High-frequency acquisition gateway

Abstract

The utility model discloses a high-frequency acquisition gateway, which belongs to the technical field of Internet of Things and comprises a CPU (central processing unit), a network module, a USB (universal serial bus) module, a video module, a Bluetooth module, a power module, a 4GLTE (long term evolution) module, an RS485 module A, an RS485 module B, an RS485 module C, an RS485 module D, a CAN (controller area network) module, an indicator lamp, a buzzer, an Ethernet interface A1, a USB interface A2, a USB interface A5, a USB interface A17, an HDMI (high-definition multimedia interface) interface A3, an RS232 interface A12, a Micro USB interface, an HDMI DSI (direct digital interface), an SIM (subscriber identity module) card slot A4, a 485 interface A7, a 485 interface A8, a 485 interface A9, a 485 interface A10 and a CAN interface The technical problem of multi-interface compatibility of the high-frequency acquisition gateway is solved, multiple interfaces are integrated, and high-frequency data acquisition and real-time processing can be supported.

Description

Technical Field

[0001] The utility model belongs to the technical field of Internet of Things, and in particular relates to a high-frequency acquisition gateway. Background Art

[0002] In the fields of industrial automation, Internet of Things (IoT), remote monitoring, etc., high-frequency data acquisition and transmission are key technologies.

[0003] Traditional data acquisition gateways have poor multi-interface compatibility and cannot simultaneously support multiple communication interfaces, such as Ethernet, USB, RS485, CAN, etc., which limits the compatibility between the device and different systems. Utility Model Content

[0004] The utility model aims to provide a high-frequency acquisition gateway, which solves the technical problem of multi-interface compatibility of the high-frequency acquisition gateway.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A high-frequency acquisition gateway comprises a CPU, a network module, a USB module, a video module, a Bluetooth module, a power module, a 4G LTE module, an RS485 module A, an RS485 module B, an RS485 module C, an RS485 module D, a CAN module, an indicator light, a buzzer, an Ethernet interface A1, a USB interface A2, a USB interface A5, a USB interface A17, an HDMI interface A3, an RS232 interface A12, a Micro USB interface, an HDMIDSI interface, a SIM card slot A4, a 485 interface A7, a 485 interface A8, a 485 interface A9, a 485 interface A10 and a CAN interface A11, wherein the network module, the USB module, the video module, the Bluetooth module, the 4G LTE module, the RS485 module A, the RS485 module B, the RS485 module C, the RS485 module D, the CAN module, the indicator light and the buzzer are all connected to the CPU;

[0007] Ethernet interface A1 is connected to the network module, USB interface A2, USB interface A5 and USB interface A17 are all connected to the USB module, HDMI interface A3 is connected to the video module, RS232 interface A12 is connected to a UART interface of the CPU, Micro USB interface is connected to a USB interface of the CPU, HDMIDSI interface is connected to an HDMI interface of the CPU, SIM card slot A4 is connected to the 4G LTE module, 485 interface A7, 485 interface A8, 485 interface A9, 485 interface A10 are respectively connected to RS485 module A, RS485 module B, RS485 module C and RS485 module D, CAN interface A11 is connected to the CAN module;

[0008] The power module provides operating voltage for the CPU, network module, USB module, video module, Bluetooth module, 4GLTE module, RS485 module A, RS485 module B, RS485 module C, RS485 module D, CAN module, indicator light and buzzer.

[0009] Preferably, the network module is connected to the CPU via an RGMII interface, the USB module is connected to a USB interface of the CPU, the video module is connected to an HDMI interface of the CPU, the Bluetooth module is connected to the CPU via an SDIO interface, the 4G LTE module is connected to the CPU via a MiniPCIe interface, RS485 module A, RS485 module B, RS485 module C and RS485 module D are respectively connected to 4 UART interfaces of the CPU, the CAN module is connected to the CPU via an SPI interface, and the indicator light and the buzzer are respectively connected to different IO ports of the CPU.

[0010] Preferably, the model of the CPU is BCM2711, the model of the network module is BCM54213PE Ethernet module, the model of the USB module is VL817, the model of the video module is TDA19988, the model of the Bluetooth module is CYW43455, the model of the 4GLTE module is Quectel EC25-E, the models of the RS485 module A, the RS485 module B, the RS485 module C and the RS485 module D are all SN65HVD485E, and the model of the CAN module is MCP2515.

[0011] Preferably, the power supply module includes a 12V power supply module, a 5V power supply module and a 3.3V power supply module, the input end of the 12V power supply module is connected to an external power supply, and the output end outputs a 12V power supply, the input end of the 5V power supply module is connected to a 12V power supply, and the output end outputs a 5V power supply, and the input end of the 3.3V power supply module is connected to a 5V power supply, and the output end outputs a 3.3V power supply;

[0012] The 5V power supply is used to power the CPU, USB module, RS485 module A, RS485 module B, RS485 module C, RS485 module D, CAN module, indicator light and buzzer;

[0013] The 3.3V power supply powers the Bluetooth module, network module, video module, CPU, and 4G LTE module.

[0014] Preferably, the Ethernet interface A1 includes a network interface U3, an ESD protector U1, an ESD protector U2 and a choke J9, and pins 1, 2, 3, 6, 7, 8, 9, 10, 11, 12, 13, 14, 16 and 18 of the network interface U3 are all connected to the network module, the ESD protector U1 is an EDS protector for pins 7, 8, 9 and 10 of the network interface U3, the ESD protector U2 is an EDS protector for pins 1, 2, 3 and 6 of the network interface U3, and pins 1, 2, 3 and 4 of the choke J9 are respectively connected to pins 12, 13, 11 and 14 of the network interface U3;

[0015] Pins 4 and 5 of the network interface U3 are connected to the ground wire through capacitor C1, pins 15 and 17 are connected to the 3.3V power supply, and pins 19 and 20 are connected to the ground wire.

[0016] Preferably, the model of the network interface U3 is A70-112-331N126, and the models of the ESD protector U1 and the ESD protector U2 are both TPD4EUSB30.

[0017] A high-frequency acquisition gateway described in the utility model solves the technical problem of multi-interface compatibility of high-frequency acquisition gateways. The utility model integrates multiple interfaces such as Gigabit Ethernet, USB, HDMI, RS485, CAN, 4G LTE, etc., supports a wide range of industrial and communication applications, adopts BCM2711 quad-core CPU, provides powerful data processing and transmission capabilities, can support high-frequency data acquisition and real-time processing, and each functional module is connected through a standard interface, which is easy to expand and maintain, and supports flexible system configuration. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic block diagram of the utility model;

[0019] Figure 2 It is a schematic block diagram of the power module of the utility model;

[0020] Figure 3 It is a circuit diagram of the Ethernet interface A1 of the utility model. DETAILED DESCRIPTION

[0021] Depend on Figure 1-Figure 3A high-frequency acquisition gateway shown includes a CPU, a network module, a USB module, a video module, a Bluetooth module, a power module, a 4G LTE module, an RS485 module A, an RS485 module B, an RS485 module C, an RS485 module D, a CAN module, an indicator light, a buzzer, an Ethernet interface A1, a USB interface A2, a USB interface A5, a USB interface A17, an HDMI interface A3, an RS232 interface A12, a Micro USB interface, an HDMIDSI interface, a SIM card slot A4, a 485 interface A7, a 485 interface A8, a 485 interface A9, a 485 interface A10 and a CAN interface A11, and the network module, the USB module, the video module, the Bluetooth module, the 4G LTE module, the RS485 module A, the RS485 module B, the RS485 module C, the RS485 module D, the CAN module, the indicator light and the buzzer are all connected to the CPU;

[0022] The network module is connected to the CPU via an RGMII interface, the USB module is connected to a USB interface of the CPU, the video module is connected to an HDMI interface of the CPU, the Bluetooth module is connected to the CPU via an SDIO interface, the 4G LTE module is connected to the CPU via a Mini PCIe interface, RS485 module A, RS485 module B, RS485 module C and RS485 module D are respectively connected to 4 UART interfaces of the CPU, the CAN module is connected to the CPU via an SPI interface, and the indicator light and the buzzer are respectively connected to different IO ports of the CPU.

[0023] The model of the CPU is BCM2711, the model of the network module is BCM54213PE Ethernet module, the model of the USB module is VL817, the model of the video module is TDA19988, the model of the Bluetooth module is CYW43455, the model of the 4GLTE module is Quectel EC25-E, the models of the RS485 module A, the RS485 module B, the RS485 module C and the RS485 module D are all SN65HVD485E, and the model of the CAN module is MCP2515.

[0024] The Ethernet interface A1 is connected to the network module, and the Ethernet interface A1 includes a network interface U3, an ESD protector U1, an ESD protector U2 and a choke coil J9. Pins 1, 2, 3, 6, 7, 8, 9, 10, 11, 12, 13, 14, 16 and 18 of the network interface U3 are all connected to the network module, the ESD protector U1 is an EDS protector for pins 7, 8, 9 and 10 of the network interface U3, the ESD protector U2 is an EDS protector for pins 1, 2, 3 and 6 of the network interface U3, and pins 1, 2, 3 and 4 of the choke coil J9 are respectively connected to pins 12, 13, 11 and 14 of the network interface U3;

[0025] Pins 4 and 5 of the network interface U3 are connected to the ground wire through capacitor C1, pins 15 and 17 are connected to the 3.3V power supply, and pins 19 and 20 are connected to the ground wire.

[0026] USB interface A2, USB interface A5 and USB interface A17 are all connected to the USB module, HDMI interface A3 is connected to the video module, RS232 interface A12 is connected to a UART interface of the CPU, Micro USB interface is connected to a USB interface of the CPU, HDMIDSI interface is connected to an HDMI interface of the CPU, SIM card slot A4 is connected to the 4G LTE module, 485 interface A7, 485 interface A8, 485 interface A9, 485 interface A10 are respectively connected to RS485 module A, RS485 module B, RS485 module C and RS485 module D, CAN interface A11 is connected to the CAN module;

[0027] In this embodiment, Broadcom BCM2711, quad-core ARM Cortex-A72 (ARM v8) 1.5GHz, 64-bit is used to provide core computing capabilities. The Ethernet interface part uses A70-112-331N126 network interface and BroadcomBCM54213PE Ethernet PHY to support Gigabit Ethernet communication. VIA Labs VL817 USB Hub controller is used to support multiple USB device connections. TDA19988 HDMI transmitter chip supports high-definition audio and video output. Cypress CYW43455 supports 2.4G / 5.8G dual-band WiFi and Bluetooth 5.0. Quectel EC25-E is used to support mobile data communication. Texas Instruments SN65HVD485E is used to support four-way RS485 communication. By integrating multiple interfaces and modules, a high-performance, modular solution is provided, which is suitable for a variety of industrial and communication application scenarios. It solves the problems of poor compatibility, limited processing power, insufficient modularity and inefficient power management of traditional equipment, providing an efficient and reliable choice for fields such as industrial automation and remote monitoring.

[0028] The power module provides operating voltage for the CPU, network module, USB module, video module, Bluetooth module, 4GLTE module, RS485 module A, RS485 module B, RS485 module C, RS485 module D, CAN module, indicator light and buzzer.

[0029] The power supply module includes a 12V power supply module, a 5V power supply module and a 3.3V power supply module. The input end of the 12V power supply module is connected to an external power supply, and the output end outputs a 12V power supply. The input end of the 5V power supply module is connected to a 12V power supply, and the output end outputs a 5V power supply. The input end of the 3.3V power supply module is connected to a 5V power supply, and the output end outputs a 3.3V power supply.

[0030] The 5V power supply is used to power the CPU, USB module, RS485 module A, RS485 module B, RS485 module C, RS485 module D, CAN module, indicator light and buzzer;

[0031] The 3.3V power supply powers the Bluetooth module, network module, video module, CPU, and 4G LTE module.

[0032] In this embodiment, the 12V power supply module is a 12V DC-DC power supply, the 5V power supply module is LM7805, and the 3.3V power supply is LM1117.

[0033] The model of the network interface U3 is A70-112-331N126, and the model of the ESD protector U1 and the ESD protector U2 are both TPD4EUSB30.

[0034] A high-frequency acquisition gateway described in the utility model solves the technical problem of multi-interface compatibility of high-frequency acquisition gateways. The utility model integrates multiple interfaces such as Gigabit Ethernet, USB, HDMI, RS485, CAN, 4G LTE, etc., supports a wide range of industrial and communication applications, adopts BCM2711 quad-core CPU, provides powerful data processing and transmission capabilities, can support high-frequency data acquisition and real-time processing, and each functional module is connected through a standard interface, which is easy to expand and maintain, and supports flexible system configuration.

Claims

1. A high frequency acquisition gateway, characterized in that: Including CPU, network module, USB module, video module, Bluetooth module, power module, 4G LTE module, RS485 module A, RS485 module B, RS485 module C, RS485 module D, CAN module, indicator light, buzzer, Ethernet interface A1, USB interface A2, USB interface A5, USB interface A17, HDMI interface A3, RS232 interface A12, Micro USB interface, HDMIDSI interface, SIM card slot A4, 485 interface A7, 485 interface A8, 485 interface A9, 485 interface A10 and CAN interface A11, the network module, USB module, video module, Bluetooth module, 4G LTE module, RS485 module A, RS485 module B, RS485 module C, RS485 module D, CAN module, indicator light and buzzer are all connected with the CPU; Ethernet interface A1 is connected to the network module, USB interface A2, USB interface A5 and USB interface A17 are all connected to the USB module, HDMI interface A3 is connected to the video module, RS232 interface A12 is connected to a UART interface of the CPU, Micro USB interface is connected to a USB interface of the CPU, HDMIDSI interface is connected to an HDMI interface of the CPU, SIM card slot A4 is connected to the 4G LTE module, 485 interface A7, 485 interface A8, 485 interface A9, 485 interface A10 are respectively connected to RS485 module A, RS485 module B, RS485 module C and RS485 module D, CAN interface A11 is connected to the CAN module; The power module provides operating voltage for the CPU, network module, USB module, video module, Bluetooth module, 4GLTE module, RS485 module A, RS485 module B, RS485 module C, RS485 module D, CAN module, indicator light and buzzer.

2. A high frequency acquisition gateway as claimed in claim 1, characterized in that: The network module is connected to the CPU via an RGMII interface, the USB module is connected to a USB interface of the CPU, the video module is connected to an HDMI interface of the CPU, the Bluetooth module is connected to the CPU via an SDIO interface, the 4G LTE module is connected to the CPU via a Mini PCIe interface, RS485 module A, RS485 module B, RS485 module C and RS485 module D are respectively connected to 4 UART interfaces of the CPU, the CAN module is connected to the CPU via an SPI interface, and the indicator light and the buzzer are respectively connected to different IO ports of the CPU.

3. A high frequency acquisition gateway as claimed in claim 1, characterized in that: The model of the CPU is BCM2711, the model of the network module is BCM54213PE Ethernet module, the model of the USB module is VL817, the model of the video module is TDA19988, the model of the Bluetooth module is CYW43455, the model of the 4G LTE module is QuectelEC25-E, the models of the RS485 module A, the RS485 module B, the RS485 module C and the RS485 module D are all SN65HVD485E, and the model of the CAN module is MCP2515.

4. A high frequency acquisition gateway as claimed in claim 1, characterized in that: The power supply module includes a 12V power supply module, a 5V power supply module and a 3.3V power supply module. The input end of the 12V power supply module is connected to an external power supply, and the output end outputs a 12V power supply. The input end of the 5V power supply module is connected to a 12V power supply, and the output end outputs a 5V power supply. The input end of the 3.3V power supply module is connected to a 5V power supply, and the output end outputs a 3.3V power supply. The 5V power supply is used to power the CPU, USB module, RS485 module A, RS485 module B, RS485 module C, RS485 module D, CAN module, indicator light and buzzer; The 3.3V power supply powers the Bluetooth module, network module, video module, CPU, and 4G LTE module.

5. A high frequency acquisition gateway as claimed in claim 4, characterized in that: The Ethernet interface A1 includes a network interface U3, an ESD protector U1, an ESD protector U2 and a choke coil J9, wherein pins 1, 2, 3, 6, 7, 8, 9, 10, 11, 12, 13, 14, 16 and 18 of the network interface U3 are all connected to the network module, the ESD protector U1 is an EDS protector for pins 7, 8, 9 and 10 of the network interface U3, the ESD protector U2 is an EDS protector for pins 1, 2, 3 and 6 of the network interface U3, and pins 1, 2, 3 and 4 of the choke coil J9 are respectively connected to pins 12, 13, 11 and 14 of the network interface U3; Pins 4 and 5 of the network interface U3 are connected to the ground wire through capacitor C1, pins 15 and 17 are connected to the 3.3V power supply, and pins 19 and 20 are connected to the ground wire.

6. A high frequency acquisition gateway as claimed in claim 5, characterized in that: The model of the network interface U3 is A70-112-331N126, and the model of the ESD protector U1 and the ESD protector U2 are both TPD4EUSB30.

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