Film package injection molding packaging equipment

Abstract

The utility model relates to the technical field of membrane package packaging, in particular to membrane package injection molding packaging equipment which is used for conducting peripheral glue sealing on a filtering part of a membrane package to form a peripheral shell, and through holes are formed in the filtering part. The mold is characterized by comprising an upper mold and a lower mold, the upper mold and the lower mold jointly form a containing cavity, the containing cavity comprises a containing area used for containing a film package to be packaged and a glue injection area located on the periphery of the containing area, the glue injection area is arranged on the outer side of the containing area in a surrounding mode, and at least one of the upper mold and the lower mold is provided with a glue injection opening communicated to the glue injection area; the upper mold and the lower mold are each provided with an abutting face used for abutting against the surface of the film bag, and the abutting faces are at least arranged on part of the containing area and at least cover the outer side edge area of the containing area. According to the scheme, peripheral packaging can be efficiently and flatly carried out on the film bag, and meanwhile good peripheral packaging sealing performance is achieved.

Description

Technical Field

[0001] This application relates to the technical field of membrane package encapsulation, and particularly to a membrane package injection molding encapsulation device. Background Art

[0002] A membrane package is an important form of filtration component. By arranging a sieve between filter membranes, a multi-layer repetitive stacked structure of filter membrane - sieve - filter membrane - sieve is formed. The sieve is used to space between the filter membranes to create a space for liquid flow, thereby achieving liquid flow and filtration effects.

[0003] During the processing of membrane packages, the structures of the sieve and the filter membrane need to be encapsulated together. The encapsulation process includes hole encapsulation and peripheral encapsulation. Hole encapsulation refers to encapsulating some through-holes on the sieve to form communication holes for liquid flow and encapsulation holes that do not allow liquid flow on the sieve, and the arrangement of the communication holes and encapsulation holes defines the liquid flow direction. The peripheral encapsulation process is to form a fluid-tight encapsulation structure at the edge of the sieve to make the membrane package form a closed structure.

[0004] During the peripheral encapsulation process, the traditional encapsulation process uses the method of internal negative pressure to promote the adhesive liquid to penetrate into the sieve from the outside (such as the method described in the patent publication number CN218505028U). However, in the above solution, the inflow of the adhesive liquid is not restricted, and it is easy to generate structures such as serrations and bubbles when it penetrates into the internal structure of the membrane package peripherally, thereby affecting the sealing performance and flatness of the peripheral sealant. Utility Model Content

[0005] In order to achieve a flat and rapid peripheral sealing effect, this application provides a membrane package injection molding encapsulation device, which can efficiently and flatly perform peripheral encapsulation on the membrane package while achieving good peripheral encapsulation sealing performance.

[0006] The membrane package injection molding encapsulation device involved in this application is used to perform peripheral encapsulation on the membrane package filtering part with through-holes during operation to form the outer shell of the membrane package. The membrane package injection molding encapsulation device includes an upper mold and a lower mold. The upper mold and the lower mold together form a receiving cavity. The receiving cavity includes a placement area for placing the membrane package to be encapsulated and an injection area located outside the placement area. The injection area is arranged around the outside of the placement area, and at least one of the upper mold or the lower mold has an injection port communicating with the injection area;

[0007] Both the upper mold and the lower mold have a pressing surface for pressing against the surface of the membrane package. The pressing surface is at least provided in a part of the placement area, and the pressing surface at least covers the outer edge area of the placement area.

[0008] In the above solution, a mold for injection molding encapsulation of a membrane package is designed. This mold can be used in various injection molding encapsulation devices, such as three-plate mold injection molding, etc.

[0009] In this solution, peripheral sealing of the membrane package is performed through an external glue injection port. Among them, after the glue liquid flows into the glue injection area through the glue injection port, it can be used for encapsulation treatment from the edge of the membrane package. Under the restriction of the outer periphery of the glue injection area, an approximately airtight area can be formed (it does not exclude having a small number of vent holes). During the injection molding process, under the restriction of the upper and lower molds, the glue liquid can penetrate into the screen structure of the membrane package, thereby achieving the effect of encapsulating with glue.

[0010] In the membrane package, its encapsulation area is usually located at the outer periphery of the membrane package, and the internal flow channels are kept unobstructed through structures such as a screen. During the injection molding process, it is necessary not only to use the external pressure of the mold to promote the glue liquid to penetrate from the side of the membrane package into the screen, but also to control the amount and rate of its penetration into the screen to form a relatively flat structure on the inner surface of the encapsulation position. Therefore, a pressing surface needs to be set in the upper mold or the lower mold to define the contour of the glue liquid penetration. On the one hand, the pressing surface presses the membrane package, so that after the outer peripheral shell is formed, the whole membrane package has a relatively tight and regular structure, and at the same time helps to improve the flatness of the outer peripheral shell. In this solution, a pressing surface is adopted in the upper mold and made to press against the membrane package, while an approximately flat structure is adopted in the lower mold, making the overall pressing operation more convenient and easier to adjust.

[0011] In the above structure, the pressing surface presses against the inner edge of the outer peripheral shell of the membrane package, thereby forming a relatively tight structure at the edge of the encapsulation area of the membrane package. A channel with a large resistance can be formed in this area, making the glue liquid more inclined to spread along the edge of the membrane package and reducing its penetration into the interior of the membrane package, thereby improving the flatness of the inner glue penetration structure of the membrane package. Therefore, inside the membrane package, the inner edge formed by the inner side edge of the outer peripheral shell has better flatness, which is not easy to obstruct the flow of liquid and is not easy to cause the phenomenon of material accumulation in the uneven peripheral structure, improving the filtration efficiency and filtration effect.

[0012] Preferably, at least one of the upper mold and the lower mold has a thickening groove in the area corresponding to the glue injection area, so that the total thickness of the glue injection area is greater than the total thickness of the placement area. In another solution, in the accommodation cavity, on the upper mold and the lower mold, the bottom surfaces corresponding to the glue injection area and the placement area are flush.

[0013] The above solutions disclose two specific structures, thereby forming two different membrane package forms. In the first solution, the overall thickness of the outer peripheral shell of the membrane package is greater than the thickness of the filtering part, while in the second solution, the upper and lower surfaces of the outer peripheral shell are flush with the filtering part. Both solutions are used in actual membrane packages.

[0014] Preferably, the bottom surface of the upper mold and / or the lower mold has an exhaust structure in the area corresponding to the placement area.

[0015] In the above solution, the exhaust structure can utilize the voids inside the membrane package to achieve the effect of exhausting gas. Since the overall membrane package has a certain air permeability in the non-encapsulated area, the exhaust structure inside the pressing surface can achieve good gas flow, reducing the phenomenon that the membrane package expands internally during processing and then damages the filter membrane.

[0016] Preferably, the exhaust structure is located on the upper mold, and the exhaust structure includes an exhaust groove arranged in a ring and exhaust holes communicating with the exhaust groove.

[0017] In the above solution, by arranging the exhaust structure on the upper mold, gas can be better discharged from the system. The arrangement of the exhaust groove and the exhaust holes can be inside the corresponding pressing structure, so as to achieve a larger air outlet area while keeping the upper mold pressing the membrane package as a whole and achieving good sealing, and at the same time reducing the damage to the overall sealing and strength.

[0018] Preferably, the ratio of the projected area of the exhaust hole on the plane where the membrane package is located to the area of any one of the upper and lower bottom surfaces of the accommodating cavity is 0.0001 - 0.01:1.

[0019] In this solution, the plane where the membrane package is located refers to the plane where the filter membrane or sieve in the membrane package is located. The size design of the exhaust hole is usually related to the overall area of the membrane package. Since it is usually arranged inside the pressing surface and mainly communicates with the non-encapsulated area inside the membrane package, its size determines the strength of air permeability, but it will also have a certain impact on the heat preservation effect and the pressure difference balance inside and outside the pressing area. In the above solution, the area of the exhaust hole is controlled within the range of 0.001 - 0.01:1 of the area of any one of the upper and lower bottom surfaces of the accommodating cavity, so that it will not cause unbalance of the temperature difference and pressure difference inside and outside due to the too large area of the exhaust hole, thereby damaging the welded membrane package structure. At the same time, it can also ensure a good heat dissipation area, enabling good heat dissipation in the internal area, reducing the generation of excessive pressure or too high temperature in the internal area, and thus causing certain damage to the filter membrane.

[0020] Preferably, the lower mold has a limit pin, and the limit pin passes through the through hole to limit the membrane package.

[0021] In the above solution, the membrane package is limited by the positioning pin, and thus the overall structure stability of the membrane package and the outer peripheral shell can be achieved through the upper and lower molds, improving the processing stability.

[0022] Preferably, the upper mold has a clearance groove, which includes a first clearance groove for the limiting pin to pass through and a second clearance groove arranged around the outside of the first clearance groove, and the lower mold has a third clearance groove corresponding to the second clearance groove in the area surrounding the limiting pin.

[0023] The second and third clearance grooves can provide space for the packaging area around the hole. Since the membrane package has a corresponding packaging structure around the hole, its thickness will be relatively large. In this solution, the sealing performance of the upper mold to the membrane package can be improved.

[0024] Preferably, the glue injection port protrudes from the surface where it is located toward the glue injection area.

[0025] In the above scheme, it is not easy to form an uneven structure on the surface of the outer shell during encapsulation, and it is easier to have a uniform and stable outer shell structure, fewer bubbles or other uneven structures are generated inside, and the overall force is uniform. The glue is easier to penetrate into every corner of the mold, which is convenient for injection molding and demoulding.

[0026] In this solution, the injection port can be on the bottom surface or side wall of the upper mold and the lower mold.

[0027] Preferably, a protruding buffer surface is provided around the injection port, the injection port is arranged in the middle area of ​​the buffer surface, and the buffer surface forms a slope structure with a thickness gradually decreasing from the periphery of the injection port to the outside.

[0028] In this solution, the injection structure formed by the buffer surface has a smooth surface, which is easier to perform injection molding and demolding, and is not prone to bubbles and dead corners.

[0029] Preferably, the glue injection area has a first side and a second side opposite to each other, and a third side and a fourth side connected between the first side and the second side, and the glue injection ports are arranged on the first side, the second side, the third side and the fourth side.

[0030] In this solution, by arranging the injection ports on the four edges of the membrane package and arranging the membrane package on each side, the membrane package can have a more uniform curing process on each side, so that the force on each side of the membrane package is more uniform, and the membrane package is less likely to be uneven during the packaging process.

[0031] Preferably, the distance between adjacent glue injection ports on any of the first, second, third and fourth sides is 6 to 20 cm, and / or the total length of any of the first, second, third and fourth sides is 5 to 15 cm, and there is only one glue injection port on the side.

[0032] During the injection molding process, the flow of the glue liquid is usually slow. In order to make the glue liquid have better diffusion performance and flow performance, it is often necessary to increase the temperature. However, too high a temperature will also cause damage to the film structure, thereby affecting the overall structure of the film package. In the above solution, it is set by distributing the glue liquid outlets. Specifically, the distance between adjacent outlets is 6-20 cm. On the one hand, there will be no interference of the fluid between the two outlets, so that an overly thick encapsulation system will not be formed at the position between the two outlets. At the same time, on the other hand, the glue liquid is discharged evenly, and the entire injection area can be filled more smoothly, forming a uniform outer peripheral shell structure.

[0033] In addition, in the above solution, if the overall distance of any side is relatively narrow, there may only be one injection port.

[0034] Preferably, at least one of the upper mold and the lower mold has a cooling channel for connecting the cooling medium, and the arrangement of the cooling channels satisfies at least one of the following solutions:

[0035] a. The cooling channels are arranged along at least the first side and / or the second side;

[0036] b. The cooling channels are arranged along at least the third side and / or the fourth side;

[0037] c. The cooling channels are arranged along at least one of the first side and the second side, and at least one of the third side and the fourth side.

[0038] In the above solution, the cooling channels are arranged along the edge of the injection area, which can better perform heat exchange, so that the glue liquid can be cooled faster and more evenly; the cooling channels can be arranged outside or inside the injection port.

[0039] Preferably, the cooling channel includes two first cooling channels arranged along the first side and the second side or along the third side and the fourth side, and a second cooling channel connecting the two first cooling channels. The first cooling channel extends to the edge area of the upper mold or the lower mold and has a liquid inlet end, and the second cooling channel extends to the edge area of the upper mold or the lower mold and has a liquid outlet end.

[0040] In the above solution, the first cooling channels are arranged along the opposite sides of the film package, which can produce a better cooling effect. The two liquid inlet ends and one liquid outlet end help the condensed liquid to fill the entire cooling channel, thereby improving the efficiency of heat exchange and making the curing process more uniform.

[0041] Preferably, the lower mold has an ejector, and the ejector is arranged in the placement area.

[0042] An ejector is provided in the placement area. During the ejection process, it causes less damage to the film package, improves the sealing performance, and reduces the possibility of adhesive leakage. The ejector can be an ejector rod controlled mechanically or other structures that can be used for ejection.

[0043] Preferably, the ratio of the sum of the upper end face areas of all the ejectors to the bottom area of the lower mold is 3 - 10:100, and the upper end face area of a single ejector is 1 - 10 cm 2 .

[0044] The upper surface of the ejector abuts against the lower surface of the film package. Therefore, the contact area between it and the film package will affect the shape of the film package. Generally, the larger the surface area of the film package, the more ejectors are required for its ejection. Overall, when the ratio of the upper end face area of the ejectors to the bottom area of the lower mold is within the range of 3 - 10:100, a good ejection effect can be achieved. However, excessively increasing the area of the ejectors has an adverse effect on the sealing performance of the lower mold. At the same time, in this solution, the upper end face area of a single ejector is controlled not to be too large or too small. When the ejector is too small, it is easy to cause uneven local stress on the film package and result in the tearing of the filter membrane. And when the area of a single ejector is too large, the number of ejectors will be too small, which will lead to uneven stress on the film package and the feeding process is likely to deviate.

[0045] Preferably, the distance between the ejector and the edge of the placement area is not less than 0.5 cm.

[0046] In this solution, the ejector is not likely to affect the area where the edge is coated with glue, which helps to improve the integrity of the outer peripheral housing.

[0047] In summary, the present application provides a packaging device for peripheral packaging of a film package. It can tighten the two end faces of the film package through the tightening surface and form the peripheral housing of the film package in the glue injection area. The film package has a good injection molding structure with the help of the tightening surface for positioning, good peripheral sealing performance, and a relatively flat inner edge, and has the advantages of high processing efficiency and high yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 is an exploded schematic view of the upper mold and the lower mold in Embodiment 1 of the present application;

[0049] Figure 2 is a schematic structural view of the upper mold in Embodiment 1 of the present application;

[0050] Figure 2A is Figure 2 a schematic view of the method of part A in

[0051] Figure 3 is a perspective schematic view of the upper mold in Embodiment 1 of the present application;

[0052] Figure 4 Perspective schematic view of the upper mold used for another membrane package structure in Embodiment 1 of the present application;

[0053] Figure 5 Structural schematic view of the lower mold in Embodiment 1 of the present application;

[0054] Figure 6 Perspective schematic view of the lower mold in Embodiment 1 of the present application;

[0055] Figure 7 Structural schematic view of the upper mold in Embodiment 2 of the present application;

[0056] Figure 7A is Figure 7 Enlarged schematic view of part A in;

[0057] Figure 8 Overall structural schematic view of the membrane package encapsulated by the mold involved in Embodiment 1.

[0058] In the figure, 101, filtering part; 102, outer peripheral housing; 103, through hole; 2, upper mold; 3, lower mold; 31, ejector; 4, accommodating cavity; 41, glue injection area; 411, first side; 412, second side; 413, third side; 414, fourth side; 42, placement area; 5, abutting surface; 6, exhaust structure; 61, exhaust groove; 62, exhaust hole; 7, limit pin; 71, first relief groove; 72, second relief groove; 73, third relief groove; 8, glue injection port; 81, buffer surface; 9, cooling channel; 91, first cooling channel; 92, second cooling channel. Detailed implementation manners

[0059] Next, the technical solutions of the present utility model will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0060] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0061] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0062] Embodiment 1. This embodiment relates to a device for film package injection molding and encapsulation, which is used to form an outer shell 102 on the filtering part 101 of the film package. In this embodiment, the film package structure for encapsulation is as Figure 1 and Figure 8 shown. In the figure, the inner area is the structure of the filtering part 101 of the film package, which has a liquid inlet screen, a filtrate screen, and a filtering layer, and other encapsulation structures can be provided at both ends. Through holes 103 penetrating the filtering layer in the thickness direction are provided on the two end faces of the filtering part 101, and a sealing ring structure protruding from the end face of the filtering part 101 is provided on the through holes 103 for connecting with other external film packages or jigs.

[0063] Referring to Figures 1 - 5 , in order to realize the peripheral encapsulation process of the above-mentioned film package, the injection molding and encapsulation device provided in this embodiment has an upper mold 2 and a lower mold 3. After the upper mold 2 and the lower mold 3 are closed, a receiving cavity 4 is formed inside, and the peripheral encapsulation step of the film package is completed in the receiving cavity 4.

[0064] Specifically, the overall shape of the receiving cavity 4 is rectangular, the central area thereof is a placement area 42 for placing the filtering part 101 to be processed, and the outer periphery is a glue injection area 41, and the glue injection area 41 surrounds the outside of the placement area 42. Both the upper mold 2 and the lower mold 3 have a tightening surface 5, and the tightening surface 5 at least covers the outer edge area of the placement area 42, that is, when the upper mold 2 and the lower mold 3 are closed, the tightening surface 5 will be tightened against the inner edge in the filtering part 101.

[0065] In the above process, the filtering part 101 to be encapsulated is placed on the placement area 42, and the glue is injection molded and formed in the glue injection area 41. Among them, there is a partial overlap between the glue injection area 41 and the filtering part 101. The reason is that the glue will penetrate into the screen through the edge of the filtering part 101, thereby realizing the encapsulation of the filtering part 101 by the outer shell 102. The area where the tightening surface 5 is tightened against the filtering part 101 is usually located inside the edge of the filtering part 101, and there is a certain gap between it and the outermost periphery of the filtering part 101, which is convenient for the glue to penetrate from the side. In the area where the tightening surface 5 is tightened, the screen undergoes a small deformation under the action of the tightening surface 5 to promote the diffusion of the glue along the edge of the tightening surface 5, rather than penetrating into the tightened area, thereby forming a flat inner edge around the filtering part 101.

[0066] To correspond to the shape of the membrane package, the glue injection area 41 has opposite first side 411 and second side 412, and third side 413 and fourth side 414 connecting between the first side 411 and the second side 412. The area is used to form a flat inner edge around the filtering part 101. To correspond to the shape of the membrane package, the glue injection area 41 has opposite first side 411 and second side 412, and third side 413 and fourth side 414 connecting between the first side 411 and the second side 412.

[0067] Referring to Figure 3 and Figure 4 , in this embodiment, on the upper mold 2, a plurality of glue injection ports 8 are arranged in the area where the glue injection area 41 is located. The glue injection port 8 protrudes from the inner bottom surface of the upper mold 2 towards the glue injection area 41, and a buffer surface 81 is formed at a position surrounding the glue injection port 8. The buffer surface 81 is arranged in a trapezoidal shape surrounding the glue injection port 8, and some arcs can also be set, such as using a partial spherical surface, as long as the buffer surface 81 is formed such that the thickness gradually decreases from the center to the outside at the position surrounding the glue injection port 8. The glue injection ports 8 are provided on the first side 411, the second side 412, the third side 413, and the fourth side 414. Among them, in response to different membrane package shapes, the shape of the accommodation cavity 4 is different and can be set as Figure 3 and Figure 4 shown. For the arrangement of the glue outlet, taking the structure shown in Figure 3 as an example:

[0068] In Figure 3 , the lengths of the first side 411 and the second side 412 are 8 cm. Therefore, one glue outlet 8 can be provided on the first side and the second side (such as Figure 3 ), or two glue outlets 8 can be provided. If more glue outlets 8 are provided, glue liquid is likely to accumulate in the intermediate area between adjacent glue outlets 8, thereby causing defects in the outer peripheral housing structure. The lengths of the third side 413 and the fourth side 414 are 25 cm. Therefore, the number of glue outlets 8 on the third side 413 and the fourth side 414 can be 2, 3, or 4.

[0069] Similarly, corresponding to the Figure 4 shown scheme, the lengths of the first side 411 and the second side 412 are 22 cm, and the number of glue outlets 8 can be 2 - 3. The lengths of the third side 413 and the fourth side 414 are 25 cm, and the number of glue outlets can be 2 - 4. For the distance between any two adjacent glue outlets 8, on any one of the first side 411, the second side 412, the third side 413, and the fourth side 414, the distance between adjacent glue injection ports 8 can be within the range of 6 - 20 cm.

[0070] Referring to Figure 3 and Figure 4, a cooling channel 9 is also provided on the upper mold 2 for introducing a cooling medium therein to cool the glue injection area 41. Among them, the pipeline layout of the cooling channel 9 is as Figure 4 shown. Specifically, the cooling channel 9 includes two sections of first cooling channels 91 arranged along the first side 411 and the second side 412 or along the third side 413 and the fourth side 414, and a second cooling channel 92 connecting the two sections of first cooling channels 91. The first cooling channel 91 extends to the outer edge of the upper mold 2 and has a liquid inlet end, and the second cooling channel 92 extends to the outer edge of the upper mold 2 and has a liquid outlet end. The cooling medium (such as cooling water) flows in from the liquid inlet end and flows out through the liquid outlet end. Other layout structures can also be adopted, but it should generally be arranged along the glue injection area 41 to provide a better cooling effect.

[0071] Referring to Figure 5 and Figure 6 , the lower mold 3 in this embodiment is as shown in the figure. The lower mold 3 has a tightening surface 5 corresponding to the tightening surface 5 on the upper mold 2 for tightening the film package in the placement area 42. In this solution, flat surfaces are provided at the positions corresponding to the placement area 42 and the glue injection area 41 in the upper and lower molds 3. Therefore, the upper and lower end faces of the formed outer peripheral shell 102 and the filtering part 101 have substantially flat end faces. In other solutions, the glue injection area 41 can also be set to have a larger depth, so that at least one of the upper and lower molds 3 has a placement area 42 protruding compared to the glue injection area 41. In this solution, a film package structure with a thickness of the outer peripheral shell 102 greater than that of the filtering part 101 can be obtained.

[0072] Referring to Figure 5 and Figure 6 , an ejector 31 is also provided on the lower mold 3. Specifically, the lower mold 3 has an ejection hole for the ejector 31 to pass through. The ejector 31 penetrates the lower mold 3 and abuts against the filtering part 101 through the lower surface of the filtering part 101. That is, each ejection hole is arranged at the position of the placement area 42. The ratio of the area of the upper end face of the ejector 31 to the area of the bottom surface of the lower mold 3 should be controlled within the range of 3 - 10:100, and the value range of the area of the upper end face of a single ejector 31 is 1 - 10 cm 2 Within the above value range, the influence of the ejector 31 on the overall film package is small. In addition, the minimum distance between the ejector 31 and the edge of the placement area 42 should be not less than 0.5 cm to reduce the influence of the ejector 31 on the outer peripheral shell 102 of the film package. Specifically, in the solution as Figure 3 shown, the area of the bottom surface of the accommodation cavity (i.e., the area of the bottom surface of the lower mold) is 0.32 m 2 , and each ejector is a circle with a diameter of 30 mm.

[0073] Referring to Figure 5, a limit pin 7 is also provided on the lower mold 3. The limit pin 7 can be fixed on the lower mold 3 or pass through the lower mold 3 from the bottom surface of the lower mold 3. The limit pin 7 is a cylindrical columnar structure, and it can pass through the through hole 103 on the filtering part 101 during the working process. A relief groove is provided on the upper mold 2 for the limit pin 7 to pass through, wherein the relief groove includes a first relief groove 71 for the fiber pin to pass through and a second relief groove 72 arranged around the outside of the first relief groove 71, and the lower mold 3 has a third relief groove 73 corresponding to the second relief groove 72 on the circumferential side around the positioning pin. During the construction process, when the surface of the membrane package seals the through hole 103, a boss structure may be formed on the periphery of the through hole 103. The boss structure can be embedded in the second relief groove 72 and the third relief groove 73, achieving a good positioning effect while improving the pressing effect of the pressing surface 5 on the membrane package.

[0074] In addition, in this embodiment, only the cooling channel 9 is provided on the upper mold 2. In fact, the cooling channel 9 can also be provided on the lower mold 3, or the cooling channel 9 can be provided on both the upper mold 2 and the lower mold 3. The cooling channel 9 on the lower mold 3 can be set as Figure 6 shown.

[0075] Embodiment 2, referring to Figure 7 and Figure 7A , on the basis of Embodiment 1, an exhaust structure 6 is further provided on the upper mold 2. The exhaust structure 6 includes an annular exhaust groove 61 and exhaust holes 62 provided on the exhaust groove 61. The exhaust holes 62 are connected to the outside of the upper mold 2. The exhaust groove 61 is located inside the outer edge of the pressing surface 5. In this embodiment, both the inner and outer sides of the exhaust groove 61 are the pressing surface 5 to improve the overall flatness of the membrane package. Specifically, in this solution, taking the structure of the membrane package packaging device shown in Figure 7 as an example, the bottom area of its accommodation cavity 4 is 0.32 m 2 , and two exhaust holes 62 are provided. Each exhaust hole 62 has a diameter of 10 mm. Therefore, the total area of the exhaust holes is the ratio of the projection of the exhaust holes 62 on the plane where the membrane package is located to the area of the upper bottom surface of the accommodation cavity 4, which is 0.0001 - 0.01∶1.

[0076] The above embodiments are only the preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention belong to the scope of protection required by the present invention.

Claims

1. A membrane package injection molding packaging device, used for sealing the filter part of the membrane package to form an outer peripheral shell, wherein the filter part has a through hole; characterized in that: The upper mold and the lower mold are included, and the upper mold and the lower mold jointly form a receiving cavity, and the receiving cavity includes a placement area for placing the film package to be packaged and a glue injection area located outside the placement area, and the glue injection area is arranged around the outside of the placement area, and at least one of the upper mold or the lower mold has a glue injection port connected to the glue injection area; The upper mold and the lower mold both have a pressing surface for pressing against the surface of the film package. The pressing surface is at least arranged in a partial area of ​​the placement area, and the pressing surface at least covers the outer edge area of ​​the placement area.

2. The film package injection molding packaging equipment according to claim 1, characterized in that: At least one of the upper mold and the lower mold has a thickening groove in a region corresponding to the glue injection region, so that the total thickness of the glue injection region is greater than the total thickness of the placement region.

3. The film package injection molding packaging equipment according to claim 1, characterized in that: In the accommodating cavity, on the upper mold and the lower mold, the bottom surface of the corresponding injection area is flush with the bottom surface of the corresponding placement area.

4. The film package injection molding packaging equipment according to claim 1, characterized in that: The bottom surface of the upper mold and / or the lower mold has an exhaust structure in an area corresponding to the placement area.

5. The film package injection molding packaging equipment according to claim 4, characterized in that: The exhaust structure is located on the upper mold, and comprises an exhaust groove arranged around and an exhaust hole connected to the exhaust groove.

6. The film package injection molding packaging equipment according to claim 5, characterized in that: The ratio of the projection area of ​​the exhaust hole on the plane where the membrane package is located to the bottom area of ​​any one side of the upper and lower surfaces of the accommodating cavity is 0.0001-0.01:

1.

7. The film package injection molding packaging equipment according to claim 1, characterized in that: The lower mold is provided with a limiting pin, which passes through the through hole and limits the film package.

8. The film package injection molding packaging equipment according to claim 7, characterized in that: The upper mold has a clearance groove, which includes a first clearance groove for the limiting pin to pass through and a second clearance groove arranged around the outside of the first clearance groove. The lower mold has a third clearance groove corresponding to the second clearance groove in the area surrounding the limiting pin.

9. The film package injection molding packaging equipment according to claim 1, characterized in that: The glue injection port protrudes from the surface where the glue injection port is located toward the glue injection area.

10. The film package injection molding packaging equipment according to claim 9, characterized in that: A protruding buffer surface is provided around the glue injection port, the glue injection port is arranged in the middle area of ​​the buffer surface, and the buffer surface forms a slope structure with a thickness gradually decreasing from the periphery of the glue injection port to the outside.

11. The film package injection molding packaging equipment according to claim 1, characterized in that: The glue injection area has a first side and a second side opposite to each other, and a third side and a fourth side connected between the first side and the second side. The glue injection ports are arranged on the first side, the second side, the third side and the fourth side.

12. The film package injection molding packaging equipment according to claim 11, characterized in that: On any one of the first, second, third and fourth sides, the distance between adjacent glue injection ports is 6 to 20 cm, and / or the total length of any one of the first, second, third and fourth sides is 5 to 15 cm, and there is only one glue injection port on the side.

13. The film package injection molding packaging equipment according to claim 11, characterized in that: At least one of the upper mold and the lower mold has a cooling channel for connecting the cooling medium, and the arrangement of the cooling channel satisfies at least one of the following schemes: a. The cooling channel is arranged at least along the first side and / or the second side; b. The cooling channels are arranged along at least the third side and / or the fourth side; c. The cooling channel is arranged along at least one of the first side and the second side, and at least one of the third side and the fourth side.

14. The film package injection molding packaging equipment according to claim 13, characterized in that: The cooling channel includes two sections of first cooling channels arranged along the first side and the second side or along the third side and the fourth side and a second cooling channel connected to the two sections of the first cooling channels, the first cooling channel extends to the edge area of ​​the upper mold or the lower mold and has a liquid inlet end, and the second cooling channel extends to the edge area of ​​the upper mold or the lower mold and has a liquid outlet end.

15. The film package injection molding packaging equipment according to claim 1, characterized in that: The lower mold is provided with an ejector, and the ejector is arranged in the placement area.

16. The film package injection molding packaging equipment according to claim 15, characterized in that: The ratio of the sum of the upper end surfaces of all ejectors to the bottom surface area of ​​the lower mold is 3 to 10:100, and the area of ​​the upper end surface of a single ejector is 1 to 10 cm 2 .

17. The film package injection molding packaging equipment according to claim 15, characterized in that: The distance between the ejector and the edge of the placement area is not less than 0.5 cm.

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