Wafer boat for loading wafer
By designing a detachable support cabin, the problem of difficulty in compatible with wafers of multiple thicknesses in the prior art is solved, and cost reduction and stability improvement are achieved.
Patent Information
- Application Number
- CN202520597678.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-01
- Publication Date
- 2025-05-20
- Estimated Expiration
- 2035-04-01
AI Technical Summary
Existing crystal boats are difficult to compatible with wafers of multiple thicknesses, resulting in increased procurement and storage costs and low stability during high temperature diffusion.
A wafer boat consisting of a support member and a removable rod-shaped support sleeve is designed. The support sleeve is installed in parallel on the support member and is equipped with multiple wafer slots to accommodate wafers of different thicknesses.
The compatibility of the wafer boat with wafers of various thicknesses is achieved, the procurement and storage costs are reduced, and the structure is simple and the stability is high, and it is not easy to cause damage due to thermal expansion and contraction.
Smart Images

Figure CN222887854U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductor manufacturing, and more specifically, to a boat for loading wafers. Background Art
[0002] The boat is one of the key components in semiconductor diffusion, deposition and other process, and is used to load silicon wafers. Taking the diffusion process as an example, the boat material needs to be quartz, silicon or silicon carbide. The wafers need to be inserted into the slots on the boat, and the thickness of the wafers needs to match the width of the slots. When the slots are too large, the wafers will be skewed and cannot be vertically fixed, resulting in wafer collision and fragmentation or uneven impurity deposition. Therefore, corresponding boats need to be configured for wafers of different specifications, resulting in increased procurement and storage costs. To solve this problem, some technologies have been developed in this field.
[0003] For example, in the Chinese patent with the publication number CN 219658724U, the separation support surface and diffusion surface of the boat are adopted, and the wafers are all tilted to one side under the action of gravity to increase the width tolerance of the slots. In this case, the silicon wafers are still arranged in parallel, and the spacing is determined by the slot pitch, which can ensure the consistency in deposition and diffusion processes. However, this process implementation method will cause the conventional wafer unloader to be unable to complete the batch transfer of wafers, affecting the automation work of the wafer fab.
[0004] For another example, the Chinese patent with the publication number CN208796972 U discloses a universal plate boat, which uses a boat with jacks and replaceable insertion rods for fixing silicon wafers to assemble a new boat to achieve the loading of silicon wafers of different sizes. In this case, only one type of insertion rod corresponding to one type of silicon wafer is needed to achieve the compatibility of the boat. However, the slot connections of this method are fastened by spring threads and magnetic attraction, which are prone to cracking or demagnetization failure due to the influence of thermal expansion and contraction during high-temperature diffusion, and the stability is not high; and the structure is relatively complex and the processing cost is relatively high. Summary of the Utility Model
[0005] Aiming at the above-mentioned defects of the prior art, the utility model discloses a boat for loading wafers, achieving the purpose that one boat is applicable to / compatible with wafers of multiple thicknesses.
[0006] According to one aspect of the utility model, the utility model provides a boat for loading wafers, the boat includes a support and a plurality of rod-shaped sleeve supports, the sleeve supports are installed on the support parallel to each other and detachably, and a plurality of wafer slots parallel to each other are arranged on the side of the sleeve supports facing the wafers to be loaded in the extending direction of the sleeve supports; the sleeve supports are arranged to be arranged in a circumferential direction in a co-circular manner.
[0007] Preferably, the support member includes a plurality of connecting rods parallel to each other, two end plates parallel to each other, and a plurality of support rods parallel to each other; wherein, both ends of the connecting rods are respectively connected to the two end plates and are located on the same side surface of the end plates with the same orientation, and both ends of the support rods are respectively connected to the two end plates and are located on the other side surface of the end plates opposite to the one side surface.
[0008] Preferably, the end plates are all connected to the connecting rods near the ends of the end plates, and the connection positions of both ends of the connecting rods on the end plates generally equally divide the length of the end plates.
[0009] Preferably, the support rods and the connecting rods are arranged opposite to each other with respect to the end plates.
[0010] Preferably, the support rods are slightly offset by a certain distance from the connecting rods in the position on the end plates.
[0011] Preferably, the support rod sleeve is detachably mounted on the support rod.
[0012] Preferably, a groove extending along the extending direction of the support rod sleeve is provided on one side of the support rod sleeve facing the support rod, so that the support rod sleeve can be clamped on the support rod through the groove.
[0013] Preferably, a plurality of spaced hemispherical positioning protrusions are provided on the surface of the support rod facing the groove of the support rod sleeve along the extending direction of the support rod, and hemispherical positioning recesses corresponding to the positioning protrusions are provided on the surface of the groove of the support rod sleeve, so as to cooperate with the positioning protrusions to fix the support rod sleeve on the support rod.
[0014] Preferably, the radius of the circle where the support rod sleeves arranged in a common circle are located plus the thickness of the cross-section of the support rod sleeve minus the depth of the groove of the wafer slot.
[0015] Preferably, the end plates are arranged as arc-shaped plates so as to correspond to the common circle arrangement of the support rod sleeves.
[0016] Based on the above technical solutions, the utility model has at least one of the following beneficial effects compared with the prior art.
[0017] 1. The structure of the wafer boat is simple, the processing difficulty is relatively low, and the manufacturing cost has no obvious increase compared with the conventional wafer boat.
[0018] 2. The wafer boat has very few parts, is easy to assemble, is not easily damaged due to installation errors, and the precision components will not be broken due to thermal expansion and contraction at high temperatures.
[0019] 3. The wafer boat can be adapted to wafers of various thicknesses by replacing the support rod sleeves, which can greatly reduce the procurement cost of the wafer boat and also reduce the storage and management pressure of the wafer boat.
[0020] Other features and advantages of the present application will be described in the subsequent specification, and will, in part, be obvious from the specification, or will be understood by implementing the present application. Other advantages of the present application can be realized and obtained through the solutions described in the specification and the accompanying drawings. Description of the Drawings
[0021] The drawings are used to provide an understanding of the technical solutions of the present application, and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solutions of the present application, and do not constitute a limitation to the technical solutions of the present application.
[0022] Figure 1 Schematic perspective view of a susceptor according to an embodiment of the present utility model;
[0023] Figure 2 Schematic perspective view of a support member according to an embodiment of the present utility model;
[0024] Figure 3 is Figure 2 Schematic cross-sectional view of the support member shown;
[0025] Figure 4 Schematic view of a rod sleeve according to an embodiment of the present utility model;
[0026] Figure 5 is Figure 4 Enlarged view of the part circled A in;
[0027] Figure 6 Schematic cross-sectional view of a rod sleeve according to an embodiment of the present utility model.
[0028] List of reference numerals:
[0029] 1, support member; 11, connecting rod; 12, end plate; 13, rod; 131, positioning convex portion; 2, rod sleeve; 21, wafer slot; 22, groove; 23, positioning concave portion; 100, susceptor. Detailed Description of the Embodiment
[0030] In order to make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the following further describes the present utility model in detail with reference to specific embodiments and the accompanying drawings.
[0031] To make the objectives, technical solutions and advantages of the present disclosure more comprehensible and clear, the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. It should be noted that the embodiments can be implemented in multiple different forms. It is easily understandable for those of ordinary skill in the art that the forms and contents can be transformed into various forms without departing from the spirit and scope of the present disclosure. Therefore, the present disclosure should not be construed as being limited only to the contents described in the following embodiments. Without conflict, the embodiments and features in the embodiments of the present disclosure can be combined arbitrarily with each other.
[0032] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.
[0033] In addition, the terms "first", "second", etc. are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include at least one of such features.
[0034] In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.
[0035] In the present application, unless otherwise clearly specified and limited, the terms "mounted", "connected", "coupled", "fixed", etc. shall be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.
[0036] In this application, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply indicates that the horizontal height of the first feature is less than that of the second feature.
[0037] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "examples", "specific examples" or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with that embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples. For the purpose of achieving the above object according to the embodiments of the present utility model, the present utility model adopts the following technical solutions.
[0038] As Figure 1 shown, the susceptor 100 for loading wafers includes a support member 1 and a plurality of rod-shaped sleeve supports 2. The sleeve supports 2 are installed on the support member 1 parallel to each other and detachably. The sleeve supports 2 are provided with a plurality of wafer slots 21 parallel to each other on the side facing the wafer to be loaded in the extending direction of the sleeve supports 2, see Figure 4 and Figure 5 As Figure 5 shown, the cross-section of the wafer slot 21 is a generally equilateral trapezoid with an opening. Preferably, the included angle between the two hypotenuses of the trapezoid is 30 degrees. As Figure 1 shown, the sleeve supports 2 are arranged in a circumferential direction so as to be co-circular to load circular wafers. Preferably, the radius of the circle where the co-circularly arranged sleeve supports 2 are located is generally the radius of the wafer to be loaded plus the thickness of the cross-section of the sleeve support 2 minus the groove depth of the wafer slot 21. Preferably, the range of the groove depth is 0.2 - 3 mm. The sleeve supports 2 are rigid so that the wafer slots 21 are not easily deformed, thereby avoiding the wafers loaded from falling off.
[0039] As Figure 1 and Figure 2As shown, according to an embodiment of the present utility model, the support member 1 includes a plurality of connecting rods 11 parallel to each other, two end plates 12 parallel to each other, and a plurality of support rods 13 parallel to each other. Exemplarily, as Figure 2 and Figure 3 shown, the support member 1 includes four support rods 13. Correspondingly, the susceptor 100 includes four support rod sleeves 2. According to the present utility model, both ends of the connecting rod 11 are respectively connected to the two end plates 12, on the same side surface of the end plates 12 (shown as the inner side surface facing the paper surface in Figure 2 ). Both ends of the support rod 13 are respectively connected to the two end plates 12, on the other side surface of the end plates 12 (shown as the outer side surface facing the paper surface in Figure 2 ). The end plates 12 are all connected to the connecting rod 11 near the ends of the end plates 12, and the connection positions of both ends of the connecting rod 11 on the end plates 12 generally equally divide the length of the end plates 12. That is to say, two connecting rods 11 are arranged near the ends of the end plates 12, and the connection positions of the other connecting rods 11 on the end plates 12 generally equally divide the length of the end plates 12.
[0040] As Figure 2 and Figure 3 shown, the support rods 13 are arranged in one-to-one correspondence with the connecting rods 11. Specifically, the support rods 13 and the connecting rods 11 are arranged opposite to each other with respect to the end plates 12, that is, they are directly opposite to each other. Optionally, as Figure 2 and Figure 3 shown, the support rods 13 are slightly offset by a certain distance from the connecting rods 11 at the positions of the end plates 12. According to the present utility model, the position of the connecting rod 11 is specifically determined according to the equipment to which it is applied, and the position of the support rod 13 is determined according to the stability of the wafer. The number of connecting rods 11 is determined by, for example, a furnace tube transfer paddle (which is a component included in the equipment using the susceptor of the present application), generally 4; while the number of support rods can be configured according to the needs of the susceptor itself, preferably 4 or 6.
[0041] According to an embodiment of the present utility model, referring to Figure 1 , the support rod sleeve 2 is detachably mounted on the support rod 13. Exemplarily, as Figure 3 shown, the cross-section of the support rod 13 is polygonal. Correspondingly, as Figure 6 shown, the cross-section of the support rod sleeve 2 is set to a shape corresponding to the shape of the cross-section of the support rod 13, so that the support rod sleeve 2 is snap-fitted with the support rod 13. Further, as Figure 6 shown, a groove 22 extending along the extending direction of the support rod sleeve 2 is provided on one side of the support rod sleeve 2 facing the support rod 13, so that the support rod sleeve 2 can be snap-fitted on the support rod 13 through the groove 22. The shape of the groove 22 matches the polygon of the cross-section of the support rod 13 (in particular, a part of the polygon). Exemplarily, referring to Figure 6, the cross-section of the support rod 13 is generally hexagonal, and the groove 22 of the support rod sleeve 2 has three sides. The groove 22 with three sides of the support rod sleeve 2 cooperates with three sides of the hexagon of the support rod 13.
[0042] Furthermore, as Figure 3 and Figure 4 shown, the support rod 13 is provided with a plurality of spaced hemispherical positioning protrusions 131 on the surface facing the groove 22 of the support rod sleeve 2 along the extending direction of the support rod 13. The surface of the groove 22 of the support rod sleeve 2 is provided with hemispherical positioning recesses 23 corresponding to the positioning protrusions 131, so as to cooperate with the positioning protrusions 131 to fix the support rod sleeve 2 on the support rod 13, see Figure 4 . Preferably, the length of the support rod sleeve 2 is slightly less than the length of the support rod 13, so that the support rod sleeve 2 can be directly placed and fixed on the support rod 13 by gravity. As Figure 1 shown, in the susceptor 100 according to the embodiment of the present invention, a plurality of support rods 13 and the support rod sleeve 2 jointly complete the limiting and fixing of the wafer.
[0043] According to the embodiment of the present invention, as Figure 1 , Figure 2 and Figure 3 shown, the end plate 12 is arranged as an arc-shaped plate to correspond to the co-circular arrangement of the support rod sleeves 2. According to the embodiment of the present invention, the radian of the end plate 12 corresponds to a central angle of more than 45 degrees, preferably greater than 90 degrees, and more preferably 120 degrees.
[0044] The susceptor 100 for loading wafers according to the present invention can be assembled, including the following steps. Place the support member 1 so that the connecting rod 11 faces downward and the support rod 13 faces upward, align the support rod sleeve 2 with the support rod 13, align the positioning recess 23 of the support rod sleeve 2 with the positioning protrusion 131 of the support rod 13, and snap-fix the support rod sleeve 2 to the support rod 13 to complete the assembly of the susceptor 100. After the assembly is completed, the wafer slot 21 faces upward, which is also the state when the susceptor 100 is in use.
[0045] The present invention is not only applicable to the susceptors for diffusion and deposition processes, but also applicable to other situations where a susceptor with variable thickness is required. The susceptor material can be quartz, silicon, silicon carbide, etc.
[0046] The above specific embodiments have further detailed the purpose, technical solution and beneficial effects of the present invention. It should be understood that the above are only specific embodiments of the present invention and are not used to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.
Claims
1. A wafer boat (100) for loading wafers, characterized in that: The wafer boat (100) comprises a support member (1) and a plurality of rod-shaped support rod sleeves (2), the support rod sleeves (2) being detachably mounted on the support member (1) in parallel with each other, and the support rod sleeves (2) are provided with a plurality of wafer slots (21) which are parallel to each other on a side of the support rod sleeves (2) facing the wafer to be loaded in the extension direction of the support rod sleeves (2); The support rod sleeves (2) are arranged cocircularly with each other in a circumferential direction.
2. The wafer boat (100) according to claim 1, characterized in that: The support member (1) comprises a plurality of connecting rods (11) parallel to each other, two end plates (12) parallel to each other, and a plurality of supporting rods (13) parallel to each other; Wherein, the two ends of the connecting rod (11) are respectively connected to the two end plates (12) and are located on one side surface of the end plates (12) facing the same direction. Two ends of the support rod (13) are respectively connected to the two end plates (12) and are located on the other side surface of the end plate (12) opposite to the one side surface.
3. The wafer boat (100) according to claim 2, characterized in that: The end plates (12) are connected to the connecting rods (11) near the ends of the end plates (12), and The connection positions of the two ends of the connecting rod (11) on the end plate (12) divide the length of the end plate (12) into equal parts.
4. The wafer boat (100) according to claim 2, characterized in that: The support rod (13) and the connecting rod (11) are arranged opposite to each other relative to the end plate (12).
5. The wafer boat (100) according to claim 2, characterized in that: The support rod (13) is slightly offset by a certain distance relative to the connection rod (11) on the end plate (12).
6. The wafer boat (100) according to claim 2, characterized in that: The support rod sleeve (2) is detachably mounted on the support rod (13).
7. The wafer boat (100) according to claim 6, characterized in that: A groove (22) extending along the extension direction of the support rod sleeve (2) is provided on the side of the support rod sleeve (2) facing the support rod (13), so that the support rod sleeve (2) can be clamped onto the support rod (13) through the groove (22).
8. The wafer boat (100) according to claim 7, characterized in that: The support rod (13) is provided with a plurality of hemispherical positioning protrusions (131) spaced apart from each other on a surface of the groove (22) facing the support rod sleeve (2) along an extending direction of the support rod (13). The surface of the groove (22) of the support rod sleeve (2) is provided with a hemispherical positioning recess (23) corresponding to the positioning protrusion (131), so as to cooperate with the positioning protrusion (131) to fix the support rod sleeve (2) on the support rod (13).
9. The wafer boat (100) according to claim 1, characterized in that: The radius of the circle where the cocircularly arranged support rod sleeves (2) are located is the radius of the wafer to be loaded plus the thickness of the cross section of the support rod sleeve (2) minus the groove depth of the wafer slot (21).
10. The wafer boat (100) according to claim 2, characterized in that: The end plate (12) is configured as an arc-shaped plate so as to correspond to the cocircular arrangement of the support rod sleeves (2).
Citation Information
Patent Citations
General template boat
CN208796972U
Chip source placement structure and system for chip diffusion
CN219658724U