Heat-shock-resistant high-density circuit board

Abstract

The utility model discloses a thermal shock resistant high-density circuit board, which relates to the field of circuit boards and comprises a high-density board body, supporting seats are detachably arranged on two sides of the high-density board body, and a plurality of uniformly distributed supporting strips are fixedly arranged between the bottoms of the two supporting seats. A plurality of impact-resistant columns which are uniformly distributed are fixedly arranged on the upper surfaces of the plurality of supporting strips; and the supporting seats, the supporting strips and the impact-resistant columns are all made of heat-conducting aluminum alloy pieces. The high-density circuit board adopts the structure of the supporting seat, the supporting strips and the impact-resistant columns, so that the high-density circuit board has heat impact resistance, and the service life of the high-density circuit board is prolonged.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, in particular to a heat shock resistant high-density circuit board. Background Art

[0002] With the development of electrical products, circuit boards are required to not only have high-density performance, but also high stability and excellent heat shock resistance in order to ensure the normal operation of each component.

[0003] Although the current high-density circuit board has a certain heat shock resistance, since the thickness of the high-density circuit board is generally thin, if the impact force is large during installation and use, the high-density circuit board will be bent and damaged, thereby affecting the service life of the electrical equipment. Therefore, a heat shock resistant high-density circuit board is proposed. Utility Model Content

[0004] In view of the above problems existing in the existing high-density circuit boards, the present utility model is proposed.

[0005] Therefore, the purpose of the utility model is to provide a heat shock resistant high-density circuit board to solve the problems raised by the background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A heat-shock-resistant high-density circuit board comprises a high-density board body, both sides of which are detachably provided with support seats, a plurality of evenly distributed support bars are fixedly provided between the bottoms of two of the support seats, and a plurality of evenly distributed impact-resistant columns are fixedly provided on the upper surfaces of the plurality of support bars; the support seats, support bars and impact-resistant columns are all made of heat-conducting aluminum alloy parts.

[0008] Preferably, the support seat is a U-shaped seat.

[0009] Preferably, the side wall of the support base is provided with a plurality of evenly distributed heat dissipation holes.

[0010] Preferably, a bolt is threadedly disposed on the top of the support seat, and the end of the bolt extends into the interior of the support seat and is rotatably provided with a clamping plate.

[0011] Furthermore, the number of the bolts and the clamping plates on each of the support seats is two.

[0012] Preferably, the top height of the impact-resistant column is the same as the bottom inner wall height of the support seat.

[0013] In the above technical solution, the technical effects and advantages provided by the utility model are:

[0014] 1. The utility model is provided with a support seat, a support bar and an impact-resistant column. Both sides of the high-density board are placed inside the two support seats, so that the bottom of the high-density board is in contact with the tops of multiple impact-resistant columns. At this time, the multiple impact-resistant columns can improve the support of the high-density board, so that the high-density board is not easy to bend when subjected to pressure impact, thereby improving the impact resistance of the high-density board. At the same time, the support seat, the support bar and the impact-resistant column are all made of aluminum alloy, which can conduct the surface temperature of the high-density board, thereby improving the heat resistance of the high-density board.

[0015] 2. The utility model uses bolts and clamps arranged on the top of the support seat. After the two sides of the high-density board body are placed inside the support seat, the bolts are turned by a wrench to make the bolts move spirally and drive the clamps to move downward. At this time, the side walls of the high-density board body are pressed by the clamps, so that the high-density board body and the support seat are firmly installed. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present utility model. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0017] Figure 1 It is a structural schematic diagram of the utility model;

[0018] Figure 2 It is a schematic diagram of the structure of the support seat, support bar and impact-resistant column of the utility model;

[0019] Figure 3 for Figure 2 Front view of the middle support seat, support bar and impact-resistant column;

[0020] Figure 4 for Figure 3 Side view of the middle support seat.

[0021] Description of reference numerals:

[0022] 1. High-density board body; 2. Support seat; 3. Support bar; 4. Impact-resistant column; 5. Heat dissipation hole; 6. Bolt; 7. Clamp. DETAILED DESCRIPTION

[0023] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0024] The utility model embodiment discloses a heat shock resistant high-density circuit board.

[0025] The utility model provides Figure 1-3 A heat shock resistant high-density circuit board shown includes a high-density board body 1, both sides of the high-density board body 1 are detachably provided with support seats 2, a plurality of evenly distributed support bars 3 are fixedly provided between the bottoms of the two support seats 2, a plurality of evenly distributed impact-resistant columns 4 are fixedly provided on the upper surfaces of the plurality of support bars 3, the top height of the impact-resistant columns 4 is the same as the bottom inner wall height of the support seat 2, the bottom of the high-density board body 1 is in contact with the tops of the plurality of impact-resistant columns 4, at this time, the plurality of impact-resistant columns 4 and the support bars 3 can improve the support of the high-density board body 1, so that the high-density board body 1 is not easy to bend when subjected to pressure-resistant impact, thereby improving the impact resistance of the high-density board body 1;

[0026] In order to make the high-density board body 1 heat-resistant, Figure 1-4 As shown, the support seat 2, the support bar 3 and the impact-resistant column 4 are all made of heat-conducting aluminum alloy parts. The aluminum alloy material can conduct the surface temperature of the high-density board body 1, thereby improving the heat resistance of the high-density board body 1. The support seat 2 adopts a U-shaped seat, and the side wall of the support seat 2 is provided with a plurality of evenly distributed heat dissipation holes 5. The heat dissipation holes 5 can accelerate the dissipation of the surface temperature of the high-density board body 1.

[0027] Finally, in order to make the high-density board body 1 and the support base 2 detachable, as shown in FIG. Figure 1 and 3 As shown, the top thread of the support seat 2 is provided with a bolt 6, the end of the bolt 6 extends to the inside of the support seat 2 and is rotatably provided with a clamp 7, and the number of bolts 6 and clamps 7 on each support seat 2 is two. The bolt 6 is rotated by a wrench to make the bolt 6 move spirally and drive the clamp 7 to move downward. At this time, the side wall of the high-density board body 1 is pressed by the clamp 7, so that the high-density board body 1 and the support seat 2 are firmly installed.

[0028] The above only describes some exemplary embodiments of the present invention by way of illustration. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A heat shock resistant high-density circuit board, comprising a high-density board body (1), characterized in that: The high-density board body (1) is provided with detachable support seats (2) on both sides, a plurality of evenly distributed support bars (3) are fixedly provided between the bottoms of the two support seats (2), and a plurality of evenly distributed impact-resistant columns (4) are fixedly provided on the upper surfaces of the plurality of support bars (3); The support seat (2), the support bar (3) and the impact-resistant column (4) are all made of heat-conducting aluminum alloy.

2. The heat shock resistant high-density circuit board according to claim 1, characterized in that: The support seat (2) is a U-shaped seat.

3. The heat shock resistant high-density circuit board according to claim 1, characterized in that: The side wall of the support seat (2) is provided with a plurality of evenly distributed heat dissipation holes (5).

4. The heat shock resistant high-density circuit board according to claim 1, characterized in that: The top of the support seat (2) is threadedly provided with a bolt (6), and the end of the bolt (6) extends into the interior of the support seat (2) and is rotatably provided with a clamping plate (7).

5. The heat shock resistant high-density circuit board according to claim 4, characterized in that: The number of the bolts (6) and the clamping plates (7) on each of the support seats (2) is two.

6. The heat shock resistant high-density circuit board according to claim 1, characterized in that: The top height of the impact-resistant column (4) is the same as the bottom inner wall height of the support seat (2).

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