Radiator structure
By designing a radiator structure with an arched heat sink set and a misaligned setting, the problem of difficulty in taking into account both flatness and heat dissipation effects in the prior art is solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202421673393.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-15
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-07-15
AI Technical Summary
While pursuing flatness, existing radiators are difficult to take into account efficient heat dissipation, especially in compact design electronic devices, which have poor heat dissipation effects.
A radiator structure including a heat dissipation base and an arched heat dissipation module is designed. The arched heat dissipation fin set is arranged in the second direction, and the arched heat dissipation is arranged in the first direction, and ventilation holes are formed through the interlaced connection of adjacent arched heat dissipation to increase air circulation and heat dissipation.
This design not only reduces the thickness of the radiator, but also improves the contact area between the radiator and the air and the conductivity of the ventilation holes, thereby improving the heat dissipation efficiency.
Smart Images
Figure CN222885027U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat sink structure. Background Art
[0002] A radiator is a device used to dissipate heat. It is usually used to cool overheated parts generated in other devices or systems. Radiators are usually made of metal, such as copper or aluminum, which has good thermal conductivity. They are installed on the surface of the equipment that needs to be cooled to promote the dissipation of heat by increasing the surface area. Radiators are commonly used in electronic equipment, electronic components, and automobile engines. The main function of a radiator is to transfer heat from the cooled device or system to the surrounding environment by increasing the surface area and utilizing the principle of heat transfer to maintain the normal operating temperature of the equipment. In theory, the larger the surface area of the radiator, the better its heat dissipation effect.
[0003] Today's electronic devices are becoming more and more compact, and require flatter heat sinks with better heat dissipation. However, it is difficult for ordinary heat sinks to have both flatness and heat dissipation. Flat heat sinks often have poor heat dissipation effects because the contact area between the heat sink and the air is small.
[0004] Therefore, the above-mentioned technical defects need to be changed urgently. Utility Model Content
[0005] In view of the above-mentioned deficiencies in the prior art, an object of the present application is to provide a heat sink structure, aiming to reduce the thickness of the heat sink structure and improve the heat dissipation efficiency of the heat sink structure.
[0006] In order to solve the above technical problems, an embodiment of the present application provides a heat sink structure, including:
[0007] The heat dissipation base is a plate-like structure having a first direction and a second direction perpendicular to each other;
[0008] and a plurality of heat dissipation modules, the heat dissipation modules are arranged on the heat dissipation base along the first direction, the heat dissipation modules include a plurality of arched heat dissipation fin groups arranged along the second direction, the arched heat dissipation fin groups are provided with arched heat dissipation fins connected along the second direction, and the arched heat dissipation fins are staggered along the first direction;
[0009] The two ends of the arched heat sink along the first direction are respectively connected to the heat sink base to form ventilation holes, and the ventilation holes on the arched heat sinks staggered in the same arched heat sink group are interlaced and communicated.
[0010] In a possible implementation, the arched heat sink includes:
[0011] At least two foot plates, the foot plates standing on the heat dissipation base;
[0012] An upper cover plate, which is mounted on one end of the foot plate away from the heat dissipation base;
[0013] The foot plate and the upper cover plate form an arch structure, and the arch structure and the heat dissipation base are closed to form a ventilation hole.
[0014] In a possible implementation, the upper cover plate, the foot plate and the heat dissipation base are integrally formed.
[0015] In a possible implementation, the upper cover plates disposed on the same heat dissipation module are connected so that adjacent arched heat dissipation fins are connected to each other and adjacent ventilation holes are interconnected.
[0016] In a possible implementation, the upper cover plate disposed on the same heat dissipation module is integrally formed.
[0017] In a possible implementation, the thickness of the foot plate is the same as the thickness of the upper cover plate.
[0018] In a possible implementation, the width of the foot plate is the same as the width of the upper cover plate.
[0019] In a possible implementation, the heat dissipation base and the heat dissipation module are both metal copper structures or metal aluminum structures.
[0020] Compared with the prior art, the present application provides a radiator structure. The arched heat sink of the utility model can reduce the thickness of the radiator structure while increasing the contact area between the heat sink and the air; in addition, the staggered connection of adjacent arched heat sinks can allow each ventilation hole to be directly connected to the outside world, further improving the heat dissipation effect of the heat dissipation module. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0022] Figure 1 is a schematic diagram of the overall structure of a heat sink structure provided in this embodiment;
[0023] Figure 2 is a structural schematic diagram of a heat dissipation module of a heat sink structure provided in this embodiment;
[0024] Figure 3 yes Figure 2 An enlarged schematic diagram of the part marked A;
[0025] Figure 4It is a structural schematic diagram of an arched heat sink group of a heat sink structure provided in this embodiment.
[0026] In the figure: 1, heat dissipation base; 2, heat dissipation module; 20, arched heat sink group; 21, arched heat sink; 211, foot plate; 212, upper cover plate; 213, ventilation hole. DETAILED DESCRIPTION
[0027] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.
[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, "multiple" means two or more.
[0029] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0030] In addition, the technical features involved in the different embodiments of the present invention described above can be combined with each other as long as they do not conflict with each other.
[0031] On the one hand, the utility model provides Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, a radiator structure is installed on the surface of a device that needs to be cooled. It promotes heat dissipation by increasing the surface area and is used to cool overheated parts generated in other devices or systems. The main structure includes: a heat dissipation base 1 and a plurality of heat dissipation modules 2. The heat dissipation base 1 is a plate-like structure, and the plate-like structure has a first direction and a second direction that are perpendicular to each other. The heat dissipation base 1 and the heat dissipation module 2 can be integrally formed or connected by assembly. The heat dissipation module 2 is arranged on the heat dissipation base 1 along the first direction. The heat dissipation module 2 includes a plurality of arched heat sink groups 20 arranged along the second direction. The arched heat sink group 20 is provided with arched heat sinks 21 connected along the second direction. The arched heat sink 21 is staggered along the first direction. The two ends of the arched heat sink 21 along the first direction are respectively connected to the heat dissipation base 1 to form ventilation holes 213. The ventilation holes 213 on the arched heat sink 21 staggered in the same arched heat sink group 20 are staggered and communicated. That is, Figure 1 , Figure 2 and Figure 4 As shown, adjacent ventilation holes 213 arranged on the same heat dissipation module 2 are connected to each other, and each ventilation hole 213 is connected to the outside. This allows air to circulate more smoothly and the heat on the heat sink can be taken away more smoothly. The shape and size of the heat dissipation base 1 can be determined according to specific needs, and the number of corresponding heat dissipation modules 2 and the number of arched heat sinks 21 can be matched accordingly. The first direction and the second direction are as follows: Figure 1 , Figure 2 and Figure 3 As shown in the mark.
[0032] In some embodiments, at least one layer of the heat sink structure is provided on the end of the arched heat sink 21 away from the heat sink base 1. That is, a multi-layer heat sink structure design. The multi-layer heat sink structure design within a reasonable thickness range can increase the contact area between the heat sink and the air, and effectively improve the heat dissipation effect of the heat sink.
[0033] In some other embodiments, the heat sink structure is composed of a plurality of heat sink modules 2 arranged in an array, adjacent heat sink modules 2 are connected to each other, and the heat sink structure is formed by integrally stamping the plurality of heat sink modules 2 .
[0034] It should be noted that, as the design of today's electronic equipment becomes more and more compact, a flatter heat sink is urgently needed to enable electronic equipment to dissipate heat normally and efficiently. The arched heat sink 21 of the utility model can reduce the thickness of the heat sink structure while increasing the contact area between the heat sink and the air; in addition, adjacent arched heat sinks 21 are staggered and connected, so that adjacent ventilation holes 213 are connected to each other, and each ventilation hole 213 can be directly connected to the outside world. In this way, the flat structure design of the heat sink is realized, and the heat dissipation effect of the heat dissipation module 2 is guaranteed.
[0035] Further, such as Figure 2 , Figure 3 and Figure 4 As shown, the arched heat sink 21 includes: at least two foot plates 211 and an upper cover plate 212. Preferably, the foot plates 211 and the upper cover plate 212 are integrally formed. During production, the arched heat sink 21 can be formed by a rolling or bending process. The foot plate 211 stands on the heat sink base 1; the upper cover plate 212, the upper cover plate 212 is mounted on one end of the foot plate 211 away from the heat sink base 1; the foot plate 211 and the upper cover plate 212 form an arched structure, and the arched structure and the heat sink base 1 are closed to form a ventilation hole 213, and the cross-sectional shape of the ventilation hole 213 is square.
[0036] In some other embodiments, the foot plate 211 and the upper cover plate 212 form a circular arch or an elliptical arch structure, and the cross-sectional shape of the ventilation hole 213 is circular or elliptical. Preferably, the arched heat sink 21 with a square arch structure design can increase the contact area between the heat sink and the air, and the heat dissipation efficiency is higher.
[0037] Furthermore, the upper cover plate 212, the foot plate 211 and the heat dissipation base 1 are integrally formed. In some embodiments, the heat dissipation modules 2 on the same heat dissipation base 1 are all formed by stamping and bending the same plate. The production time and cost of the heat dissipation module 2 can be effectively reduced by stamping.
[0038] In some embodiments, a plurality of small ventilation holes 213 may be provided on the upper cover plate 212 and the foot plate 211 , and the small ventilation holes 213 may improve the effect of ventilation and heat dissipation.
[0039] Further, such as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, adjacent upper cover plates 212 arranged on the same heat dissipation module 2 are connected so that adjacent arched heat dissipation fins 21 are connected to each other and adjacent ventilation holes 213 are interconnected.
[0040] Furthermore, the upper cover plate 212 provided on the same heat dissipation module 2 is integrally formed. During production, the heat dissipation module 2 can be integrally stamped and formed. In some embodiments, all heat dissipation modules 2 are integrally stamped and formed from the same plate. After the heat dissipation module 2 is formed, it is connected to the heat dissipation base 1. In other embodiments, the heat dissipation base 1 is not provided in the radiator structure, that is, adjacent heat dissipation modules 2 are interconnected and formed, and there is no need to provide a heat dissipation base 1, and the heat dissipation module 2 can be directly attached to the device that needs heat dissipation. It can be seen that the integral stamping process can effectively reduce production costs.
[0041] Furthermore, the thickness of the foot plate 211 is the same as the thickness of the upper cover plate 212 .
[0042] Furthermore, the width of the foot plate 211 is the same as the width of the upper cover plate 212 .
[0043] Further, the heat dissipation base 1 and the heat dissipation module 2 are both metal copper structures or metal aluminum structures. Copper and aluminum are both excellent thermal conductive materials, so they are widely used in radiators. Copper has good thermal conductivity and heat conduction properties, making it a common choice in radiator manufacturing. Copper has a high thermal conductivity coefficient and can quickly transfer heat from the heat source to the surface of the radiator, and then dissipate the heat through other heat dissipation methods. In addition, copper also has good corrosion resistance and can resist the erosion of some chemicals. Aluminum is another commonly used radiator material with high thermal conductivity and light weight. Compared with copper, aluminum has a slightly lower thermal conductivity, but aluminum has better thermal diffusion performance and can transfer heat more evenly to the entire radiator surface. In addition, aluminum has a low cost and good processing performance, making it more economical and efficient when mass-producing radiators. In a specific implementation, the heat dissipation base 1 and the heat dissipation module 2 can be the same or different material structures.
[0044] In summary, the present application provides a radiator structure. The arched heat sink 21 of the utility model can reduce the thickness of the radiator structure while increasing the contact area between the heat sink and the air; in addition, the staggered connection of adjacent arched heat sinks 21 can allow adjacent ventilation holes 213 to be interconnected, and each ventilation hole 213 is directly connected to the outside world, further improving the heat dissipation effect of the heat dissipation module 2.
[0045] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.
Claims
1. A heat sink structure, characterized in that: include: A heat dissipation base, wherein the heat dissipation base is a plate-like structure, and the plate-like structure has a first direction and a second direction that are perpendicular to each other; and a plurality of heat dissipation modules, the heat dissipation modules are arranged on the heat dissipation base along a first direction, the heat dissipation modules include a plurality of arched heat dissipation fin groups arranged along a second direction, the arched heat dissipation fin groups are provided with arched heat dissipation fins connected along the second direction, and the arched heat dissipation fins are staggered along the first direction; Wherein, two ends of the arched heat sink along the first direction are respectively connected to the heat sink base to form ventilation holes, and the ventilation holes on the arched heat sinks staggered in the same arched heat sink group are staggered and communicated with each other.
2. A heat sink structure according to claim 1, characterized in that: The arched heat sink comprises: At least two foot plates, the foot plates standing on the heat dissipation base; An upper cover plate, the upper cover plate being mounted on an end of the foot plate away from the heat dissipation base; The foot plate and the upper cover plate form an arch structure, and the arch structure and the heat dissipation base are combined to form the ventilation hole.
3. A heat sink structure according to claim 2, characterized in that: The upper cover plate, the foot plate and the heat dissipation base are integrally formed.
4. A heat sink structure according to claim 2, characterized in that: The upper cover plates arranged on the same heat dissipation module are connected so that adjacent arched heat dissipation fins are connected to each other and adjacent ventilation holes are interconnected.
5. A heat sink structure according to claim 2, characterized in that: The upper cover plate arranged on the same heat dissipation module is integrally formed.
6. A heat sink structure according to claim 2, characterized in that: The thickness of the foot plate is the same as the thickness of the upper cover plate.
7. A heat sink structure according to claim 2, characterized in that: The width of the foot plate is the same as the width of the upper cover plate.
8. The heat sink structure according to claim 1, characterized in that: The heat dissipation base and the heat dissipation module are both metal copper structures or metal aluminum structures.