Clamp and sputtering instrument

Abstract

The utility model provides a clamp and a sputtering instrument. The clamp comprises a fixing frame and a buffer assembly. The fixing frame comprises a first surface and a second surface opposite to the first surface, and further comprises a first opening penetrating from the first surface to the second surface; the buffer assembly is arranged on the first face of the fixing frame and comprises a second opening, and the orthographic projection of the first opening on the first face and the orthographic projection of the second opening on the first face at least partially coincide; the hardness of the buffer assembly is smaller than that of the fixing frame. On the basis of keeping the structure of the clamp main body stable and unchanged, by adding the buffer layer material with low hardness, high lubrication degree, high corrosion resistance and high heat resistance, the breakage probability of the base plate is reduced; and the adjusting part capable of adjusting the size of the second opening is arranged on the substrate, so that the flexibility of realizing different shielding area schemes in the sputtering process is realized. A user can easily adjust the sputtering area according to actual requirements, so that the film deposition effect is optimized, and diversified and high-precision machining requirements are met.

Description

Technical Field

[0001] The present application relates to the field of sputtering technology, and in particular to a fixture and a sputtering apparatus. Background Art

[0002] Sputtering equipment, such as magnetron sputtering equipment, uses high-energy particles (such as ions or electrons) to bombard the surface of the target material, causing the target atoms or molecules to escape from the surface and deposit on the substrate to form a thin film. During the sputtering process, the magnetic field constrains the sputtered particles, improving the sputtering efficiency and film quality. The sputtering equipment has the characteristics of compact structure, easy operation and stable performance. It is an important tool for preparing high-quality thin film materials. The sputtering fixture ensures the quality and uniformity of the sputtering coating by ensuring the precise positioning and stable fixation of the target and substrate during the sputtering process. It is an indispensable key component for realizing high-precision coating technology.

[0003] In the prior art, in order to keep the main structure of the clamp stable, the clamp is generally made of high-hardness, high-temperature-resistant, and corrosion-resistant stainless steel. However, the stainless steel clamp is prone to cause stress concentration on the substrate at the edge during processing, thereby causing the substrate to break. The existing clamp is also unable to change the shielding area according to the needs of different substrates. Utility Model Content

[0004] In order to overcome the above-mentioned deficiencies in the prior art, the present application provides a clamp, comprising a fixed frame and a buffer assembly; the fixed frame comprises a first surface and a second surface opposite thereto, and also comprises a first opening extending from the first surface to the second surface; the buffer assembly is arranged on the first surface of the fixed frame, comprises a second opening, and the orthographic projection of the first opening on the first surface at least partially overlaps with the orthographic projection of the second opening on the first surface; the hardness of the buffer assembly is less than the hardness of the fixed frame.

[0005] In a possible implementation manner, the buffer assembly includes an adjusting portion, and the adjusting portion is used to adjust a relative position between at least a portion of the buffer assembly and the fixing frame to change an area of ​​the second opening.

[0006] In a possible embodiment, the fixed frame is rectangular, and the buffer component includes two fixed bars arranged in parallel and two movable bars arranged in parallel; the two fixed bars are respectively connected to the opposite sides of the fixed frame, and when the fixed bars are connected to the fixed frame, the positions of the fixed bars and the fixed frame remain unchanged; the adjustment part is used to adjust the relative positions of the two movable bars and the fixed frame to adjust the distance between the two movable bars; the buffer component includes at least two setting states, and the distance between the movable bars in the first setting state is smaller than the distance between the movable bars in the second setting state.

[0007] In a possible implementation, the fixed bar includes a slide rail, the adjustment portion includes a sliding connection member, the movable bar is connected to the slide rail via the sliding connection member, and the movable bar can slide relative to the fixed bar via the sliding connection member.

[0008] In a possible implementation, the movable bar includes a first connection hole and a second connection hole, and the movable bar is in a first state when connected to the fixed frame through the first connection hole, and is in a second state when connected to the fixed frame through the second connection hole.

[0009] In a possible implementation manner, the buffer assembly is detachably connected to the fixing frame.

[0010] In a possible implementation manner, the clamp includes a plurality of the buffer components, and different buffer components have different areas of the second openings.

[0011] In a possible implementation, the material used for the buffer component includes Teflon.

[0012] In a possible implementation manner, the fixing frame is made of stainless steel.

[0013] Another object of the present application is to provide a sputtering apparatus, comprising the clamp and support assembly described in any one of the above items, wherein the support assembly is used to attach the substrate to a position where the buffer assembly is away from the fixed frame.

[0014] Compared with the prior art, this application has the following beneficial effects:

[0015] The present application provides a fixture and a sputtering apparatus, which, while maintaining the fixture main structure stable and unchanged, reduces the probability of substrate breakage by adding a buffer layer material with low hardness, high lubricity, high corrosion resistance and high heat resistance; and provides an adjustment portion on it that can adjust the size of the second opening, giving it the flexibility to implement different shielding area solutions during the sputtering process. Users can easily adjust the sputtering area according to actual needs, thereby optimizing the film deposition effect and meeting diverse and high-precision processing needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A top view of the clamp provided for this embodiment;

[0018] Figure 2 One of the cross-sectional views of the clamp provided in this embodiment;

[0019] Figure 3 One of the top views of the buffer assembly of the clamp provided in this embodiment;

[0020] Figure 4 A second top view of the buffer assembly of the clamp provided in this embodiment;

[0021] Figure 5 A third top view of the buffer assembly of the clamp provided in this embodiment;

[0022] Figure 6 A fourth top view of the buffer assembly of the clamp provided in this embodiment;

[0023] Figure 7 A second cross-sectional view of the clamp provided in this embodiment;

[0024] Figure 8 A third cross-sectional view of the clamp provided in this embodiment;

[0025] Fig. 9 A cross-sectional view of the sputtering apparatus provided for this embodiment.

[0026] Icons: 10-clamp; 20-sputtering device; 100-fixed frame; 101-first side; 102-second side; 110-first opening; 120-fixed hole; 130-alignment hole; 200-buffer assembly; 201-fixed bar; 202-movable bar; 210-second opening; 211-slide rail; 212-sliding connector; 221-first connecting hole; 222-second connecting hole; 300-support assembly; 400-substrate. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0029] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0030] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0031] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0032] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0033] The specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings.

[0034] The present application provides a clamp 10 , including a fixing frame 100 and a buffer assembly 200 .

[0035] Please refer to Figure 1 and Figure 2 The fixing frame 100 includes a first surface 101 and a second surface 102 opposite thereto, and also includes a first opening 110 extending from the first surface 101 to the second surface 102 .

[0036] The buffer assembly 200 is disposed on the first surface 101 of the fixing frame 100 and includes a second opening 210 . The orthographic projection of the first opening 110 on the first surface 101 at least partially overlaps with the orthographic projection of the second opening 210 on the first surface 101 .

[0037] The hardness of the buffer component 200 is smaller than the hardness of the fixing frame 100 .

[0038] In this embodiment, in order to solve the problem that the stainless steel clamp 10 causes stress concentration on the substrate 400 at the edge pressing position during processing, thereby causing the substrate 400 to break, on the basis of keeping the main structure of the clamp 10 stable and unchanged, this embodiment reduces the probability of the substrate 400 breaking by adding a low-hardness buffer layer material between the fixed frame 100 and the substrate 400.

[0039] In a possible implementation manner, the buffer assembly 200 includes an adjusting portion, and the adjusting portion is used to adjust the relative position between at least a portion of the buffer assembly 200 and the fixing frame 100 to change the area of ​​the second opening 210 .

[0040] In this embodiment, in order to meet the sputtering requirements of different substrates 400, the buffer assembly 200 includes an adjustment unit, which can adjust the size of the second opening 210, giving it the flexibility to implement different shielding area solutions during the sputtering process. Several different embodiments will be provided below for adjusting the size of the second opening 210. Users can adjust the sputtering area according to actual needs, thereby optimizing the film deposition effect and meeting diversified and high-precision processing requirements.

[0041] It should be noted that the following embodiments for adjusting the size of the second opening 210 merely represent selected embodiments of the present application, but not all embodiments.

[0042] Please refer to Figure 3 In a possible implementation manner, the fixing frame 100 is rectangular, and the buffer assembly 200 includes two fixing bars 201 arranged in parallel and two moving bars 202 arranged in parallel.

[0043] The two fixing bars 201 are connected to two opposite sides of the fixing frame 100 respectively. When the fixing bars 201 are connected to the fixing frame 100, the positions of the fixing bars 201 and the fixing frame 100 remain unchanged.

[0044] The adjusting portion is used to adjust the relative position of the two moving bars 202 and the fixing frame 100 , so as to adjust the distance between the two moving bars 202 .

[0045] The buffer assembly 200 includes at least two setting states. In the first setting state, the distance between the moving bars 202 is smaller than the distance between the moving bars 202 in the second setting state.

[0046] For example, Figure 3 is the position of the moving bar 202 in the first setting state, Figure 4This is the position of the moving bar 202 in the second setting state. The position of the moving bar 202 ( b ) is adjusted by the adjustment unit.

[0047] Please refer to Figure 5 In a possible implementation, the fixed bar 201 includes a slide rail 211, the adjustment portion includes a sliding connector 212, the movable bar 202 is connected to the slide rail 211 via the sliding connector 212, and the movable bar 202 can slide relative to the fixed bar 201 via the sliding connector 212.

[0048] In this embodiment, the buffer assembly 200 is provided with a slide rail 211 on the parallel fixed bar 201, so that the moving bar 202 slides on the slide rail 211 to achieve the change of the size of the second opening 210. For example, Figure 5 The moving bar 202 in is the initial position, Figure 6 The moving bar 202 in the figure is the position after the move.

[0049] In this embodiment, positioning grooves may be provided at both ends of the slide rail 211 to prevent the moving bar 202 from sliding out.

[0050] Please refer to Figure 7 In another possible implementation, the moving bar 202 includes a first connecting hole 221 and a second connecting hole 222. The moving bar 202 is in a first state when connected to the fixed frame 100 through the first connecting hole 221, and is in a second state when connected to the fixed frame 100 through the second connecting hole 222.

[0051] In this embodiment, the moving bar 202 includes a plurality of connection holes, which can be connected to the alignment holes 130 on the fixing frame 100 through alignment screws, and the size of the second opening 210 can be changed through different connection holes. Figure 7 The moving bar 202 connected by the first connecting hole 221 and the alignment hole 130 is in the first state. Figure 8 The moving bar 202 that is aligned with the second connection hole 222 and the alignment hole 130 is in the second state.

[0052] In this embodiment, the alignment hole 130 is disposed on a side of the fixing hole 120 close to the first opening 110 .

[0053] In other implementations of this embodiment, the movable bar 202 can be detachably connected to the fixed frame 100 by means of a slot buckle, a magnetic attraction, etc., which will not be described in detail in this embodiment.

[0054] In a possible implementation manner, the buffer assembly 200 is detachably connected to the fixing frame 100 .

[0055] In this embodiment, in order to meet the sputtering requirements of different substrates 400, it is ensured that multiple buffer components 200 with different second openings 210 can be used, and the buffer component 200 and the fixed frame 100 can be detachably connected. For example, in the previous embodiment, the fixed frame 100 is provided with an alignment hole 130, which can be aligned with the first connection hole 221 and the second connection hole 222 on the buffer component 200 and disassembled by an alignment screw.

[0056] In a possible implementation manner, the clamp 10 includes a plurality of the buffer components 200 , and the second openings 210 of different buffer components 200 have different areas.

[0057] In this embodiment, the fixture 10 includes a plurality of buffer components 200 with different opening areas, which can accurately adjust the sputtering range on the sputtered target substrate 400, ensure the sputtering process is efficient and accurate, and meet the diverse material preparation requirements. Through such a design, the sputtering apparatus 20 can more flexibly cope with different application scenarios and achieve high-quality thin film deposition effects.

[0058] In order to solve the problem that high-hardness materials are prone to cause stress concentration on the substrate 400 at the edge during processing, thereby causing the substrate 400 to break, the fixture 10 provided in the present application adds a buffer component 200 on the basis of the original high-hardness fixed frame 100. The buffer component 200 is located between the fixed frame 100 and the substrate 400 of the sputtered target material, and plays a buffering and protective role. Therefore, the material used in the buffer component 200 should have a lower hardness and a lower friction coefficient; since the buffer component 200 will directly contact the target material sputtered by the sputtering device 20, the temperature of the target material will vary according to its different sputtering powers. For example, in some cases, when the sputtering power increases from 5KW to 10KW, the surface temperature of the target material may rise from about 200 degrees to nearly 400 degrees. Therefore, the material used in the buffer component 200 should have good chemical corrosion resistance and high temperature resistance.

[0059] In some possible implementations, the buffer assembly 200 is made of Teflon. Teflon has an extremely low friction coefficient, which can reduce the friction between it and the substrate 400 during the sputtering process and reduce wear; Teflon has lubricity and can work under oil-free lubrication conditions, reducing maintenance costs and environmental pollution; Teflon has excellent chemical corrosion resistance and can maintain its stable performance in various corrosive environments to ensure the reliability and durability of the sputtering fixture 10; Teflon material has excellent high temperature resistance and can maintain the stability of its physical and chemical properties in high temperature environments. In addition, Teflon also has the characteristics of not easy to adhere to substances and excellent insulation, which can extend the service life of the fixture 10 and reduce losses.

[0060] It should be noted that in other implementations of this embodiment, the buffer component 200 may also be made of other materials, such as fluororubber, ceramic materials, etc.

[0061] In a possible implementation manner, the fixing frame 100 is made of stainless steel.

[0062] Stainless steel has excellent corrosion resistance and can resist the erosion of most chemical media. In the use environment of the sputtering device 20, it will be exposed to various chemical reagents or corrosive gases. The corrosion resistance of stainless steel can ensure that the fixture 10 remains stable during long-term use and prolong its service life; stainless steel has high strength. When it is used as the fixing frame 100 of the fixture 10, it can withstand large loads and stresses, ensuring the stability and reliability of the fixture 10 when fixing the sample or target; stainless steel also has good high temperature resistance. Therefore, in this embodiment, the fixing frame 100 is made of stainless steel.

[0063] The present application also provides a sputtering apparatus 20, please refer to Fig. 9 , including the clamp 10 and the supporting assembly 300 described in any one of the above embodiments, and the supporting assembly 300 is used to attach the substrate 400 to a position of the buffer assembly 200 away from the fixing frame 100.

[0064] For example, when the sputtering device 20 provided in this embodiment is used, the substrate 400 is first placed on the support assembly 300, and the size of the second opening 210 is adjusted as needed. Then, the support assembly 300 is moved upward until the substrate 400 is attached to the buffer assembly 200, and then sputtering is performed.

[0065] In summary, the present application provides a fixture 10 and a sputtering apparatus 20, wherein the fixture 10 includes a fixed frame 100 and a buffer assembly 200; the fixed frame 100 includes a first surface 101 and a second surface 102 opposite thereto, and also includes a first opening 110 extending from the first surface 101 to the second surface 102; the buffer assembly 200 is disposed on the first surface 101 of the fixed frame 100, and includes a second opening 210, and the orthographic projection of the first opening 110 on the first surface 101 and the orthographic projection of the second opening 210 on the first surface 101 at least partially overlap; the hardness of the buffer assembly 200 is less than the hardness of the fixed frame 100. The present application reduces the probability of breakage of the substrate 400 by adding a buffer layer material with low hardness, high lubricity, high corrosion resistance and high heat resistance on the basis of maintaining the main structure of the fixture 10 stable and unchanged; and an adjustment portion is provided thereon to adjust the size of the second opening 210, giving it the flexibility to implement different shielding area schemes during the sputtering process. Users can easily adjust the shielding area according to actual needs, thereby optimizing the thin film deposition effect and meeting diverse and high-precision processing needs.

[0066] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A clamp, characterized in that: It includes a fixing frame and a buffer component; The fixing frame includes a first surface and a second surface opposite thereto, and also includes a first opening extending from the first surface to the second surface; The buffer assembly is disposed on the first surface of the fixing frame and includes a second opening, wherein an orthographic projection of the first opening on the first surface at least partially overlaps with an orthographic projection of the second opening on the first surface; The hardness of the buffer component is smaller than the hardness of the fixing frame.

2. The clamp according to claim 1, characterized in that: The buffer assembly includes an adjusting portion, and the adjusting portion is used to adjust the relative position between at least a part of the buffer assembly and the fixing frame to change the area of ​​the second opening.

3. The clamp according to claim 2, characterized in that: The fixing frame is rectangular, and the buffer assembly includes two fixing bars arranged in parallel and two moving bars arranged in parallel; The two fixing bars are respectively connected to two opposite sides of the fixing frame, and when the fixing bars are connected to the fixing frame, the positions of the fixing bars and the fixing frame remain unchanged; The adjusting unit is used to adjust the relative position of the two moving bars and the fixed frame to adjust the distance between the two moving bars; The buffer assembly includes at least two setting states, and the distance between the moving bars in the first setting state is smaller than the distance between the moving bars in the second setting state.

4. The clamp according to claim 3, characterized in that: The fixed bar includes a slide rail, the adjusting portion includes a sliding connection member, the movable bar is connected to the slide rail via the sliding connection member, and the movable bar can slide relative to the fixed bar via the sliding connection member.

5. The clamp according to claim 3, characterized in that: The moving bar includes a first connection hole and a second connection hole. The moving bar is in a first state when connected to the fixing frame through the first connection hole, and is in a second state when connected to the fixing frame through the second connection hole.

6. The clamp according to claim 1, characterized in that: The buffer assembly is detachably connected to the fixing frame.

7. The clamp according to claim 6, characterized in that The clamp includes a plurality of the buffer components, and different buffer components have different areas of the second openings.

8. The clamp according to claim 1, characterized in that: The material used for the buffer component includes Teflon.

9. The clamp according to claim 1, characterized in that: The material used for the fixing frame includes stainless steel.

10. A sputtering apparatus, characterized in that: It comprises the clamp and support assembly according to any one of claims 1 to 9, wherein the support assembly is used to attach the substrate to a position where the buffer assembly is away from the fixed frame.

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