Liquid cooling plate structure

Abstract

The utility model discloses a liquid cooling plate structure. The liquid cooling plate structure comprises a plate body with a built-in closed cavity, a liquid suction mechanism and a liquid flow channel, the liquid suction mechanism is a metal powder sintering body, is arranged in the closed cavity and is provided with a capillary structure; the liquid flow channel is formed in the liquid suction mechanism and communicated with a liquid inlet and a liquid outlet which are formed in the plate body. The liquid cooling plate structure provided by the utility model has the advantages of simple structure, easiness in processing, low production cost, high heat transfer performance and the like.

Description

Technical Field

[0001] The utility model relates to a heat exchange device, in particular to an improved liquid cooling plate structure. Background Art

[0002] As people's requirements for the performance of electronic devices and power devices continue to increase, the power and frequency of such devices have increased rapidly, and accordingly, their heat density has also increased significantly. In order to ensure the working performance and life of such devices, reasonable thermal design must be carried out.

[0003] In recent years, liquid cooling plates have received extensive attention and favor from the industry due to their instant controllability, stability and adaptability, reliability, and safety of heat exchange intensity. Existing liquid cooling plates generally use linear liquid flow channels, and set multiple groups of micro-fins in the flow channels. The fin design is relatively simple, and the heat transfer area per unit area is limited, which makes it difficult to meet the heat dissipation requirements of high heat flux density power modules. At the same time, in existing liquid cooling plates, the liquid flow channel is mainly made by mold manufacturing, shovel forming, machining, melt casting, etc., and then composited with the base plate through brazing processes, etc. The process is complicated, the manufacturing cost is high, it is time-consuming and labor-intensive, and there is serious waste of materials. Summary of the invention

[0004] The main purpose of the utility model is to provide a liquid cooling plate structure to overcome the deficiencies of the prior art.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] Some embodiments of the present invention provide a liquid cooling plate structure, including:

[0007] A plate body with a built-in closed cavity;

[0008] A liquid absorbing mechanism, which is arranged in the closed cavity and has a capillary structure;

[0009] And, a liquid flow channel is formed in the liquid suction mechanism and is communicated with a liquid inlet and a liquid outlet arranged on the plate body.

[0010] In one embodiment, the liquid suction mechanism has a first surface and a second surface opposite to each other, the first surface is coupled to the inner wall of the closed cavity, and the liquid flow channel includes a groove formed on the second surface.

[0011] The liquid suction mechanism is formed by sintering metal powder, which can be selected from copper powder, copper alloy powder, etc., but is not limited thereto.

[0012] In one embodiment, the groove extends continuously along a set curve on the second surface. Exemplarily, the liquid flow channel includes a serpentine flow channel, or a flow channel of other shapes such as a zigzag shape or a U-shaped shape.

[0013] In one embodiment, the first surface of the liquid suction mechanism is coupled to an inner wall of the closed cavity adjacent to a bottom end surface of the plate body, and the bottom end surface of the plate body is used for thermal connection with a heat source.

[0014] In one embodiment, a gap is left between the second surface of the liquid suction mechanism and the inner wall of the other side of the closed cavity away from the bottom end surface of the plate body. If this solution is adopted, the contact surface between the steam formed by the evaporation of the working fluid and the cover plate can be increased, which is conducive to releasing latent heat through the evaporation-condensation process, transferring part of the heat through the cover plate, and improving the heat dissipation efficiency of the liquid cooling plate.

[0015] In one embodiment, the second surface of the liquid suction mechanism is in contact with or combined with the inner wall of the other side of the closed cavity away from the bottom end surface of the plate body, for example, the two can be seamlessly bonded or combined into one by sintering, welding, etc. If this solution is adopted, leakage of the working fluid can be effectively avoided and the system pressure and stability can be maintained.

[0016] In one embodiment, the liquid suction mechanism is a sintered body of metal powder, and the first surface of the liquid suction mechanism is sintered and bonded to the inner wall of the closed cavity.

[0017] In one embodiment, the plate body includes a bottom plate and a cover plate, the cover plate is sealed and combined with the bottom plate to enclose the closed cavity, and the liquid suction mechanism is integrally arranged with the bottom plate. Exemplarily, the liquid suction mechanism can be formed by sintering metal powder deposited on the inner wall of the bottom plate, and in this process, the liquid suction mechanism and the bottom plate are integrally combined by powder metallurgy sintering.

[0018] In one embodiment, the shape of the cross section of the liquid flow channel in the radial direction includes, but is not limited to, a circle, a triangle, a trapezoid or a rectangle.

[0019] In one embodiment, the liquid inlet and the liquid outlet are arranged on the same side of the plate body. Alternatively, in some cases, the liquid inlet and the liquid outlet can also be arranged on different sides of the plate body according to actual needs. The liquid inlet can be used to inject water or other working fluid into the liquid flow channel to absorb the heat transferred from the heat source to the liquid cooling plate, and the liquid outlet can be used to discharge the working fluid after absorbing the heat from the liquid cooling plate to achieve heat dissipation.

[0020] Compared with the prior art, the utility model has at least the following advantages:

[0021] (1) By providing a liquid suction mechanism with a capillary structure in the liquid cooling plate and forming a liquid flow channel in the liquid suction mechanism, the effective heat transfer area can be significantly increased, the liquid flow resistance can be greatly reduced, and the heat transfer efficiency of the liquid cooling plate can be effectively improved.

[0022] (2) By using metal powder sintering to form the liquid suction mechanism, the liquid suction mechanism can be sintered into one with the plate body of the liquid cooling plate during the molding process, thereby forming good contact between the liquid suction mechanism and the plate body of the liquid cooling plate, which can greatly reduce the interface thermal resistance between the two, thereby significantly improving the heat transfer performance of the liquid cooling plate.

[0023] (3) A plastic precursor of a liquid suction mechanism can be formed by coating or printing a slurry or paste containing metal powder on the plate body of a liquid cooling plate, and a groove structure for forming a liquid flow channel can be processed in the plastic precursor by a simple method such as embossing. The plastic precursor can then be sintered to form the liquid suction mechanism and the liquid flow channel as one piece. The process is simple, easy to operate, and low in cost. In particular, a variety of complex configuration flow channels can be produced at low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic diagram of a three-dimensional structure of a water cooling plate in Example 1;

[0025] Figure 2 is a schematic cross-sectional structure diagram of a water cooling plate in Example 1;

[0026] Figure 3 is a schematic diagram of the radial cross-sectional structure of the first type of groove used to form a liquid flow channel in Example 1;

[0027] Figure 4 is a schematic diagram of a radial cross-sectional structure of a second type of groove used to form a liquid flow channel in Example 1;

[0028] Figure 5 is a schematic diagram of a radial cross-sectional structure of a third type of groove used to form a liquid flow channel in Example 1;

[0029] Figure 6 is a schematic diagram of a radial cross-sectional structure of a fourth type of groove used to form a liquid flow channel in Example 1;

[0030] Figure 7 is a schematic diagram of the radial cross-sectional structure of the fifth type of groove used to form a liquid flow channel in Example 1;

[0031] Figure 8 It is a schematic diagram of the cross-sectional structure of a water cooling plate in Example 2. DETAILED DESCRIPTION

[0032] The present invention is described in detail below in conjunction with embodiments, but the implementation methods of the present invention are not limited thereto. Obviously, the embodiments described below are only partial embodiments of the present invention. For those skilled in the art, other similar embodiments obtained without creative work all fall within the protection scope of the present invention.

[0033] Example 1

[0034] See also Figure 1-Figure 2 , a liquid cooling plate provided in this embodiment includes a plate body 1, a liquid suction mechanism 2 and a liquid flow channel 3. Among them, the plate body 1 includes a bottom plate 11 and a cover plate 12, and the cover plate 12 is sealed and combined with the bottom plate 11 and encloses a closed cavity 13 between the two. The liquid suction mechanism 2 is a metal powder sintered body, which has a capillary structure and is arranged in the closed cavity 13. The liquid suction mechanism 2 has a first face 21 and a second face 22 opposite to each other, wherein the first face 21 is sintered and combined with the inner wall of the bottom plate 11, and the second face 22 is arranged opposite to the inner wall of the cover plate 12, and a gap is left between the two, and the gap can increase the contact area between the vapor formed by the liquid working medium in the liquid suction mechanism 2 and the inner wall of the cover plate 12, and then condense and reflux, so that the cover plate can also assist in transferring part of the heat. Among them, the outer wall of the bottom plate 11 is used for thermal connection with electronic devices or power devices such as semiconductor chips. The liquid flow channel 3 is a serpentine flow channel, and its two ends are respectively connected to the liquid inlet 14 and the liquid outlet 15 arranged on the plate body 1. The liquid flow channel 3 includes a groove formed on the second surface 22 of the liquid suction mechanism 2, and the groove continuously extends along a serpentine curve on the second surface 22. The groove may be in various forms, for example, its radial cross section may be as follows: Figure 3-Figure 7 The circle, triangle, inverted trapezoid, trapezoid or rectangle shown may also be other regular or irregular shapes.

[0035] In this embodiment, a liquid suction mechanism with a capillary structure is provided in the liquid cooling plate, thereby greatly increasing the heat transfer area. By forming a liquid flow channel in the liquid suction mechanism, on the one hand, the porous structure of the inner wall of the liquid flow channel is utilized to increase the heat transfer area of ​​the working medium, and on the other hand, the liquid flow resistance is significantly reduced. At the same time, by sintering the liquid suction mechanism and the bottom plate of the liquid cooling plate as one, the interface thermal resistance between the two is greatly reduced. Combining the above factors, the liquid cooling plate of this embodiment has better heat transfer performance while having a simpler structure.

[0036] A method for preparing the liquid cooling plate of this embodiment may include the following steps:

[0037] S1. Apply or print a slurry or paste containing metal powder on the inner wall of the base plate to form a coating, and before the coating dries, press a groove in the coating with a mold having a shape matching the aforementioned groove. In some cases, the groove can also be formed in the coating while the coating is printed. Therefore, the shape of the groove can be arbitrarily selected according to actual needs.

[0038] S2, drying and shaping the coating. Alternatively, in some cases, the coating may be shaped by light curing or heat curing.

[0039] S3. Place the base plate carrying the cured coating in a high-temperature environment for sintering. The temperature in the high-temperature environment is above the sintering temperature of the metal powder. The sintering process can be carried out in a vacuum environment or a protective atmosphere, thereby converting the cured coating into a liquid absorption mechanism integrated with the base plate.

[0040] S4, sealing and combining the cover plate and the bottom plate, so that the liquid suction mechanism is encapsulated in a closed cavity formed by the cover plate and the bottom plate. The connection method between the cover plate and the bottom plate can be brazing, resistance welding, friction welding, etc., but is not limited thereto.

[0041] The preparation method may also include conventional operations such as connecting a liquid inlet joint and a liquid outlet joint to the liquid inlet and the liquid outlet opened on the plate body, which will not be described in further detail here.

[0042] Obviously, by utilizing the preparation method of this embodiment, the liquid cooling plate can be manufactured simply and quickly, and in particular, it can easily realize the integrated molding of complex liquid flow channels and liquid suction mechanisms, and realize the integrated combination of the liquid suction mechanism and the base plate, which not only makes the combination of the two more firmly, but also can greatly reduce or even eliminate the interface thermal resistance between the two.

[0043] In addition, by utilizing the preparation method of this embodiment, when manufacturing the liquid aspiration mechanism and the liquid flow channel, no additional machining operations are required, thus saving materials.

[0044] When the liquid cooling plate of this embodiment is used, the bottom plate of the liquid cooling plate can be connected to the heat source for heat conduction, and a working medium can be injected into the liquid flow channel through the liquid inlet, and after the working medium fully absorbs the heat transferred from the heat source to the liquid cooling plate, the heat is discharged from the liquid cooling plate through the liquid outlet. In some cases, the liquid inlet and the liquid outlet can be connected to a working medium circulation device.

[0045] Obviously, the liquid cooling plate provided in this embodiment has the advantages of simple structure, easy processing, low production cost, high heat transfer performance, etc.

[0046] Example 2

[0047] See also Figure 8The structure of a liquid cooling plate provided in this embodiment is basically the same as that of the embodiment 1, except that the second surface 22 of the liquid suction mechanism 2 is seamlessly fitted to the inner wall of the cover plate 12 .

[0048] It should be noted that the various specific technical features described in the above specific embodiments can be combined in any way without contradiction. In order to avoid unnecessary repetition, the present utility model will not separately describe various possible combinations.

[0049] In addition, various embodiments of the present invention may be arbitrarily combined, and as long as they do not violate the concept of the invention, they should also be regarded as the contents disclosed by the present invention.

Claims

1. A liquid cooling plate structure, comprising a plate body with a built-in closed cavity, characterized in that: Also includes: A liquid absorbing mechanism, which is arranged in the closed cavity and has a capillary structure; A liquid flow channel is formed in the liquid suction mechanism and is communicated with a liquid inlet and a liquid outlet arranged on the plate body.

2. The liquid cooling plate structure according to claim 1, characterized in that: The liquid suction mechanism comprises a first surface and a second surface opposite to each other, the first surface is coupled to the inner wall of the closed cavity, and the liquid flow channel comprises a groove formed on the second surface.

3. The liquid cooling plate structure according to claim 2, characterized in that: The groove extends continuously along a predetermined curve on the second surface.

4. The liquid cooling plate structure according to claim 3, characterized in that: The liquid flow channel includes a serpentine flow channel.

5. The liquid cooling plate structure according to claim 2, characterized in that: The first surface of the liquid suction mechanism is combined with an inner wall of one side of the closed cavity adjacent to the bottom end surface of the plate body, and the bottom end surface of the plate body is used for thermal connection with a heat source.

6. The liquid cooling plate structure according to claim 5, characterized in that: A gap is left between the second surface of the liquid suction mechanism and the inner wall of the closed cavity on the other side away from the bottom end surface of the plate body; or, the second surface of the liquid suction mechanism is in contact with or combined with the inner wall of the closed cavity on the other side away from the bottom end surface of the plate body.

7. The liquid cooling plate structure according to any one of claims 2 to 6, characterized in that: The liquid suction mechanism is a sintered body of metal powder, and a first surface of the liquid suction mechanism is sintered and bonded to an inner wall of the closed cavity.

8. The liquid cooling plate structure according to claim 1, characterized in that: The plate body comprises a bottom plate and a cover plate, wherein the cover plate is sealed and combined with the bottom plate to enclose the closed cavity therebetween, and the liquid suction mechanism is integrally arranged with the bottom plate.

9. The liquid cooling plate structure according to claim 1, characterized in that: The cross-section of the liquid flow channel in the radial direction has a shape including a circle, a triangle, a trapezoid or a rectangle.

10. The liquid cooling plate structure according to claim 1, characterized in that: The liquid inlet and the liquid outlet are arranged on the same side of the plate body.

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