Waterproof packaging structure at joint of circuit board and wire

Abstract

The utility model relates to a waterproof packaging structure at the joint of a circuit board and a wire. The waterproof packaging structure comprises a substrate and a wire fixed on the substrate, an injection molding frame is arranged on the substrate, a glue pouring cavity is formed in the injection molding frame, and the wire penetrates into the glue pouring cavity from the outer side wall of the injection molding frame; the glue filling cavity is filled with a waterproof glue injection layer, and the waterproof glue injection layer is used for covering the joint of the wire and the substrate. And an injection molding protective layer is also wrapped outside the injection molding frame. The waterproof structure has the advantages that connection is reliable, the waterproof grade is high, waterproof performance is high, the waterproof grade of the connecting position of the substrate and the wire can be greatly improved through the injection molding protective layer, the waterproof grade reaches IP67 or above, and the effect of high reliability of the electrical connection component is achieved.

Description

Technical Field

[0001] This application relates to the technical field of circuit board connection structures, and in particular to a waterproof encapsulation structure at the connection between a circuit board and a wire. Background Art

[0002] Currently, the connection methods between FPC / FFC (hereinafter referred to as circuit boards) and wires mainly include welding, crimping, and mutual plugging through connectors. For the above several connection methods, after the connection is completed, since the connection part between the two is directly exposed, the waterproof performance of the connection part between the two is poor, and it is extremely easy for the circuit board to malfunction due to water ingress at the connection part.

[0003] The waterproof structure at the connection between a circuit board and a wire is an important design to ensure the normal operation of electronic devices in humid or underwater environments. This structure is usually used to improve the durability and reliability of products, especially in outdoor or industrial applications. Therefore, for the above several connection methods, this application provides a waterproof encapsulation structure to solve the problem of poor waterproof performance. Utility Model Content

[0004] This application provides a waterproof encapsulation structure at the connection between a circuit board and a wire, which has the effects of reliable connection, high waterproof level, and strong waterproof performance.

[0005] The waterproof encapsulation structure at the connection between a circuit board and a wire provided by this application adopts the following technical solutions:

[0006] A waterproof encapsulation structure at the connection between a circuit board and a wire includes a substrate and a wire fixed on the substrate; an injection molding frame is arranged on the substrate, a glue injection cavity is formed in the injection molding frame, and the wire penetrates from the outer side wall of the injection molding frame into the glue injection cavity; a waterproof glue injection layer is filled in the glue injection cavity, and the waterproof glue injection layer is used to cover the connection part between the wire and the substrate; an injection molding protective layer is also wrapped outside the injection molding frame.

[0007] Preferably, a glue injection groove is arranged on the substrate, and the wire is welded and fixed on the inner side wall of the glue injection groove.

[0008] Preferably, the glue injection groove is opposite to the glue injection port of the glue injection cavity

[0009] Preferably, a relief groove is formed on the outer side wall of the injection molding frame, and the substrate is inserted into the injection molding frame from the side wall of the relief groove.

[0010] Preferably, a plurality of reinforcing ribs are arranged on the outer side wall of the injection molding frame, and the reinforcing ribs are symmetrically arranged on the outer side walls of the injection molding frame facing away from each other.

[0011] Preferably, a plurality of positioning blocks are provided on the outer side wall of the injection molding frame, and the positioning blocks are circumferentially distributed around the glue injection port of the glue injection cavity.

[0012] In summary, the present application includes at least one of the following beneficial technical effects:

[0013] The cured waterproof glue injection layer is used to completely cover the connection between the wire and the substrate. In addition, since the glue injection groove is directly opposite to the glue injection port of the glue injection cavity, the covering effect of the waterproof glue injection layer on the glue injection groove can be ensured, and the connection reliability of the connection between the wire and the substrate can be ensured;

[0014] After waiting for the waterproof glue injection layer to cure, the final injection molding encapsulation is required. By performing injection molding encapsulation on the outside of the injection molding frame, an injection molding protective layer will be formed and wrapped around the outside of the injection molding frame after injection molding is completed. The injection molding protective layer can greatly improve the waterproof level of the connection between the substrate and the wire, and the waterproof level reaches above IP67, achieving high reliability of the electrical connection components;

[0015] The reinforcing ribs can further improve the structural strength of the injection molding frame, making the overall structure of the injection molding frame more stable and reliable. Brief Description of the Drawings

[0016] Figure 1 is a schematic diagram of the overall structure of an embodiment of the present application;

[0017] Figure 2 is Figure 1 a partial structural schematic diagram after hiding the injection molding protective layer;

[0018] Figure 3 is Figure 2 a partial structural schematic diagram after hiding the waterproof glue injection layer.

[0019] Description of the Reference Numerals: 1. Substrate; 2. Wire; 3. Injection molding frame; 30. Glue injection cavity; 4. Waterproof glue injection layer; 5. Injection molding protective layer; 6. Glue injection groove; 7. Relief groove; 8. Reinforcing rib; 9. Positioning block. Detailed Description of the Embodiment

[0020] The following further describes the present application in detail with reference to the drawings.

[0021] An embodiment of the present application discloses a waterproof encapsulation structure at the connection between a circuit board and a wire.

[0022] Refer to Figure 1 、 Figure 2 and Figure 3, the waterproof encapsulation structure at the connection between the circuit board and the wire includes a substrate 1 and a wire 2 fixedly arranged at one end of the substrate 1. A glue injection groove 6 is arranged on the outer side wall of the end of the substrate 1. The arrangement of the glue injection groove 6 can expose the metal connection part of the substrate 1. The conductive end of the wire 2 is welded and fixed on the inner side wall of the glue injection groove 6 to realize the signal transmission between the wire 2 and the substrate 1.

[0023] As Figure 2 , Figure 3 shown, an injection molding frame 3 is also fixedly arranged at the end of the substrate 1. A glue injection cavity 30 is formed inside the injection molding frame 3. The glue injection groove 6 is located inside the glue injection cavity 30, and the glue injection groove 6 is directly opposite to the glue injection port of the glue injection cavity 30. The wire 2 penetrates from the outer side wall of the injection molding frame 3 into the glue injection cavity 30 and is then welded and fixed on the inner side wall of the glue injection groove 6. The glue injection cavity 30 is filled with a waterproof glue injection layer 4, which is formed by pouring and curing a glue with waterproof characteristics. The cured waterproof glue injection layer 4 is used to completely cover the connection between the wire 2 and the substrate 1. In addition, since the glue injection groove 6 is directly opposite to the glue injection port of the glue injection cavity 30, the covering effect of the waterproof glue injection layer 4 on the glue injection groove 6 can be ensured, and the connection reliability of the connection between the wire 2 and the substrate 1 can be ensured.

[0024] As Figure 2 , Figure 3 shown, a relief groove 7 is formed on the outer side wall of the injection molding frame 3. The substrate 1 is inserted into the injection molding frame 3 from the outer side wall of the relief groove 7. The relief groove 7 can further reduce the thickness of the injection molding frame 3, so that the end of the substrate 1 can be inserted into the injection molding frame 3 more smoothly.

[0025] As Figure 2 , Figure 3 shown, a plurality of reinforcing ribs 8 are integrally formed on the outer side wall of the injection molding frame 3. The reinforcing ribs 8 are arranged in pairs and symmetrically on the mutually opposite outer side walls of the injection molding frame 3. The length direction of the reinforcing ribs 8 extends along the thickness direction of the injection molding frame 3. The reinforcing ribs 8 can further improve the structural strength of the injection molding frame 3 and make the overall structure of the injection molding frame 3 more stable and reliable.

[0026] As Figure 1 , Figure 2 and Figure 3 shown, a plurality of positioning blocks 9 are fixedly arranged on the outer side wall of the injection molding frame 3. The positioning blocks 9 are circumferentially distributed around the glue injection port of the glue injection cavity 30. After waiting for the waterproof glue injection layer 4 to cure, the final injection molding encapsulation needs to be carried out. The arrangement of the positioning blocks 9 facilitates positioning with the mold cavity during injection molding. Through injection molding encapsulation of the outside of the injection molding frame 3, an injection molding protective layer 5 will be formed and wrapped around the outside of the injection molding frame 3 after injection molding. The injection molding protective layer 5 can greatly improve the waterproof level of the connection between the substrate 1 and the wire 2, and the waterproof level reaches above IP67, realizing the high reliability of the electrical connection components.

[0027] The implementation principle is as follows: The potting cavity 30 is filled with a waterproof potting layer 4, which is formed by pouring and curing a glue with waterproof characteristics. The cured waterproof potting layer 4 is used to completely cover the connection between the wire 2 and the substrate 1. In addition, since the potting groove 6 is opposite to the potting port of the potting cavity 30, it can ensure the covering effect of the waterproof potting layer 4 on the potting groove 6 and ensure the connection reliability of the connection between the wire 2 and the substrate 1.

[0028] After waiting for the waterproof potting layer 4 to cure, the final injection molding and encapsulation are required, and the setting of the positioning block 9 facilitates positioning with the mold cavity during injection molding. By performing injection molding and encapsulation on the outside of the injection molding frame 3, an injection molding protective layer 5 will be formed and wrapped around the outside of the injection molding frame 3 after injection molding. The injection molding protective layer 5 can greatly improve the waterproof level of the connection between the substrate 1 and the wire 2, and the waterproof level reaches above IP67, achieving high reliability of the electrical connection components.

[0029] The above are all the preferred embodiments of this application. The protection scope of this application is not limited by this. Therefore, all equivalent changes made according to the structure, shape, and principle of this application should be covered within the protection scope of this application.

Claims

1. A waterproof packaging structure for a connection between a circuit board and an electric wire, comprising a substrate (1) and a wire (2) fixed on the substrate (1); characterized in that: An injection molding frame (3) is provided on the substrate (1), a glue injection cavity (30) is formed in the injection molding frame (3), and the wire (2) penetrates into the glue injection cavity (30) from the outer wall of the injection molding frame (3); the glue injection cavity (30) is filled with a waterproof glue injection layer (4), and the waterproof glue injection layer (4) is used to cover the connection between the wire (2) and the substrate (1); the outside of the injection molding frame (3) is also wrapped with an injection molding protective layer (5).

2. The waterproof packaging structure at the connection between the circuit board and the wire according to claim 1, characterized in that: The base plate (1) is provided with a glue potting groove (6), and the wire (2) is welded and fixed to the inner wall of the glue potting groove (6).

3. The waterproof packaging structure at the connection between the circuit board and the wire according to claim 2, characterized in that: The glue pouring groove (6) is directly opposite to the glue pouring port of the glue pouring cavity (30).

4. The waterproof packaging structure at the connection between the circuit board and the wire according to claim 1, characterized in that: A clearance groove (7) is formed on the outer side wall of the injection molding frame (3), and the substrate (1) is inserted into the injection molding frame (3) from the side wall of the clearance groove (7).

5. The waterproof packaging structure at the connection between the circuit board and the wire according to claim 1, characterized in that: A plurality of reinforcing ribs (8) are arranged on the outer side wall of the injection molding frame (3), and the reinforcing ribs (8) are symmetrically arranged on the outer side walls of the injection molding frame (3) which are away from each other.

6. The waterproof packaging structure at the connection between the circuit board and the wire according to claim 1, characterized in that: A plurality of positioning blocks (9) are arranged on the outer side wall of the injection molding frame (3), and the positioning blocks (9) are circumferentially arranged around the glue injection port of the glue injection cavity (30).

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