Integrated tower type water cooling radiator

Abstract

An integrated tower type water cooling radiator relates to the technical field of radiators and comprises a cold head assembly, at least one cold discharge assembly and a pipeline assembly used for communicating the cold head assembly with the cold discharge assembly, the cold head assembly comprises a water cooling block and a water pump, cooling liquid is stored in the water cooling block, and the water pump is used for providing flowing power for the cooling liquid; the cold row assembly is fixedly arranged on the cold head assembly, and the cold row assembly is provided with a cooling liquid inlet and a cooling liquid outlet; the pipeline assembly comprises a liquid inlet pipeline and a liquid outlet pipeline, one end of the liquid inlet pipeline and one end of the liquid outlet pipeline communicate with the cold head assembly, and the other end of the liquid inlet pipeline and the other end of the liquid outlet pipeline communicate with the cooling liquid inlet and the cooling liquid outlet correspondingly. By the adoption of the technical scheme, the cold head assembly and the water drainage assembly are integrated, the distance between the cold head assembly and the water drainage assembly is shortened, the flow speed of cooling liquid is increased, the heat dissipation efficiency is improved, the overall appearance is simple and concise, assembling is easy, and market popularization is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to an integrated tower-type water-cooling radiator. Background Art

[0002] The chip will generate a lot of heat when working. Excessive temperature will affect the working performance of the chip, so the chip needs to be cooled. Currently, mature heat dissipation methods include air cooling and liquid cooling. The chip liquid cooling radiator has the advantages of being quiet, stable in cooling, and less dependent on the environment. The traditional liquid cooling radiator consists of three parts: a cold head, a cold row and a fan. Among them, the cold head is in direct contact with the chip and is responsible for absorbing the heat emitted by the chip. The water pump in the cold head is responsible for providing the power for the flow of the coolant. After the coolant absorbs the heat in the cold head, it flows into the cold row through the water pipe under the action of the water pump; the cold row is installed in the chassis and is responsible for dissipating the heat absorbed by the coolant to the outside of the chassis. After the coolant is cooled in the cold row, it flows back to the cold head through the water pipe, thus circulating; the fan is installed on the cold row and is responsible for accelerating the speed of air flow in the cold row and improving the heat dissipation efficiency.

[0003] However, the head of the water pump in the cold head is certain. In traditional water-cooled radiators, the radiator and the cold head are separated, and the water pipe is long, which wastes the head of the water pump to a certain extent, slows down the flow rate of the coolant, and limits the heat dissipation efficiency of the water-cooled radiator. Since the radiator of a traditional water-cooled radiator usually needs to be equipped with a dust cover for dust prevention, it is difficult for the fan to blow through the entire radiator, which also limits the heat dissipation efficiency.

[0004] Therefore, the present application proposes an integrated tower-type water-cooling radiator to solve the above-mentioned deficiencies. Utility Model Content

[0005] The purpose of the utility model is to address the defects and shortcomings in the prior art, and the utility model provides an integrated tower-type water-cooling radiator.

[0006] The technical solution adopted by the utility model is: an integrated tower water-cooling radiator, comprising a cold head assembly, at least one cold row assembly, and a pipe assembly for connecting the cold head assembly and the cold row assembly, the cold head assembly comprising a water-cooling block for contacting the chip and a water pump arranged on the water-cooling block, the water-cooling block stores coolant, the water pump is used to provide flow power to the coolant, so that the coolant in the water-cooling block can flow into the water row assembly through the pipe assembly and then flow back to the water-cooling block;

[0007] The cold row assembly is fixedly arranged on the cold head assembly, and the cold row assembly has a coolant inlet and a coolant outlet;

[0008] The pipeline assembly includes a liquid inlet pipeline and a liquid outlet pipeline, one end of the liquid inlet pipeline and the liquid outlet pipeline are connected to the cold head assembly, and the other ends of the liquid inlet pipeline and the liquid outlet pipeline are respectively connected to the coolant inlet and the coolant outlet

[0009] Optionally, the radiator assembly includes a frame, water chambers symmetrically arranged on both sides of the frame, a plurality of water channels arranged between two of the water chambers, and a heat sink group arranged between two adjacent water channels, the water chambers are used to contain coolant, the plurality of water channels are evenly distributed between the two water chambers, and the plurality of water channels are connected to the water chambers so that the coolant can flow from one of the water chambers through the water channels into the other water chamber.

[0010] Optionally, the coolant inlet and the coolant outlet are respectively arranged on two water chambers.

[0011] Optionally, the plurality of water channels are arranged along a direction perpendicular to the length of the water chamber, and the plurality of water channels are evenly distributed along the length of the water chamber.

[0012] Optionally, the heat sink group includes a plurality of heat sink fins connected in sequence, the heat sink fins are arranged in a V shape, and the top and bottom of the heat sink fins are in contact with the water channel.

[0013] Optionally, at least one fan assembly is further included, wherein the fan assembly is fixedly mounted on the side wall of the radiator assembly, the air outlet surface of the fan assembly faces the radiator assembly, and the fan assembly is used to accelerate the air flow on the surface of the radiator assembly to improve the heat dissipation efficiency.

[0014] Optionally, the fan assembly includes a fan, the size of the fan is adapted to the frame, and the air outlet surface of the fan faces the heat sink.

[0015] Optionally, a fan fixing plate is provided on the frame, a fixing hole is formed on the fan fixing plate, and a positioning hole corresponding to the fixing hole is provided on the fan.

[0016] Optionally, mounting blocks are provided on both sides of the water cooling block, the two mounting blocks are symmetrically arranged, and the two mounting blocks are fixedly connected to the water cooling block by threaded fasteners.

[0017] After adopting the above technical solution, the beneficial effects of the utility model are:

[0018] 1. The present application forms a cold head assembly by forming a water cooling block and a water pump, and arranges a water discharge assembly on the cold head assembly, that is, the cold head assembly and the water discharge assembly are arranged as an integrated design, which greatly shortens the distance between the cold head assembly and the water discharge assembly, increases the flow rate of the coolant, improves the heat dissipation efficiency, and has a simple and concise overall appearance, does not require a dust cover, and has a better heat dissipation effect;

[0019] 2. This application can adapt to different heat dissipation requirements by changing the width of the water row assembly and the width of the fan assembly, which is highly practical and has a wide range of applications;

[0020] 3. When the present application is used in a chassis, the fan assembly can overlap with the internal air duct of the chassis, which is beneficial to further accelerate the air flow rate of the heat dissipation fins in the radiator assembly, thereby improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0022] Figure 1 is a schematic diagram of the overall structure of the first embodiment;

[0023] Figure 2 yes Figure 1 Another perspective of the display diagram;

[0024] Figure 3 yes Figure 1 A partial display diagram of

[0025] Figure 4 is a schematic diagram of the overall structure of the second embodiment;

[0026] Figure 5 yes Figure 4 Another perspective showing the picture.

[0027] Explanation of the reference numerals: 10, cold head assembly; 11, water cooling block; 111, mounting block; 12, water pump; 20, radiator assembly; 21, frame; 211, fan fixing plate; 212, fixing hole; 22, water chamber; 23, water channel; 24, cooling fin; 201, coolant inlet; 202, coolant outlet; 30, pipe assembly; 31, liquid inlet pipe; 32, liquid outlet pipe; 40, fan assembly. DETAILED DESCRIPTION

[0028] The following will be combined with the attached embodiment of the utility model Figure 1-4 , clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] It should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", "back", "side", "circumferential" and the like in the present invention indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present invention. In addition, the words "first", "second" and the like are only used to distinguish multiple components or structures with the same or similar structures, and do not represent any special limitation on the setting order or connection relationship.

[0030] Embodiment 1:

[0031] This embodiment relates to an integrated tower water-cooling radiator. Figure 1-Figure 3 , including a cold head assembly 10, a cold row assembly 20, and a pipe assembly 30 for connecting the cold head assembly 10 and the cold row assembly 20, wherein the cold head assembly 10 includes a water cooling block 11 for contacting the chip and a water pump 12 arranged on the water cooling block 11, and the water cooling block 11 stores cooling liquid, that is, the water cooling block 11 directly contacts the chip, absorbs the heat generated when the chip is working, and transfers the absorbed heat to the cooling liquid. The water pump 12 is used to provide the cooling liquid with flowing power, so that the cooling liquid in the water cooling block 11 can absorb the heat of the chip and then flow into the water row assembly through the pipe assembly 30 and then flow back to the water cooling block 11.

[0032] The radiator assembly 20 is fixedly disposed on the cold head assembly 10, and the radiator assembly 20 has a coolant inlet 201 and a coolant outlet 202. The pipe assembly 30 includes a liquid inlet pipe 31 and a liquid outlet pipe 32, one end of the liquid inlet pipe 31 and the liquid outlet pipe 32 are both connected to the cold head assembly 10, and the other ends of the liquid inlet pipe 31 and the liquid outlet pipe 32 are respectively connected to the coolant inlet 201 and the coolant outlet 202.

[0033] When the chip is working, the water-cooling block 11 absorbs the heat generated by the chip and transfers the heat to the coolant. The water pump 12 provides power to the coolant, so that the coolant that absorbs the heat flows into the liquid inlet pipe 31 and then enters the radiator assembly 20 through the coolant inlet 201. The radiator assembly 20 discharges the heat to reduce the temperature of the coolant. At this time, since the water pump 12 continues to provide power to the coolant, the coolant can flow from the coolant outlet 202 into the liquid outlet pipe 32 and then flow back to the water-cooling block 11, thereby forming a complete water-cooling liquid cycle, realizing continuous heat dissipation of the chip to ensure the normal operation of the chip.

[0034] Furthermore, the radiator assembly 20 includes a frame 21, water chambers 22 symmetrically arranged on both sides of the frame 21, a plurality of water channels 23 arranged between the two water chambers 22, and a heat sink arranged between two adjacent water channels 23, wherein the frame 21 is fixedly connected to the water chambers 22 to ensure the overall stability of the radiator assembly 20, the water chambers 22 are arranged along a length direction perpendicular to the frame 21, the water chambers 22 have a receiving cavity for receiving coolant, the plurality of water channels 23 are evenly distributed between the two water chambers 22, and the plurality of water chambers 22 are connected to the two water bodies so that the coolant can flow from one of the water chambers 22 through the water chamber 22 into the other water chamber 22.

[0035] It can be understood that the coolant in the water cooling block 11 is pumped into the liquid inlet pipe 31 by the water pump 12 and then flows into one of the water chambers 22. The coolant flows into the other water chamber 22 through the water channel 23 in the water chamber 22. In the process of flowing through the water channel 23, the coolant absorbs the heat in the coolant through the heat sink group, thereby reducing the temperature of the coolant and achieving the effect of cooling the chip.

[0036] Furthermore, the coolant inlet 201 and the coolant outlet 202 are respectively arranged on the two water chambers 22. In the present embodiment, the coolant inlet 201 and the coolant outlet 202 are symmetrically arranged, and the coolant inlet 201 and the coolant outlet 202 are respectively located at the lower middle part of the two water chambers 22. Such an arrangement can reduce the length of the liquid inlet pipe 31 and the liquid outlet pipe 32, thereby speeding up the flow rate of the coolant and improving the heat dissipation efficiency. In other embodiments, the positions of the coolant inlet 201 and the coolant outlet 202 can be adjusted accordingly according to the actual situation, and no limitation is made here.

[0037] Furthermore, the plurality of water channels 23 are arranged along a direction perpendicular to the length of the water chamber 22 , and the plurality of water channels 23 are evenly distributed along the length of the water chamber 22 .

[0038] Through the above arrangement, the radiator assembly 20 is more stable as a whole and has a better heat dissipation effect. Meanwhile, the simple appearance design makes the radiator assembly 20 more suitable for the public and is conducive to market promotion.

[0039] Furthermore, the heat sink group includes a plurality of heat sink fins 24 connected in sequence, the heat sink fins 24 are arranged in a V-shape, and the top and bottom of the heat sink fins 24 are in contact with the water channel 23 .

[0040] It can be understood that a plurality of V-shaped heat sink fins 24 connected in sequence are arranged between two adjacent water channels 23, and the contact area between the heat sink fins 24 and the water channel 23 is large, so that when the coolant enters the water chamber 22 through the water channel 23, the heat of the coolant can be evenly transferred to the heat sink fins 24. At the same time, the gaps between the V-shaped heat sink fins 24 themselves are more conducive to heat dissipation, thereby improving the heat dissipation efficiency.

[0041] Furthermore, the integrated tower water-cooling radiator provided in this embodiment also includes at least one fan assembly 40, which is fixedly arranged on the side wall of the radiator assembly 20, with the air outlet surface of the fan assembly 40 facing the radiator assembly 20, and the fan assembly 40 is used to accelerate the air flow on the surface of the radiator assembly 20 to improve the heat dissipation efficiency.

[0042] Furthermore, the fan assembly 40 includes a fan, the size of the fan is adapted to the frame 21, and the air outlet surface of the fan faces the heat sink.

[0043] When in use, the fan assembly 40 blows air to the radiator assembly 20, that is, blows air to the heat sink assembly, which speeds up the air flow at the heat sink assembly, so that the heat on the surface of the heat sink fins 24 can be quickly blown away, thereby achieving the effect of improving the heat dissipation efficiency. In addition, it should be noted that when in use, the fan assembly 40 can overlap with the air duct inside the computer case, so as to further speed up the air flow between the heat sink fins 24, thereby improving the heat dissipation efficiency.

[0044] Furthermore, a fan fixing plate 211 is provided on the frame 21. In the present embodiment, there are two fan fixing plates 211, which are respectively located on the upper and lower sides of the frame 21. A fixing hole 212 is provided on the fan fixing plate 211, and a positioning hole corresponding to the fixing hole 212 is provided on the fan.

[0045] When installing the fan, the positioning holes on the fan are aligned with those on the fan fixing plate 211, and the fan and the fan fixing plate 211 are fixed by threaded fasteners, so as to achieve positioning and fixing of the fan.

[0046] In addition, for the convenience of installation and fixing, mounting blocks 111 are provided on both sides of the water cooling block 11, the two mounting blocks 111 are symmetrically arranged, and the two mounting blocks 111 are fixedly connected to the water cooling block 11 by threaded fasteners. This design enables the water cooling block 11 to be conveniently installed on the chip that needs heat dissipation while ensuring the stability of the connection.

[0047] Embodiment 2:

[0048] Reference Figure 4 and Figure 5 The difference between this embodiment and the first embodiment is that the number of the cooling radiator assembly 20, the duct assembly 30 and the fan assembly 40 is different.

[0049] Specifically, the number of the radiator assembly 20 and the fan assembly 40 are both two groups, and the pipe assembly 30 includes two liquid inlet pipes 31 and two liquid outlet pipes 32. One end of the two liquid inlet pipes 31 is connected to the cold head assembly 10, and the other end of the two liquid inlet pipes 31 is respectively connected to the coolant inlet 201 of the two groups of radiator assemblies 20, one end of the two liquid outlet pipes 32 is connected to the cold head assembly 10, and the other end of the two liquid outlet pipes 32 is respectively connected to the coolant outlet 202 of the two groups of radiator assemblies 20. One group of fan assemblies 40 is fixedly arranged between the two groups of radiator assemblies 20, and the other group of fan assemblies 40 is fixedly arranged on the side of the two groups of radiator assemblies 20 that are away from each other, and the blowing directions of the two groups of fan assemblies 40 are consistent.

[0050] The above is only used to illustrate the technical solution of the utility model rather than to limit it. Other modifications or equivalent substitutions made to the technical solution of the utility model by ordinary technicians in this field should be included in the scope of the claims of the utility model as long as they do not depart from the spirit and scope of the technical solution of the utility model.

Claims

1. An integrated tower water-cooling radiator, characterized in that: The invention comprises a cold head assembly (10), at least one cold row assembly (20), and a pipe assembly (30) for connecting the cold head assembly (10) and the cold row assembly (20), wherein the cold head assembly (10) comprises a water cooling block (11) for contacting a chip and a water pump (12) arranged on the water cooling block (11), wherein the water cooling block (11) stores a cooling liquid, and the water pump (12) is used to provide a flow force for the cooling liquid, so that the cooling liquid in the water cooling block (11) can flow into the water row assembly through the pipe assembly (30) and then flow back into the water cooling block (11); The cold row assembly (20) is fixedly arranged on the cold head assembly (10), and the cold row assembly (20) has a cooling liquid inlet (201) and a cooling liquid outlet (202); The pipeline assembly (30) comprises a liquid inlet pipeline (31) and a liquid outlet pipeline (32), one end of the liquid inlet pipeline (31) and the liquid outlet pipeline (32) are connected to the cold head assembly (10), and the other end of the liquid inlet pipeline (31) and the liquid outlet pipeline (32) are respectively connected to the cooling liquid inlet (201) and the cooling liquid outlet (202).

2. The integrated tower water cooling radiator according to claim 1, characterized in that: The radiator assembly (20) comprises a frame (21), water chambers (22) symmetrically arranged on both sides of the frame (21), a plurality of water channels (23) arranged between two of the water chambers (22), and a heat sink group arranged between two adjacent water channels (23), wherein the water chamber (22) is used to contain a coolant, the plurality of water channels (23) are evenly distributed between the two water chambers (22), and the plurality of water channels (23) are all connected to the water chambers (22), so that the coolant can flow from one of the water chambers (22) through the water channels (23) into the other water chamber (22).

3. The integrated tower water cooling radiator according to claim 2, characterized in that: The cooling liquid inlet (201) and the cooling liquid outlet (202) are respectively arranged on the two water chambers (22).

4. The integrated tower water cooling radiator according to claim 2, characterized in that: The plurality of water channels (23) are all arranged in a direction perpendicular to the length of the water chamber (22), and the plurality of water channels (23) are evenly distributed along the length of the water chamber (22).

5. The integrated tower water cooling radiator according to claim 2, characterized in that: The heat sink group comprises a plurality of heat sink fins (24) connected in sequence, the heat sink fins (24) are arranged in a V-shape, and the top and bottom of the heat sink fins (24) are in contact with the water channel (23).

6. The integrated tower water cooling radiator according to claim 2, characterized in that: The invention also comprises at least one fan assembly (40), wherein the fan assembly (40) is fixedly arranged on the side wall of the radiator assembly (20), the air outlet surface of the fan assembly (40) faces the radiator assembly (20), and the fan assembly (40) is used to accelerate the air flow on the surface of the radiator assembly (20) to improve the heat dissipation efficiency.

7. The integrated tower water cooling radiator according to claim 6, characterized in that: The fan assembly (40) comprises a fan, the size of the fan is adapted to the frame (21), and the air outlet surface of the fan faces the heat sink.

8. The integrated tower water cooling radiator according to claim 7, characterized in that: The frame (21) is provided with a fan fixing plate (211), the fan fixing plate (211) is provided with a fixing hole (212), and the fan is provided with a positioning hole corresponding to the fixing hole (212).

9. The integrated tower water cooling radiator according to claim 1, characterized in that: Mounting blocks (111) are provided on both sides of the water cooling block (11), the two mounting blocks (111) are symmetrically arranged, and the two mounting blocks (111) are fixedly connected to the water cooling block (11) via threaded fasteners.

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