Fin column type heat dissipation substrate and power module thereof

Abstract

The utility model belongs to the technical field of chip heat dissipation, and discloses a fin column type heat dissipation substrate, which comprises a substrate body, a plurality of fin column groups are arranged on one surface of the substrate body, the plurality of fin column groups are linearly arranged and distributed along the direction from one end of the substrate body to the other end of the substrate body, a plurality of fin columns are arranged in each fin column group, and the fin columns are arranged in the fin column groups. Each fin column is fixedly connected with the substrate body; the diameters of the fin columns in the same fin column group are the same, the diameters of the fin columns in different fin column groups are different, and the diameters of the fin columns in the plurality of fin column groups which are arranged and distributed in the straight line are sequentially increased from the fin column group at one end to the fin column group at the other end. According to the flowing direction of cooling water, the diameters of the fin columns are gradually increased in sequence, so that when the cooling water flows through the fin columns with different diameters during cooling, the water flow speed is continuously increased, the heat dissipation capability is continuously improved, and the heat dissipation capability is kept consistent as far as possible when the cooling water flows through different positions of the radiator in combination with the fact that the water flow absorbs the heat of the front chip and the temperature is increased.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip heat dissipation, and in particular relates to a fin-column type heat dissipation substrate and a power module thereof. Background Art

[0002] With the development of semiconductor technology, the integration of power modules is getting higher and higher, and the number of chips used in each module is more than one. With the diversification of application scenarios, more and more power modules use fin-column-type water-cooling heat dissipation substrates. The fins of the fin-column-type water-cooling heat dissipation substrates currently used are all cylindrical or truncated cones of the same size.

[0003] The cooling water flows from one side to the other under the heat dissipation substrate, which will always cause the cooling water to pass under the chip in sequence. Since the chip continuously generates heat when working, the temperature of the cooling water will rise after absorbing the heat. According to the working principle of the existing wing-column heat dissipation substrate, the heat dissipation conditions of each chip are different. The water temperature near the water inlet is low and the heat dissipation effect is good. As the cooling water continuously absorbs heat, the water temperature near the water outlet is high and the heat dissipation effect becomes worse. Therefore, the life of the module will be reduced. The heat dissipation effect is different. Due to the negative feedback mechanism of the chip, the current carried by each chip is different, and the failure and damage time of each chip is also different. However, as long as one chip fails, the entire module will fail. Utility Model Content

[0004] In view of the deficiencies in the prior art, the purpose of the utility model is to provide a fin-type heat dissipation substrate and a power module thereof. The diameter of the fin is increased successively according to the direction of cooling water flow, so that when flowing through fins of different diameters during cooling, the water flow velocity continues to increase, and the heat dissipation capacity will continue to improve. Combined with the fact that the water flow has absorbed the heat of the front chip and the temperature has risen, the heat dissipation capacity can be kept as consistent as possible when the cooling water flows through different positions of the radiator.

[0005] The purpose of the utility model can be achieved through the following technical solutions:

[0006] A fin-column type heat dissipation substrate, comprising:

[0007] A substrate body, wherein one side of the substrate body is provided with a plurality of fin column groups, wherein the plurality of fin column groups are arranged in a line from one end of the substrate body to the other end, wherein each of the fin column groups is provided with a plurality of fin columns, and each of the fin columns is fixedly connected to the substrate body;

[0008] The diameters of the wing columns in the same group of the wing column groups are the same, the diameters of the wing columns in different groups of the wing column groups are different, and the diameters of the wing columns in several groups of the wing column groups arranged in a line increase successively from the wing column group at one end to the wing column group at the other end.

[0009] The above technical solution, its principle and technical effect:

[0010] The end of the substrate close to the smallest diameter of the fin column is the water inlet, and the end close to the largest diameter of the fin column is the water outlet. Cooling water enters from the water inlet and flows toward the outlet. During the flow, the cooling water continuously absorbs the heat of the fin column, and the water temperature continues to rise. Since the flow rate of cooling water entering from the water inlet remains unchanged, when the cooling water flows through the fin column, as the diameter of the fin column increases, the water flow rate continues to increase, and the heat dissipation capacity will continue to improve. Combined with the fact that the water flow has absorbed the heat of the front chip and the temperature has risen, the heat dissipation capacity can be kept as consistent as possible when the cooling water flows through different positions of the radiator.

[0011] In a preferred example, the utility model can be further configured as follows: a heat conducting plate is fixedly connected to the other side of the substrate body, and several groups of the fin column groups are arranged in a line along one end of the heat conducting plate toward the other end, and several groups of the fin column groups are fixedly connected to the heat conducting plate.

[0012] In a preferred example, the utility model can be further configured as follows: the top end of the fin column is fixedly connected to the heat conducting plate, wherein the fin column and the heat conducting plate are vertically arranged.

[0013] In a preferred example, the present invention can be further configured as follows: the numbers of the wing columns in different groups of wing columns are equal.

[0014] In a preferred example, the utility model can be further configured as follows: a plurality of the wing columns in each group of the wing columns are evenly distributed at equal distances.

[0015] In a preferred example, the present invention can be further configured as follows: the wing column is a cylindrical structure or a truncated cone structure.

[0016] A power module comprises a chip, a liner and a fin-shaped heat dissipation substrate as described above, wherein the liner is fixedly connected to a side of the substrate body away from the fins, and the chip is fixedly connected to a side of the liner away from the substrate body.

[0017] In a preferred example, the utility model can be further configured as follows: the number of the lining plates is equal to the number of the fin column groups, and a plurality of the lining plates are arranged in a line along one end of the substrate body toward the other end, and each of the lining plates is arranged corresponding to the corresponding fin column group.

[0018] The nouns, conjunctions or adjectives involved in the above technical solution are explained as follows:

[0019] Fixed connection refers to a connection in which parts or components are fixed without any relative movement. There are two types of connection: detachable and non-detachable.

[0020] (1) A removable connection is a connection that uses screws, splines, wedge pins, etc. to hold parts together. This type of connection can be disassembled for maintenance without damaging the parts. However, the specifications of the connectors used must be correct (such as the length of the bolts, keys, and wedge pins) and they must be properly tightened.

[0021] (2) Non-detachable connections mainly refer to welding, riveting and tenoning. Since they need to be disassembled by forging, sawing or oxygen cutting for maintenance or replacement, spare parts generally cannot be reused. At the same time, when making connections, attention should be paid to process quality, technical inspection and remedial measures (such as calibration, polishing, etc.).

[0022] A threaded connection refers to a detachable connection in which the connected parts are connected together using threaded parts (or the threaded parts of the connected parts).

[0023] A sliding connection is when two objects are in contact but not fixed and can slide relative to each other.

[0024] A rotational connection is a connection between parts that allows the parts to rotate relative to each other.

[0025] Beneficial effects of the utility model:

[0026] According to the direction of cooling water flow, the diameter of the fin column is increased successively, so that when flowing through fin columns of different diameters during cooling, the water flow speed continues to increase, and the heat dissipation capacity will continue to improve. Combined with the fact that the water flow has absorbed the heat of the front chip and the temperature has risen, the heat dissipation capacity can be kept as consistent as possible when the cooling water flows through different positions of the radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 It is a bottom view of the overall structure of an embodiment of the utility model;

[0029] Figure 2 This is a front view of the overall structure of an embodiment of the utility model;

[0030] Figure 3 It is a top view of the overall structure of an embodiment of the utility model. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] In the description of the present invention, it should be understood that terms such as "opening", "upper", "lower", "thickness", "top", "middle", "length", "inside", "all around" and the like indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0033] According to the concept of this application, Figures 1 to 3 To describe an embodiment of a fin-column type heat dissipation substrate and its power module. Specifically, the fin-column type heat dissipation substrate is constructed as a split structure, which has a substrate body 1, a fin column group 11, a fin column 111 and other structures that cooperate with each other. The end of the substrate close to the smallest diameter of the fin column 111 is a water inlet, and the end close to the largest diameter of the fin column 111 is a water outlet. The cooling water enters from the water inlet and flows in the direction of the water outlet. The cooling water continuously absorbs the heat of the fin column 111 during the flow process, and the water temperature continues to rise. Since the flow rate of the cooling water entering from the water inlet remains unchanged, when the cooling water flows through the fin column 111, as the diameter of the fin column 111 increases, the water flow rate continues to increase, and the heat dissipation capacity will continue to improve. Combined with the fact that the water flow has absorbed the heat of the previous chip and the temperature has risen, the heat dissipation capacity of the cooling water can be kept as consistent as possible when it flows through different positions of the radiator.

[0034] like Figure 1-3 As shown, a fin-column type heat dissipation substrate comprises:

[0035] A substrate body 1, one side of which is provided with a plurality of fin column groups 11, the plurality of fin column groups 11 are arranged in a line from one end of the substrate body 1 to the other end, each fin column group 11 is provided with a plurality of fin columns 111, and each fin column 111 is fixedly connected to the substrate body 1;

[0036] The diameters of the wing columns 111 in the same wing column group 11 are the same, the diameters of the wing columns 111 in different wing column groups 11 are different, and the diameters of the wing columns 111 in several groups of wing column groups 11 arranged in a line increase successively from the wing column group 11 at one end to the wing column group 11 at the other end.

[0037] The end of the substrate with the smallest diameter close to the fin column 111 is the water inlet, and the end of the substrate with the largest diameter close to the fin column 111 is the water outlet. The cooling water enters from the water inlet and flows toward the water outlet. The cooling water continuously absorbs the heat of the fin column 111 during the flow, and the water temperature continues to rise. Since the flow rate of the cooling water entering from the water inlet remains unchanged, when the cooling water flows through the fin column 111, as the diameter of the fin column 111 increases, the water flow rate continues to increase, and the heat dissipation capacity will continue to improve. Combined with the fact that the water flow has absorbed the heat of the front chip and the temperature has risen, the heat dissipation capacity can be kept as consistent as possible when the cooling water flows through different positions of the radiator.

[0038] It should be noted that the diameter of the fin column 111 can be designed according to the chip heating power and the cooling water flow rate so that the heat dissipation effect of each chip is consistent.

[0039] Furthermore, the cooling water may also be replaced by a forced air-cooling air flow.

[0040] In one embodiment of the present invention, the other side of the substrate body 1 is fixedly connected to the heat conducting plate 2, and a plurality of groups of fin column groups 11 are arranged in a line from one end of the heat conducting plate 2 to the other end, and the plurality of groups of fin column groups 11 are fixedly connected to the heat conducting plate 2. Such a design makes the fin column 111 and the heat conducting plate 2 an integrated structure, which is convenient for heat conduction and heat dissipation.

[0041] In one embodiment of the present invention, the top of the fin column 111 is fixedly connected to the heat conducting plate 2, wherein the fin column 111 is vertically arranged with respect to the substrate body 1. Such a design increases the heat dissipation efficiency of the fin column 111.

[0042] In one embodiment of the present invention, the number of fin columns 111 in different fin column groups 11 is equal. Such a design ensures that the spacing between adjacent fin columns 111 in different fin column groups 11 is different. The larger the diameter of the fin column 111, the smaller the spacing between adjacent fin columns 111, thereby increasing the flow rate of water in the unit.

[0043] In one embodiment of the present invention, the plurality of fin columns 111 in each fin column group 11 are evenly distributed at equal distances. Such a design enables the cooling water to flow more evenly in each fin column group 11 .

[0044] In one embodiment of the present invention, the fin column 111 is a cylindrical structure or a truncated cone structure.

[0045] A power module comprises a chip 3, a liner 4 and a fin-type heat dissipation substrate as described above, wherein the liner 4 is fixedly connected to a side of the substrate body 1 away from the fin 111, and the chip 3 is fixedly connected to a side of the liner 4 away from the substrate body 1.

[0046] In one embodiment of the present invention, the number of lining plates 4 is equal to the number of fin column groups 11, and a plurality of lining plates 4 are arranged in a line from one end of the substrate body 1 to the other end, and each lining plate 4 is arranged corresponding to a corresponding fin column group 11. Such a design enables the heat emitted by the chip 3 arranged on each lining plate 4 to be quickly transferred to the fin column 111 in the corresponding fin column group 11, thereby improving the heat dissipation efficiency.

[0047] It should be noted that the power module is a component of power electronic devices that are combined according to certain functions and then encapsulated into a module. The chip, liner and substrate in the above-mentioned power module are only part of the power module. The power module also includes but is not limited to devices such as solder layers, bonding wires, tube shells, power terminals, etc.

[0048] The following is a further description of a fin-column type heat dissipation substrate and a power module thereof provided by the present invention in combination with the accompanying drawings and implementation modes.

[0049] A fin-column type heat dissipation substrate, comprising:

[0050] A substrate body 1, one side of which is provided with a plurality of fin column groups 11, the plurality of fin column groups 11 are arranged in a line from one end of the substrate body 1 to the other end, each fin column group 11 is provided with a plurality of fin columns 111, and each fin column 111 is fixedly connected to the substrate body 1;

[0051] The diameters of the wing columns 111 in the same wing column group 11 are the same, the diameters of the wing columns 111 in different wing column groups 11 are different, and the diameters of the wing columns 111 in several groups of wing column groups 11 arranged in a line increase successively from the wing column group 11 at one end to the wing column group 11 at the other end.

[0052] The other side of the substrate body 1 is fixedly connected with a heat conducting plate 2 , and a plurality of fin column groups 11 are arranged in a line from one end of the heat conducting plate 2 to the other end, and the plurality of fin column groups 11 are fixedly connected to the heat conducting plate 2 .

[0053] The top end of the fin column 111 is fixedly connected to the heat conducting plate 2 , wherein the fin column 111 is vertically arranged to the base plate body 1 .

[0054] The numbers of the wing columns 111 in different wing column groups 11 are all equal.

[0055] The plurality of fin columns 111 in each fin column group 11 are evenly and equidistantly distributed.

[0056] The fin column 111 is a cylindrical structure or a truncated cone structure.

[0057] A power module comprises a chip 3, a liner 4 and a fin-type heat dissipation substrate as described above, wherein the liner 4 is fixedly connected to a side of the substrate body 1 away from the fin 111, and the chip 3 is fixedly connected to a side of the liner 4 away from the substrate body 1.

[0058] The number of the lining plates 4 is equal to the number of the fin column groups 11 , and the lining plates 4 are arranged in a line from one end of the substrate body 1 to the other end, and each lining plate 4 is arranged corresponding to the corresponding fin column group 11 .

[0059] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0060] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.

Claims

1. A fin-column type heat dissipation substrate, characterized in that: include: A base body (1), wherein one side of the base body (1) is provided with a plurality of fin column groups (11), the plurality of fin column groups (11) are arranged in a line from one end of the base body (1) to the other end, each of the fin column groups (11) is provided with a plurality of fin columns (111), and each of the fin columns (111) is fixedly connected to the base body (1); The diameters of the wing columns (111) in the same group of the wing column groups (11) are all the same, the diameters of the wing columns (111) in different groups of the wing column groups (11) are different, and the diameters of the wing columns (111) in a plurality of groups of the wing column groups (11) arranged in a line increase in sequence from the wing column group (11) at one end to the wing column group (11) at the other end.

2. The fin-column type heat dissipation substrate according to claim 1, characterized in that: A heat conducting plate (2) is fixedly connected to the other side of the base plate body (1), and a plurality of groups of fin column groups (11) are arranged in a line from one end of the heat conducting plate (2) toward the other end, and the plurality of groups of fin column groups (11) are all fixedly connected to the heat conducting plate (2).

3. The fin-column type heat dissipation substrate according to claim 2, characterized in that: The top end of the fin column (111) is fixedly connected to the heat conducting plate (2), wherein the fin column (111) and the heat conducting plate (2) are arranged vertically.

4. The fin-column type heat dissipation substrate according to claim 1, characterized in that: The numbers of the fin columns (111) in different groups of the fin column groups (11) are all equal.

5. The fin-column type heat dissipation substrate according to claim 4, characterized in that: The plurality of fin columns (111) in each group of fin column groups (11) are evenly distributed at equal distances.

6. The fin-column type heat dissipation substrate according to claim 5, characterized in that: The fin column (111) is a cylindrical structure or a truncated cone structure.

7. A power module, comprising a chip (3), a backing plate (4) and a fin-column heat dissipation substrate according to any one of claims 1 to 6, characterized in that: The lining plate (4) is fixedly connected to a side of the substrate body (1) away from the fin column (111), and the chip (3) is fixedly connected to a side of the lining plate (4) away from the substrate body (1).

8. A power module according to claim 7, characterized in that: The number of the lining plates (4) is equal to the number of the fin column groups (11), and a plurality of the lining plates (4) are arranged in a line from one end of the base plate body (1) to the other end, and each of the lining plates (4) is arranged corresponding to the corresponding fin column group (11).

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