Solid precursor packaging device and vapor deposition system

Abstract

The utility model relates to a solid precursor packaging device and a vapor deposition system. The solid precursor packaging device comprises a bottle body, an air inlet pipe, an air outlet pipe and a path extension piece, the gas inlet pipe penetrates through the bottle body, one end of the gas inlet pipe partially extends into the bottle body, and the end, far away from the end extending into the bottle body, of the gas inlet pipe is used for being communicated with the gas supply end of a preset gas supply device; the gas outlet pipe penetrates through the bottle body, one end of the gas outlet pipe partially extends into the bottle body, and the end, away from the bottle body, of the gas outlet pipe is used for being communicated with a reaction chamber of preset vapor deposition equipment; the path extension piece is used for changing the carrier gas direction flowing into the bottle body from the gas inlet pipe. In the solid precursor process, due to the baffles, the carrier gas transmission uniformity in the direction away from the center of the gas outlet pipe is guaranteed, the precursor output stability is guaranteed, the carrier gas circulation path is prolonged, the contact area of the carrier gas and the solid precursor is increased, the problem that the vapor pressure of the precursor in the container body is unstable is solved, and the stability of the vapor deposition process is improved.

Description

Technical Field

[0001] The utility model relates to the field of precursor packaging, in particular to a solid precursor packaging device and a vapor deposition system. Background Art

[0002] Precursors are important raw materials for thin film deposition processes. They are used in vapor deposition processes to form various thin film layers that meet the requirements of semiconductor manufacturing and are widely used in fields such as light-emitting diodes or radio frequency integrated circuit chips. Precursors are key materials for semiconductor chip manufacturing, and their purity, stability or vapor pressure and other factors directly affect the quality of film formation.

[0003] In traditional technology, a packaging container is usually used to fill and package the precursor during the use of the precursor. During the vapor deposition process, the precursor is encapsulated in the packaging container and transported to the reaction chamber of the vapor deposition equipment in the form of gas by the gas supply system. Then, under specific temperature, pressure and atmosphere conditions, it is deposited on the surface of the substrate through chemical reaction or physical process to form a thin film.

[0004] However, as the precursor in the packaging container is consumed, the contact area and path of the carrier gas delivered by the gas supply system through the precursor gradually decreases, affecting the concentration of the precursor carried by the carrier gas, and further affecting the quality of the vapor deposited film, ultimately leading to poor performance of the semiconductor device. Utility Model Content

[0005] Based on this, it is necessary to provide a solid-state precursor packaging device and vapor deposition system to address the problem that as the precursor in the packaging container is consumed, the contact area and path of the carrier gas delivered by the gas supply system through the precursor gradually decrease, ultimately leading to poor performance of the semiconductor device.

[0006] The utility model provides a solid precursor packaging device, comprising: a bottle body, the bottle body is used to accommodate the precursor;

[0007] An air inlet pipe, the air inlet pipe is passed through the bottle body, one end of the air inlet pipe partially extends into the bottle body, and the end of the air inlet pipe away from the end extending into the bottle body is used to communicate with the air supply end of an external gas supply device;

[0008] An air outlet pipe, the air outlet pipe is arranged in the bottle body, one end of the air outlet pipe partially extends into the bottle body, and one end of the air outlet pipe away from the bottle body is used to communicate with a reaction chamber of an external vapor deposition device;

[0009] A path extension member is disposed in the bottle body, and is used to change the flow direction of the carrier gas flowing from the air inlet pipe into the bottle body, and the carrier gas is used to carry the precursor into the reaction chamber.

[0010] In one of the embodiments, the air inlet pipe is coaxially arranged with the air outlet pipe, and the length of the air outlet pipe extending toward the inside of the bottle body is greater than the length of the air inlet pipe extending toward the bottle body.

[0011] In one of the embodiments, the path extension member includes an air inlet baffle, which is arranged on the inner wall of the bottle body and at the air outlet of the air inlet pipe, and is used to change the air outlet direction of the air inlet pipe.

[0012] In one of the embodiments, the path extension member further includes a partition, which is disposed inside the bottle body and is used to change the flow direction of the carrier gas guided by the air inlet baffle.

[0013] In one of the embodiments, a vent is provided on the partition, and the vent is used to change the flow direction of the carrier gas.

[0014] In one of the embodiments, the path extension member includes a plurality of baffles, which are sequentially arranged along the flow direction of the carrier gas guided by the air inlet baffle and whose heights decrease along the flow direction of the carrier gas guided by the air inlet baffle.

[0015] In one embodiment, the distance between adjacent partitions increases in a direction away from the air inlet pipe; and / or

[0016] The height of the vent portion decreases gradually in a direction away from the air inlet pipe;

[0017] The air inlet pipe and the air outlet pipe are arranged opposite to each other, and the path extension member is arranged between the air inlet pipe and the air outlet pipe.

[0018] In one embodiment, the path extension member includes an air intake baffle and a plurality of partitions, wherein the partitions are arranged in sequence along the direction from the air intake pipe to the air outlet pipe and the height of the partitions decreases as the distance from the air outlet pipe decreases, and the distance between adjacent partitions increases as the distance between the partitions and the air intake pipe.

[0019] In one of the embodiments, a reverse baffle is further provided in the bottle body, the reverse baffle is staggered with the partition, and a vent is provided at one end of the reverse baffle away from the air inlet pipe.

[0020] In a second aspect, the present application provides a vapor deposition system, comprising any one of the solid precursor packaging devices provided in the first aspect, the vapor deposition system also comprising a gas supply device, a solid precursor packaging device and a vapor deposition device, the solid precursor packaging device being connected to the gas supply device and the vapor deposition equipment.

[0021] The above-mentioned solid precursor packaging device includes: a bottle body, an air inlet pipe, an air outlet pipe and a path extension member, the bottle body is used to accommodate the precursor; the air inlet pipe is passed through the bottle body, one end of the air inlet pipe partially extends into the bottle body, and the end of the air inlet pipe away from the bottle body is used to communicate with the gas delivery end of an external gas supply device; the air outlet pipe is passed through the bottle body, one end of the air outlet pipe partially extends into the bottle body, and the end of the air outlet pipe away from the bottle body is used to communicate with the reaction chamber of an external vapor deposition device; the path extension member is arranged in the bottle body, and the path extension member is used to change the flow direction of the carrier gas flowing from the air inlet pipe into the bottle body, and the carrier gas is used to carry the precursor into the reaction chamber. When the solid-state precursor packaging device is connected to the vapor deposition equipment, the air inlet pipe of the solid-state precursor packaging device is connected to the gas delivery end of the gas supply device, and the air outlet pipe of the solid-state precursor packaging device is connected to the process pipeline of the vapor deposition equipment. The carrier gas enters the bottle body through the air inlet pipe of the solid-state precursor packaging device. The carrier gas is redirected by the path extension component, which prolongs the time the carrier gas stays in the bottle body, thereby ensuring the concentration of the precursor carried by the carrier gas, thereby improving the quality of the vapor deposited film, and ultimately improving the performance of the semiconductor device.

[0022] Furthermore, the arrangement of the air inlet baffle and the partition enables the carrier gas to form lateral and longitudinal carrier gas transmission under the guidance of the air inlet baffle and the partition. After the carrier gas flows through the area with the ventilation portion, it is reversely transmitted from the ventilation portion to reflux through the solid precursor, and then flows out through the outlet pipe into the process pipeline of the vapor deposition equipment. During the transmission of the carrier gas inside the solid precursor and the bottle cavity, the height of the baffle decreases and the cavity area increases in the lateral direction, thereby ensuring the uniformity of the carrier gas transmission away from the center of the outlet pipe, thereby ensuring the output stability of the precursor, extending the carrier gas flow path to increase the contact area of ​​the carrier gas with the solid precursor, thereby improving the problem of unstable precursor vapor pressure in the container body, improving the stability of the vapor deposition process and the equipment utilization rate, and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic structural diagram of a solid precursor packaging device in a first embodiment of the utility model;

[0024] Figure 2 It is a structural schematic diagram of a solid precursor packaging device in a second embodiment of the utility model;

[0025] Figure 3 It is a schematic structural diagram of a solid precursor packaging device in a third embodiment of the present utility model;

[0026] Figure 4 It is a schematic structural diagram of a solid precursor packaging device in a fourth embodiment of the present utility model;

[0027] Figure 5It is a structural schematic diagram of a solid precursor packaging device in a fifth embodiment of the utility model;

[0028] Figure 6 It is a schematic structural diagram of a solid precursor packaging device in the sixth embodiment of the utility model.

[0029] Figure numerals: 100, bottle body; 200, air inlet pipe; 300, air outlet pipe; 400, path extension member; 410, air inlet baffle; 420, partition; 430, reverse baffle; 440, fixing member; 500, ventilation portion. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0031] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0033] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0035] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0036] See also Figure 1 , Figure 1 Schematic diagram of the structure of the solid precursor packaging device in the first embodiment of the utility model, the solid precursor packaging device includes: a bottle body 100, an air inlet pipe 200, an air outlet pipe 300 and a path extension member 400.

[0037] The bottle body 100 is used to encapsulate the precursor.

[0038] The air inlet pipe 200 is passed through the bottle body 100 , and one end of the air inlet pipe 200 toward the bottle body 100 extends into the bottle body 100 . The end of the air inlet pipe 200 away from the bottle body 100 is used to communicate with the air supply end of a preset gas supply device.

[0039] The gas outlet pipe 300 is disposed in the bottle body 100 , and one end of the gas outlet pipe 300 extends into the bottle body 100 . The end of the gas outlet pipe 300 away from the bottle body 100 is used to communicate with a reaction chamber of a preset vapor deposition device.

[0040] The path extension member 400 is disposed in the bottle body 100 , and the path extension member 400 is used to change the flow direction of the carrier gas flowing into the bottle body 100 from the air inlet pipe 200 , and the carrier gas is used to carry the precursor into the reaction chamber.

[0041] Through the above embodiment, when the staff starts the vapor deposition equipment, the air inlet pipe 200 of the solid precursor packaging device is connected to the gas supply end of the gas supply device, and the air outlet pipe 300 of the solid precursor packaging device is connected to the reaction chamber of the vapor deposition equipment. The carrier gas flowing out of the gas supply device enters the bottle body 100 through the air inlet pipe 200 of the solid precursor packaging device, and is guided by the path extension member 400 to change the flow direction of the carrier gas from the longitudinal flow direction of the air inlet pipe 200 to the lateral flow direction, and finally flows out to the process pipeline of the vapor deposition equipment through the air outlet pipe 300 of the solid precursor packaging device. During the transmission process inside the bottle body 100, the path extension member 400 is provided to change the flow direction of the carrier gas inside the bottle body 100, thereby increasing the time the carrier gas stays in the bottle body 100. The lateral and longitudinal flows of the carrier gas in the bottle body 100 make the carrier gas transmission more uniform, thereby ensuring the stability of the solid precursor output, extending the carrier gas flow path, and increasing the contact area between the carrier gas and the solid precursor, thereby improving the problem of unstable vapor pressure of the solid precursor in the solid precursor packaging device, thereby improving the stability of the vapor deposition process and the equipment utilization rate, while reducing the production cost.

[0042] In one embodiment, Figure 1 and Figure 2 As shown, the air inlet pipe 200 and the air outlet pipe 300 are coaxially arranged on the bottle body 100, the length of the air outlet pipe 300 extending toward the inside of the bottle body 100 is greater than the length of the air inlet pipe 200 extending toward the bottle body 100, one end of the air inlet pipe 200 extending toward the bottle body 100 extends to the middle position of the bottle body 100, and one end of the air outlet pipe 300 extending toward the bottle body 100 extends to the bottom of the bottle body 100 and has a gap with the bottom of the bottle body 100.

[0043] It is worth mentioning that, since the existing packaging containers are arranged on both sides of the top of the container wall, the air inlet pipe 200 and the air outlet pipe 300 are difficult to identify in shape. When replacing the precursor packaging container, the operator may not be able to clearly identify the air inlet pipe 200 and the air outlet pipe 300 due to negligence. The solid-state precursor packaging device provided in this embodiment can avoid the phenomenon of the air inlet pipe 200 and the air outlet pipe 300 being connected reversely by coaxially arranging the air inlet pipe 200 and the air outlet pipe 300.

[0044] Furthermore, the enlarged diameter of the air inlet pipe 200 can increase the contact area between the carrier gas entering the packaging container and the precursor in the horizontal direction. However, the conventional air inlet pipe 200 is arranged at a position far away from the air outlet pipe 300 at the top of the packaging container. As the precursor is used and consumed, even if the diameter of the air inlet pipe 200 is enlarged, there is a high probability that channeling will occur inside the solid precursor. The air inlet pipe 200 of the solid precursor packaging device provided in this embodiment is arranged outside the air outlet pipe 300 and distributed at the top center of the packaging container, which not only ensures that the air inlet pipe 200 has a larger air inlet pipe 200 diameter, increases the contact area between the carrier gas entering the packaging container and the precursor in the horizontal direction, but also avoids the channeling phenomenon of the solid precursor. In addition, the air inlet pipe 200 and the air outlet pipe 300 are arranged at a position at the top of the packaging container, which can simplify the packaging container preparation process and reduce the process processing cost.

[0045] Through the above-mentioned embodiment, the bottle body 100 can fully flow inside the bottle body 100 under the obstruction of the path extension member 400, and finally be transmitted to the reaction chamber of the vapor deposition equipment through the gas outlet pipe 300. The path extension member 400 continuously changes the flow direction of the carrier gas inside the bottle body 100, so that the carrier gas is fully mixed with the precursor, so that the carrier gas in the flow process can be fully mixed with the precursor through a longer path and then transmitted to the vapor deposition equipment.

[0046] In one embodiment, Figure 1 and Figure 2 As shown, a fixing member 440 is provided on the inner wall of the bottle body 100, and one end of the fixing member 440 away from the inner wall of the bottle body 100 is connected to the path extension member 400. The connection method between the path extension member 400 and the fixing member 440 can be a fixed connection or a detachable connection, so that the path extension member 400 can stably change the flow direction of the carrier gas. This is not limited in the present embodiment, and the fixing member 440 can be fixedly connected to the inner wall of the bottle body 100 at one end away from the path extension member 400, or fixedly connected to the side wall of the bottle body 100.

[0047] In one embodiment, Figure 1-Figure 4 As shown, the path extension member 400 includes an air intake baffle 410, which is used to change the air intake direction of the air intake pipe 200. The connection method between the air intake baffle 410 and the bottle body 100 can be a fixed connection or a detachable connection. The connection method between the air intake baffle 410 and the bottle body 100 is not limited here. In this embodiment, the air intake baffle 410 is set at the air outlet of the air intake pipe 200 in a fixed connection manner.

[0048] Through the above-mentioned embodiment, the provision of the air inlet baffle 410 changes the direction of the carrier gas flow in the air inlet pipe 200, and the carrier gas is guided into other areas in the bottle body 100 through the air inlet baffle 410, so that the carrier gas and the precursor in the bottle body 100 are fully mixed. By extending the time of the carrier gas in the bottle body 100, the flow direction of the carrier gas is further changed horizontally and vertically through the air inlet baffle 410, so that the precursor is evenly distributed inside the bottle body 100 under the guidance of different wind directions, thereby improving the uniformity of mixing of the carrier gas and the precursor.

[0049] In one embodiment, Figure 1 and Figure 2 As shown, the path extension member 400 also includes a partition 420, which is used to change the flow direction of the carrier gas guided by the air intake partition 420. The partition 420 is fixedly connected to the inner wall of the bottle body 100, and the partition 420 is vertically arranged along the corresponding guide of the air intake baffle 410.

[0050] Furthermore, a ventilation portion 500 is provided on the partition plate 420 , and the ventilation portion 500 is used to change the flow direction of the carrier gas. In the present embodiment, the ventilation portion 500 may be a ventilation hole or a mesh plate.

[0051] Through the above embodiment, the carrier gas moves to the partition 420 under the guidance of the air inlet baffle 410, and the partition 420 blocks and guides the carrier gas that changes from longitudinal flow to transverse flow again, so that the transversely flowing carrier gas is again divided into the longitudinal carrier gas flowing along the partition 420 and the transverse carrier gas directly formed through the vent holes on the ventilation part 500 or the mesh holes on the mesh plate. The setting of the partition 420 further increases the flow direction of the carrier gas inside the bottle body 100, so that the precursor concentration inside the bottle body 100 is more uniform.

[0052] In one embodiment, Figure 3 As shown, a plurality of partitions 420 may be arranged in the bottle body 100, and the partitions 420 are arranged in sequence along the carrier gas flow guided by the air inlet baffle 410, and the height of the partitions 420 decreases with the flow direction of the carrier gas guided by the air inlet baffle 410, and the distance between adjacent partitions 420 increases with the distance of the air inlet pipe 200; partitions 420 are arranged in sequence on one side of the air outlet pipe 300 inside the bottle body 100, and when the number of partitions 420 is 1, a vent 500 is arranged on the partition 420 near the bottom of the bottle body 100; when the number of partitions 420 is greater than 1, except for the partition 420 near the air outlet pipe 300, the vent 500 is not arranged, and the other partitions 420 are arranged near the bottom of the bottle body 100. The vent 500 is a vent hole or a mesh plate, and the height of the partition 420 gradually decreases.

[0053] In one embodiment, Figure 4As shown, a plurality of baffles 420 may be provided in the bottle body 100, and the baffles 420 are sequentially arranged along the flow direction of the carrier gas guided by the air inlet baffle 410, the height of the baffles 420 decreases with the flow direction of the carrier gas guided by the air inlet baffle 410 (i.e., the height H gradually decreases along the direction away from the air inlet pipe 200), and the distance between adjacent baffles 420 increases with the distance from the air inlet pipe 200 (i.e., the distance L gradually increases along the direction away from the air inlet pipe 200), and the air outlet pipe inside the bottle body 100 is located at a position adjacent to the baffle 420. The partitions 420 with symmetrical distribution of height are symmetrically arranged on both sides of 300. When the number of the partitions 420 on one side is 1, the partitions 420 are provided with a vent 500 near the bottom of the bottle body 100; when the number of the partitions 420 on one side is greater than 1, except that the partitions 420 near the air outlet pipe 300 are not provided with the vent 500, the other partitions 420 are provided with a vent 500 near the bottom of the bottle body 100, which is a vent hole or a mesh plate, and the height of the partitions 420 on one side gradually decreases.

[0054] Through the above embodiments, when the packaging device is connected to the vapor deposition equipment, the air inlet pipe 200 is connected to the air inlet end of the vapor deposition equipment, and the air outlet pipe 300 is connected to the process pipeline of the vapor deposition equipment. The carrier gas enters the bottle body 100 through the air inlet pipe 200, and is redirected in the lateral direction through the air inlet baffle 410 to form lateral and longitudinal carrier gas transmission. After the carrier gas flows through the area with the vent 500, it is reversely transmitted from the vent 500 to reflux through the solid precursor, and then flows out through the air outlet pipe 300 to enter the process pipeline of the vapor deposition equipment. During the transmission of the solid precursor and the inside of the bottle cavity, the height of the baffle decreases and the cavity area increases in the lateral direction, thereby ensuring the uniformity of the carrier gas transmission in the direction away from the center of the air outlet pipe 300, thereby ensuring the output stability of the precursor, extending the carrier gas flow path, and increasing the contact area between the carrier gas and the solid precursor, thereby improving the problem of unstable precursor vapor pressure in the container body, improving the stability of the vapor deposition process and the equipment utilization rate, and reducing the production cost.

[0055] In one embodiment, Figure 5 and Figure 6 As shown, the air inlet pipe 200 and the air outlet pipe 300 are arranged at relative positions on the top end of the bottle body 100 , and the path extension member 400 is arranged between the air inlet pipe 200 and the air outlet pipe 300 .

[0056] Through the above-mentioned embodiment, since the air inlet pipe 200 and the air outlet pipe 300 are relatively arranged on the top surface of the bottle body 100, and the path extension member 400 is arranged between the air inlet pipe 200 and the air outlet pipe 300, during the flow of the carrier gas, the carrier gas passes through a longer path in the bottle body 100, so that the carrier gas can fully carry the uniform precursor, and a path extension member 400 for increasing the flow distance of the carrier gas is also arranged between the air inlet pipe 200 and the air outlet pipe 300, which further increases the uniformity of the mixing of the carrier gas and the precursor.

[0057] In one embodiment, Figure 5 and Figure 6 As shown, the path extension piece 400 of the air inlet pipe 200 and the air outlet pipe 300 includes a plurality of partitions 420, which are arranged in sequence along the direction of the carrier gas flow guided by the air inlet baffle 410 and the height of the partitions 420 decreases with the direction of the carrier gas flow guided by the air inlet baffle 410, and the distance between adjacent partitions 420 increases with the distance of the air inlet pipe 200.

[0058] Through the above embodiments, when the packaging device is connected to the vapor deposition equipment, the air inlet pipe 200 is connected to the air inlet end of the vapor deposition equipment, and the air outlet pipe 300 is connected to the process pipeline of the vapor deposition equipment. The carrier gas enters the bottle body 100 through the air inlet pipe 200, and is redirected in the lateral direction through the air inlet baffle 410 to form lateral and longitudinal carrier gas transmission. After the carrier gas flows through the area with the vent 500, it is reversely transmitted from the vent 500 to reflux through the solid precursor, and then flows out through the air outlet pipe 300 to enter the process pipeline of the vapor deposition equipment. During the transmission of the solid precursor and the inside of the bottle cavity, the height of the baffle decreases and the cavity area increases in the lateral direction, thereby ensuring the uniformity of the carrier gas transmission in the direction away from the center of the air outlet pipe 300, thereby ensuring the output stability of the precursor, extending the carrier gas flow path, and increasing the contact area between the carrier gas and the solid precursor, thereby improving the problem of unstable precursor vapor pressure in the container body, improving the stability of the vapor deposition process and the equipment utilization rate, and reducing the production cost.

[0059] In one embodiment, Figure 5 and Figure 6 As shown, a reverse baffle 430 is further provided in the bottle body 100 , and the reverse baffle 430 and the partition 420 are arranged alternately, and a vent 500 is provided at one end of the reverse baffle 430 away from the air inlet pipe 200 .

[0060] Through the above embodiments, when the packaging device is connected to the vapor deposition equipment, the air inlet pipe 200 is connected to the air inlet end of the vapor deposition equipment, and the air outlet pipe 300 is connected to the process pipeline of the vapor deposition equipment. The carrier gas enters the bottle body 100 through the air inlet pipe 200, and is redirected in the lateral direction through the air inlet baffle 410 to form lateral and longitudinal carrier gas transmission. After the carrier gas flows through the area with the vent 500, it is reversely transmitted from the vent 500 to reflux through the solid precursor, and then flows out through the air outlet pipe 300 to enter the process pipeline of the vapor deposition equipment. During the transmission of the solid precursor and the inside of the bottle cavity, the height of the baffle decreases and the cavity area increases in the lateral direction, thereby ensuring the uniformity of the carrier gas transmission in the direction away from the center of the air outlet pipe 300, thereby ensuring the output stability of the precursor, extending the carrier gas flow path, and increasing the contact area between the carrier gas and the solid precursor, thereby improving the problem of unstable precursor vapor pressure in the container body, improving the stability of the vapor deposition process and the equipment utilization rate, and reducing the production cost.

[0061] This embodiment also provides a vapor deposition system, which includes: a gas supply device, a vapor deposition device, and the solid precursor packaging device in the above embodiment, the solid precursor packaging device is connected to the gas supply device and the vapor deposition device, the gas supply device is used to provide a carrier gas to the solid precursor packaging device, the precursor in the solid precursor packaging device enters the vapor deposition device under the action of the carrier gas, and the vapor deposition device uses the precursor to grow a thin film.

[0062] Since the solid precursor packaging device in the vapor deposition system has a path extension component, it can extend the carrier gas flow path and increase the contact area between the carrier gas and the solid precursor, thereby improving the problem of unstable precursor vapor pressure in the container body; by adopting this vapor deposition system, the stability of the vapor deposition process and the equipment utilization rate can be improved, and the production cost can be reduced.

[0063] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0064] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A solid precursor packaging device, characterized in that: The solid-state precursor packaging device comprises: A bottle body, wherein the bottle body is used to contain the precursor; An air inlet pipe, the air inlet pipe is passed through the bottle body, one end of the air inlet pipe partially extends into the bottle body, and the end of the air inlet pipe away from the end extending into the bottle body is used to communicate with the air supply end of an external gas supply device; An air outlet pipe, the air outlet pipe is arranged in the bottle body, one end of the air outlet pipe partially extends into the bottle body, and one end of the air outlet pipe away from the bottle body is used to communicate with a reaction chamber of an external vapor deposition device; A path extension member is disposed in the bottle body, and is used to change the flow direction of the carrier gas flowing from the air inlet pipe into the bottle body, and the carrier gas is used to carry the precursor into the reaction chamber.

2. The solid-state precursor packaging device according to claim 1, characterized in that: The air inlet pipe is coaxially arranged with the air outlet pipe, and a length of the air outlet pipe extending toward the inside of the bottle body is greater than a length of the air inlet pipe extending toward the bottle body.

3. The solid-state precursor packaging device according to claim 2, characterized in that: The path extension member includes an air intake baffle, which is arranged on the inner wall of the bottle body and at the air outlet of the air intake pipe, and is used to change the air outlet direction of the air intake pipe.

4. The solid-state precursor packaging device according to claim 3, characterized in that: The path extension member further includes a partition, which is arranged inside the bottle body and is used to change the flow direction of the carrier gas guided by the air inlet baffle.

5. The solid-state precursor packaging device according to claim 4, characterized in that: The partition plate is provided with a vent, and the vent is used to change the flow direction of the carrier gas.

6. The solid-state precursor packaging device according to claim 5, characterized in that: The path extension member includes a plurality of partitions, which are sequentially arranged along the flow direction of the carrier gas guided by the air inlet baffle and whose heights decrease along the flow direction of the carrier gas guided by the air inlet baffle.

7. The solid-state precursor packaging device according to claim 6, characterized in that: The distance between adjacent partitions increases in a direction away from the air inlet pipe; and / or The height of the vent portion decreases gradually in a direction away from the air inlet pipe; The air inlet pipe and the air outlet pipe are arranged opposite to each other, and the path extension member is arranged between the air inlet pipe and the air outlet pipe.

8. The solid-state precursor packaging device according to claim 1, characterized in that: The path extension member includes an air intake baffle and a plurality of partitions, wherein the partitions are arranged in sequence along the direction from the air intake pipe to the air outlet pipe, and the height of the partitions decreases as the distance from the air outlet pipe decreases, and the distance between adjacent partitions increases as the distance between the partitions and the air intake pipe.

9. The solid-state precursor packaging device according to claim 8, characterized in that: The bottle body is further provided with a reverse baffle, which is arranged alternately with the partition, and a vent is provided at one end of the reverse baffle away from the air inlet pipe.

10. A vapor deposition system, characterized in that: include: A gas supply device, a solid precursor packaging device and a vapor deposition device, wherein the solid precursor packaging device is connected to the gas supply device and the vapor deposition device, and the solid precursor packaging device is the solid precursor packaging device described in any one of claims 1-9.

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