Heat dissipation bottom plate

Abstract

The utility model discloses a heat dissipation bottom plate which comprises a heat dissipation bottom plate body and a plurality of columnar pin fins, and each columnar pin fin comprises a first end face and a second end face. The first end face is fixed to the first surface of the heat dissipation bottom plate body, and the surfaces of the columnar pin fins serve as current conversion surfaces. In the extending direction from the first end face to the second end face, the columnar pin fins are formed by sweeping a first cross section along a first line, the first line comprises a bent structure of a two-dimensional structure or a three-dimensional structure, and the bent structure serves as a first commutation surface increasing structure. Under the condition that the density and the distribution of the pin fins are not changed, the commutation surface area of the whole columnar pin fins is fully increased, the commutation efficiency is improved, and therefore the heat dissipation capacity of the heat dissipation bottom plate can be effectively improved.

Description

Technical Field

[0001] The utility model relates to a semiconductor device module, in particular to a heat dissipation base plate. Background Art

[0002] Pin fin heat sink copper baseplate is commonly used in HPD modules and plastic encapsulated automotive modules. Currently, the most common pin fin shape is columnar, and the common cross-section shapes are round, oval, and diamond. The pin fin and the copper baseplate are combined by cold heading or welding. Compared with flat modules, pin fin heat sink modules can be directly installed on the radiator without the need to apply thermal grease, which increases the heat dissipation efficiency.

[0003] The existing commonly used heat dissipation baseplate mainly changes the shape and distribution of the cross section of the pin fins. For example, the utility model patent CN220731510U and the invention patent applications CN117769211A and CN117747563A disclose a technical solution for changing the shape and distribution of the cross section of each pair of pin fins. The disadvantage of the existing technical solution for changing the shape and distribution of the cross section of the pin fins is that while increasing the commutation efficiency, it will increase the weight of the heat dissipation baseplate, bringing high requirements for installation. In addition, due to the limited processing accuracy, the pin fin density of the copper baseplate is limited, and the heat dissipation capacity of the baseplate cannot be further improved. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide a heat dissipation base plate, which can fully increase the commutation surface area of ​​the overall columnar pin fins without changing the density and distribution of the pin fins, improve the commutation efficiency, and thus effectively improve the heat dissipation capacity of the heat dissipation base plate.

[0005] In order to solve the above technical problems, the heat dissipation base plate provided by the utility model includes a heat dissipation base plate body and a plurality of columnar pin fins, each of the columnar pin fins includes a first end surface and a second end surface.

[0006] The first end surface is fixed on the first surface of the heat dissipation base plate body, and the surface of the columnar pin fin serves as a commutation surface.

[0007] In the extension direction from the first end face to the second end face, the columnar pin fin is formed by sweeping a first cross section along a first line, wherein the first line includes a curved structure in a two-dimensional structure or a three-dimensional structure, and the curved structure serves as a first commutation surface adding structure.

[0008] A further improvement is that the two-dimensional structure of the curved structure includes a first fold line or a second curve;

[0009] The line ends of each straight line segment in the first fold line are directly connected;

[0010] The line ends of each straight line segment in the second curve are connected by an arc line.

[0011] A further improvement is that the three-dimensional structure of the curved structure includes: a spiral line.

[0012] A further improvement is that the height of the columnar pin fin is 3 mm to 10 mm, and the height of the columnar pin fin is the straight-line distance between the first end face and the second end face.

[0013] A further improvement is that the surface of the columnar pin fin is provided with a plurality of protruding structures or a plurality of concave structures.

[0014] Each of the protruding structures serves as a second type of flow-conversion surface increasing structure.

[0015] Each of the concave structures serves as a third type of flow-conversion surface-adding structure.

[0016] A further improvement is that the first line includes a first straight line segment and a second straight line segment.

[0017] The first straight line segment is connected between the first end surface and the curved structure, and the second straight line segment is connected between the curved structure and the second end surface.

[0018] The first straight line segment and the second straight line segment are both perpendicular to the first surface, and the first straight line segment and the second straight line segment are aligned and located on the same straight line.

[0019] A further improvement is that the first cross section is circular, elliptical, diamond-shaped or raindrop-shaped.

[0020] A further improvement is that a plurality of the columnar pin-fin arrays are arranged to form a heat dissipation pin-fin area.

[0021] The second surface of the heat dissipation base plate body is opposite to the first surface, and one or more heat dissipation target areas are arranged on the second surface.

[0022] The corresponding heat dissipation pin-fin area is arranged on the first surface opposite to each heat dissipation target area, and the coverage area of ​​the heat dissipation pin-fin area is greater than or equal to the area of ​​the heat dissipation target area.

[0023] A further improvement is that the heat dissipation target area is a chip area where chips are mounted.

[0024] A further improvement is that the array in the heat dissipation pin-fin area includes a plurality of columnar pin-fin rows and a plurality of columnar pin-fin columns.

[0025] In the heat dissipation pin-fin area, the columnar pin-fins in each row of the columnar pin-fins are completely aligned, and the columnar pin-fins in each column of the columnar pin-fins are completely aligned.

[0026] Alternatively, in the heat dissipation pin-fin area, the columnar pin-fins in two adjacent rows of the columnar pin-fins are staggered with each other, and the columnar pin-fins in two adjacent columns of the columnar pin-fins are staggered with each other.

[0027] A further improvement is that the fixing structure of the first end surface fixed to the first surface of the heat dissipation base plate body includes: a welding structure, an adhesive structure, a press-fit structure or an integrally formed structure.

[0028] Compared with the prior art in which the columnar pin fins are straight columnar structures, i.e., structures formed by sweeping the cross section along a straight line, the columnar pin fins of the utility model are formed by sweeping a first cross section along a first line with a curved structure. The curved structure can increase the surface area of ​​the columnar pin fins, i.e., the commutation surface, thereby improving the commutation efficiency. The commutation surface is the surface that will come into contact with the coolant to achieve heat exchange. Therefore, the improvement in commutation efficiency is also the improvement in heat dissipation efficiency. Therefore, the utility model can effectively improve the heat dissipation capacity of the heat dissipation base plate.

[0029] At the same time, the curved structure provided in the columnar pin fins of the utility model is completely independent of the array structure of the columnar pin fins, and is therefore irrelevant to the distribution density and specific distribution structure of the pin fins. Therefore, the utility model can effectively improve the heat dissipation capacity of the heat dissipation base plate without changing the density and distribution of the pin fins.

[0030] The first cross-section of the utility model can adopt any suitable cross-sectional structure in the prior art, that is, the first cross-sectional structure of the utility model can be used in various cross-sectional structures. Therefore, the improvement of the columnar pin fins of the utility model is also independent of any specific cross-sectional structure and is not limited by the specific cross-sectional structure. When a specific cross-sectional structure is selected, the heat dissipation capacity of the heat dissipation base can be effectively improved without changing the cross-sectional structure.

[0031] The utility model can further arrange a protruding structure or a recessed structure in the columnar pin fins. The protruding structure or the recessed structure can further increase the exchange area, that is, increase the contact area between the coolant and the columnar pin fins. On this basis, the heat transfer efficiency of the coolant can also be improved at the same time, thereby further effectively improving the heat dissipation capacity of the heat dissipation substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The present invention is further described in detail below with reference to the accompanying drawings and specific embodiments:

[0033] Figure 1 It is a side view of an existing heat dissipation base plate;

[0034] Figure 2 It is a side view of the heat dissipation base plate of the first embodiment of the utility model;

[0035] Figure 3A-3CIt is various structural diagrams of the first line of the columnar pin fin of the heat dissipation base plate of the first embodiment of the utility model;

[0036] Figure 4A-4D 1 is a diagram of various structures of a first cross section of a columnar pin fin of a heat dissipation base plate of a first embodiment of the utility model;

[0037] Figure 5A It is a side view of the heat dissipation base plate of the second embodiment of the utility model;

[0038] Figure 5B It is a side view of the heat dissipation base plate of the third embodiment of the utility model;

[0039] Figure 5C It is a side view of the heat dissipation base plate of the fourth embodiment of the utility model;

[0040] Fig. 6A yes Figure 1 The heat dissipation effect simulation diagram of the existing heat dissipation base plate shown;

[0041] Figure 6B yes Figure 2 The heat dissipation effect simulation diagram of the heat dissipation base plate of the first embodiment of the utility model is shown. DETAILED DESCRIPTION

[0042] like Figure 2 , is a side view of the heat dissipation base plate of the first embodiment of the utility model; the heat dissipation base plate of the utility model embodiment includes a heat dissipation base plate body 201 and a plurality of columnar pin fins 202, and each columnar pin fin 202 includes a first end face and a second end face.

[0043] The first end surface is fixed on the first surface of the heat dissipation base plate body 201, and the surface of the columnar pin fin 202 serves as a commutation surface.

[0044] In some embodiments, the fixing structure of the first end surface on the first surface of the heat dissipation base plate body 201 includes: a welding structure, an adhesive structure, a press-fit structure or an integrally formed structure.

[0045] In the extension direction from the first end face to the second end face, the columnar pin fin 202 is formed by sweeping the first cross section along the first line, and the first line includes a curved structure in a two-dimensional structure or a three-dimensional structure, and the curved structure serves as a first commutation surface increasing structure.

[0046] In the first embodiment of the utility model, the curved structure can be varied in various ways. In some varied embodiments, the curved structure is a two-dimensional structure, and the two-dimensional structure includes a first fold line or a second curve.

[0047] Figure 3A The first structure of the curved structure is shown, e.g. Figure 3AAs shown, the curved structure 301a adopts a first fold line, and the ends of each straight line segment in the first fold line are directly connected.

[0048] Figure 3B The second structure of the curved structure is shown, e.g. Figure 3B As shown, the curved structure 301b adopts a second curve, and the ends of each straight line segment in the second curve are connected by an arc line.

[0049] In some variations of the embodiments, the curved structure is a three-dimensional structure, and the three-dimensional structure includes: a spiral line.

[0050] Figure 3C A third structure of the curved structure is shown, e.g. Figure 3C As shown, the curved structure 301c is a spiral line.

[0051] In some embodiments, the height of the columnar pin fin 202 is 3 mm to 10 mm, and the height of the columnar pin fin 202 is the straight line distance between the first end surface and the second end surface. The height of the columnar pin fin 202 can be appropriately changed according to actual applications.

[0052] In the first embodiment of the present invention, the first line includes a first straight line segment and a second straight line segment.

[0053] The first straight line segment is connected between the first end surface and the curved structure, and the second straight line segment is connected between the curved structure and the second end surface.

[0054] The first straight line segment and the second straight line segment are both perpendicular to the first surface, and the first straight line segment and the second straight line segment are aligned and located on the same straight line.

[0055] Figure 3A In FIG. 1 , the first straight line segment is indicated by reference numeral 302a; Figure 3B In FIG. 1 , the first straight line segment is indicated by reference numeral 302 b ; Figure 3C In FIG. 3 , the first straight line segment is denoted by reference numeral 302c.

[0056] Figure 3A In FIG. 1 , the second straight line segment is indicated by reference numeral 303a; Figure 3B In FIG. 1 , the second straight line segment is indicated by a mark 303 b ; Figure 3C In FIG. 3 , the second straight line segment is denoted by mark 303c.

[0057] In other embodiments, one or both of the first straight line segment and the second straight line segment may be omitted.

[0058] In the first embodiment of the present invention, the first cross section can adopt various suitable shapes, for example, the first cross section is circular, elliptical, diamond or raindrop-shaped. FIG. 4A to FIG. 4D Various structural diagrams showing the first cross section of the columnar pin fins of the heat dissipation base plate of the first embodiment of the utility model; Figure 4A As shown, the first cross section is circular 304a; Figure 4B As shown, the first cross section is an ellipse 304b; Figure 4C As shown, the first cross section is a diamond shape 304c; Figure 4D As shown, the first cross section is a raindrop shape 304d. In some embodiments, the radius or side length of the first cross section can be 0.5mm to 4mm; for example, the radius of the circle 304a is 0.5mm to 4mm; the side length of the diamond 304c is 0.5mm to 4mm; the ellipse 304b and the raindrop shape 304d can also be set with corresponding lateral dimensions as needed.

[0059] Back to Figure 2 As shown, in the first embodiment of the present invention, a plurality of columnar pin-fins 202 are arranged in an array to form a heat dissipation pin-fin area 203 .

[0060] The second surface of the heat dissipation base plate body 201 is opposite to the first surface, and one or more heat dissipation target areas are arranged on the second surface. Figure 2 In the figure, the first surface is the lower surface of the heat dissipation base plate body 201 and is also the heat dissipation surface; the second surface is the upper surface of the heat dissipation base plate body 201.

[0061] In some embodiments, the heat dissipation target area is a chip area where a chip is mounted. Figure 2 As shown, a chip 205 is arranged in the chip area, and the chip 205 includes a power device chip. The chip 205 is usually arranged on a surface of an insulating substrate 204, and the other surface of the insulating substrate 204 is arranged on a second surface. Usually, the insulating substrate 204 includes multiple chip areas and multiple chips 205 are arranged. Figure 2 Only one chip region and a corresponding chip 205 are shown.

[0062] A corresponding heat dissipation pin-fin area 203 is arranged on the first surface opposite to each heat dissipation target area, and the coverage area of ​​the heat dissipation pin-fin area 203 is greater than or equal to the area of ​​the heat dissipation target area.

[0063] In some embodiments, after the chip 205 is placed on the insulating substrate 204, it is connected by welding, sintering, pressing, etc. The front side of the chip 205 can be interconnected by bonding, welding clip, etc. The insulating substrate 204 is connected to the upper surface of the heat dissipation base body 201, that is, the second surface, by welding, sintering, etc.

[0064] The array in the heat dissipation pin-fin area 203 includes a plurality of columnar pin-fin rows and a plurality of columnar pin-fin columns.

[0065] In actual use, the heat dissipation pin-fin area 203 will be inserted into the coolant, and the coolant will flow in from the coolant inlet and out from the coolant outlet. During the flow of the coolant, the coolant contacts and exchanges heat with the surface of each columnar pin-fin 202 to achieve heat dissipation. In some embodiments, after the heat dissipation pin-fin area 203 is inserted into the coolant, the coolant inlet and the coolant outlet are respectively located at the two ends of the heat dissipation base plate body 201.

[0066] In some embodiments, in the heat dissipation pin-fin area 203 , the columnar pin-fins 202 in each columnar pin-fin row are completely aligned, and the columnar pin-fins 202 in each columnar pin-fin column are completely aligned.

[0067] In some embodiments, the columnar pin fins 202 of two adjacent rows of columnar pin fins in the heat dissipation pin-fin area 203 are staggered, and the columnar pin fins 202 of two adjacent columns of columnar pin fins are staggered; the staggered structure is conducive to controlling the flow of the coolant and facilitating heat dissipation. In some more specific embodiments, the staggered spacing of the columnar pin fins 202 of two adjacent rows of columnar pin fins is 0.5mm to 4mm; the staggered spacing of the columnar pin fins 202 of two adjacent columns of columnar pin fins is 0.5mm to 4mm.

[0068] In some embodiments, the material of each columnar pin fin 202 includes copper, copper alloy, aluminum, aluminum alloy, etc. The material of the heat dissipation base body 201 also includes copper, copper alloy, aluminum, aluminum alloy, etc. The material of each columnar pin fin 202 and the material of the heat dissipation base body 201 are usually the same, but can also be different.

[0069] Compared with the prior art in which the columnar pin fins 202 are straight columnar structures, i.e., structures formed by sweeping the cross section along a straight line, the columnar pin fins 202 of the first embodiment of the utility model are formed by sweeping the first cross section along a first line with a curved structure. The curved structure can increase the surface area of ​​the columnar pin fins 202, i.e., the commutation surface, thereby improving the commutation efficiency. The commutation surface is also the surface that will come into contact with the coolant to achieve heat exchange. Therefore, the improvement in commutation efficiency is also the improvement in heat dissipation efficiency. Therefore, the first embodiment of the utility model can effectively improve the heat dissipation capacity of the heat dissipation base plate.

[0070] At the same time, the bending structure set in the columnar pin fins 202 in the first embodiment of the utility model is completely independent of the array structure of the columnar pin fins 202, and is therefore irrelevant to the distribution density and specific distribution structure of the pin fins. Therefore, the first embodiment of the utility model can effectively improve the heat dissipation capacity of the heat dissipation base plate without changing the density and distribution of the pin fins.

[0071] The first cross-section of the first embodiment of the utility model can adopt any suitable cross-sectional structure in the prior art, that is, the first cross-section of the first embodiment of the utility model can be used in various cross-sectional structures. Therefore, the improvement of the columnar pin fins 202 of the first embodiment of the utility model is also independent of any specific cross-sectional structure and is not limited by the specific cross-sectional structure. When a specific cross-sectional structure is selected, the heat dissipation capacity of the heat dissipation base plate can be effectively improved without changing the cross-sectional structure.

[0072] The key to the first embodiment of the utility model is to optimize the structure of the base plate pin fins in the height direction, fully increase the commutation area of ​​the overall pin fins without changing the density and distribution of the pin fins, and improve the commutation efficiency; effectively reduce the junction-water thermal resistance of the device, improve the outflow capacity of the device, and reduce the operating junction temperature of the device.

[0073] exist Figure 2 On the basis of the first embodiment of the utility model shown, further improvements can be made to obtain more embodiments, and the improved features include: the surface of the columnar pin fin 202 is provided with multiple protrusion structures or multiple concave structures. Each protrusion structure is used as a second type of commutation surface increase structure. Each concave structure is used as a third type of commutation surface increase structure. The following is a further description of the embodiments formed by each group combination of the protrusion structure and the concave structure:

[0074] like Figure 5A FIG. 2 is a side view of a heat dissipation base plate according to a second embodiment of the present invention; Figure 5A In the embodiment, a plurality of recessed structures are provided on the surface of the columnar pin fin 202; and Figure 2 The surface of the middle columnar pin fin 202 is a smooth structural deformation, and the concave structure can obviously further increase the commutation surface.

[0075] like Figure 5B FIG. 2 is a side view of a heat dissipation base plate according to a third embodiment of the present utility model; Figure 5B In the embodiment, a plurality of protrusion structures are provided on the surface of the columnar pin fin 202; and Figure 2 The surface of the middle columnar pin fin 202 is a smooth structural deformation, and the protruding structure can obviously further increase the commutation surface.

[0076] like Figure 5C FIG. 2 is a side view of a heat dissipation base plate according to a fourth embodiment of the present utility model; Figure 5C In the embodiment, a plurality of protrusion structures and a plurality of recessed structures are simultaneously provided on the surface of the columnar pin fin 202; and Figure 2 The surface of the middle columnar pin fin 202 is a smooth structural deformation, and the convex structure and the concave structure can obviously further increase the commutation surface.

[0077] The raised structure or recessed structure in the second to fourth embodiments of the utility model can further increase the exchange area, that is, increase the contact area between the coolant and the columnar pin fins. On this basis, it can also improve the heat transfer efficiency of the coolant at the same time, thereby further effectively improving the heat dissipation capacity of the heat dissipation substrate.

[0078] like Fig. 6A As shown, Figure 1 The heat dissipation effect simulation diagram of the existing heat dissipation base plate shown; Fig. 6A In the embodiment, the heat dissipation base body is indicated by the mark 401a, the columnar pin fin is indicated by the mark 402a, and the chip is indicated by the mark 403a. The columnar pin fin corresponding to the mark 402a is Figure 1 The simulation diagram of the columnar pin fin 102 in FIG. 1 shows that the maximum temperature of the chip is about 180°C. Fig. 6A The temperature of one point is shown to be 179.850℃.

[0079] like Figure 6B As shown, Figure 2 The heat dissipation effect simulation diagram of the heat dissipation base plate of the first embodiment of the utility model is shown. Figure 6B In the embodiment, the heat dissipation base body is indicated by the mark 401b, the columnar pin fin is indicated by the mark 402b, and the chip is indicated by the mark 403b; the columnar pin fin corresponding to the mark 402b is Figure 2 The simulation diagram of the columnar pin fin 202 in FIG. 1 shows that the maximum temperature of the chip is about 173°C. Fig. 6A The temperature of a point is shown to be 173.415°C. It can be seen that under the condition that other structures remain unchanged, such as the cross-section of the array structure and the columnar pin fins are the same, the first embodiment of the utility model can reduce the temperature of the chip by about 7°C by setting a bending structure for the columnar pin fins, so the heat dissipation efficiency of the structure of the first embodiment of the utility model is improved.

[0080] The present invention is described in detail above through specific embodiments, but these do not constitute a limitation of the present invention. Without departing from the principle of the present invention, those skilled in the art may make many modifications and improvements, which should also be regarded as the protection scope of the present invention.

Claims

1. A heat dissipation base plate, characterized in that: It includes a heat dissipation base plate body and a plurality of columnar pin fins, each of the columnar pin fins includes a first end surface and a second end surface; The first end surface is fixed to the first surface of the heat dissipation base plate body, and the surface of the columnar pin fin serves as a commutation surface; In the extension direction from the first end face to the second end face, the columnar pin fin is formed by sweeping a first cross section along a first line, wherein the first line includes a curved structure in a two-dimensional structure or a three-dimensional structure, and the curved structure serves as a first commutation surface adding structure.

2. The heat dissipation base plate according to claim 1, characterized in that: The two-dimensional structure of the curved structure includes a first fold line or a second curve; The line ends of each straight line segment in the first fold line are directly connected; The line ends of each straight line segment in the second curve are connected by an arc line.

3. The heat dissipation base plate according to claim 1, characterized in that: The three-dimensional structure of the curved structure includes: a spiral line.

4. The heat dissipation base plate according to claim 1, characterized in that: The height of the columnar pin fin is 3 mm to 10 mm, and the height of the columnar pin fin is the straight-line distance between the first end surface and the second end surface.

5. The heat dissipation base plate according to claim 1, characterized in that: The surface of the columnar pin fin is provided with a plurality of protruding structures or a plurality of concave structures; Each of the protruding structures serves as a second type of flow-changing surface-adding structure; Each of the recessed structures serves as a third type of commutation surface increasing structure.

6. The heat dissipation base plate according to claim 1, characterized in that: The first line includes a first straight line segment and a second straight line segment; The first straight line segment is connected between the first end surface and the curved structure, and the second straight line segment is connected between the curved structure and the second end surface; The first straight line segment and the second straight line segment are both perpendicular to the first surface, and the first straight line segment and the second straight line segment are aligned and located on the same straight line.

7. The heat dissipation base plate according to claim 1, characterized in that: The first cross section is circular, elliptical, diamond-shaped or raindrop-shaped.

8. The heat dissipation base plate according to claim 1, characterized in that: A plurality of the columnar pin-fin arrays are arranged to form a heat dissipation pin-fin area; The second surface of the heat dissipation base plate body is opposite to the first surface, and one or more heat dissipation target areas are arranged on the second surface; The corresponding heat dissipation pin-fin area is arranged on the first surface opposite to each heat dissipation target area, and the coverage area of ​​the heat dissipation pin-fin area is greater than or equal to the area of ​​the heat dissipation target area.

9. The heat dissipation base plate according to claim 8, characterized in that: The heat dissipation target area is a chip area where chips are mounted.

10. The heat dissipation base plate according to claim 8, characterized in that: The array in the heat dissipation pin-fin area includes a plurality of columnar pin-fin rows and a plurality of columnar pin-fin columns; In the heat dissipation pin-fin area, the columnar pin-fins in each row of the columnar pin-fins are completely aligned, and the columnar pin-fins in each column of the columnar pin-fins are completely aligned; Alternatively, in the heat dissipation pin-fin area, the columnar pin-fins in two adjacent rows of the columnar pin-fins are staggered with each other, and the columnar pin-fins in two adjacent columns of the columnar pin-fins are staggered with each other.

11. The heat dissipation base plate according to claim 1, characterized in that: The fixing structure of the first end surface fixed on the first surface of the heat dissipation base plate body includes: a welding structure, an adhesive structure, a press-fit structure or an integrally formed structure.

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