Heat dissipation profile

Abstract

The utility model discloses a heat dissipation section bar, which relates to the technical field of heat dissipation equipment, and comprises a first substrate, a second substrate, a heat dissipation layer and a heat dissipation layer, the heat dissipation plate comprises a plurality of first heat dissipation plates, the plurality of first heat dissipation plates are arranged in parallel at intervals, one end of each first heat dissipation plate is connected with the edge of one side of the first substrate, the other end of each first heat dissipation plate extends in the direction away from the first substrate, and the extending direction is parallel to the first substrate. A first heat dissipation channel is formed between every two adjacent first heat dissipation plates, and the first heat dissipation channels are arranged in a penetrating mode in the direction perpendicular to the plane where the substrate is located. The heat dissipation profile provided by the technical scheme of the utility model can improve the heat dissipation effect and is suitable for heat dissipation of different products.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation equipment, in particular to a heat dissipation profile. Background Art

[0002] With the development of electronic and electrical equipment, in order to meet user demand for products, the power circuit conversion capacity of electrical products has been continuously increased, and the power consumption has increased accordingly. The heat generated by various electronic components, such as chips, has increased sharply. The heat dissipation effect of traditional heat dissipation profiles cannot meet the requirements, and the heat dissipation problem needs to be solved urgently. Utility Model Content

[0003] The main purpose of the utility model is to provide a heat dissipation profile, aiming to solve the technical problem that the heat dissipation effect of the current traditional heat dissipation profile cannot meet the heat dissipation demand.

[0004] In order to achieve the above-mentioned purpose, the heat dissipation profile proposed by the utility model includes:

[0005] a first substrate that contacts and transfers heat to the product; and

[0006] The heat dissipation plate includes a first heat dissipation plate, a plurality of the first heat dissipation plates are provided, and the plurality of the first heat dissipation plates are arranged in parallel and at intervals. One end of the first heat dissipation plate is connected to an edge of one side of the first substrate, and the other end extends in a direction away from the first substrate, and the extension direction is parallel to the first substrate. A first heat dissipation channel is formed between two adjacent first heat dissipation plates, and the first heat dissipation channel is arranged to penetrate in a direction perpendicular to the plane where the substrate is located.

[0007] In one embodiment, the end of the first heat dissipation plate away from the first substrate is connected to a second substrate, and the second substrate contacts the product and performs heat transfer.

[0008] In one embodiment, the second substrate is provided with a boss, and the boss is provided on a side of the second substrate away from the first heat dissipation plate and protrudes from the surface of the second substrate.

[0009] In one embodiment, the heat sink further includes a second heat sink, which is disposed on the first substrate, one end of the second heat sink is connected to the first heat sink, and the other end of the second heat sink extends in a direction away from the first heat sink.

[0010] In one embodiment, there are multiple second heat dissipation plates, which are arranged at intervals and correspond one-to-one to the first heat dissipation plates. The space enclosed by two adjacent second heat dissipation plates and the first substrate forms a second heat dissipation channel, and the first heat dissipation channel is connected to the second heat dissipation channel.

[0011] In one embodiment, the first substrate includes a connecting portion and a fixing portion, the first heat dissipation plate is disposed on the connecting portion, and the fixing portion defines a first connecting hole.

[0012] In one embodiment, the first heat dissipation plate and the second heat dissipation plate further extend in a direction perpendicular to the first substrate, respectively, and an extension length of the first heat dissipation plate is greater than an extension length of the second heat dissipation plate.

[0013] In one embodiment, the second substrate is provided with an avoidance portion, and the avoidance portion is provided with a second connection hole.

[0014] In one embodiment, a third substrate is disposed on a side of the first substrate close to the first heat sink, a third connecting hole is defined in the third substrate, and the first heat sink is further disposed on the third substrate.

[0015] In one embodiment, the heat dissipation profile is made of aluminum.

[0016] The technical solution of the utility model adopts a first substrate to contact with the product and conduct heat transfer, and transfers the heat generated by the product to the heat dissipation plate. The product dissipates heat through the first substrate and the heat dissipation plate, and the first heat dissipation plate is provided with multiple first heat dissipation plates, and a first heat dissipation channel is formed between two adjacent first heat dissipation plates. The first heat dissipation channel is set in a direction perpendicular to the plane of the substrate, so that the heat dissipation airflow at the first heat dissipation plate can circulate in two directions to dissipate heat, thereby improving the heat dissipation efficiency. In addition, the heat dissipation profile proposed in this application can also contact different products through the first substrate and the second substrate respectively, so as to be used for heat dissipation of multiple devices, saving processes and simple installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0018] Figure 1 This is a schematic diagram of an angle structure of an embodiment of the heat dissipation profile provided by the utility model;

[0019] Figure 2 This is a schematic structural diagram from another angle of an embodiment of the heat dissipation profile provided by the utility model;

[0020] Figure 3 A structural schematic diagram of another embodiment of the heat dissipation profile provided by the utility model;

[0021] Figure 4This is a structural schematic diagram of an embodiment of the heat dissipation profile provided by the utility model.

[0022] Description of Figure Numbers:

[0023] 100, first substrate; 110, connecting portion; 120, fixing portion; 130, first connecting hole;

[0024] 200, first heat dissipation plate; 210, first heat dissipation channel;

[0025] 300, second substrate; 310, boss; 320, second connection hole;

[0026] 400, second heat dissipation plate; 410, second heat dissipation channel;

[0027] 500, a third substrate; 510, a third connecting hole.

[0028] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0031] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0032] In the prior art, in order to meet user needs, the power circuit conversion capacity of various electrical products continues to increase, and the power consumption increases accordingly. The heat generated by electronic components increases sharply, and the heat dissipation effect of traditional heat dissipation profiles cannot meet the requirements. The heat dissipation problem needs to be solved urgently.

[0033] The utility model provides a heat dissipation profile.

[0034] See also Figures 1 to 4 As shown, in one embodiment of the utility model, the heat dissipation profile includes: a first substrate 100 and a heat dissipation plate, wherein the first substrate 100 contacts the product and performs heat transfer, and the heat dissipation plate includes a first heat dissipation plate 200, and a plurality of first heat dissipation plates 200 are provided, and the plurality of first heat dissipation plates 200 are arranged in parallel and at intervals, one end of the first heat dissipation plate 200 is connected to an edge of one side of the first substrate 100, and the other end extends in a direction away from the first substrate 100, and the extension direction is parallel to the first substrate 100, and a first heat dissipation channel 210 is formed between two adjacent first heat dissipation plates 200, and the first heat dissipation channel 210 is arranged to penetrate in a direction perpendicular to the plane where the substrate is located.

[0035] It should be noted that, in order to further improve the heat dissipation efficiency, in the specific implementation process, the heat dissipation profile is made of aluminum and is formed in one piece, which saves working steps and improves production efficiency.

[0036] In this embodiment, the first substrate 100 is in contact with the product to transfer heat. In the specific implementation process, the first substrate 100 and the product are also heat-conducted through thermal conductive silica gel to improve the heat exchange efficiency. One end of the first heat sink 200 is connected to the first substrate 100 and performs heat exchange with the first substrate 100. The first substrate 100 and the first heat sink 200 also perform heat exchange with the surrounding air to achieve the purpose of heat dissipation. The first heat sink 200 is a long plate-shaped structure and is parallel to each other. One end of the first heat sink 200 is connected to the first substrate 100. In order to improve the heat exchange efficiency and strength, the first heat sink 200 and the first substrate 100 are integrally formed. Further, the airflow flows through the first heat dissipation channel 210 and performs heat exchange with the first heat sink 200, taking away the heat of the first heat sink 200. Specifically, the airflow between the first heat sink 200 can flow along the extension direction of the first heat sink 200, and can also flow in a direction perpendicular to the plane where the first substrate 100 is located. The flow rate of the airflow is increased, thereby improving the heat dissipation effect.

[0037] The technical solution of the utility model adopts the first substrate 100 to contact the product and conduct heat transfer, and transfers the heat generated by the product to the heat dissipation plate. The product dissipates heat through the first substrate 100 and the heat dissipation plate, and the first heat dissipation plate 200 is provided with multiple first heat dissipation plates 200, and a first heat dissipation channel 210 is formed between two adjacent first heat dissipation plates 200. The first heat dissipation channel 210 is set through in a direction perpendicular to the substrate plane, so that the heat dissipation airflow at the first heat dissipation plate 200 can circulate in two directions to dissipate heat, thereby improving the efficiency of heat dissipation. In addition, the heat dissipation profile proposed in this application can also contact different products through the first substrate 100 and the second substrate 300 respectively, so as to be used for heat dissipation of multiple devices, saving processes and simple installation.

[0038] In one embodiment, one end of the first heat dissipation plate 200 away from the first substrate 100 is connected to the second substrate 300 , and the second substrate 300 contacts the product and performs heat transfer.

[0039] The second substrate 300 is located at one end of the first heat sink 200 away from the first substrate 100. The second substrate 300 is used to contact the product and transfer heat, and then transfer the heat to the first heat sink 200 for heat dissipation. In the specific implementation process, the first heat sink 200 extends to the side of the second substrate 300 away from the first substrate 100, thereby improving the heat transfer efficiency between the first heat sink 200 and the second substrate 300, thereby improving the heat dissipation effect. In addition, by setting the second substrate 300 and using it to contact the product, the heat dissipation efficiency of different heat-generating parts of a product can also be improved, and different products can also be cooled. Of course, it can be understood that the second substrate 300 can also be set in different shapes according to different products.

[0040] In another embodiment, reference Figure 3 As shown, the second substrate 300 is provided with a boss 310 , which is disposed on a side of the second substrate 300 away from the first heat sink 200 and protrudes from the surface of the second substrate 300 .

[0041] In the specific implementation process, the second substrate 300 is provided with a boss 310, which is integrally formed with the second substrate 300 and protrudes from the surface of the second substrate 300 to contact products at different positions and heights and perform heat exchange, thereby improving the heat dissipation efficiency of the corresponding products. At the same time, the applicability of the heat dissipation profile can also be improved.

[0042] In one embodiment, the heat sink further includes a second heat sink 400 , which is disposed on the first substrate 100 , one end of which is connected to the first heat sink 200 , and the other end of which extends away from the first heat sink 200 .

[0043] The second heat sink 400 is protruding from the surface of the first substrate 100 and performs heat exchange with the first substrate 100, and the second heat sink 400, the first heat sink 200 and the first substrate 100 are integrally formed. Further, a plurality of second heat sinks 400 are provided, and the plurality of second heat sinks 400 are arranged at intervals and correspond to the first heat sink 200 one by one. The space enclosed by two adjacent second heat sinks 400 and the first substrate 100 forms a second heat dissipation channel 410, and the first heat dissipation channel 210 is connected to the second heat dissipation channel 410. Specifically, it can be understood that in order to ensure the heat transfer efficiency between the first substrate 100 and the product, the first substrate 100 is not hollowed out at the second heat dissipation channel 410. On the one hand, the heat dissipation airflow around the second heat sink 400 flows and dissipates along the second heat dissipation channel 410, and on the other hand, the heat dissipation airflow also flows through the second heat dissipation channel 410 to the first heat dissipation channel 210 and is dissipated by the first heat dissipation channel 210.

[0044] Furthermore, the first heat sink 200 and the second heat sink 400 are also extended in a direction perpendicular to the first substrate 100, and the extension length of the first heat sink 200 is greater than the extension length of the second heat sink 400, so that the contact portion of the first heat sink 200 and the second heat sink 400 forms a step-like structure. In this way, the second heat sink 400 can avoid other products, which is convenient for the installation of the heat dissipation profile.

[0045] In one embodiment, the first substrate 100 includes a connecting portion 110 and a fixing portion 120, the first heat dissipation plate 200 is disposed on the connecting portion 110, and the fixing portion 120 is provided with a first connecting hole 130. The fixing portion 120 is disposed close to the edge of the first substrate 100 and is provided with the first connecting hole 130, and screws are installed at the corresponding position through the first connecting hole 130.

[0046] In one embodiment, the second substrate 300 is provided with an avoidance portion, and the avoidance portion is provided with a second connection hole 320. It is understandable that, for the convenience of installation, the first heat sink 200 will avoid the avoidance portion, and the screws are fixed and installed through the second connection hole 320 to fix the heat dissipation profile.

[0047] In one embodiment, a third substrate 500 is provided on one side of the first substrate 100 close to the first heat sink 200, a third connection hole 510 is provided on the third substrate 500, and a first heat sink 200 is also provided on the third substrate 500. In this embodiment, a side of the first substrate 100 connected to the first heat sink 200 extends toward the first heat sink 200 to form the third substrate 500, the first heat sink 200 is provided on the third substrate 500, and a third connection hole 510 is provided on the third substrate 500, and screws are fixed and installed through the third connection hole 510. It can be understood that in order to adapt to different products, the thickness and shape of the first substrate 100, the second substrate 300 and the third substrate 500 can be adaptively changed to improve the applicability of the heat sink.

[0048] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A heat dissipation profile, characterized in that: include: a first substrate, the first substrate contacts the product and performs heat transfer; and The heat dissipation plate includes a first heat dissipation plate, a plurality of the first heat dissipation plates are provided, and the plurality of the first heat dissipation plates are arranged in parallel and at intervals. One end of the first heat dissipation plate is connected to an edge of one side of the first substrate, and the other end extends in a direction away from the first substrate, and the extension direction is parallel to the first substrate. A first heat dissipation channel is formed between two adjacent first heat dissipation plates, and the first heat dissipation channel is arranged to penetrate in a direction perpendicular to the plane where the substrate is located.

2. The heat dissipation profile according to claim 1, characterized in that: One end of the first heat sink away from the first substrate is connected to a second substrate, and the second substrate contacts the product and performs heat transfer.

3. The heat dissipation profile according to claim 2, characterized in that: The second substrate is provided with a boss, which is arranged on a side of the second substrate away from the first heat sink and protrudes from the surface of the second substrate.

4. The heat dissipation profile according to claim 1, characterized in that: The heat sink also includes a second heat sink, which is disposed on the first substrate. One end of the second heat sink is connected to the first heat sink, and the other end of the second heat sink extends in a direction away from the first heat sink.

5. The heat dissipation profile according to claim 4, characterized in that: There are multiple second heat dissipation plates, which are arranged at intervals and correspond to the first heat dissipation plates one by one. The space surrounded by two adjacent second heat dissipation plates and the first substrate forms a second heat dissipation channel, and the first heat dissipation channel is connected to the second heat dissipation channel.

6. The heat dissipation profile according to claim 4, characterized in that: The first substrate includes a connecting portion and a fixing portion, the first heat dissipation plate is arranged on the connecting portion, and the fixing portion is provided with a first connecting hole.

7. The heat dissipation profile according to claim 4, characterized in that: The first heat dissipation plate and the second heat dissipation plate also extend in a direction perpendicular to the first substrate, respectively, and an extension length of the first heat dissipation plate is greater than an extension length of the second heat dissipation plate.

8. The heat dissipation profile according to claim 2, characterized in that: The second substrate is provided with an avoidance portion, and the avoidance portion is provided with a second connection hole.

9. The heat dissipation profile according to claim 1, characterized in that: A third substrate is provided on a side of the first substrate close to the first heat sink. A third connecting hole is provided on the third substrate. The first heat sink is also provided on the third substrate.

10. The heat dissipation profile according to any one of claims 1 to 9, characterized in that: The heat dissipation profile is made of aluminum.

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