Calibration-free temperature measurement system for high-temperature coating

Abstract

The utility model discloses a calibration-free temperature measurement system used for high temperature coating, belonging to the semiconductor coating technology field, the calibration-free temperature measurement system used for high temperature coating comprises a growth assembly, an optical fiber and a laser thermometer, the growth assembly is used for arranging a semiconductor substrate to be coated, the growth assembly is provided with a temperature measurement hole, and the temperature measurement hole is communicated with the optical fiber. One end of the optical fiber is connected with the laser emitting end of the laser thermometer, and the other end of the optical fiber is connected with the temperature measuring hole. A light beam channel between the laser thermodetector and the temperature measuring hole is built through the optical fiber, laser emitted by the laser thermodetector can reach the temperature measuring hole through total reflection in the optical fiber, after the optical fiber is added, the laser emitted by the laser thermodetector can reach the temperature measuring hole all the time, and the measured temperature result accurately and stably reflects the temperature of the temperature measuring hole. And instability in calibration operation is eliminated.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor coating, and particularly relates to a non-calibration temperature measurement system for high-temperature coating. Background Art

[0002] In the field of semiconductor coating, temperature monitoring is an important part. Some coating growth requires a high-temperature environment. Therefore, ordinary thermometers cannot be used, and a laser thermometer needs to be used for non-contact measurement. The current way of using a laser thermometer is as Figure 1 shown. The laser thermometer generates laser light and irradiates a temperature measurement hole near the semiconductor coating growth area. At this time, the temperature measurement hole emits radiation to the laser thermometer. However, such a temperature measurement structure has the following problems:

[0003] 1. It consumes production time. After each maintenance of the components (such as graphite parts) in the growth area, it is necessary to recalibrate the position of the thermometer to align the light beam with the temperature measurement hole, which consumes a large amount of production time, reduces production efficiency, and increases production costs.

[0004] 2. Temperature calibration is difficult, and the accuracy and stability are poor. On the one hand, during the actual temperature calibration process, it depends on the operator's eyes to observe the thermometer and the temperature measurement hole, and manually adjust the position and angle of the light emitted by the laser thermometer to align with the temperature measurement hole. Therefore, it is difficult to align the laser with the position of the temperature measurement hole, and the quality of temperature calibration highly depends on the operator's experience. The result of temperature calibration is difficult to guarantee, and the stability and accuracy are poor. In addition, even an experienced operator cannot ensure that the position of the laser aligned with the temperature measurement hole after calibration is exactly the same as that before the growth cycle, so there will always be a difference in temperature before and after calibration, affecting the product quality.

[0005] It should be noted that the information disclosed in the background art part of this utility model is only intended to deepen the understanding of the general background art of this utility model, and should not be regarded as an admission or any form of suggestion that this information constitutes the prior art known to those skilled in the art. Summary of the Utility Model

[0006] The purpose of the utility model is to provide a non-calibration temperature measurement system for high-temperature coating to solve the problems of consuming production time, difficult calibration, poor accuracy and stability of the temperature measurement structure.

[0007] To solve the above technical problems, the utility model provides a non-calibration temperature measurement system for high-temperature coating, including a growth component, an optical fiber and a laser thermometer. The growth component is used to arrange a semiconductor substrate to be coated. A temperature measurement hole is opened on the growth component. One end of the optical fiber is connected to the laser emission end of the laser thermometer, and the other end is connected to the temperature measurement hole.

[0008] Preferably, one end of the optical fiber is detachably connected to the temperature measurement hole through a connector.

[0009] Preferably, the end of the connector away from the optical fiber is inserted into the temperature measurement hole.

[0010] Preferably, the growth component is a graphite part, and the inside of the graphite part has a cavity for arranging the semiconductor substrate to be coated.

[0011] In the non-calibrated temperature measurement system for high-temperature coating provided by the present utility model, a beam channel is built between the laser pyrometer and the temperature measurement hole through the optical fiber. The laser emitted by the laser pyrometer can reach the temperature measurement hole through total reflection in the optical fiber. The laser emitted by the laser pyrometer can always reach the temperature measurement hole. The measured temperature result accurately and stably reflects the temperature of the temperature measurement hole, eliminating the instability in the calibration operation. In addition, since the beam of the laser pyrometer can always be aligned with the temperature measurement hole through the optical fiber, there is no need to calibrate the temperature, saving a large amount of production time, improving production efficiency, with accurate and stable temperature. Measuring the temperature at the same position in different production cycles makes the temperature measurement position consistent in multiple production cycles, improving the product stability. Description of the Drawings

[0012] Those of ordinary skill in the art will understand that the provided drawings are used to better understand the present utility model and do not constitute any limitation to the scope of the present utility model. Among them:

[0013] Figure 1 is a schematic structural diagram of a temperature measurement device in the prior art;

[0014] Figure 2 is a schematic structural diagram of an embodiment of the present utility model.

[0015] In the drawings:

[0016] 100, growth component; 101, temperature measurement hole; 200, optical fiber; 201, connector; 300, laser pyrometer; 400, fixing part. Detailed Embodiments

[0017] To make the objectives, advantages, and features of the present utility model clearer, the following further describes the present utility model in detail with reference to the drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and not drawn to scale, only for conveniently and clearly assisting in explaining the objectives of the embodiments of the present utility model. In addition, the structures shown in the drawings are often a part of the actual structures. In particular, the emphasis to be shown in each drawing is different, and sometimes different scales are used.

[0018] As used in the present utility model, the singular forms "a", "an" and "the" include plural referents. The term "or" is generally used in the sense of including "and / or". The term "several" is generally used in the sense of including "at least one". The term "at least two" is generally used in the sense of including "two or more". In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", "third" may explicitly or implicitly include one or at least two of such features. The term "proximal end" generally refers to the end close to the operator, and the term "distal end" generally refers to the end close to the patient. "One end" and "the other end", as well as "proximal end" and "distal end", generally refer to corresponding two parts, which include not only the endpoints. The terms "mounted", "connected", "coupled" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral body; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and may be the communication inside two elements or the interaction relationship between two elements. In addition, as used in the present utility model, one element being disposed on another element generally only means that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the two elements may be directly or indirectly connected, coupled, cooperated or transmitted through an intermediate element, and cannot be construed as indicating or implying the spatial position relationship between the two elements, that is, one element may be inside, outside, above, below or on one side of the other element, etc. in any orientation, unless otherwise explicitly specified in the content. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0019] The core idea of the present utility model is to provide a calibration-free temperature measurement system for high-temperature coating. By arranging an optical fiber to connect a temperature measurement hole and a laser thermometer, the laser emitted by the laser thermometer undergoes total internal reflection in the optical fiber to reach the temperature measurement hole, and the radiation emitted at the temperature measurement hole is received by the thermometer, thereby solving the problems brought by the calibration of the laser thermometer.

[0020] Specifically, please refer to Figure 2 , which is a schematic diagram of an embodiment of the present utility model. As Figure 2 shown, a calibration-free temperature measurement system for high-temperature coating includes a growth component 100, an optical fiber 200, and a laser thermometer 300. The growth component 100 is used to arrange a semiconductor substrate to be coated. A temperature measurement hole 101 is formed on the growth component 100. One end of the optical fiber 200 is connected to the laser emission end of the laser thermometer 300, and the other end is connected to the temperature measurement hole 101.

[0021] On the basis of the existing temperature measuring device, an optical fiber 200 is arranged, and a light beam channel is built between the laser thermometer 300 and the temperature measuring hole 101 through the optical fiber 200. The laser emitted by the laser thermometer 300 can reach the temperature measuring hole 101 through total internal reflection in the optical fiber 200. After adding the optical fiber 200, the laser emitted by the laser thermometer 300 can always reach the temperature measuring hole 101, and the measured temperature result accurately and stably reflects the temperature of the temperature measuring hole 101, eliminating the instability in the calibration operation. In addition, since the light beam of the laser thermometer 300 can always be aligned with the temperature measuring hole 101 through the optical fiber 200, there is no need to calibrate the temperature, saving a large amount of production time, improving production efficiency, with accurate and stable temperature. Measuring the temperature at the same position in different production cycles makes the temperature measuring position consistent in multiple production cycles, improving product stability.

[0022] In one embodiment, one end of the optical fiber 200 is detachably connected to the temperature measuring hole 101 through a connector 201 for maintaining the growth component 100. For example, the end of the connector 201 away from the optical fiber 200 is inserted into the temperature measuring hole 101. More preferably, threads are provided on the outer wall of the connector 201, and threads are also provided on the inner wall of the temperature measuring hole 101 to cooperate with the connector 201, and the two are threadedly connected.

[0023] Exemplarily, the other end of the optical fiber 200 can also be detachably connected to the laser thermometer 300. Since the optical fiber 200 itself can bend at a certain angle, the position of the laser thermometer 300 can be appropriately adjusted according to the production environment, such as Figure 2 shown, the laser thermometer 300 can also be arranged on a fixing member 400, and the fixing member 400 is, for example, a baffle.

[0024] Furthermore, the temperature of the semiconductor coating equipment is, for example, 850 - 1100 °C. Therefore, a heat insulation structure can also be arranged between the laser thermometer 300 and the growth component 100 to prevent the laser thermometer 300 from being damaged by high temperature. The heat insulation structure is, for example, a heat insulation medium such as a heat insulation board, and only a through hole is left on the heat insulation board for the optical fiber 200 to pass through.

[0025] Specifically, the growth component 100 is a graphite part, and the inside of the graphite part has a cavity (not shown) for arranging the semiconductor substrate to be coated. The temperature measuring hole 101 on the graphite part is, for example, a blind hole. The semiconductor substrate is, for example, a silicon substrate, such as semiconductor materials of Si, SiGe, SiGeC, SiC, GaAs, InAs, InP and other III / V or II / VI compound semiconductors, or can also be a semiconductor substrate including an epi-layer, or a silicon-on-insulator (SOI) substrate.

[0026] The above description is only a description of the preferred embodiments of the present utility model, and does not impose any limitation on the scope of the present utility model. Any changes and modifications made by those of ordinary skill in the art of the present utility model based on the above disclosure shall fall within the protection scope of the technical solution of the present utility model.

Claims

1. A calibration-free temperature measurement system for high-temperature coating, characterized in that: It includes a growth component, an optical fiber and a laser thermometer. The growth component is used to arrange the semiconductor substrate to be coated. The growth component is provided with a temperature measuring hole. One end of the optical fiber is connected to the laser emitting end of the laser thermometer, and the other end is connected to the temperature measuring hole.

2. The calibration-free temperature measurement system for high-temperature coating according to claim 1, characterized in that: One end of the optical fiber is detachably connected to the temperature measuring hole through a connector.

3. The calibration-free temperature measurement system for high-temperature coating according to claim 2, characterized in that: One end of the connector away from the optical fiber is inserted into the temperature measuring hole.

4. The calibration-free temperature measurement system for high-temperature coating according to claim 1, characterized in that: The growth component is a graphite piece, and a cavity is provided inside the graphite piece for arranging a semiconductor substrate to be coated.

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