Spray cleaning device

Abstract

The spray cleaning device comprises the spray cleaning cavity, the temporary storage box and the liquid storage tank, the spray cleaning cavity comprises the cavity body and the atomization nozzle arranged in the cavity body, the atomization nozzle is used for cleaning the surface of the copper material, process residual grease and other foreign matter on the surface of the copper material can be effectively cleaned, and the cleaning effect is good. Meanwhile, the copper material is prevented from being impacted by water flow, the smoothness of the surface of the copper material is prevented from being affected, the follow-up coating process of the copper material is prevented from being affected, and therefore the product quality is improved; a liquid storage tank is connected with a buffer box, a cleaning agent is stored in the liquid storage tank, the buffer box is connected with an atomization spray head, and the buffer box is provided with a liquid level control assembly and can buffer the cleaning agent; the liquid level control assembly can control the amount of the cleaning agent used when the copper material is cleaned, and waste of water resources is avoided.

Description

Technical Field

[0001] The utility model belongs to the field of copper material processing, and specifically relates to a spray cleaning device. Background Art

[0002] In the field of copper material processing, the role of the cleaning process is to remove residual grease and other foreign matter on the surface of the copper material. Most of the cleaning devices in the prior art directly rinse the surface of the copper material. Due to the low hardness of the copper material, the surface of the copper material is easily impacted by water flow, which reduces the smoothness of the copper surface, affects the subsequent plating process of the copper material, and reduces the quality of the product. In addition, a large amount of water resources are easily wasted during the cleaning process, which increases production costs.

[0003] To solve the above problems, patent document 114192762A discloses a cleaning device for special copper castings, including a tank body, a support ring is fixedly installed on the outer side of the tank body, four telescopic legs are fixedly installed on the bottom plate of the support ring, an outer cylinder is fixedly installed on the bottom of the inner cavity of the tank body, two limit grooves are provided inside the outer cylinder, limit strips are movably installed inside the two limit grooves, an inner cylinder is fixedly installed on the opposite side of the limit strip, a screw is fixedly installed on the top of the inner cavity of the inner cylinder, and a threaded cylinder is threadedly connected to the outer side of the screw, but the above problems cannot be solved. Utility Model Content

[0004] The utility model is designed to solve the above problems, and aims to provide a spray cleaning device that can effectively clean the residual grease and other foreign matter on the surface of copper materials, can prevent the copper surface from being impacted by water flow during the awakening process, can avoid affecting the subsequent plating process of the copper material, can improve product quality, and can avoid wasting water resources. In order to achieve the above purposes, the technical solution adopted by the utility model is:

[0005] The utility model provides a spray cleaning device with the following characteristics: it comprises a spray cleaning chamber, a cache box and a liquid storage tank; the spray cleaning chamber comprises a cavity body and an atomizing nozzle arranged in the cavity body; the liquid storage tank is connected with the cache box, the cache box is connected with the atomizing nozzle; and the cache box is provided with a liquid level control component.

[0006] The spray cleaning device provided by the utility model may also have the following characteristics: a first liquid inlet pipeline is provided between the liquid storage tank and the cache box, one end of the first liquid inlet pipeline is connected to the liquid storage tank, the other end of the first liquid inlet pipeline is connected to the cache box, and a first liquid pump is provided on the first liquid inlet pipeline.

[0007] The spray cleaning device provided by the utility model may also have the following characteristics: a second liquid inlet pipeline is provided between the cache box and the atomizing nozzle, one end of the second liquid inlet pipeline is connected to the cache box, the other end of the second liquid inlet pipeline is connected to the atomizing nozzle, and a second liquid pump is provided on the second liquid inlet pipeline.

[0008] The spray cleaning device provided by the utility model may also have such a feature that the liquid level control component includes a liquid level sensor and a controller, the liquid level sensor is arranged in the cache box, the liquid level sensor is connected to the controller, and the controller is connected to the first liquid pump and the second liquid pump.

[0009] The spray cleaning device provided by the utility model may also have the following features: a motor is provided in the cavity, the motor is arranged on the inner wall of the cavity, a mounting plate is provided on the motor shaft of the motor, and the atomizing nozzle is arranged on the mounting plate.

[0010] The spray cleaning device provided by the utility model may also have such a feature that a fan is provided on the mounting plate, and the fan is located on one side of the atomizing nozzle.

[0011] The spray cleaning device provided by the utility model may also have such a feature that a liquid leakage plate is provided at the bottom of the cavity, and a collecting box is provided under the liquid leakage plate.

[0012] The technical effect of the utility model is as follows: the spray cleaning device provided by the utility model includes a spray cleaning chamber, a cache box and a liquid storage tank. The spray cleaning chamber includes a cavity and an atomizing nozzle arranged in the cavity. The surface of the copper material is cleaned by the atomizing nozzle, which can effectively clean the process residual grease and other foreign matter on the surface of the copper material, while avoiding the impact of water flow, avoiding affecting the smoothness of the copper material surface, and avoiding affecting the subsequent plating process of the copper material, thereby improving product quality. The liquid storage tank is connected to the cache box, and cleaning agent is stored in the liquid storage tank. The cache box is connected to the atomizing nozzle, and the cache box is provided with a liquid level control component. The cache box can cache the cleaning agent. The liquid level control component can control the amount of cleaning agent used when cleaning the copper material to avoid wasting water resources.

[0013] Therefore, the spray cleaning device provided by the utility model can effectively clean the residual grease and other foreign matter on the surface of the copper material, avoid the copper material surface being impacted by water flow during the cleaning process, avoid affecting the subsequent plating process of the copper material, improve product quality, and avoid wasting water resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] This specification includes the following drawings, which show the following contents:

[0015] Figure 1 It is a structural schematic diagram of a spray cleaning device in an embodiment of the utility model.

[0016] Marked in the figure: 10-spray cleaning chamber, 11-cavity, 12-atomizing nozzle, 13-motor, 14-mounting plate, 15-fan, 16-leakage plate, 17-collection box, 20-cache box, 30-liquid storage tank, 40-liquid level control component, 41-liquid level sensor, 42-controller, 50-first liquid inlet pipeline, 51-first liquid pump, 60-second liquid inlet pipeline, 61-second liquid pump. DETAILED DESCRIPTION

[0017] The specific implementation methods of the present invention are further explained in detail below by describing the embodiments with reference to the accompanying drawings, with the aim of helping those skilled in the art to have a more complete, accurate and in-depth understanding of the inventive concept and technical solution of the present invention and facilitating their implementation.

[0018] Figure 1 It is a structural schematic diagram of a spray cleaning device in an embodiment of the utility model.

[0019] like Figure 1 As shown, the spray cleaning device provided by the utility model includes a spray cleaning chamber 10, a cache box 20 and a liquid storage tank 30. The spray cleaning chamber 10 includes a cavity 11 and an atomizing nozzle 12 arranged in the cavity 11. The surface of the copper material is cleaned by the atomizing nozzle 12, which can effectively clean the process residual grease and other foreign matter on the surface of the copper material, while avoiding the impact of water flow, avoiding affecting the smoothness of the copper material surface, and avoiding affecting the subsequent plating process of the copper material, thereby improving product quality. The liquid storage tank 30 is connected to the cache box 20, and cleaning agents are stored in the liquid storage tank 30. The cache box 20 is connected to the atomizing nozzle 12. The cache box 20 is provided with a liquid level control component 40. The cache box 20 can cache cleaning agents, and the liquid storage tank 30 can facilitate the addition of cleaning agents. The liquid level control component 40 can control the amount of cleaning agents used when cleaning the copper material, avoid wasting water resources, reduce the amount of cleaning agents used for cleaning the copper material, and reduce sewage treatment costs and production costs.

[0020] A first liquid inlet pipeline 50 is provided between the liquid storage tank 30 and the cache box 20. One end of the first liquid inlet pipeline 50 is connected to the liquid storage tank 30, and the other end of the first liquid inlet pipeline 50 is connected to the cache box 20. A first liquid pump 51 is provided on the first liquid inlet pipeline 50. The first liquid pump 51 can pump the cleaning agent in the liquid storage tank 30 into the cache box 20 for caching. A second liquid inlet pipeline 60 is provided between the cache box 20 and the atomizing nozzle 12, one end of the second liquid inlet pipeline 60 is connected to the cache box 20, and the other end of the second liquid inlet pipeline 60 is connected to the atomizing nozzle 12. A second liquid pump 61 is provided on the second liquid inlet pipeline 60, and the second liquid pump 61 can pump the cleaning agent in the cache box 20 into the atomizing nozzle 12, so as to perform atomization cleaning, thereby improving the cleaning effect, and can effectively clean the process residual grease and other foreign matter on the surface of the copper material, while avoiding the impact of water flow, avoiding affecting the smoothness of the copper material surface, and avoiding affecting the subsequent copper plating process, thereby improving product quality.

[0021] The liquid level control component 40 includes a liquid level sensor 41 and a controller 42. The liquid level sensor 41 is arranged in the cache box 20. The liquid level sensor 41 is a static pressure immersion liquid level sensor. Based on the principle that the static pressure of the liquid is proportional to the liquid height, the liquid level sensor 41 can detect the liquid level in the cache box 20 and convert it into an electrical signal to be transmitted to the controller 42. The controller 42 is a single-chip microcomputer. The controller 42 is connected to the first liquid pump 51 and the second liquid pump 61, and can control the start or stop of the first liquid pump 51 and the second liquid pump 61.

[0022] When the liquid level sensor 41 detects that the liquid level of the cleaning agent in the buffer box 20 reaches the set maximum liquid level, the controller 42 controls the first liquid pump 51 to stop, so that the first liquid pump 51 stops pumping the cleaning agent in the liquid storage tank 30 into the buffer box 20, and then controls the second liquid pump 61 to start, pumping the cleaning agent in the buffer box 20 to the atomizing nozzle 12 for atomizing spraying, thereby cleaning the surface of the copper material, improving the cleaning effect, and being able to effectively clean the process residual grease and other foreign matter on the surface of the copper material, while avoiding the impact of water flow, avoiding affecting the smoothness of the copper material surface, and avoiding affecting the subsequent plating process of the copper material, thereby improving product quality. When the liquid level of the cleaning agent in the mixed storage box 20 reaches the set minimum liquid level, the controller 42 controls the second liquid pump 61 to stop, completes the atomizing spray cleaning of the copper material surface, and controls the first liquid pump 51 to start, so that the first liquid pump 51 stops pumping the cleaning agent in the liquid storage tank 30 into the buffer box 20, and completes the cleaning process of cyclic cleaning of the copper material surface. The amount of cleaning agent used in each atomization spray cleaning can be controlled by controlling the maximum liquid level and the minimum liquid level, thereby avoiding the waste of cleaning agents, saving water resources and reducing production costs.

[0023] A motor 13 is also provided in the cavity 11. The motor 13 is arranged on the inner wall of the cavity 11 and is located at the top of the cavity 11. A mounting plate 14 is provided on the motor shaft of the motor 13. The atomizing nozzle 12 is arranged on the mounting plate 14, so that the motor 13 can drive the atomizing nozzle 12 to rotate, thereby improving the effect of atomizing spray cleaning, and further effectively cleaning the process residual grease and other foreign matter on the surface of the copper material. A fan 15 is provided on the mounting plate 14. The fan 15 is located on one side of the atomizing nozzle 12, and can further disperse the atomized cleaning agent sprayed by the atomizing nozzle 12, thereby further improving the effect of atomizing spray cleaning, and further effectively cleaning the process residual grease and other foreign matter on the surface of the copper material, avoiding the copper material surface from being impacted by water flow during the waking process, avoiding affecting the subsequent plating process of the copper material, and improving product quality.

[0024] A liquid leakage plate 16 is provided at the bottom of the cavity 11. The liquid leakage plate 16 is mesh-shaped. A collecting box 17 is provided under the liquid leakage plate 16. The liquid leakage plate 16 can leak the cleaning agent after atomization spraying into the collecting box 17, thereby collecting the cleaning agent and waste liquid after use, facilitating centralized treatment and avoiding environmental pollution.

[0025] Functions and Effects of the Embodiments

[0026] The spray cleaning device provided by the utility model includes a spray cleaning chamber 10, a buffer box 20 and a liquid storage tank 30. The spray cleaning chamber 10 includes a cavity 11 and an atomizing nozzle 12 arranged in the cavity 11. The surface of the copper material is cleaned by the atomizing nozzle 12, which can effectively clean the process residual grease and other foreign matter on the surface of the copper material, while avoiding the impact of water flow, avoiding affecting the smoothness of the surface of the copper material, and avoiding affecting the subsequent plating process of the copper material, thereby improving product quality. The liquid storage tank 30 is connected to the buffer box 20, and the liquid storage tank 30 stores cleaning agents. The buffer box 20 is connected to the atomizing nozzle 12 The buffer box 20 is provided with a liquid level control component 40. The buffer box 20 can cache the cleaning agent. The liquid storage tank 30 can conveniently add the cleaning agent. The liquid level control component 40 can control the amount of cleaning agent used when cleaning the copper material, avoid wasting water resources, reduce the amount of cleaning agent used for cleaning the copper material, and reduce sewage treatment costs and production costs. The spray cleaning device provided by the utility model can effectively clean the residual grease and other foreign matter on the surface of the copper material, avoid the copper material surface being impacted by water flow during the waking process, avoid affecting the subsequent plating process of the copper material, improve product quality, and avoid wasting water resources.

[0027] The above is an exemplary description of the utility model in conjunction with the accompanying drawings. Obviously, the specific implementation of the utility model is not limited to the above-mentioned method. As long as various non-substantial improvements are made using the method concept and technical solution of the utility model; or the above concept and technical solution of the utility model are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A spray cleaning device, characterized in that: The invention comprises a spray cleaning chamber (10), a cache box (20) and a liquid storage tank (30), wherein the spray cleaning chamber (10) comprises a cavity body (11) and an atomizing nozzle (12) arranged in the cavity body (11), the liquid storage tank (30) is connected to the cache box (20), the cache box (20) is connected to the atomizing nozzle (12), and the cache box (20) is provided with a liquid level control component (40).

2. The spray cleaning device according to claim 1, characterized in that: A first liquid inlet pipeline (50) is provided between the liquid storage tank (30) and the cache box (20), one end of the first liquid inlet pipeline (50) is connected to the liquid storage tank (30), and the other end of the first liquid inlet pipeline (50) is connected to the cache box (20), and a first liquid pump (51) is provided on the first liquid inlet pipeline (50).

3. The spray cleaning device according to claim 2, characterized in that: A second liquid inlet pipeline (60) is provided between the cache box (20) and the atomizing nozzle (12), one end of the second liquid inlet pipeline (60) is connected to the cache box (20), and the other end of the second liquid inlet pipeline (60) is connected to the atomizing nozzle (12), and a second liquid pump (61) is provided on the second liquid inlet pipeline (60).

4. The spray cleaning device according to claim 3, characterized in that: The liquid level control component (40) includes a liquid level sensor (41) and a controller (42), wherein the liquid level sensor (41) is disposed in the cache box (20), the liquid level sensor (41) is connected to the controller (42), and the controller (42) is connected to the first liquid pump (51) and the second liquid pump (61).

5. The spray cleaning device according to any one of claims 1 to 4, characterized in that: A motor (13) is also provided in the cavity (11). The motor (13) is arranged on the inner wall of the cavity (11). A mounting plate (14) is provided on the motor shaft of the motor (13). The atomizing nozzle (12) is arranged on the mounting plate (14).

6. The spray cleaning device according to claim 5, characterized in that: A fan (15) is provided on the mounting plate (14), and the fan (15) is located on one side of the atomizing nozzle (12).

7. The spray cleaning device according to claim 6, characterized in that: A liquid leakage plate (16) is provided at the bottom of the cavity (11), and a collection box (17) is provided under the liquid leakage plate (16).

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