Solder paste transportation frame

Abstract

The utility model provides a solder paste transportation frame, which relates to the technical field of solder paste transportation and comprises a frame body defined by a bottom plate and a frame, and a limiting structure is embedded in the frame body. A plurality of storage cavities are formed in the limiting structure, and corresponding canned solder paste is embedded in the storage cavities; the canned solder paste comprises a can body and a can cover installed on the can body. The outer diameter of the can cover is matched with the inner diameter of the containing cavity, and the outer diameter of the can body is smaller than that of the can cover. A plurality of receding notches are formed in the corresponding upper surfaces of the storage cavities, and the receding notches penetrate through the corresponding storage cavities; after the canned solder paste is placed in the corresponding storage cavity, the lower end of the can cover is higher than the lower end of the receding notch, and by arranging the limiting structure and combining the corresponding canned solder paste, the problems that in the prior art, after multiple pieces of canned solder paste are embedded, the outer side wall of the can body of the canned solder paste is fastened to the conveying frame, and the canned solder paste is inconvenient to take and place from the conveying frame are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of solder paste transportation, and particularly relates to a solder paste transportation frame. Background Art

[0002] After the canned solder paste is produced, it needs to be loaded and transported. Before loading, the canned solder paste is often placed in a transportation frame for subsequent loading and transportation.

[0003] In the prior art, when the transportation frame is in transportation, a plurality of canned solder pastes are embedded in the transportation frame to achieve stability during the transportation of the canned solder paste. However, after a plurality of canned solder pastes are embedded, the outer side wall of the can body of the canned solder paste is fastened to the transportation frame, making it inconvenient to take and place the canned solder paste from the transportation frame, resulting in low transportation efficiency. Summary of the Utility Model

[0004] (1) Technical Problems to be Solved

[0005] Aiming at the deficiencies of the prior art, the utility model provides a solder paste transportation frame, which solves the problem that it is inconvenient to take and place the canned solder paste from the transportation frame in the prior art.

[0006] (2) Technical Solutions

[0007] To achieve the above object, the utility model is realized through the following technical solutions:

[0008] In the utility model, the solder paste transportation frame comprises a frame body formed by a bottom plate and a frame, and a limiting structure is embedded in the frame body;

[0009] A plurality of placement cavities are formed on the limiting structure, and corresponding canned solder pastes are embedded in the placement cavities;

[0010] The canned solder paste comprises a can body and a can cover installed on the can body;

[0011] The outer diameter of the can cover is adapted to the inner diameter of the placement cavity, and the outer diameter of the can body is smaller than the outer diameter of the can cover;

[0012] A plurality of relief notches are formed on the upper surface corresponding to the placement cavity, and the plurality of relief notches penetrate through the corresponding placement cavity;

[0013] After the canned solder paste is placed in the corresponding placement cavity, the lower end of the can cover is higher than the lower end of the relief notch.

[0014] Further, a plurality of limiting structures are provided.

[0015] Further, a plurality of slots are formed on one side of the limiting structure away from the bottom plate, and adjacent limiting structures are inserted into each other through plugs and corresponding slots.

[0016] Further, the plug-in is detachably connected to the limit structure.

[0017] Further, a limit groove is provided on the side of the can lid away from the can body, and the inner diameter of the limit groove is adapted to the outer diameter of the can body.

[0018] (III) Beneficial effects

[0019] The utility model provides a solder paste transportation frame. Compared with the prior art, the following beneficial effects are achieved:

[0020] By providing a limit structure and combining it with the corresponding canned solder paste, the can lid of the canned solder paste is brought into contact with the placement cavity provided on the limit structure. The depth of the can lid is less than the depth of the can body, and the limit structure limits the can lid. Therefore, while the limit structure limits the canned solder paste to ensure the overall stability of the transportation of the canned solder paste, the fastening force of the limit structure in the depth direction with the canned solder paste is reduced, and a plurality of relief notches penetrating the corresponding placement cavities are provided, which can facilitate the taking and placing operations of the canned solder paste, solving the problem in the prior art that after a plurality of canned solder pastes are embedded, the outer side wall of the can body of the canned solder paste is fastened to the transportation frame, making it inconvenient to take and place the canned solder paste from the transportation frame. Description of the drawings

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1 Is a perspective view of a solder paste transportation frame;

[0023] Figure 2 Is a perspective view of the transportation frame when installing a set of limit structures;

[0024] Figure 3 Is a perspective view of the canned solder paste 21 placed in the limit structure;

[0025] Figure 4 Is a perspective view of the limit structure;

[0026] Figure 5 Is a schematic cross-sectional structure diagram of the canned solder paste placed in the limit structure;

[0027] Figure 6 Is a perspective view of the adjacent limit mechanisms after installing the plug-in.

[0028] Reference numerals:

[0029] 10. Frame; 11. Bottom plate; 12. Frame; 20. Limiting structure; 201. Slot; 202. Storage cavity; 203. Relief notch; 21. Canned solder paste; 211. Can body; 212. Can lid; 213. Limiting groove; 30. Plug-in component. Detailed implementation manners

[0030] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be described clearly and completely. Apparently, the described embodiments are some but not all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0031] By providing a solder paste transport frame in the embodiments of the present application, the problem that it is inconvenient to take and place canned solder paste from the transport frame is solved, and the efficiency of transporting canned solder paste by the transport frame is improved.

[0032] The technical solutions in the embodiments of the present application for solving the above technical problems are generally as follows:

[0033] As Figures 1-6 shown, by providing a limiting structure and combining it with the corresponding canned solder paste, the can lid of the canned solder paste is brought into contact with the storage cavity opened on the limiting structure. The depth of the can lid is less than the depth of the can body. The limiting structure limits the can lid. Therefore, while the limiting structure limits the canned solder paste to ensure the overall stability of transporting the canned solder paste, the fastening force between the limiting structure and the canned solder paste in the depth direction is reduced. Moreover, by providing a plurality of relief notch penetrating through the corresponding storage cavity, it is convenient for the taking and placing operation of the canned solder paste, solving the problem in the prior art that after a plurality of canned solder pastes are embedded, the outer side wall of the can body of the canned solder paste is fastened to the transport frame, and it is inconvenient to take and place the canned solder paste from the transport frame.

[0034] To better understand the above technical solutions, the above technical solutions will be described in detail below in conjunction with the accompanying drawings of the specification and specific implementation manners.

[0035] As Figures 1-5 shown, a solder paste transport frame includes a frame 10 formed by a bottom plate 11 and a frame 12, and a limiting structure 20 is embedded in the frame 10;

[0036] A plurality of storage cavities 202 are opened on the limiting structure 20, and corresponding canned solder pastes 21 are embedded in the storage cavities 202;

[0037] The canned solder paste 21 includes a can body 211 and a can lid 212 installed on the can body 211;

[0038] The outer diameter of the can lid 212 is adapted to the inner diameter of the storage cavity 202, and the outer diameter of the can body 211 is smaller than the outer diameter of the can lid 212;

[0039] A plurality of relief notches 203 are provided on the upper surface corresponding to the storage cavity 202, and the plurality of relief notches 203 all penetrate through the corresponding storage cavity 202;

[0040] After the canned solder paste 21 is placed into the corresponding storage cavity 202, the lower end of the can lid 212 is higher than the lower end of the relief notch 203. After the canned solder paste 21 is placed into the corresponding storage cavity 202, the specific position of the canned solder paste 21 in the limiting structure 20 is as Figure 5 shown.

[0041] By providing the limiting structure 20 and combining it with the corresponding canned solder paste 21, the can lid 212 of the canned solder paste 21 is brought into contact with the storage cavity 202 provided on the limiting structure 20. The depth of the can lid 212 is smaller than the depth of the can body 211. The limiting structure 20 limits the can lid 212. Therefore, while the limiting structure 20 limits the canned solder paste 21 to ensure the overall stable transportation of the canned solder paste 21, the fastening force between the limiting structure 20 and the canned solder paste 21 in the depth direction is reduced. Moreover, by providing a plurality of relief notches 203 that penetrate through the corresponding storage cavity 202, it is convenient for the taking and placing operations of the canned solder paste 21, solving the problem in the prior art that after multiple canned solder pastes 21 are embedded, the outer side wall of the can body 211 of the canned solder paste 21 is fastened to the transportation frame, making it inconvenient to take and place the canned solder paste 21 from the transportation frame.

[0042] As Figure 1 shown, a plurality of the limiting structures 20 are provided.

[0043] By providing a plurality of limiting structures 20, the multi-layer placement of the canned solder paste 21 in the frame body 10 is realized, and one frame body 10 of the present application replaces the existing frame body with single-layer placement. For the transportation of the same quantity of canned solder paste 21, the number of frame bodies 10 used can be reduced, thereby reducing the instability when multiple existing single-layer frames are stacked, and facilitating the stacking of the transportation frames into the transport vehicle for transportation.

[0044] As Figure 1 and Figure 6 shown, a plurality of slots 201 are provided on the side of the limiting structure 20 away from the bottom plate 11, and adjacent two limiting structures 20 are plugged through the plug-in members 30 and the corresponding slots 201.

[0045] By providing the slots 201 and the plug-in members 30, the stability between adjacent two limiting structures 20 is further improved.

[0046] It should be noted that the set length of the plug 30 can ensure that the lower end of the lid 212 of each layer of canned solder paste 21 is higher than the lower end of the corresponding relief notch 203 of the limiting structure 20, facilitating the taking of the canned solder paste 21.

[0047] Specifically, the plug 30 is detachably connected to the limiting structure 20, which facilitates the replacement of the plug 30 with different heights for the multi-layer transportation of cans with different depths 211, enabling the use of the transport frame in different scenarios. At the same time, the plug 30 and the limiting structure 20 can be connected by means of threaded connection or mortise and tenon structure, facilitating the overall installation of the transport frame.

[0048] As Figures 1-3 and Figure 5 shown, a limiting groove 213 is provided on the side of the lid 212 away from the can body 211, and the inner diameter of the limiting groove 213 is adapted to the outer diameter of the can body 211.

[0049] By providing the limiting groove 213, when multiple layers of canned solder paste 21 are stacked, the limiting groove 213 limits the upper layer of canned solder paste 21, improving the stability of the placement of multiple layers of canned solder paste 21 in the transport frame.

[0050] During operation, first embed the limiting structure 20 into the interior of the frame body 10 and contact the bottom plate 11 inside the frame body 10. Then, place the canned solder paste 21 into the corresponding placement cavity 202 of the limiting structure 20. After the canned solder paste 21 is placed in the corresponding placement cavity 202, the outer side wall of the lid 212 of the canned solder paste 21 contacts the inner side wall of the placement cavity 202. Since the outer diameter of the can body 211 is smaller than the outer diameter of the lid 212, the outer side wall of the can body 211 does not contact the inner side wall of the placement cavity 202. When taking the solder paste placed in the placement cavity 202, place the finger into the corresponding relief notch 203. Since the lower end of the lid 212 is higher than the lower end of the relief notch 203 and the relief notch 203 communicates with the corresponding placement cavity 202, the finger passes through the relief notch 203 and contacts the outer wall of the can body 211, facilitating the taking of the corresponding finger of the canned solder paste 21;

[0051] Similarly, embed multiple limiting structures 20 into the frame body 10 in sequence, and the frame body 10 limits the limiting structures 20 embedded in the frame body 10 to achieve the multi-layer swing of the canned solder paste 21. To further improve the stability of the limiting structure 20, when using the slot 201 and the plug 30, just align the plug 30 with the corresponding slot 201;

[0052] It should be noted that according to actual transportation needs, the entire transport frame can be embedded in a foam box for transportation to meet the needs of solder paste transportation in different scenarios.

[0053] In summary, compared with the prior art, the following beneficial effects are achieved:

[0054] 1. By providing the limiting structure 20 and combining it with the corresponding canned solder paste 21, the lid 212 of the canned solder paste 21 is brought into contact with the storage cavity 202 opened on the limiting structure 20. The depth of the lid 212 is less than that of the can body 211. The limiting structure 20 limits the lid 212. Therefore, while the limiting structure 20 limits the canned solder paste 21 to ensure the overall stability of the transportation of the canned solder paste 21, the fastening force between the limiting structure 20 and the canned solder paste 21 in the depth direction is reduced. Moreover, by providing a plurality of relief notches 203 penetrating the corresponding storage cavities 202, it is convenient to take and place the canned solder paste 21, solving the problem in the prior art that after multiple canned solder pastes 21 are embedded, the outer side wall of the can body 211 of the canned solder paste 21 is fastened to the transportation frame, making it inconvenient to take and place the canned solder paste 21 from the transportation frame.

[0055] 2. By providing a plurality of limiting structures 20, the multi-layer placement of the canned solder paste 21 in the frame body 10 is realized. One frame body 10 of the present application replaces the frame body with a single-layer placement in the prior art. For the transportation of the same quantity of canned solder paste 21, the number of frame bodies 10 used can be reduced, thereby reducing the instability when multiple single-layer frames are stacked, and facilitating the stacking of the transportation frames into the transport vehicle for transportation.

[0056] 3. By providing the limiting groove 213, when the multi-layer canned solder paste 21 is stacked, the limiting groove 213 limits the upper-layer canned solder paste 21, improving the stability of the multi-layer canned solder paste 21 placed in the transportation frame.

[0057] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0058] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A solder paste transport frame, comprising a frame body (10) formed by a bottom plate (11) and a frame (12), characterized in that: A limiting structure (20) is embedded in the frame (10); The limiting structure (20) is provided with a plurality of storage cavities (202), and corresponding canned solder pastes (21) are embedded in the storage cavities (202); The canned solder paste (21) comprises a can body (211) and a can cover (212) mounted on the can body (211); The outer diameter of the tank cover (212) is matched to the inner diameter of the storage cavity (202), and the outer diameter of the tank body (211) is smaller than the outer diameter of the tank cover (212); A plurality of clearance slots (203) are provided on the upper surface corresponding to the storage cavity (202), and the plurality of clearance slots (203) all penetrate the corresponding storage cavity (202); After the canned solder paste (21) is placed in the corresponding storage cavity (202), the lower end of the can cover (212) is higher than the lower end of the clearance slot (203).

2. A solder paste transport frame as claimed in claim 1, characterized in that: The limiting structures (20) are provided in plurality.

3. A solder paste transport frame as claimed in claim 2, characterized in that: A plurality of slots (201) are provided on a side of the limiting structure (20) away from the bottom plate (11), and two adjacent limiting structures (20) are plugged into the corresponding slots (201) via a plug-in unit (30).

4. A solder paste transport frame as claimed in claim 3, characterized in that: The plug-in unit (30) is detachably connected to the limiting structure (20).

5. A solder paste transport frame as claimed in claim 1, characterized in that: A limiting groove (213) is provided on a side of the tank cover (212) away from the tank body (211), and the inner diameter of the limiting groove (213) is matched with the outer diameter of the tank body (211).

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