Memory card packaging structure

By adopting the sliding connection between the slide chute and the substrate in the memory card packaging structure, and combining multiple heat dissipation strips and heat dissipation mechanisms of the heat dissipation plates, the problem of poor heat dissipation and susceptibility to external forces during use is solved, and more efficient heat dissipation and convenient installation and disassembly are achieved, extending the service life of the memory card.

CN222883067UActive Publication Date: 2025-05-16SHENZHEN DOUDAN TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202421628064.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-10
Publication Date
2025-05-16
Estimated Expiration
2034-07-10

AI Technical Summary

Technical Problem

The existing memory card packaging structure is easily subjected to external force to deform or damage during use, and the heat dissipation effect is poor, resulting in a low service life of the memory card.

Method used

A memory card packaging structure is designed, adopting a sliding connection between the slide chute and the substrate, combined with a heat dissipation mechanism, including multiple heat dissipation strips and heat dissipation plates, and bonding to the memory card through the heat dissipation strips, heat is transmitted to the heat dissipation plate and heat is derived through the heat dissipation port.

Benefits of technology

It improves the heat dissipation efficiency of the memory card, extends its service life, and facilitates installation and disassembly, avoiding damage to the memory card during installation or disassembly.

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Abstract

The utility model relates to the technical field of memory card packaging, and particularly discloses a memory card packaging structure which comprises a shell, sliding grooves are fixed on two sides in the shell, the sliding grooves are connected with a substrate in a sliding mode, the substrate is internally connected with a memory card, the shell is connected with a heat dissipation mechanism below the substrate, the substrate is provided with a clamping groove, and the clamping groove is connected with the memory card. A clamping groove is formed in the shell, a supporting net plate is fixed to the bottom of the clamping groove, a plurality of openings are formed in the supporting net plate at intervals, the heat dissipation mechanism comprises two heat dissipation plates, the two heat dissipation plates are located below the sliding groove and slidably connected with the shell, a plurality of heat dissipation strips arranged at intervals are fixedly connected between the two heat dissipation plates, and the heat dissipation strips are matched with the openings. The top of the heat dissipation strip is attached to the memory card. The heat dissipation efficiency of the memory card is improved, the service life of the memory card is prolonged, meanwhile, assembly and disassembly are convenient, connection is stable, and the memory card can be effectively prevented from being damaged during assembly or disassembly.
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Description

Technical Field

[0001] The utility model relates to the technical field of memory card packaging, in particular to a memory card packaging structure. Background Art

[0002] Memory cards have the characteristics of small size, large capacity, fast speed, high reliability, long life, rewritable and easy to carry, and are widely used in electronic products such as digital cameras, mobile phones, laptops, music players, game consoles, etc.

[0003] Most existing memory card packaging structures use heat dissipation holes to facilitate heat dissipation during use. However, during assembly and maintenance, they are easily deformed or damaged by external forces, so the heat sink is designed to be thicker, which in turn affects the heat dissipation effect, thereby shortening the service life of the memory card.

[0004] Therefore, those skilled in the art provide a memory card packaging structure to solve the problems raised in the above background technology. Utility Model Content

[0005] The purpose of the utility model is to provide a memory card packaging structure to solve the following technical problems:

[0006] How to improve the heat dissipation efficiency of memory cards and extend their service life.

[0007] The purpose of the utility model can be achieved through the following technical solutions:

[0008] The memory card packaging structure comprises a shell, wherein two sides of the shell are fixed with slide grooves, the slide grooves are slidably connected to a substrate, the substrate is connected with a memory card, and the shell is located below the substrate and is connected with a heat dissipation mechanism;

[0009] The base plate is provided with a card slot, a supporting mesh plate is fixed at the bottom of the card slot, and a plurality of openings are provided on the supporting mesh plate at intervals;

[0010] The heat dissipation mechanism includes two heat dissipation plates, which are located below the slide slot and are slidably connected to the shell. A plurality of heat dissipation strips arranged at intervals are fixedly connected between the two heat dissipation plates. The heat dissipation strips cooperate with the openings, and the tops of the heat dissipation strips fit with the memory card.

[0011] Furthermore, a connecting rod is fixed to the bottom of the two heat dissipation plates, a connecting plate is fixedly connected to the bottom of the two connecting rods, a spring is fixedly connected between the heat dissipation plate and the shell, and the spring is sleeved on the outside of the connecting rod.

[0012] Furthermore, fixing plates are fixed on both sides of the base plate, and the fixing plates are slidably connected to the sliding grooves.

[0013] Furthermore, through holes are provided on both sides of the fixing plate, and clamping posts are fixed on both sides of the heat dissipation plate, and the clamping posts are clamped with the through holes in cooperation with each other.

[0014] Furthermore, a heat dissipation mesh plate is provided on the top of the shell, and heat dissipation openings are provided on both sides of the shell, and the heat dissipation openings are in the shape of long strips.

[0015] Furthermore, a cavity is provided at the bottom of the shell, the cavity cooperates with the connecting plate, and the connecting plate is embedded in the outer side of the shell.

[0016] Furthermore, a packaging plate is connected to one side of the shell, and the packaging plate is used to package the interior of the shell.

[0017] Beneficial effects of the utility model:

[0018] (1) The utility model is provided with a heat dissipation mechanism, which can improve the heat dissipation efficiency of the memory card. When in use, a plurality of heat dissipation strips are attached to the bottom of the memory card to conduct heat to the heat dissipation plates on both sides. The heat dissipation plates are away from the memory card and cooperate with the heat dissipation ports to effectively conduct heat and dissipate heat. A heat dissipation mesh port is provided to effectively dissipate heat from the upper and lower surfaces of the memory card, thereby extending its service life.

[0019] (2) The utility model is provided with a heat dissipation mechanism, which is convenient for heat dissipation and can also improve the convenience of installing and removing the memory card. During installation, the memory card is placed in the card slot, and after slightly pulling the connecting plate downward, the fixed plate is plugged into the sliding slot. At this time, the connecting plate is released, and the clamping column is plugged into the through hole of the fixed plate to fix the fixed plate. During disassembly, the connecting plate is pulled downward, and the clamping column is separated from the through hole of the fixed plate, and the base plate can be pulled out. The installation and disassembly are convenient, and the connection is stable. At the same time, the memory card can be effectively prevented from being damaged during installation or disassembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The utility model is further described below in conjunction with the accompanying drawings.

[0021] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0022] Figure 2 It is an explosion analysis diagram of the utility model;

[0023] Figure 3 It is a schematic diagram of the internal connection structure of the utility model;

[0024] Figure 4 It is a three-dimensional structural schematic diagram of the connection between the substrate and the memory card of the utility model;

[0025] Figure 5 It is a schematic diagram of the connection structure of the heat dissipation mechanism of the utility model.

[0026] Reference numerals:

[0027] 1. Shell; 2. Heat dissipation mechanism; 21. Snap-on column; 22. Heat dissipation plate; 23. Heat dissipation strip; 24. Connecting plate; 25. Connecting rod; 26. Spring; 3. Base plate; 4. Memory card; 31. Supporting mesh plate;

[0028] 32. slot; 33. through hole; 34. fixing plate; 35. opening; 11. cavity; 12. packaging plate;

[0029] 13. Slide groove; 14. Heat dissipation mesh plate; 15. Heat dissipation port. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] Please refer to the attached Figure 1-5 The memory card packaging structure in the embodiment of the utility model comprises a housing 1, wherein slide grooves 13 are fixed on both sides of the housing 1, wherein the slide grooves 13 are slidably connected to a substrate 3, wherein a memory card 4 is connected inside the substrate 3, wherein the housing 1 is located below the substrate 3 and is connected to a heat dissipation mechanism 2, wherein the substrate 3 is used to install the memory card 4, and wherein the heat dissipation mechanism 2 cooperates with the substrate 3 to effectively dissipate heat from the memory card 4 and extend its service life;

[0032] The base plate 3 is provided with a card slot 32, a support mesh plate 31 is fixed at the bottom of the card slot 32, and a plurality of openings 35 are provided at intervals on the support mesh plate 31, and the support mesh plate 31 can assist in heat dissipation while providing support;

[0033] The heat dissipation mechanism 2 includes two heat dissipation plates 22, which are located below the slide groove 13 and are slidably connected to the shell 1. A plurality of heat dissipation strips 23 arranged at intervals are fixedly connected between the two heat dissipation plates 22. The heat dissipation strips 23 are heat-conducting metals commonly used in the prior art. The heat dissipation strips 23 cooperate with the openings 35, and the top of the heat dissipation strips 23 fits with the memory card 4. A heat dissipation mesh plate 14 is provided above the shell 1, thereby improving the heat dissipation efficiency of the upper and lower surfaces of the memory card 4 and extending its service life.

[0034] A connecting rod 25 is fixed at the bottom of the two heat sinks 22, and a connecting plate 24 is fixedly connected to the bottom of the two connecting rods 25. A spring 26 is fixedly connected between the heat sink 22 and the shell 1. The spring 26 is sleeved on the outside of the connecting rod 25. When the connecting plate 24 is pulled outward, the spring 26 is squeezed downward by the heat sink 22. When the pulling of the connecting plate 24 stops, the connecting plate 24 opens under the action of the spring 26, and then the connecting plate 24 is reset.

[0035] The base plate 3 is fixed with fixing plates 34 on both sides, and the fixing plates 34 are slidably connected with the slide groove 13. Through holes 33 are opened on both sides of the fixing plates 34. The heat dissipation plate 22 is fixed with clamping posts 21 on both sides, and the clamping posts 21 and the through holes 33 cooperate and clamp with each other, so as to limit the base plate 3, enhance its connection stability in the shell 1, and facilitate installation and disassembly. When installing, place the memory card 4 in the card slot 32, and after slightly pulling the connecting plate 24 downward, the fixing plate 34 is plugged into the slide groove 13. At this time, the connecting plate 24 is released, and the clamping posts 21 are plugged into the through holes 33 of the fixing plate 34 to fix the fixing plate 34. When disassembling, pull the connecting plate 24 downward, the clamping posts 21 are separated from the through holes 33 of the fixing plate 34, and the base plate 3 can be pulled out.

[0036] Heat dissipation openings 15 are provided on both sides of the housing 1. The heat dissipation openings 15 are in a long strip shape and can effectively dissipate heat from the heat dissipation plate 22 after being heated, thereby improving the heat dissipation efficiency.

[0037] A cavity 11 is provided at the bottom of the shell 1 , and the cavity 11 cooperates with the connecting plate 24 . The connecting plate 24 is embedded in the outer side of the shell 1 and does not occupy external space, so that the connecting plate 24 can be pulled through the cavity 11 , which is convenient to use.

[0038] A packaging plate 12 is connected to one side of the shell 1, and the packaging plate 12 is used to package the inside of the shell 1. The packaging plate 12 can be detachably connected or rotatably connected. When detachably connected, a card block is fixed on one side of the packaging plate 12 and is engaged with the unpackaged side of the shell 1. Both the detachable connection and the rotatable connection are existing technologies, and their purpose is to seal the inside of the shell 1 to prevent dust from easily entering its interior and affecting its normal use.

[0039] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A memory card packaging structure, comprising a housing (1), characterized in that: Slide grooves (13) are fixed on both sides of the shell (1), the slide grooves (13) are slidably connected to a base plate (3), a memory card (4) is connected inside the base plate (3), and the shell (1) is located below the base plate (3) and is connected to a heat dissipation mechanism (2); The base plate (3) is provided with a slot (32), a supporting mesh plate (31) is fixed at the bottom of the slot (32), and a plurality of openings (35) are provided at intervals on the supporting mesh plate (31); The heat dissipation mechanism (2) comprises two heat dissipation plates (22), the two heat dissipation plates (22) are located below the slide slot (13) and are slidably connected to the housing (1), a plurality of heat dissipation bars (23) arranged at intervals are fixedly connected between the two heat dissipation plates (22), the heat dissipation bars (23) and the openings (35) cooperate with each other, and the top of the heat dissipation bars (23) fits the memory card (4).

2. The memory card packaging structure according to claim 1, characterized in that: A connecting rod (25) is fixed at the bottom of each of the two heat dissipation plates (22), a connecting plate (24) is fixedly connected to the bottom of the two connecting rods (25), a spring (26) is fixedly connected between the heat dissipation plate (22) and the housing (1), and the spring (26) is sleeved on the outside of the connecting rod (25).

3. The memory card packaging structure according to claim 1, characterized in that: Fixed plates (34) are fixed on both sides of the base plate (3), and the fixed plates (34) are slidably connected to the slide groove (13).

4. The memory card packaging structure according to claim 3, characterized in that: Through holes (33) are provided on both sides of the fixing plate (34), and clamping columns (21) are fixed on both sides of the heat dissipation plate (22), and the clamping columns (21) and the through holes (33) are mutually engaged and clamped.

5. The memory card packaging structure according to claim 1, characterized in that: A heat dissipation mesh plate (14) is provided on the upper side of the shell (1), and heat dissipation openings (15) are provided on both sides of the shell (1), wherein the heat dissipation openings (15) are in the shape of long strips.

6. The memory card packaging structure according to claim 2, characterized in that: The bottom of the shell (1) is provided with a cavity (11), the cavity (11) and the connecting plate (24) cooperate with each other, and the connecting plate (24) is embedded in the outer side of the shell (1).

7. The memory card packaging structure according to claim 1, characterized in that: A packaging plate (12) is connected to one side of the shell (1), and the packaging plate (12) is used to package the interior of the shell (1).