Heat dissipation system

Abstract

The utility model belongs to the technical field of heat dissipation, and discloses a heat dissipation system. A first medium is stored in one part of the vacuum liquid storage device, gas is stored in the other part of the vacuum liquid storage device, the pressure of the gas is preset pressure, and the preset pressure is smaller than the atmospheric pressure; the heat release device and the vacuum liquid storage device are connected through a first pipeline to form a first loop, a first medium in the vacuum liquid storage device can flow to the first pipeline, and the pressure in the first pipeline is equal to the gas pressure in the vacuum liquid storage device; the super-vaporization structure is arranged on the pipe wall of the first pipeline in a sealed and penetrating mode and comprises a heat absorption part and a super-vaporization part, the heat absorption part is located outside the first pipeline and used for absorbing heat of the part to be cooled, and the super-vaporization part is located in the first pipeline and used for making contact with a first medium in the first pipeline. The heat dissipation system provided by the utility model improves the heat dissipation efficiency and the heat dissipation effect of the piece to be cooled, so that heat exchange with high heat flux can be realized under the condition of relatively low temperature.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation system. Background Art

[0002] High-power electronic devices generate heat during operation, so a cooling system is needed to dissipate the heat.

[0003] Existing heat dissipation methods such as air cooling and natural convection cooling can no longer meet the growing heat dissipation needs of electronic equipment. Phase change heat transfer is a highly efficient heat transfer mode. During the phase change process, when the fluid changes from liquid to gas, it absorbs a large amount of latent heat of vaporization. Its heat transfer coefficient is usually 2500-100000w / m 2 k, is the forced water cooling heat transfer coefficient (100-20000w / m 2 k) is more than 5 times that of air cooling (25-250w / m 2 ·k) is more than 100 times. Among them, super-vaporization structure is one of the important ways to enhance heat transfer, and the currently commonly used super-vaporization structure is fins.

[0004] In the prior art, the area where the fins are located is usually at ambient air pressure, and the vaporization temperature of water is usually 100°C. That is, when the fin temperature reaches 100°C, the water in contact with the fins will vaporize and absorb the latent heat of vaporization, resulting in the heat dissipation system in the prior art being unable to achieve efficient heat exchange under relatively low temperature conditions, and the heat exchange effect needs to be improved. Utility Model Content

[0005] The utility model aims to provide a heat dissipation system to solve the problems of low heat dissipation efficiency and poor heat dissipation effect existing in the prior art.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] A heat dissipation system, comprising:

[0008] A vacuum liquid storage device, wherein a portion of the volume of the vacuum liquid storage device stores a first medium, and another portion of the volume stores a gas, and the pressure of the gas is a preset pressure, and the preset pressure is less than the atmospheric pressure;

[0009] A heat release device, wherein the heat release device is connected to the vacuum liquid storage device through a first pipeline to form a first loop, a first medium in the vacuum liquid storage device can flow to the first pipeline, and a pressure in the first pipeline is equal to a gas pressure in the vacuum liquid storage device;

[0010] A supervaporization structure, wherein the supervaporization structure is sealed and penetrates the tube wall of the first pipeline, and comprises a heat absorbing part and a supervaporization part, wherein the heat absorbing part is located outside the first pipeline and is used to absorb the heat of the heat element to be dissipated, and the supervaporization part is located inside the first pipeline and is used to contact the first medium inside the first pipeline.

[0011] Preferably, the first pipeline is provided with a transparent window, and the transparent window is arranged opposite to the super vaporization part.

[0012] Preferably, the first pipeline includes a round pipe section and a square pipe section, and the super vaporization structure is sealed and penetrated through the pipe wall of the square pipe section.

[0013] Preferably, the heat dissipation system also includes a first temperature sensor and a second temperature sensor, both of which are arranged in the square tube section, and the first temperature sensor is arranged upstream of the supervaporization structure, and the second temperature sensor is arranged downstream of the supervaporization structure.

[0014] Preferably, the heat release device is a heat exchanger, the heat exchanger comprises a heat dissipation channel and a heat absorption channel, and the first pipeline is connected to the heat dissipation channel;

[0015] The heat dissipation system further includes a cooling device, which is connected to the heat absorption channel of the heat exchanger through a second pipeline to form a second loop, and the second medium in the second loop is used to absorb the heat of the first medium in the first loop.

[0016] Preferably, the heat dissipation system further comprises a liquid storage tank, which is connected between the heat exchanger and the cooling device via the second pipeline, and stores half the volume of the second medium in the liquid storage tank.

[0017] Preferably, the heat dissipation system further comprises a first circulation pump, which is arranged in the first pipeline and is used to drive the flow of the first medium in the first circuit; and / or

[0018] The heat dissipation system further includes a second circulation pump, which is disposed in the second pipeline and is used to drive the flow of the second medium in the second circuit.

[0019] Preferably, the heat dissipation system further comprises a vacuum pump, which is connected to the top of the vacuum liquid storage device via a third pipeline, and the third pipeline is provided with a vacuum control valve, which is used to control the on-off of the third pipeline.

[0020] Preferably, the heat dissipation system further comprises a flow control valve, which is arranged in the first pipeline and located between the vacuum liquid storage device and the supervaporization structure, and is used to control the on-off of the first pipeline.

[0021] Preferably, the heat absorbing part comprises a heat absorbing plate, the heat absorbing plate is connected to the first pipeline, and the super vaporization part comprises a plurality of fins, and an arrangement direction of the plurality of fins is perpendicular to a flow direction of the first medium.

[0022] Beneficial effects of the utility model:

[0023] The heat dissipation system provided by the utility model is provided with a vacuum liquid storage device, and a part of the volume of the vacuum liquid storage device stores a first medium, and the other part of the volume stores a gas, and the pressure of the gas is a preset pressure, so that the pressure in the first pipeline connected to the vacuum liquid storage device can be the preset pressure, and when the temperature of the supervaporized part of the supervaporized structure located in the first pipeline reaches the vaporization temperature of the first medium under the preset pressure, the first medium in contact with the supervaporized part can be vaporized, and quickly absorbs the heat on the supervaporized part, thereby realizing cooling of the heat dissipation element to be cooled, so that the heat dissipation system provided by this embodiment can create a low-pressure environment for the first medium, so that the first medium can also be vaporized when the temperature of the supervaporized part is low. Since the first medium can absorb a large amount of latent heat of vaporization during the phase change process, and the heat transfer coefficient is very high, it can quickly absorb the heat on the supervaporized part, thereby improving the heat dissipation efficiency and heat dissipation effect of the heat dissipation element to be cooled, so that high heat flux density heat exchange can be achieved under relatively low temperature conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the structure of the heat dissipation system provided by the embodiment of the utility model. Figure 1 ;

[0025] Figure 2 This utility model Figure 1 The enlarged view of point A is shown;

[0026] Figure 3 This is a schematic diagram of the structure of the heat dissipation system provided by the embodiment of the utility model. Figure 2 ;

[0027] Figure 4 It is an exploded schematic diagram of the super vaporization structure and the first pipeline provided by the utility model.

[0028] In the figure:

[0029] 1. Vacuum liquid storage device; 2. Heat release device; 3. First pipeline; 31. Circular pipe section; 32. Square pipe section; 4. Super vaporization structure; 41. Heat absorbing plate; 42. Fins; 5. Transparent window; 6. First temperature sensor; 7. Second temperature sensor; 8. Cooling device; 9. Second pipeline; 10. Liquid storage tank; 11. First circulation pump; 12. Second circulation pump; 13. Vacuum pump; 14. Third pipeline; 15. Vacuum control valve; 16. Flow control valve; 17. Heat dissipation component; 18. Bracket. DETAILED DESCRIPTION

[0030] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0031] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0033] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0034] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0035] like Figures 1 to 4 As shown, this embodiment provides a heat dissipation system, which can cool the heat dissipation element 17 in a low temperature environment and has a high heat dissipation effect and efficiency.

[0036] The heat dissipation system includes a vacuum liquid storage device 1, a heat release device 2, and a super vaporization structure 4. Among them, a part of the volume in the vacuum liquid storage device 1 stores a first medium, and another part of the volume stores a gas. In some optional embodiments, the vacuum liquid storage device 1 can be in a can shape, and the upper part of the volume of the vacuum liquid storage device 1 stores gas, and the lower part of the volume stores the first medium. Exemplarily, the first medium is water, and it can be understood that the first medium can also be other substances, which is not limited in this embodiment.

[0037] In this embodiment, the pressure of the gas in the vacuum liquid storage device 1 is a preset pressure, which is lower than the atmospheric pressure. That is, the pressure in the vacuum liquid storage device 1 is lower than the atmospheric pressure.

[0038] The heat release device 2 in this embodiment is connected to the vacuum liquid storage device 1 through the first pipeline 3 to form a first loop. The first medium flows in the first loop. That is, the first medium in the vacuum liquid storage device 1 can flow to the first pipeline 3, and flow to the heat release device 2 through the first pipeline 3, and the first medium in the heat release device 2 can also flow to the vacuum liquid storage device 1 through the first pipeline 3 to achieve the reuse of the first medium. Since the first pipeline 3 is connected to the vacuum liquid storage device 1, the pressure in the first pipeline 3 is equal to the gas pressure in the vacuum liquid storage device 1, so that the pressure of the environment where the first medium in the first pipeline 3 is located is a preset pressure and is less than the atmospheric pressure.

[0039] For example, Figure 2As shown, the super vaporization structure 4 is sealed and penetrated through the wall of the first pipeline 3, that is, the super vaporization structure 4 has a portion located outside the first pipeline 3 and a portion located inside the first pipeline 3. The super vaporization structure 4 includes a heat absorbing portion and a super vaporization portion. The heat absorbing portion is located outside the first pipeline 3 and is used to absorb the heat of the heat element 17 to be dissipated, and the super vaporization portion is located inside the first pipeline 3 and is used to contact the first medium in the first pipeline 3. The heat absorbing part transfers heat to the super-vaporized part, so that the temperature of the super-vaporized part increases. When the temperature of the super-vaporized part increases to the vaporization temperature corresponding to the first medium under the preset pressure, the first medium in contact with the super-vaporized part vaporizes and absorbs the heat (i.e., latent heat of vaporization) on the super-vaporized part, so that the temperature of the super-vaporized part drops rapidly. The temperature of the super-vaporized part is relatively low, so that the temperature difference between the super-vaporized part and the heat absorbing part increases, thereby improving the heat transfer efficiency between the super-vaporized part and the heat absorbing part, so that the heat of the heat absorbing part is quickly transferred to the super-vaporized part, thereby increasing the temperature of the super-vaporized part again and vaporizing the first medium, and repeating this process to achieve continuous cooling of the heat sink 17, with a high cooling effect and cooling efficiency. For example, the preset pressure can be 0.01Mpa. At this time, if the first medium is water, the vaporization temperature of water is about 45°C.

[0040] The heat dissipation system provided in the present embodiment is provided with a vacuum liquid storage device 1, and a part of the volume of the vacuum liquid storage device 1 stores the first medium, and the other part of the volume stores the gas, and the pressure of the gas is a preset pressure, so that the pressure in the first pipeline 3 connected to the vacuum liquid storage device 1 can be the preset pressure. When the temperature of the super-vaporized part of the super-vaporized structure 4 located in the first pipeline 3 reaches the vaporization temperature of the first medium under the preset pressure, the first medium in contact with the super-vaporized part can be vaporized, and quickly absorbs the heat on the super-vaporized part, thereby realizing the cooling of the heat dissipation element 17, so that the heat dissipation system provided in the present embodiment can create a low-pressure environment for the first medium, so that the first medium can also be vaporized when the temperature of the super-vaporized part is low. Since the first medium will absorb a large amount of latent heat of vaporization during the phase change process, and the heat transfer coefficient is very high, it can quickly absorb the heat on the super-vaporized part, thereby improving the heat dissipation efficiency and heat dissipation effect of the heat dissipation element 17, so that high heat flux density heat exchange can be achieved under relatively low temperature conditions.

[0041] Alternatively, if Figure 2 As shown, the first pipeline 3 is provided with a transparent window 5, which is arranged opposite to the super-vaporized portion, so that the vaporization process of the first medium from the super-vaporized portion can be seen through the transparent window 5, and then it can be photographed. In some optional embodiments, the transparent window 5 is a part of the tube wall of the first pipeline 3, and the transparent window 5 is sealed and connected to other parts of the tube wall of the first pipeline 3 to ensure sealing. For example, the transparent window 5 is glass.

[0042] In some optional embodiments, such as Figure 2 and Figure 3 As shown, the first pipeline 3 includes a round pipe section 31 and a square pipe section 32. The portion between the vacuum liquid storage device 1 and the heat release device 2 is the round pipe section 31, so as to have a larger flow area and a smaller internal resistance.

[0043] The super vaporization structure 4 is sealed and penetrated through the tube wall of the square tube section 32, that is, the super vaporization structure 4 is arranged at the square tube section 32, so as to facilitate the installation and sealing of the super vaporization structure 4. In this embodiment, the transparent window 5 is also arranged at the square tube section 32 for easy installation and observation.

[0044] For example, Figure 4 The heat dissipation system further includes a first temperature sensor 6 and a second temperature sensor 7. The first temperature sensor 6 and the second temperature sensor 7 are both arranged in the square tube section 32, and the first temperature sensor 6 is arranged upstream of the supervaporization structure 4, and the second temperature sensor 7 is arranged downstream of the supervaporization structure 4. The first temperature sensor 6 is used to detect the temperature of the first medium that has not flowed to the supervaporization structure 4, and the second temperature sensor 7 is used to detect the temperature of the first medium after flowing through the supervaporization structure 4, wherein the temperature detected by the second temperature sensor 7 is greater than the temperature detected by the first temperature sensor 6. The first temperature sensor 6 and the second temperature sensor 7 can be connected to the controller, and the controller obtains the detection data of the first temperature sensor 6 and the second temperature sensor 7 to judge the working state of the supervaporization structure 4.

[0045] Optionally, the heat release device 2 in this embodiment is a heat exchanger, and the heat exchanger includes a heat dissipation channel and a heat absorption channel. The medium in the heat exchange channel exchanges heat with the medium in the heat absorption channel. The first pipeline 3 is connected to the heat dissipation channel, and the first medium that absorbs heat at the super vaporization structure 4 flows into the heat dissipation channel.

[0046] The heat dissipation system also includes a cooling device 8, which is connected to the heat absorption channel of the heat exchanger through a second pipe 9 to form a second loop. The second medium in the second loop is used to absorb the heat of the first medium in the first loop to reduce the temperature of the first medium, thereby preventing the temperature of the first medium returning to the vacuum liquid storage device 1 from being too high. For example, the cooling device 8 is a water chiller, which is used to cool the second medium, reduce the temperature of the second medium, and dissipate the heat to the surrounding environment.

[0047] For example, Figure 1As shown, the heat dissipation system further includes a liquid storage tank 10, which is connected between the heat exchanger and the cooling device 8 through the second pipeline 9 and is used to store the second medium. In this embodiment, half of the volume of the second medium is stored in the liquid storage tank 10. The arrangement of the liquid storage tank 10 ensures that the second circuit always has the second medium, thereby preventing the problem of affecting the cooling effect of the first medium due to the reduction of the second medium in the second circuit.

[0048] In this embodiment, the heat dissipation system further includes a first circulation pump 11, which is disposed in the first pipeline 3 and is used to drive the first medium in the first circuit to flow so as to realize the circulation of the first medium.

[0049] Optionally, the heat dissipation system further includes a second circulation pump 12, which is disposed in the second pipeline 9 and is used to drive the second medium in the second circuit to flow so as to realize the circulation of the second medium.

[0050] For example, Figure 1 and Figure 3 As shown, the heat dissipation system further includes a vacuum pump 13. The vacuum pump 13 is connected to the top of the vacuum liquid storage device 1 through a third pipeline 14. The vacuum pump 13 is used to evacuate the vacuum liquid storage device 1 so that the pressure in the vacuum liquid storage device 1 reaches a preset pressure.

[0051] In this embodiment, the third pipeline 14 is provided with a vacuum control valve 15, and the vacuum control valve 15 is used to control the on-off of the third pipeline 14. In this embodiment, a vacuum gauge (not shown in the figure) is also provided on the top of the vacuum liquid storage device 1, and the vacuum gauge is used to monitor the real-time vacuum degree of the vacuum liquid storage device 1, so that when the pressure in the vacuum liquid storage device 1 reaches a preset pressure, the third pipeline 14 can be blocked by the vacuum control valve 15.

[0052] In this embodiment, the heat dissipation system further includes a flow control valve 16. The flow control valve 16 is disposed in the first pipeline 3 and located between the vacuum liquid storage device 1 and the super vaporization structure 4. The flow control valve 16 is used to control the on-off of the first pipeline 3 to be more intelligent.

[0053] Alternatively, if Figure 4 As shown, the heat absorbing part includes a heat absorbing plate 41. The heat absorbing plate 41 is connected to the first pipeline 3. Exemplarily, the heat absorbing plate 41 is arranged toward the heat dissipation element 17 to have a larger heat absorbing area, which is conducive to the rapid heat dissipation of the heat dissipation element 17. In this embodiment, a hoop (not shown in the figure) is connected to the heat absorbing plate 41, and the hoop is sleeved on the first pipeline 3 to clamp the heat absorbing plate 41 on the first pipeline 3.

[0054] Please continue to see Figure 4The super vaporization part in this embodiment includes a plurality of fins 42, and the arrangement direction of the plurality of fins 42 is perpendicular to the flow direction of the first medium, so that a microchannel is formed between two adjacent fins 42. When the first medium flows through the microchannel, it contacts the fins 42 to be vaporized. The fins 42 in this embodiment are in contact with the heat absorbing plate 41, so that the heat absorbed by the heat absorbing plate 41 is transferred to the fins 42 in a heat conduction manner, thereby improving the heat transfer efficiency.

[0055] like Figure 3 As shown, the heat dissipation system further includes a plurality of brackets 18, and the brackets 18 are used to support the first pipeline 3, the second pipeline 9 or other devices, which is not limited in this embodiment.

[0056] The heat dissipation system provided in this embodiment, due to the transparent window 5, can realize the observation of low-temperature super-vaporization phenomenon under a preset pressure, in other words, under rough vacuum environment conditions. Moreover, for the super-vaporization structure 4 in contact with the heat source, the saturated steam temperature of the super-vaporization phenomenon of the fins 42 of the super-vaporization part is constant, and the relatively low temperature of the heat absorbing plate 41 is maintained, so that the temperature difference gradient between the surface of the heat absorbing plate 41 and the heat dissipation element 17 (i.e., the wall surface of the heat source) is increased, so that it can adapt to the impact of higher heat flux density. Moreover, for the same mass of the first medium, the heat taken away by vaporization under rough vacuum environment conditions is greater than the heat taken away by vaporization under normal pressure conditions, and it has higher heat dissipation efficiency and heat dissipation effect.

[0057] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A heat dissipation system, characterized in that: include: A vacuum liquid storage device (1), wherein a portion of the volume of the vacuum liquid storage device (1) stores a first medium, and another portion of the volume stores a gas, and the pressure of the gas is a preset pressure, and the preset pressure is less than atmospheric pressure; A heat release device (2), wherein the heat release device (2) is connected to the vacuum liquid storage device (1) via a first pipeline (3) to form a first loop, a first medium in the vacuum liquid storage device (1) can flow to the first pipeline (3), and the pressure in the first pipeline (3) is equal to the gas pressure in the vacuum liquid storage device (1); A supervaporization structure (4), the supervaporization structure (4) is sealed and penetrated through the wall of the first pipeline (3), and comprises a heat absorbing part and a supervaporization part, the heat absorbing part is located outside the first pipeline (3) and is used to absorb heat from the heat element (17) to be dissipated, and the supervaporization part is located inside the first pipeline (3) and is used to contact the first medium in the first pipeline (3).

2. The heat dissipation system according to claim 1, characterized in that: The first pipeline (3) is provided with a transparent window (5), and the transparent window (5) is arranged opposite to the super vaporization part.

3. The heat dissipation system according to claim 1, characterized in that: The first pipeline (3) comprises a circular tube section (31) and a square tube section (32), and the super vaporization structure (4) is sealingly arranged through the tube wall of the square tube section (32).

4. The heat dissipation system according to claim 3, characterized in that: The heat dissipation system further comprises a first temperature sensor (6) and a second temperature sensor (7), wherein the first temperature sensor (6) and the second temperature sensor (7) are both arranged on the square tube section (32), and the first temperature sensor (6) is arranged upstream of the supervaporization structure (4), and the second temperature sensor (7) is arranged downstream of the supervaporization structure (4).

5. The heat dissipation system according to claim 1, characterized in that: The heat release device (2) is a heat exchanger, the heat exchanger comprises a heat dissipation channel and a heat absorption channel, and the first pipeline (3) is connected to the heat dissipation channel; The heat dissipation system further comprises a cooling device (8), wherein the cooling device (8) is connected to the heat absorption channel of the heat exchanger via a second pipeline (9) to form a second circuit, and the second medium in the second circuit is used to absorb the heat of the first medium in the first circuit.

6. The heat dissipation system according to claim 5, characterized in that: The heat dissipation system further comprises a liquid storage tank (10), wherein the liquid storage tank (10) is connected between the heat exchanger and the cooling device (8) via the second pipeline (9), and half the volume of the second medium is stored in the liquid storage tank (10).

7. The heat dissipation system according to claim 5, characterized in that: The heat dissipation system further comprises a first circulation pump (11), wherein the first circulation pump (11) is arranged in the first pipeline (3) and is used to drive the flow of the first medium in the first circuit; and / or The heat dissipation system further comprises a second circulation pump (12), which is arranged in the second pipeline (9) and is used to drive the flow of the second medium in the second circuit.

8. The heat dissipation system according to claim 1, characterized in that: The heat dissipation system further comprises a vacuum pump (13), wherein the vacuum pump (13) is connected to the top of the vacuum liquid storage device (1) via a third pipeline (14), and the third pipeline (14) is provided with a vacuum control valve (15), and the vacuum control valve (15) is used to control the on-off of the third pipeline (14).

9. The heat dissipation system according to claim 1, characterized in that: The heat dissipation system further comprises a flow control valve (16), wherein the flow control valve (16) is arranged in the first pipeline (3) and is located between the vacuum liquid storage device (1) and the supervaporization structure (4), and the flow control valve (16) is used to control the on-off of the first pipeline (3).

10. The heat dissipation system according to claim 1, characterized in that: The heat absorbing part comprises a heat absorbing plate (41), the heat absorbing plate (41) is connected to the first pipeline (3), and the super vaporization part comprises a plurality of fins (42), and the arrangement direction of the plurality of fins (42) is perpendicular to the flow direction of the first medium.

Images