Heat pipe, heat dissipation assembly and electronic equipment

Abstract

The utility model provides a heat pipe, a heat dissipation assembly and electronic equipment, the heat pipe comprises a heat pipe body, the heat pipe body comprises a cavity, the cavity is provided with a cavity wall, and the cavity wall comprises a first side wall in contact with a heating element and a second side wall opposite to the first side wall; the group hole structure is attached to the cavity wall; the capillary structure is positioned in the cavity and is arranged on the first side wall; at least part of the group hole structure is attached to the second side wall. According to the heat pipe, the heat dissipation assembly and the electronic equipment, due to the fact that the heat pipe is provided with the capillary structure, liquid is adsorbed through the capillary structure, and the liquid returns to the end where the heating element is located and is heated and vaporized again to circulate; due to the fact that the group hole structure is attached to the cavity wall, at least part of the group hole structure is arranged on the second side wall, the second side wall is opposite to the first side wall, backflow channels of liquid are increased, the liquid suction capacity of the heat pipe body is improved, backflow of the liquid working medium is greatly improved, and the performance of the heat pipe in the reverse gravity direction is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation devices, and in particular to a heat pipe, a heat dissipation component and an electronic device. Background Art

[0002] As electronic devices become thinner and lighter, the heat dissipation devices in electronic devices also change accordingly. To meet the demand, ultra-thin heat pipes came into being. The working principle of a heat pipe is that under the action of a small pressure difference, the steam rises to the upper end of the heat pipe, releases heat to the outside world and condenses into liquid. The liquid is adsorbed by the capillary structure of the inner wall of the heat pipe, and the liquid returns to the evaporation end and is heated and vaporized again, and the cycle repeats. However, in the case of existing ultra-thin heat pipes with liquid absorption and reflux capability only on one side, the liquid working medium cannot return to the evaporation end in time in the direction against gravity, resulting in a decrease in performance in the direction against gravity, and the overall liquid absorption and reflux capability of the heat pipe is insufficient. Utility Model Content

[0003] The present disclosure provides a heat pipe, a heat dissipation component and an electronic device to at least solve the above technical problems existing in the prior art.

[0004] According to a first aspect of the present disclosure, there is provided a heat pipe, comprising:

[0005] The heat pipe body comprises a cavity having a cavity wall, wherein the cavity wall comprises a first side wall in contact with the heating element and a second side wall opposite to the first side wall;

[0006] A group of holes structure is attached to the cavity wall; and

[0007] A capillary structure is located in the cavity and is disposed at the first side wall;

[0008] Wherein, at least a portion of the hole group structure is attached to the second side wall.

[0009] In one embodiment, the capillary structure includes a supporting portion and an adsorption portion connected to a bottom of the supporting portion, the adsorption portion is connected to the first side wall, and a top of the supporting portion is in contact with and connected to the second side wall for supporting the second side wall.

[0010] In one possible implementation manner, the pore group structure is attached to the first side wall, and at least a portion of the adsorption portion is embedded in the small holes of the pore group structure and connected to the first side wall.

[0011] In one possible implementation manner, the pore group structure is an integrally formed structure, and the pore group structure is fully connected to all of the cavity walls.

[0012] In one embodiment, at both sides of the support portion, at least a portion of the adsorption portion, at least a portion of the support portion, and at least a portion of the second side wall together form a first cavity and a second cavity.

[0013] In one embodiment, the first cavity and the second cavity are symmetrically arranged relative to the support portion.

[0014] In one possible implementation, in a cross section of the heat pipe, the support portion is in a trapezoidal shape.

[0015] In one possible implementation, the pore group structure is a metal mesh.

[0016] According to a second aspect of the present disclosure, a heat dissipation assembly is provided, comprising a heat dissipation module and a heat dissipation fan, and also comprising a heat pipe as described in any one of the above-mentioned embodiments, wherein the first side wall is in contact with and connected to the heating element, the second side wall is connected to the heat dissipation module, and the heat dissipation module is connected to the heat dissipation fan.

[0017] According to a third aspect of the present disclosure, an electronic device is provided, including a heating element and a heat pipe as described in the above embodiment, wherein the first side wall is in contact with and connected to the heating element.

[0018] In the present disclosure, since the heat pipe has a capillary structure, the capillary structure is located at the first side wall in the cavity that is in contact with the heating element. The capillary structure absorbs the liquid, causing the liquid to return to the end where the heating element is located and to be heated and vaporized again in a reciprocating cycle. In addition, since the cavity wall is attached with a group of pores, and at least part of the group of pores is arranged at the second side wall, the second side wall is opposite to the first side wall, which increases the reflux channel of the liquid, thereby increasing the liquid absorption capacity of the heat pipe body, greatly increasing the reflux of the liquid working medium, and improving the heat pipe performance in the direction against gravity.

[0019] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, in which:

[0021] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0022] Figure 1 The overall structure schematic diagram of a heat pipe according to an exemplary embodiment of the present disclosure is shown;

[0023] Figure 2 A front view of a heat pipe according to an exemplary embodiment of the present disclosure is shown;

[0024] Figure 3 A schematic structural diagram of a heat pipe before forming according to an exemplary embodiment of the present disclosure is shown.

[0025] Explanation of the numbers in the figure: 1. heat pipe body; 2. group hole structure; 3. capillary structure; 4. core rod; 10. cavity; 11. first side wall; 12. second side wall; 31. support part; 32. adsorption part; 101. first cavity; 102. second cavity. DETAILED DESCRIPTION

[0026] In order to make the purpose, features, and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.

[0027] The embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0028] Reference Figure 1 and Figure 2 As shown, a heat pipe of an exemplary embodiment of the present disclosure includes a heat pipe body 1, a group hole structure 2 and a capillary structure 3. The heat pipe body 1 includes a cavity 10, and the cavity 10 has a cavity wall. The cavity wall includes a first side wall 11 in contact with a heating element and a second side wall 12 opposite to the first side wall 11. The group hole structure 2 is attached to the cavity wall, and the capillary structure 3 is located in the cavity 10 and is arranged at the first side wall 11. Among them, at least part of the group hole structure 2 is attached to the second side wall 12.

[0029] In this embodiment, the heating element may specifically include but not limited to a central processing unit, a chip or a resistance wire, etc. The heating element is in direct contact with the first side wall 11 outside the cavity 10. When heat conduction is performed, the heat of the heating element is conducted to the capillary structure 3 via the first side wall 11; the heat pipe body 1 and the capillary structure 3 are usually made of the same material with high thermal conductivity, including but not limited to metal materials, graphite materials or ceramic materials, etc. Taking metal materials as an example, they may specifically include but not limited to copper, silver or aluminum and other materials with good thermal conductivity, and the group hole structure 2 may be a metal hole structure or a metal mesh structure. In the embodiments shown in the present disclosure, the heat pipe body 1 and the capillary structure 3 are made of copper, and the group hole structure 2 is a copper mesh. The pore group structure 2 is at least partially attached to the second side wall 12 to ensure that when the steam reaches the second side wall 12 from the first side wall 11, the condensed liquid is adsorbed by the pore group structure 2 at the second side wall 12, thereby increasing the channels for liquid reflux, thereby increasing the liquid absorption capacity of the heat pipe body 1, greatly increasing the reflux of the liquid working medium, and improving the heat pipe performance in the direction against gravity. The liquid can penetrate into the pore group structure 2, further improving the performance limit of the heat pipe. It can be understood that the pore group structure 2 is also arranged at the first side wall 11, or the pore group structure 2 is arranged at the first side wall 11 and the connection between the first side wall 11 and the second side wall 12, and is connected to the pore group structure 2 at the second side wall 12 to increase the adsorption capacity for the liquid working medium.

[0030] Preferably, in one embodiment, the pore group structure 2 is an integrally formed structure, and the pore group structure 2 is fully connected to the walls of all the cavities 10 .

[0031] Reference Figure 3 As shown, in this embodiment, before the heat pipe is formed, a layer of group hole structure 2 is pre-set in the inner wall of the circular tube, and the capillary structure 3 is formed by inserting a core rod 4 into the circular tube after the group hole structure 2 is pre-set and filling it with high thermal conductivity powder and then sintering. Among them, the core rod 4 has a structure that imitates the capillary structure 3 in the present disclosure, and the high thermal conductivity powder can be copper powder. After the core rod 4 is inserted into the circular tube, the copper powder is filled into the imitation part of the capillary structure 3 between the core rod 4 and the group hole structure 2. After high-temperature sintering, the core rod 4 is pulled out, and then the structure is flattened to form a heat pipe in the present disclosure.

[0032] In one embodiment, the capillary structure 3 includes a support portion 31 and an adsorption portion 32 connected to the bottom of the support portion 31 , the adsorption portion 32 is connected to the first side wall 11 , and the top of the support portion 31 is in contact with and connected to the second side wall 12 for supporting the second side wall 12 .

[0033] In this embodiment, the adsorption portion 32 is laid flat on the first side wall and is in full contact with the first side wall 11, thereby ensuring that the heating element can conduct heat to the adsorption portion 32. The supporting portion 31 is used to support the second side wall 12, which can improve the stability of the overall structure of the heat pipe and the capillary structure 3, and increase the contact surface for liquid fluid to absorb heat or vaporize and release heat, thereby improving the heat dissipation efficiency of the heat pipe and reducing thermal resistance.

[0034] Furthermore, in one possible implementation manner, the pore group structure 2 is attached to the first side wall 11 , and at least a portion of the adsorption portion 32 is embedded in the small holes of the pore group structure 2 and connected to the first side wall 11 .

[0035] In this embodiment, the pore group structure 2 is attached to the first side wall 11 , and the capillary structure 3 formed by high-temperature sintering of copper powder is embedded in the small holes or meshes of the pore group structure 2 and connected to the first side wall 11 .

[0036] Specifically, in one embodiment, on both sides of the support portion 31 , at least a portion of the adsorption portion 32 , at least a portion of the support portion 31 , and at least a portion of the second sidewall 12 together form a first cavity 101 and a second cavity 102 .

[0037] In this embodiment, a first cavity 101 and a second cavity 102 are formed on both sides of the support portion 31, respectively. The gas flows from the first side wall 11 to the first cavity 101 and the second cavity 102 via the adsorption portion 32 and the support portion 31. The vaporized molecules can be liquefied when cold, and the liquid fluid can be adsorbed by the capillary structure 3 and the pore structure 2. The liquid fluid can be vaporized when hot, so that the heat pipe of the present disclosure can be used for circulation. The capillary structure 3 increases the branch paths for the diffusion of vaporized molecules, which can improve the heat dissipation efficiency of the heat pipe and reduce thermal resistance.

[0038] In one embodiment, the first cavity 101 and the second cavity 102 are symmetrically arranged relative to the support portion 31 .

[0039] In this embodiment, the first cavity 101 and the second cavity 102 are preferably of the same shape and symmetrically arranged relative to the support portion 31, which is conducive to uniform heat dissipation of the heat pipe. It is understandable that the shapes of the first cavity 101 and the second cavity 102 are not limited thereto, and can also be asymmetrically arranged. Therefore, the shapes of the first cavity 101 and the second cavity 102 are not specifically limited, and are determined by actual applications and molding conditions.

[0040] In one embodiment, in the cross section of the heat pipe, the support portion 31 is in a trapezoidal shape.

[0041] In this embodiment, preferably, the support portion 31 is in a trapezoidal shape, which can ensure that the heat pipe body 1 can be quickly sintered and formed on the basis of stable support. It is understandable that the shape of the support portion 31 on the cross section of the heat pipe is not limited to this, and can also be a rectangle, arc or other polygon, depending on the actual application and molding conditions, as long as it can play a supporting role for the second side wall 12.

[0042] In one embodiment, the pore group structure 2 is a metal mesh.

[0043] In this embodiment, the hole group structure 2 can be a metal hole structure or a metal mesh structure. In practical applications, it is preferably made of the same metal material as the heat pipe body 1 .

[0044] The present disclosure also provides a heat dissipation component, including a heat dissipation module and a heat dissipation fan, and also including a heat pipe as in any of the above-mentioned embodiments, wherein the first side wall 11 is in contact with the heating element, the second side wall 12 is connected to the heat dissipation module, the heat dissipation module is connected to the heat dissipation fan, the second side wall 12 conducts heat to the heat dissipation module, and the heat dissipation fan can cool the heat dissipation module. By arranging a heat pipe in the heat dissipation component, since the heat pipe has a capillary structure 3, the capillary structure 3 is located at the first side wall 11 in contact with the heating element in the cavity 10, the capillary structure 3 absorbs liquid, so that the liquid returns to the end where the heating element is located and is heated and vaporized again for a cycle; and since the cavity wall is attached with a group hole structure 2, and at least part of the group hole structure 2 is arranged at the second side wall 12, the second side wall 12 is opposite to the first side wall 11, and the reflux channel of the liquid is increased, thereby increasing the liquid absorption capacity of the heat pipe body 1, greatly increasing the reflux of the liquid working medium, and improving the heat pipe performance in the direction against gravity.

[0045] The present disclosure also provides an electronic device, including a heating element, and is also provided with a heat pipe as in the above-mentioned embodiment. The first side wall 11 is in contact with the heating element and connected to achieve the effect of the heat pipe, which will not be elaborated here.

[0046] In the description of the present disclosure, it is necessary to understand that the orientation or positional relationship indicated by the directional words is usually based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description. Unless otherwise stated, these directional words do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present disclosure; the directional words "inside" and "outside" refer to the inside and outside relative to the outline of each component itself.

[0047] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between one or more components or features shown in the figure and other components or features. It should be understood that spatially relative terms include not only the orientation of the components as described in the figure, but also different orientations in use or operation. For example, if the components in the accompanying drawings are inverted as a whole, the components "above other components or features" or "above other components or features" will include the situation where the components are "below other components or structures" or "below other components or structures". Therefore, the exemplary term "above" may include both "above" and "below". In addition, these components or features may also be positioned at other different angles (e.g., rotated 90 degrees or other angles), and this article is intended to include all of these situations.

[0048] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present disclosure. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, parts, components and / or combinations thereof.

[0049] It should be noted that the terms "first", "second", etc. in the specification and claims of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present disclosure described herein can be implemented in an order other than those illustrated or described herein.

[0050] The present disclosure has been described through the above-mentioned embodiments, but it should be understood that the above-mentioned embodiments are only for the purpose of example and description, and are not intended to limit the present disclosure to the scope of the described embodiments. In addition, it can be understood by those skilled in the art that the present disclosure is not limited to the above-mentioned embodiments, and more variations and modifications can be made according to the teachings of the present disclosure, and these variations and modifications all fall within the scope of protection claimed by the present disclosure. The scope of protection of the present disclosure is defined by the attached claims and their equivalents.

Claims

1. A heat pipe, characterized in that: include: A heat pipe body (1) comprises a cavity (10), wherein the cavity (10) has a cavity wall, wherein the cavity wall comprises a first side wall (11) in contact with a heating element and a second side wall (12) opposite to the first side wall (11); A group of pores (2) is attached to the cavity wall; and A capillary structure (3) located in the cavity (10) and arranged on the first side wall (11); Wherein, at least part of the hole group structure (2) is attached to the second side wall (12).

2. The heat pipe according to claim 1, characterized in that The capillary structure (3) comprises a supporting portion (31) and an adsorption portion (32) connected to the bottom of the supporting portion (31), the adsorption portion (32) being connected to the first side wall (11), and the top of the supporting portion (31) being in contact with and connected to the second side wall (12) for supporting the second side wall (12).

3. The heat pipe according to claim 2, characterized in that The pore group structure (2) is attached to the first side wall (11), and at least part of the adsorption portion (32) is embedded in the small holes of the pore group structure (2) and connected to the first side wall (11).

4. The heat pipe according to claim 3, characterized in that The group pore structure (2) is an integrally formed structure, and the group pore structure (2) is fully connected to all of the cavity walls.

5. The heat pipe according to claim 2, characterized in that On both sides of the support portion (31), at least part of the adsorption portion (32), at least part of the support portion (31) and at least part of the second side wall (12) jointly form a first cavity (101) and a second cavity (102).

6. The heat pipe according to claim 5, characterized in that The first cavity (101) and the second cavity (102) are symmetrically arranged relative to the supporting portion (31).

7. The heat pipe according to claim 2, characterized in that In the cross section of the heat pipe, the support portion (31) is in a trapezoidal shape.

8. The heat pipe according to claim 7, characterized in that The pore group structure (2) is a metal mesh.

9. A heat dissipation assembly, comprising a heat dissipation module and a heat dissipation fan, characterized in that: It also includes a heat pipe as described in any one of claims 1 to 8, the first side wall (11) is in contact with and connected to the heating element, the second side wall (12) is connected to the heat dissipation module, and the heat dissipation module is connected to the heat dissipation fan.

10. An electronic device comprising a heating element, characterized in that: A heat pipe as claimed in any one of claims 1 to 8 is also provided, and the first side wall (11) is in contact with and connected to the heating element.

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