a plurality of air outlets 710 arranged in an array, and the side wall 750 is provided with a plurality of air inlets 720 arranged in an array.

[0068] The protective cover 700 is composed of a top wall 740 and a side wall 750. The top wall 740 is arranged corresponding to the fan 620, and a plurality of air outlets 710 arranged in an array can be arranged on the top wall 740. The side wall 750 is arranged corresponding to the side of the fan 620 and the heat sink 610, and a plurality of air inlets 720 arranged in an array can be arranged on the side wall 750. In this embodiment, the air inlets 720 and the air outlets 710 of the protective cover 700 are arranged in an array in a staggered manner, which can not only increase the air circulation, but also improve the overall aesthetics of the vehicle-mounted product, while protecting the internal heat dissipation component 600.

[0069] Optionally, the protective cover 700 can be fixed by screwing the rear shell screw position 730 on the side wall 750 with the rear shell protective cover screw position 430 on the rear shell assembly 400.

[0070] In the description of the present application, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0071] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0072] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated. It can be mechanically connected or electrically connected. It can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0073] The above describes the contents provided by the implementation methods of the present application in detail, and describes and illustrates the principles and implementation methods of the present application. These descriptions are only used to help understand the method and its core ideas of the present application. However, the contents of this specification should not be construed as limiting the present application, and those skilled in the art may make various changes and modifications to the present application without departing from the spirit and scope of the present application. These modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents.

Claims

1. A vehicle-mounted device with a heat dissipation and waterproof structure, characterized in that: The vehicle-mounted equipment includes: The display device comprises a housing module, a display screen module mounted on the housing module, and a mainboard assembly disposed in the housing module, wherein the mainboard assembly is electrically connected to the display screen module and is attached to the housing module, and the mainboard assembly can generate heat when in operation; A semiconductor module, fixed outside the housing module and electrically connected to the mainboard assembly, the semiconductor module having a cooling surface and a heating surface, the cooling surface being in contact with the housing module; and A heat dissipation component is fixed outside the housing module and is in contact with the heat-generating surface; The heat transferred from the mainboard component to the housing module can be transferred to the heat dissipation component through the semiconductor module, and the heat dissipation component is used to transfer the heat to the outside.

2. The vehicle-mounted device with a heat dissipation and waterproof structure according to claim 1, characterized in that: The shell module includes a front shell component and a rear shell component, the display screen module is arranged on the front shell component, the front shell component and the rear shell component are arranged to form a sealed space, and the mainboard component is arranged in the sealed space; the mainboard component includes a mainboard CPU module that is fitted with the rear shell component, and the mainboard CPU module is arranged correspondingly to the semiconductor module.

3. The vehicle-mounted device with a heat dissipation and waterproof structure as claimed in claim 2, characterized in that: A rear shell CPU step is provided on the side of the rear shell component close to the sealed space, and the mainboard CPU module is attached to the rear shell CPU step; a receiving groove is provided on the side of the rear shell component away from the sealed space, and the semiconductor module is arranged in the receiving groove and the cooling surface of the semiconductor module is attached to the bottom wall of the receiving groove.

4. The vehicle-mounted device with a heat dissipation and waterproof structure according to claim 2, characterized in that: The rear shell component has a rear shell power lead through hole, and the semiconductor module includes a power lead, and the power lead passes through the rear shell power lead through hole to be electrically connected to the mainboard component.

5. The vehicle-mounted device with a heat dissipation and waterproof structure as claimed in claim 4, characterized in that: A sealing filler is arranged in the rear shell power lead through hole to seal the rear shell power lead through hole.

6. The vehicle-mounted device with a heat dissipation and waterproof structure according to claim 2, characterized in that: The heat dissipation assembly includes a heat sink fixed to the rear shell assembly, and the heat sink includes a heat sink heat absorbing platform in contact with the heat generating surface of the semiconductor module, and a plurality of heat sink fins arranged at the periphery of the heat sink heat absorbing platform and arranged in an array.

7. The vehicle-mounted device with a heat dissipation and waterproof structure according to claim 6, characterized in that: The heat dissipation assembly further comprises a fan installed on the heat dissipation element away from the semiconductor module. The fan comprises a fan power lead, and the fan power lead passes through the rear shell assembly and is electrically connected to the mainboard assembly.

8. The vehicle-mounted device with a heat dissipation and waterproof structure as claimed in claim 2, characterized in that: The rear shell component is an aluminum rear shell component, and the rear shell component is an integrated structure.

9. The vehicle-mounted device with a heat dissipation and waterproof structure according to claim 1, characterized in that: The vehicle-mounted device further comprises a protective cover which is arranged on the heat dissipation component, and the protective cover is fixed to the housing module.

10. The vehicle-mounted device with a heat dissipation and waterproof structure according to claim 9, characterized in that: The protective cover includes a top wall and a side wall bent and connected to the periphery of the top wall, the side wall is fixed to the shell module, the top wall is provided with a plurality of air outlets arranged in an array, and the side wall is provided with a plurality of air inlets arranged in an array.

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