Middle clamping plate rubber coating assembly and connector device
By designing glue-encapsulated components on the connector mid-clad board and using an integrated molding process to cover electronic components, the problem of uncapsulated mid-clad board when leaving the factory is solved, the protection and overall mechanical strength of electronic components are improved, the risk of short circuit and production complexity are reduced, and the production efficiency and product reliability are improved.
Patent Information
- Application Number
- CN202421694951.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-17
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-07-17
AI Technical Summary
The existing connector mid-jacket board is not glued when it leaves the factory or is only injection molded after assembly, resulting in lack of protection and easy damage to electronic components. The exposed components are prone to contact with metal conductive materials and cause short circuits, increasing defect rate and reducing production efficiency.
A medium-clamp adhesive-covering assembly is designed, by providing the first and second injection molding parts on the outside of the medium-clamping plate, covering the electronic components, and integrating the PCB board, injection molding parts and components into one through an integrated molding process to form a symmetrical structure to enhance the overall mechanical strength and protective effect.
By pre-encapsulating the middle clamping board, the protection of electronic components is enhanced, short-circuit problems are avoided, the durability and reliability of components are improved, the production process is simplified, and the production efficiency is improved.
Smart Images
Figure CN222883909U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of connector structures, in particular to a middle card board rubber-coated component and a connector device. Background Art
[0002] In the prior art, the middle card board of the connector is not encapsulated with glue before leaving the factory, or is injection molded after the connector device is assembled, resulting in a lack of protection for the electronic components of the middle card board, which is easy to damage the electronic components. At the same time, when assembling the connector device, since the electronic components are exposed, they are easy to cause short circuits when they come into contact with metal conductive materials, resulting in a high overall defective rate of the connector device and low production and assembly efficiency. Utility Model Content
[0003] The purpose of the utility model is to provide a middle card board rubber-coated component and a connector device to solve the problems raised in the above-mentioned background technology.
[0004] On the one hand, the utility model provides a mid-card board rubber-coated component, which includes a PCB board, a first injection molded part and a second injection molded part: a first component is arranged on one side of the PCB board, and a second component is arranged on the other side of the PCB board, and the first component and the second component are arranged symmetrically; the first injection molded part is arranged on the outer side of the PCB board, and the first injection molded part covers the first component; the second injection molded part is arranged on the outer side of the PCB board, and the second injection molded part covers the second component; wherein the first injection molded part, the second injection molded part and the PCB board are integrally formed.
[0005] Specifically, a terminal is provided at one end of the PCB board, and a soldering pad is provided at the other end of the PCB board; wherein the terminal, the soldering pad, the first component, and the second component are integrally formed.
[0006] Specifically, the PCB board includes:
[0007] A first injection molding groove, wherein the first injection molding groove is provided at one end of the first injection molding groove adjacent to the first component;
[0008] A second injection molding groove, wherein the second injection molding groove is provided at one end of the second injection molding groove adjacent to the second component;
[0009] Wherein, the first injection groove and the second injection groove are symmetrically arranged.
[0010] Specifically, the first injection molded part includes a rubber block and a first rubber plate, and the first rubber plate is injection molded by the first injection molding tank;
[0011] The second injection molded part includes a rubber block and a second rubber plate, and the second rubber plate is injection molded by the second injection molding tank;
[0012] Wherein, the first rubber plate and the second rubber plate are integrally injection-molded by the rubber block.
[0013] Specifically, the rubber block is in close contact with the first injection groove and the second injection groove.
[0014] The second aspect of the utility model provides a connector device, which includes a middle card board rubber-coated component and a protective shell, and the middle card board rubber-coated component includes a PCB board, a first injection molded part and a second injection molded part: a first component is arranged on one side of the PCB board, and a second component is arranged on the other side of the PCB board, and the first component and the second component are symmetrically arranged; the first injection molded part is arranged on the outer side of the PCB board, and the first injection molded part covers the first component; the second injection molded part is arranged on the outer side of the PCB board, and the second injection molded part covers the second component; wherein the first injection molded part, the second injection molded part and the PCB board are integrally formed; the middle card board rubber-coated component is externally connected to the protective shell.
[0015] Through the implementation of the above technical solution, the mid-card board is increased with a rubber coating structure when it leaves the factory, and the electronic components are coated with the first injection molded part and the second injection molded part, so that the structure of the mid-card board is strengthened, the electronic components are not easily crushed, and the electronic components will not contact conductive materials such as metal to cause short circuit problems. At the same time, compared with the injection molding process after the connector device is assembled, the production process can be further simplified and the production efficiency can be improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of a three-dimensional assembly structure of a mid-card board rubber-coated component;
[0017] Figure 2 for Figure 1 The three-dimensional structural schematic diagram of the PCB board shown;
[0018] Figure 3 for Figure 1 The three-dimensional assembly structure diagram of the plastic-coated pallet assembly shown in the figure is a three-dimensional structure diagram from another angle;
[0019] Among them, the marks in the accompanying drawings are:
[0020] 100, mid-card board rubber-coated assembly; 10, PCB board; 101, first component; 102, second component; 103, terminal; 104, pad; 105, first injection molding groove; 106, second injection molding groove; 30, first injection molding part; 301, first rubber plate; 303, rubber block; 50, second injection molding part; 501, second rubber plate. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0022] Please refer to Figure 1-Figure 3 On the one hand, the utility model provides a mid-card board rubber-coated component 100, which includes a PCB board 10, a first injection molded part 30 and a second injection molded part 50: a first component 101 is arranged on one side of the PCB board 10, and a second component 102 is arranged on the other side of the PCB board 10, and the first component 101 and the second component 102 are arranged symmetrically; the first injection molded part 30 is arranged on the outer side of the PCB board 10, and the first injection molded part 30 covers the first component 101; the second injection molded part 50 is arranged on the outer side of the PCB board 10, and the second injection molded part 50 covers the second component 102; wherein, the first injection molded part 30, the second injection molded part 50 and the PCB board 10 are integrally formed.
[0023] It should be noted that the first injection molded part 30, the second injection molded part 50 and the PCB board 10 are integrally formed to ensure the integrity and stability of the assembly. The seamless structure reduces the possibility of electrical performance degradation or structural damage caused by loose connections. The integrated production process reduces the complexity of multi-step processing and assembly and improves production efficiency. While reducing human assembly errors, it also reduces production costs.
[0024] The first injection molded part 30 and the second injection molded part 50 cover the two sides of the PCB board 10 respectively, and fully cover the first component 101 and the second component 102. The presence of the injection molded parts can effectively prevent the components from being damaged by external physical impact, dust and moisture, and the electronic components will not contact with conductive materials such as metal to cause short circuit problems, thereby improving the durability and reliability of the components.
[0025] The first component 101 and the second component 102 are symmetrically arranged, which is conducive to uniform distribution and dissipation of heat, avoids the problem of overheating of components on one side, and prolongs the service life of the components.
[0026] Specifically, a terminal 103 is disposed at one end of the PCB board 10 , and a soldering pad 104 is disposed at the other end of the PCB board 10 ; wherein the terminal 103 , the soldering pad 104 , the first component 101 , and the second component 102 are integrally formed.
[0027] It should be noted that the terminal 103, the pad 104, the first component 101 and the second component 102 are integrally formed with the PCB board 10, which ensures the stability of the electrical connection and avoids the problems of poor contact and cold soldering that may occur in traditional soldering or plugging methods.
[0028] The one-piece design improves the overall mechanical strength of the PCB board 10, enhances the impact and vibration resistance, and prolongs the service life of the product.
[0029] Specifically, the PCB board 10 includes:
[0030] A first injection molding groove 105 , wherein the first injection molding groove 105 is disposed at one end of the first injection molding groove 105 adjacent to the first component 101 ;
[0031] A second injection molding groove 106 , wherein the second injection molding groove 106 is disposed at one end of the second injection molding groove 106 adjacent to the second component 102 ;
[0032] The first injection groove 105 and the second injection groove 106 are symmetrically arranged.
[0033] It should be noted that the first injection molding groove 105 and the second injection molding groove 106 provide additional fixing positions, so that the injection molding part can be more firmly attached to the PCB board 10, thereby enhancing the bonding strength and preventing the injection molding part from falling off.
[0034] The symmetrical design of the first injection molding groove 105 and the second injection molding groove 106 makes the PCB board 10 more balanced when subjected to stress, reduces stress concentration, and improves the stability and durability of the overall structure.
[0035] The injection molding groove is designed near the position of the first component 101 and the second component 102, so that the injection molding can better cover and protect the components and prevent the components from being damaged by external impact and vibration. The injection molding groove also provides precise positioning, so that the injection molding material in the injection molding process can be accurately filled in the specified position, ensuring that the shape and size of the injection molding are consistent with the design, and improving the manufacturing accuracy.
[0036] Specifically, the first injection molded part 30 includes a rubber block 303 and a first rubber plate 301, and the first rubber plate 301 is injection molded through the first injection groove 105;
[0037] The second injection molded part 50 includes a rubber block 303 and a second rubber plate 501, and the second rubber plate 501 is injection molded through the second injection molding groove 106;
[0038] The first rubber plate 301 and the second rubber plate 501 are integrally injection-molded by the rubber block 303 .
[0039] It should be noted that the first rubber sheet 301 and the second rubber sheet 501 are respectively injection molded through the first injection molding groove 105 and the second injection molding groove 106, ensuring complete coverage and protection of components. Injection molding can not only prevent external physical impact, but also provide dust and moisture-proof effects.
[0040] The first rubber plate 301 and the second rubber plate 501 connected by the rubber block 303 can effectively dissipate the heat generated by the components when they are working, and avoid the heat concentration at a certain position, thereby improving the heat dissipation performance of the entire PCB board 10.
[0041] Through one-piece injection molding, the first rubber plate 301, the second rubber plate 501 and the rubber block 303 form a unified structure, which improves the consistency and reliability of the product, reduces the errors caused by multi-step manufacturing, and improves the quality of the product.
[0042] It should be noted that the first component 101 and the second component 102 can be
[0043] Specifically, the rubber block 303 is in close contact with the first injection groove 105 and the second injection groove 106 .
[0044] It should be noted that the rubber block 303 is in close contact with the first injection groove 105 and the second injection groove 106, ensuring full coverage and protection of the electronic components, preventing dust, moisture and other pollutants from entering, and extending the service life of the electronic components.
[0045] The second aspect of the utility model provides a connector device (not shown in the figure), which includes a middle card board rubber-coated component 100 and a protective shell (not shown in the figure), and the middle card board rubber-coated component 100 includes a PCB board 10, a first injection molded part 30 and a second injection molded part 50: a first component 101 is arranged on one side of the PCB board 10, and a second component 102 is arranged on the other side of the PCB board 10, and the first component 101 and the second component 102 are symmetrically arranged; the first injection molded part 30 is arranged on the outer side of the PCB board 10, and the first injection molded part 30 covers the first component 101; the second injection molded part 50 is arranged on the outer side of the PCB board 10, and the second injection molded part 50 covers the second component 102; wherein the first injection molded part 30, the second injection molded part 50 and the PCB board 10 are integrally formed; the middle card board rubber-coated component 100 is externally connected to the protective shell (not shown in the figure).
[0046] Through the implementation of the above technical solution, the middle card board is increased with a rubber coating structure when leaving the factory, and the electronic components are coated with the first injection molded part 30 and the second injection molded part 50, so that the structure of the middle card board is strengthened, the electronic components are not easily crushed, and the electronic components will not contact conductive materials such as metal to cause short circuit problems. At the same time, compared with the injection molding process after the connector device is assembled, the production process can be further simplified and the production efficiency can be improved.
[0047] The above descriptions are only some embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Anything that is directly or indirectly used in other related technical fields is also included in the patent protection scope of the present invention.
Claims
1. A mid-card board rubber-coated component, characterized in that: include: A PCB board, wherein a first component is disposed on one side of the PCB board, and a second component is disposed on the other side of the PCB board, and the first component and the second component are symmetrically disposed; A first injection molded part, wherein the first injection molded part is arranged on the outer side of the PCB board, and the first injection molded part covers the first component; A second injection molded part, wherein the outer side of the PCB board is provided with the second injection molded part, and the second injection molded part covers the second component; Wherein, the first injection molded part, the second injection molded part and the PCB board are integrally formed.
2. The mid-card board rubber-coated assembly according to claim 1 is characterized in that: A terminal is provided at one end of the PCB board, and a soldering pad is provided at the other end of the PCB board; Wherein, the terminal, the pad, the first component, and the second component are integrally formed.
3. The mid-card board rubber-coated assembly according to claim 1 is characterized in that: The PCB board comprises: A first injection molding groove, wherein the first injection molding groove is provided at one end of the first injection molding groove adjacent to the first component; A second injection molding groove, wherein the second injection molding groove is provided at one end of the second injection molding groove adjacent to the second component; Wherein, the first injection groove and the second injection groove are symmetrically arranged.
4. The mid-card board rubber-coated assembly according to claim 3 is characterized in that: The first injection molded part includes a rubber block and a first rubber plate, and the first rubber plate is injection molded by the first injection molding tank; The second injection molded part includes a rubber block and a second rubber plate, and the second rubber plate is injection molded by the second injection molding tank; Wherein, the first rubber plate and the second rubber plate are integrally injection-molded by the rubber block.
5. The mid-card board rubber-coated assembly according to claim 4 is characterized in that: The rubber block is in close contact with the first injection groove and the second injection groove.
6. A connector device, characterized in that: include: The mid-card rubber-coated assembly according to any one of claims 1 to 5; A protective shell is externally connected to the middle card board rubber-coated assembly.