Longitudinal movement guiding device for wafer

Abstract

The utility model discloses a longitudinal movement guiding device for a wafer, which comprises a lifting module, an electroplating module loaded with the wafer is fixedly connected to the lower end part of the lifting module, the lifting module can be arranged in an up-and-down reciprocating motion manner, and the guiding device comprises a guiding part and a limiting part, the guiding component is provided with a guiding channel which extends up and down and is matched with the lifting module, the limiting component forms a limiting channel located below the guiding channel, the upper portion of the lifting module is arranged in the guiding channel in a sliding mode, and the lower portion of the lifting module protrudes out of the guiding channel downwards and is inserted into the limiting channel. According to the utility model, through the up-and-down cooperation of the guide channel and the limiting channel, during the lifting motion of the lifting module, the vibration of the lifting module and the electroplating module in the horizontal direction can be effectively reduced while the up-and-down motion guide is realized, and the precision and the stability of wafer movement are greatly improved; in addition, the structure is simple, and implementation cost is low.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductors, and in particular relates to a longitudinal movement guiding device for wafers. Background Art

[0002] In the semiconductor packaging electroplating process, it is necessary to control the electroplating module to drive the wafer into the electrolytic tank and gradually immerse it in the electrolyte.

[0003] At present, there is a Chinese patent with publication number CN117966243A that discloses a wafer electroplating cathode device, including a frame, a lifting module vertically installed on the frame, a rotating module fixed on a slider of the lifting module, a fixed seat connected to the rotating module, a hollow rotating motor installed in the fixed seat, a wafer clamp detachably assembled with the hollow rotating motor, a lifting drive component installed on a rotating drive member, and a detection component.

[0004] However, in the actual production process, during the lifting process of the wafer in the prior art, due to the lack of radial constraints on the wafer (especially the part of the lifting drive assembly close to the wafer), it is easy to cause the wafer to vibrate in the radial direction due to external forces or the vibration of the equipment itself, which is not conducive to the removal of surface bubbles when the wafer contacts the electrolyte. Summary of the invention

[0005] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a new longitudinal movement guiding device for wafers.

[0006] In order to solve the above technical problems, the technical solutions adopted by the utility model are as follows:

[0007] A longitudinal movement guiding device for wafers, comprising a lifting module, wherein an electroplating module loaded with wafers is fixedly connected to the lower end of the lifting module, wherein the lifting module can be arranged to reciprocate up and down, the guiding device also comprises a guiding component and a limiting component, the guiding component has a guiding channel extending up and down and matching the lifting module, the limiting component forms a limiting channel located below the guiding channel, the upper part of the lifting module is slidably arranged in the guiding channel, the lower part emerges downward from the guiding channel and is inserted in the limiting channel, and when the lifting module moves up and down along the guide channel, the limiting channel has an elastic tendency to keep clamping the lifting module in the radial direction of the wafer.

[0008] According to a specific implementation and preferred aspect of the utility model, in the orthographic projection on the horizontal plane, the guide channel and the center of the wafer are arranged to coincide with each other, thereby ensuring that the wafer is accurately immersed in the electrolyte during the up and down movement.

[0009] According to another specific implementation and preferred aspect of the utility model, the guide channel and the limit channel are staggered up and down. Here, by staggering the guide channel and the limit channel, a certain space can be formed above the electroplating module to facilitate the installation of other electroplating parts.

[0010] According to another specific implementation and preferred aspect of the utility model, the limiting component includes a plurality of resistance members distributed circumferentially around the lifting module, wherein a limiting channel is formed between the plurality of resistance members.

[0011] Preferably, the plurality of abutments are elastically abutted against the lifting module synchronously.

[0012] Specifically, each abutment is a roller and forms rolling contact with the lifting module, and as the lifting module moves up and down, each roller rolls up and down along the surface of the lifting module, thereby reducing the friction generated by the relative movement between the abutment and the lifting module, reducing wear and tear, and increasing service life.

[0013] Preferably, there are two rollers and they are symmetrically arranged on opposite sides of the lifting module, wherein each roller is recessed inward from the wheel surface to form a groove, and the lifting module forms raised parts extending up and down and corresponding to the groove from opposite sides, respectively. When lifting, the lifting module is inserted into the groove from the raised parts and moves up and down relative to the abutment. Here, the structure is simple and easy to assemble and implement.

[0014] Specifically, the cross section of the raised portion is fan-shaped or circular.

[0015] Preferably, the lifting module includes an upper block and a lower block connected to the bottom of the upper block, wherein the upper block is slidably arranged in the guide channel, and the lower block forms a protrusion from opposite sides, and when the upper block is in the highest position, the roller abuts against the bottom end of the protrusion, and when the upper block is in the lowest position, the roller abuts against the top end of the protrusion.

[0016] Preferably, the limiting component also includes a mounting mold base and an elastic member, wherein there are multiple mounting mold bases and they are arranged one-to-one with multiple interference members, each mounting mold base is formed with a horizontally extending mounting groove, there are multiple elastic members and they are correspondingly arranged in each mounting groove, each interference member has a mounting portion and is correspondingly inserted into each mounting groove from the mounting portion, each elastic member interferes with the corresponding mounting portion and drives the interference member to maintain a tendency to move outward along the extension direction of the mounting groove.

[0017] Due to the implementation of the above technical solution, the utility model has the following advantages compared with the prior art:

[0018] In the prior art, during the lifting process of wafers, due to the lack of radial constraints on the wafers, the wafers are easily vibrated in the radial direction due to external forces or the vibration of the equipment itself, which is not conducive to the removal of surface bubbles when the wafers come into contact with the electrolyte. The present application designs the structure of the longitudinal movement guide device for the wafer as a whole, and cleverly solves the shortcomings and defects of the prior art. After adopting the guide device, the electroplating module loaded with the wafers is fixedly connected to the lower end of the lifting module, and the upper part of the lifting module is inserted into the guide channel, and the lower part emerges from the guide channel downward and is inserted into the limit channel And in the process of the wafer being immersed in the electrolyte, the upper part of the lifting module slides downward along the guide channel, and at the same time, the limit channel has an elastic tendency to keep the lifting module clamped in the radial direction of the wafer to synchronously form a constraint in the horizontal direction; therefore, compared with the prior art, the utility model can achieve the up and down movement guidance through the upper and lower coordination of the guide channel and the limit channel during the lifting movement of the lifting module, and can also effectively reduce the vibration of the lifting module and the electroplating module in the radial direction of the wafer, thereby greatly improving the accuracy and stability of the wafer movement; in addition, the structure is simple and the implementation cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a front view schematic diagram of the longitudinal movement guide device for wafers of the utility model;

[0020] Figure 2 for Figure 1 Schematic diagram of the left side;

[0021] Figure 3 for Figure 1 BB-direction cross-sectional view;

[0022] Among them: A, electroplating module;

[0023] 1. lifting module; 10. upper block; 11. lower block; 110. raised portion;

[0024] 2. Guide component; 20. Guide seat; t 1. Guide channel;

[0025] 3. Limiting component; 30. Resistance member; 300. Mounting portion; t 2. Limiting channel; c. Groove; 31. Mounting die base; 310. Mounting groove; 32. Elastic member. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0027] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0029] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0030] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0031] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0032] like Figures 1 to 3 As shown, the longitudinal movement guiding device for the wafer of this embodiment includes a lifting module 1, a guide component 2, and a limiting component 3; the wafer of this embodiment is horizontally loaded on the electroplating module A, wherein the electroplating module A is fixedly connected to the lower end of the lifting module 1.

[0033] Specifically, the lifting module 1 realizes up and down reciprocating motion under the drive of external conventional power, wherein the lifting module 1 includes an upper block 10 and a lower block 11 which are vertically extended plates, wherein the upper block 10 and the lower block 11 are parallel and staggered up and down, and the bottom of the upper block 10 and the top of the lower block 11 are integrally connected through a horizontal connecting plate, and the bottom of the lower block 11 is connected to the electroplating module A through a horizontal connecting plate.

[0034] In this example, the guide component 2 includes a vertically extending guide seat 20, wherein a guide channel t1 is formed on the guide seat 20, which extends vertically up and down and passes through the guide seat 20 and matches the lifting module 1. The upper part of the lifting module 1 is slidably arranged in the guide channel t1, and the lower part emerges downward from the guide channel t1.

[0035] In some specific embodiments, the upper block 10 is matched with the guide channel t1, that is, the upper block 10 is slidably arranged in the guide channel t1, and at the same time, the lower block 11 emerges downward from the guide channel t1; in the orthographic projection on the horizontal plane, the guide channel t1 and the center of the wafer are arranged to coincide with each other.

[0036] In this example, the limiting component 3 forms a limiting channel t2 located below the guide channel t1, that is, the lower part of the lifting module 1 is inserted into the limiting channel t2, and when the lifting module 1 moves up and down along the guide channel t1, the limiting channel t2 has an elastic tendency to keep clamping the lifting module 1 in the radial direction of the wafer.

[0037] For the convenience of implementation, the guide channel t1 and the limiting channel t2 are staggered up and down, and the lower block 11 is inserted into the limiting channel t2.

[0038] The limiting component 3 includes a plurality of resistance members 30 distributed circumferentially around the lifting module 1, a plurality of mounting mold seats 31 corresponding to the plurality of resistance members 30, and an elastic member 32, wherein a limiting channel t2 is formed between the plurality of resistance members 30, and the plurality of resistance members 30 are synchronously elastically resisted on the lifting module 1, and the resistance forces in various directions on the lifting module 1 are kept balanced.

[0039] To further facilitate implementation, the resistance member 30 is a roller and forms a rolling contact with the lifting module 1. As the lifting module 1 moves up and down, each roller rolls up and down along the surface of the lifting module 1; there are two rollers and they are symmetrically arranged on opposite sides of the lifting module 1, wherein each roller is recessed inward from the wheel surface and forms a groove c, and the lower block 11 forms raised portions 110 extending up and down and corresponding to the groove c from opposite sides respectively. When lifting, the lifting module 1 is inserted into the groove c from the raised portion 110 and moves up and down relative to the resistance member 30. When the upper block 10 is in the highest position, the roller abuts against the bottom end of the raised portion 110, and when the upper block 10 is in the lowest position, the roller abuts against the top end of the raised portion 110; in some specific embodiments, the cross-section of the raised portion 110 is fan-shaped or circular.

[0040] In addition, a horizontally extending mounting groove 310 is formed on each mounting mold base 31, and there are multiple elastic members 32 that are correspondingly arranged in each mounting groove 310. Each resistance member 30 has a mounting portion 300 and is correspondingly inserted into each mounting groove 310 from the mounting portion 300. Each elastic member 32 resists the corresponding mounting portion 300 and drives the resistance member 30 to maintain a tendency to move outward along the extension direction of the mounting groove 310.

[0041] In summary, after adopting the guiding device, the electroplating module loaded with the wafer is fixedly connected to the lower end of the lifting module, the upper part of the lifting module is inserted in the guide channel, the lower part emerges downward from the guide channel and is inserted in the limiting channel, and in the process of the wafer being immersed downward in the electrolyte, the upper part of the lifting module slides downward along the guide channel, and at the same time the limiting channel has an elastic tendency to clamp the lifting module in the radial direction of the wafer, so as to synchronously form a constraint in the horizontal direction; therefore, compared with the prior art, the present invention, on the one hand, achieves a high degree of flexibility in the lifting and lowering of the lifting module through the upper and lower coordination of the guiding channel and the limiting channel. During the movement, while achieving the up and down movement guidance, it can also effectively reduce the vibration of the lifting module and the electroplating module in the wafer radial direction, greatly improving the accuracy and stability of the wafer movement; in addition, the structure is simple and the implementation cost is low; secondly, it ensures that the wafer is accurately immersed in the electrolyte during the up and down movement; thirdly, through the staggered setting of the guide channel and the limit channel, a certain space can be formed above the electroplating module to facilitate the installation of other electroplating parts; fourthly, rolling contact is used to reduce the friction generated by the relative movement of the resistance part and the lifting module, reduce wear and increase service life

[0042] The above detailed description of the utility model is intended to enable people familiar with the technology in this field to understand the content of the utility model and implement it. It is not intended to limit the protection scope of the utility model. All equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A longitudinal movement guide device for a wafer, comprising a lifting module, a plating module loaded with wafers is fixedly connected to the lower end of the lifting module, wherein the lifting module can be reciprocated up and down, characterized in that: The guiding device also includes a guiding component and a limiting component. The guiding component has a guiding channel extending up and down and matching the lifting module. The limiting component forms a limiting channel below the guiding channel. The upper part of the lifting module is slidably arranged in the guiding channel, and the lower part emerges downward from the guiding channel and is inserted in the limiting channel. When the lifting module moves up and down along the guiding channel, the limiting channel has an elastic tendency to keep the lifting module clamped in the radial direction of the wafer.

2. The longitudinal movement guide device for a wafer according to claim 1, characterized in that: In the orthographic projection on the horizontal plane, the guide channel and the center of the wafer are arranged to coincide with each other.

3. The longitudinal movement guide device for a wafer according to claim 1 or 2, characterized in that: The guide channel and the limit channel are arranged in an up-and-down staggered manner.

4. The longitudinal movement guide device for a wafer according to claim 1, characterized in that: The limiting component includes a plurality of resisting members distributed circumferentially around the lifting module, wherein the limiting channel is formed between the plurality of resisting members.

5. The longitudinal movement guide device for a wafer according to claim 4, characterized in that: The plurality of abutting members are synchronously and elastically abutted against the lifting module.

6. The longitudinal movement guide device for a wafer according to claim 5, characterized in that: Each of the resisting members is a roller and forms rolling contact with the lifting module. As the lifting module moves up and down, each of the rollers rolls up and down along the surface of the lifting module.

7. The longitudinal movement guide device for a wafer according to claim 6, characterized in that: There are two rollers which are symmetrically arranged on opposite sides of the lifting module, wherein each roller is recessed inward from the wheel surface to form a groove, and the lifting module forms raised portions extending up and down from opposite sides respectively and corresponding to the groove. When lifting, the lifting module is inserted into the groove from the raised portion and moves up and down relative to the abutment.

8. The longitudinal movement guide device for a wafer according to claim 7, characterized in that: The cross section of the protrusion is fan-shaped or circular.

9. The longitudinal movement guide device for a wafer according to claim 7, characterized in that: The lifting module includes an upper block and a lower block connected below the upper block, wherein the upper block is slidably arranged in the guide channel, and the lower block forms the protrusions from opposite sides, and when the upper block is in the highest position, the roller abuts against the bottom end of the protrusion, and when the upper block is in the lowest position, the roller abuts against the top end of the protrusion.

10. The longitudinal movement guide device for a wafer according to any one of claims 4 to 9, characterized in that: The limiting component also includes a mounting mold base and an elastic member, wherein the mounting mold base is provided in plurality and is arranged one-to-one with the plurality of resistance members, each mounting mold base is formed with a horizontally extending mounting groove, the elastic member is provided in plurality and is arranged correspondingly in each mounting groove, each resistance member has a mounting portion and is correspondingly inserted into each mounting groove from the mounting portion, each elastic member resists against the corresponding mounting portion and drives the resistance member to maintain a tendency to move outward along the extension direction of the mounting groove.

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