Sensor and electronic device

Abstract

The utility model provides a sensor and electronic equipment relates to sensor technical field, the sensor includes connecting portion and output portion mutually connected, the housing covers the connecting portion to form the accommodation cavity, be provided with MEMS chip and ASIC chip in signal connection in the accommodation cavity, connecting portion one side away from the housing is connected with the support member, the support member is connected with the output portion, and the output portion is connected with the MEMS chip and the ASIC chip. The output part is connected with the outer wall surface of the housing, and one side of the output part away from the housing is provided with a pad. The flexible circuit board further comprises an output part, the output part is connected with the outer wall face of the shell, a bonding pad is arranged on the side, away from the shell, of the output part, and the bonding pad on the output part is used for being in signal connection with an external structure. According to the utility model, the flexible circuit board is adopted to lead out the bonding pad to the position of the shell, that is, the position of the bonding pad of the output part can be arranged according to the position of an external structure and the space structure in the electronic equipment, thereby greatly improving the installation flexibility, reducing the installation difficulty, and simplifying the installation process without adopting lead connection; and the connection reliability is also improved.

Description

Technical Field

[0001] The utility model relates to the technical field of sensors, in particular to a sensor and electronic equipment. Background Art

[0002] Existing sensors use a printed circuit board as a substrate, and set pads on the printed circuit board to connect signals with external structures. This structure limits the soldering to only one side of the printed circuit board and the electronic device. For external structures with special structures of electronic equipment, the soldering position may not be exactly at the position of the printed circuit board, making it difficult to connect with the soldering pad, resulting in installation difficulties.

[0003] In view of this, it is necessary to provide a new sensor and electronic device to solve or at least alleviate the above technical defects. Utility Model Content

[0004] The main purpose of the utility model is to provide a sensor and an electronic device, aiming to solve the technical problem of the difficulty in connecting and installing the sensor and the external structure in the prior art.

[0005] To achieve the above-mentioned purpose, according to one aspect of the utility model, the utility model provides a sensor, including a flexible circuit board and a shell, the flexible circuit board including a connecting part and an output part connected to each other, the shell covering the connecting part to form a accommodating cavity, the accommodating cavity is provided with a MEMS chip and an ASIC chip for signal connection, the connecting part is connected to a support member on a side away from the shell, the output part is connected to an outer wall surface of the shell, and a solder pad is provided on a side of the output part away from the shell.

[0006] In some embodiments, the output portion includes a connecting section and a welding section, the two ends of the connecting section are respectively connected to the connecting portion and the welding section, the welding section is connected to the top of the shell, the welding pad is provided on the side of the welding section away from the shell, and a deformation space is formed between the connecting section and the outer wall of the shell.

[0007] In some embodiments, the connecting portion is formed with a first sub-hole, the supporting member is formed with a second sub-hole, the first sub-hole and the second sub-hole are connected to form an acoustic hole, and the MEMS chip is bonded to the connecting portion and arranged facing the acoustic hole.

[0008] In some embodiments, the support member is formed with a groove, the connecting portion is disposed in the groove, and the output portion extends out of the groove.

[0009] In some embodiments, the size of the output portion is smaller than that of the connecting portion, the groove includes a receiving sub-groove and a communicating sub-groove that are interconnected, the size of the communicating sub-groove is smaller than that of the receiving sub-groove, the connecting portion is arranged in the receiving sub-groove, the communicating sub-groove passes through the outer edge of the support member, and the output portion is partially arranged in the communicating sub-groove.

[0010] In some embodiments, the accommodating sub-groove is arranged in the middle position of the supporting member, the number of the communicating sub-grooves is multiple, and the multiple communicating sub-grooves are arranged at intervals along the outer circumference of the accommodating sub-groove, the number of the output parts is also multiple and equal to the number of the communicating sub-grooves, and the multiple communicating sub-grooves are arranged one-to-one with the multiple output parts.

[0011] In some embodiments, the support member is a support plate, and the support plate is attached to the flexible circuit board.

[0012] In some embodiments, the support member and the flexible circuit board are pressed together into an integral piece.

[0013] In some embodiments, the support member is a metal member or a ceramic member.

[0014] According to another aspect of the present invention, the present invention further provides an electronic device, wherein the electronic device comprises the sensor described above.

[0015] In some embodiments, a ground circuit is provided in the electronic device;

[0016] The support member is a metal member, and the metal member is electrically connected to the grounding circuit through a conductive adhesive layer; and or, the output part is electrically connected to the grounding circuit through a conductive adhesive layer.

[0017] In the above scheme, the sensor includes a flexible circuit board and a shell, the flexible circuit board includes a connecting part and an output part connected to each other, the shell cover is arranged on the connecting part to form a receiving cavity, a signal-connected MEMS chip and an ASIC chip are arranged in the receiving cavity, a support is connected to the side of the connecting part away from the shell, the output part is connected to the outer wall surface of the shell, and a solder pad is arranged on the side of the output part away from the shell. The flexible circuit board includes two parts, namely a connecting part and an output part, and the connecting part is used to cooperate with the shell to form a receiving cavity. Specifically, the shell can be bonded to the flexible circuit board by bonding or soldering with solder paste. In addition, the flexible circuit board also includes an output part, and the output part is connected to the outer wall surface of the shell. The outer surface of the shell refers to the side of the shell away from the receiving cavity. The side of the output part away from the shell is provided with a solder pad, and the solder pad on the output part is used to connect with the external structure signal. Specifically, the output part can be bonded to the shell by hard glue. Since the flexible circuit board is flexible, the output part can be bent or curved. The utility model uses a flexible circuit board to lead the pad to the position of the shell, that is, the position of the pad of the output part can be set according to the position of the external structure and the spatial structure in the electronic device, which greatly improves the flexibility of installation and reduces the difficulty of installation. At the same time, there is no need to use wire connection, which simplifies the installation process and improves the reliability of the connection. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0019] Figure 1 This is a schematic diagram of the cross-sectional structure of the sensor according to the embodiment of the utility model;

[0020] Figure 2 This is a schematic diagram of the structure of a flexible circuit board of a sensor according to an embodiment of the utility model;

[0021] Figure 3 A schematic diagram of the structure of a support member of a sensor according to an embodiment of the utility model;

[0022] Figure 4 Another structural schematic diagram of the support member of the sensor of the embodiment of the utility model;

[0023] Figure 5 For Figure 4 A schematic diagram of the structure of a flexible circuit board matching the supporting member;

[0024] Figure 6This is another structural schematic diagram of the support member of the sensor according to the embodiment of the utility model;

[0025] Figure 7 This is another structural schematic diagram of the support member of the sensor according to the embodiment of the utility model.

[0026] Description of labels:

[0027] 100. sensor; 1. housing; 2. flexible circuit board; 21. connection part; 22. output part; 221. connection section; 222. welding section; 2221. welding pad; 3. accommodating cavity; 4. MEMS chip; 5. ASIC chip; 6. acoustic hole; 61. first sub-hole; 62. second sub-hole; 7. support member; 70. body; 71. groove; 711. accommodating sub-groove; 712. connecting sub-groove; 8. gold wire; 9. deformation space.

[0028] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with the implementation methods and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] It should be noted that all directional indications (such as up, down, etc.) in the implementation mode of the utility model are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0031] In addition, in the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0032] Furthermore, the technical solutions between the various implementation modes of the present invention may be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in the field. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0033] The sensor includes a substrate and a shell covering the substrate. The substrate and the shell are surrounded by a receiving cavity. A MEMS chip and an ASIC chip are arranged in the receiving cavity. The MEMS chip and the ASIC chip are connected by signal. A sound hole connecting the outside world and the receiving cavity is opened on the substrate or the shell. The sound signal enters the MEMS chip of the sensor through the sound hole, is received and converted into an electrical signal and transmitted to the ASIC chip to realize the detection function.

[0034] Sensors are generally used in electronic devices, such as smart wearable devices, such as mobile phones, headphones, bracelets, rings, or computers, tablets, or IPADs. According to feedback, when installing sensors in electronic devices, installation difficulties often occur.

[0035] After careful research, the applicant found that the pads are generally set on the substrate. The traditional substrate is generally a printed circuit board. The printed circuit board is made of hard materials and is generally a flat plate that cannot be bent or deformed. When the sensor is installed in an electronic device, due to the internal structure of the electronic device, the installation space left for the sensor is limited, and there are clear constraints on the installation position of the sensor. The installation environment of electronic devices of different types or models is also different. For some electronic devices, the pads in the electronic device are set at the location of the sensor housing, which is far away from the location of the substrate, making installation difficult.

[0036] The applicant considered connecting the pads on the printed circuit board and the pads of the electronic device through wires to achieve signal connection. However, the use of wires increases the connection process and production costs. On the other hand, electronic devices often shake or collide during use. If the wires are loose from any pad, it will affect the normal use of the electronic device.

[0037] To this end, the utility model provides a sensor.

[0038] Reference Figure 1 and Figure 2 According to one aspect of the utility model, the utility model provides a sensor 100, including a flexible circuit board 2 and a shell 1, the flexible circuit board 2 includes a connecting portion 21 and an output portion 22 connected to each other, the shell 1 is covered on the connecting portion 21 to form a accommodating cavity 3, and a signal-connected MEMS chip 4 and an ASIC chip 5 are arranged in the accommodating cavity 3, the connecting portion 21 is connected to a support member 7 on the side away from the shell 1, the output portion 22 is connected to the outer wall surface of the shell 1, and a solder pad 2221 is arranged on the side of the output portion 22 away from the shell 1.

[0039] Flexible printed circuit board 2 is also called FPC (Full name: Flexible Printed Circuit), which is flexible and has a circuit inside. Figure 2As shown by the black line indicated by A in the figure, a soldering pad 2221 is provided on the surface, and various electronic components can be connected through the circuit to provide the installation position and signal transmission. Compared with the traditional printed circuit board, the flexible circuit board 2 can be folded and bent. In the above embodiment of the utility model, the size of the flexible circuit board 2 is larger than that of the conventional printed circuit board. The traditional printed circuit board is generally set to be slightly larger than the shell 1. In the embodiment of the utility model, the flexible circuit board 2 includes two parts, namely a connecting part 21 and an output part 22. The connecting part 21 is used to cooperate with the shell 1 to form a receiving cavity 3, playing the role of a traditional printed circuit board. Specifically, the shell 1 can be bonded to the flexible circuit board 2 by bonding or soldering with solder paste. In addition, the flexible circuit board 2 also includes an output part 22, and the output part 22 is connected to the outer wall surface of the shell 1. The outer surface of the shell 1 refers to the side of the shell 1 away from the receiving cavity 3. The side of the output part 22 away from the shell 1 is provided with a soldering pad 2221. The soldering pad 2221 on the output part 22 is used to connect with the external structure signal. Specifically, the output part 22 can be bonded to the shell 1 by hard glue. Since the flexible circuit board 2 is flexible, the output part 22 can be bent or curved. In this embodiment, the flexible circuit board 2 is used to lead the pad 2221 to the position of the housing 1, that is, the position of the pad 2221 of the output part 22 can be set according to the position of the external structure and the spatial structure inside the electronic device, so that the sensor 100 can be welded to the inside of the electronic device from one side of the housing 1, which greatly improves the flexibility of installation and reduces the difficulty of installation. At the same time, there is no need to use wire connection, which simplifies the installation process and improves the reliability of the connection.

[0040] In addition, since the flexible circuit board 2 is flexible, in order to improve the rigidity of the sensor 100, a support member 7 is provided on the side of the connecting portion 21 away from the housing 1. The support member 7 is generally made of a harder material and is used to support the connecting portion 21 to prevent the connecting portion 21 from deforming or collapsing.

[0041] It should be noted that in the present application, the support member 7 only plays a supporting role, improves the strength of the flexible circuit board 2, and prevents the flexible circuit board 2 from deforming. There is no need to set up a circuit structure inside. The circuit structure is set in the flexible circuit board 2.

[0042] Reference Figure 1 and Figure 2In some embodiments, the output portion 22 includes a connecting section 221 and a welding section 222. The two ends of the connecting section 221 are respectively connected to the connecting section 21 and the welding section 222. The welding section 222 is connected to the top of the housing 1. A pad 2221 is provided on the side of the welding section 222 away from the housing 1. A deformation space 9 is formed between the connecting section 221 and the outer wall of the housing 1. The welding section 222 is provided with a pad 2221. The welding section 222 is connected to the top of the housing 1, which is suitable for application scenarios where the top of the housing 1 of the sensor 100 needs to be welded to an electronic device. The deformation space 9 is formed between the connecting section 221 and the housing 1, indicating that there is a margin for deformation. The position of the welding section 222 and the pad 2221 thereon can be adjusted according to actual needs, which greatly improves the flexibility of installation. It should be noted that the pad 2221 can also be set on the connecting section 221, and those skilled in the art can set it according to the actual application scenario.

[0043] Reference Figure 1 In some embodiments, the connecting portion 21 is formed with a first sub-hole 61 , the supporting member 7 is formed with a second sub-hole 62 , the first sub-hole 61 and the second sub-hole 62 are connected to form the acoustic hole 6 , and the MEMS chip 4 is bonded to the connecting portion 21 and arranged facing the acoustic hole 6 .

[0044] An ASIC chip 5 connected to the MEMS chip 4 signal is also arranged in the accommodating cavity 3. The ASIC chip 5 is also bonded to the connecting portion 21 of the flexible circuit board 2. The ASIC chip 5 is connected to the flexible circuit board 2 signal through the gold wire 8. In this way, the pressure signal received by the MEMS chip 4 can be transmitted through the flexible circuit board 2 after being processed by the ASIC chip 5. The central axis of the first sub-hole 61 and the central axis of the second sub-hole 62 coincide with each other and are the same size. The two are spliced ​​to form a sound hole 6, and the signal coming from the sound hole 6 is received by the MEMS chip 4. In this embodiment, the sound hole 6 is arranged on the connecting portion at the bottom, so that the sensor 100 has a larger back cavity volume. Compared with the sound hole 6 being arranged on the housing 1, this embodiment has high sensitivity and signal-to-noise ratio, which effectively improves the sensitivity and signal-to-noise ratio of the product.

[0045] It should be noted that the connection portion 21 and the output portion 22 are described as two parts here, but in fact the two parts are integrally formed in the flexible circuit board 2 , and they are divided into two parts for ease of description because different positions can achieve different functions.

[0046] Reference Figure 3In some embodiments, the support member 7 is formed with a groove 71, the connecting portion 21 is arranged in the groove 71, and the output portion 22 is arranged to extend out of the groove 71. The support member 7 includes a body 70 and a groove 71. In order to achieve the positioning and effective support of the connecting portion 21, a groove 71 that is recessed away from the connecting portion 21 can be provided on the support member 7. The connecting portion 21 is arranged in the groove 71, which can not only achieve effective positioning, but also the side wall and bottom wall of the groove 71 can protect the connecting portion 21. The connecting portion 21 is not easily deformed by external pressure or collision, and can play a good protective role for the flexible circuit board 2. Since the output portion 22 needs to extend out to connect with the external structure, it needs to extend out of the groove 71. Specifically, the thickness range of the support member 7 can be set to 10μm-300μm.

[0047] Reference Figure 4 and Figure 5 In some embodiments, the size of the output portion 22 is smaller than that of the connecting portion 21, the groove 71 includes a receiving sub-groove 711 and a communicating sub-groove 712 that are interconnected, the size of the communicating sub-groove 712 is smaller than that of the receiving sub-groove 711, the connecting portion 21 is disposed in the receiving sub-groove 711, the communicating sub-groove 712 runs through the outer edge of the supporting member 7, and the output portion 22 is partially disposed in the communicating sub-groove 712. Here, the groove 71 includes two parts, the receiving sub-groove 711 is used to accommodate the connecting portion 21, and the communicating sub-groove 712 runs through the outer edge of the supporting member 7 to connect the receiving sub-groove 711 with the outside. In this way, when the output portion 22 is placed in the receiving sub-groove 711, the connecting portion 21 of the output portion 22 and the connecting portion 21 of the connecting portion 21 can be placed in the communicating sub-groove 712. Compared with the embodiment without the communicating sub-groove 712, this embodiment provides an avoidance position for the output portion 22, and it is not easy to crush the flexible circuit board 2. Furthermore, the size of the output portion 22 is designed to be smaller than that of the connecting portion 21 , which can be considered that the width of the output portion 22 is designed to be smaller, so as not to occupy too much space inside the electronic device and to facilitate extension to the housing 1 in a narrow space.

[0048] Reference Figure 6 In some embodiments, the receiving sub-groove 711 is disposed in the middle of the support member 7, the number of the communicating sub-grooves 712 is multiple, and the multiple communicating sub-grooves 712 are spaced apart along the outer periphery of the receiving sub-groove 711, the number of the output parts 22 is also multiple and equal to the number of the communicating sub-grooves 712, and the multiple communicating sub-grooves 712 are disposed one-to-one with the multiple output parts 22. In the application scenario where welding with pads 2221 at multiple different positions inside the electronic device is required, multiple output parts 22 can be disposed, and the multiple output parts 22 are all provided with pads 2221, and corresponding communicating sub-grooves 712 are disposed at the positions of the output parts 22, so as to meet the actual scenario requirements of users requiring welding at multiple positions.

[0049] For the specific structure of the support member 7, there are at least the following specific implementations:

[0050] Reference Figure 7 , the support member 7 is a support plate, and the support plate is attached to the flexible circuit board 2. In this embodiment, the support member 7 is a whole support plate, and the shape and size of the support plate are basically the same as the shape and size of the connecting portion 21, and the surface of the support plate is attached to the flexible circuit board 2, which can support the connecting portion 21 of the flexible circuit board 2 from various positions, and a second sub-hole 62 is formed at the position corresponding to the first sub-hole 61. Specifically, it supports the connecting portion 21 and reduces the possibility of deformation of the connecting portion 21 of the flexible circuit board 2.

[0051] Regarding the connection method between the support member 7 and the flexible circuit board 2, glue bonding can be used, which is more convenient and has a relatively low cost. In some embodiments, the support member 7 and the flexible circuit board 2 are pressed together as an integral part. By pressing together as an integral part, the flexible circuit board 2 can be supported more effectively, and the connection between the support member 7 and the flexible circuit board 2 is prefabricated, which can simplify the installation process of the sensor 100.

[0052] In some embodiments, the support member 7 is a metal member or a ceramic member. In the embodiments of the present utility model, the support member 7 mainly serves to improve the strength and can be made of a material with relatively high hardness. The metal member can be copper or stainless steel sheet, and the ceramic member can be made of ordinary ceramic material.

[0053] According to another aspect of the utility model, the utility model further provides an electronic device, which includes the above-mentioned sensor 100. The electronic device can be a smart wearable device, such as a mobile phone, earphones, a bracelet, a ring, or a computer or a tablet or an IPAD. Since the electronic device includes all technical solutions of all embodiments of the above-mentioned sensor 100, it has at least all the beneficial effects brought by all the above-mentioned technical solutions, which will not be described one by one here.

[0054] In some embodiments, a grounding circuit is provided in the electronic device; the support member 7 is a metal member, and the metal member is electrically connected to the grounding circuit through a conductive adhesive layer; and or, the output portion 22 is electrically connected to the grounding circuit through a conductive adhesive layer. The housing 1 can be a metal shell, and the grounding circuit in the electronic device refers to the grounding circuit layer, which can be applied with conductive adhesive to play a bonding role and connect the sensor 100 to the grounding circuit of the electronic device; or, conductive adhesive is applied to the welding section 222 of the output portion 22 to connect the output portion 22 to the grounding circuit of the electronic device. This embodiment can enhance the function of the electronic device to resist electromagnetic radiation interference and electrostatic damage.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and do not limit the patent scope of the present utility model; although the present application is described in detail with reference to the above embodiments, ordinary technicians in this field should understand that under the technical concept of the present utility model, it is still possible to modify the technical solutions recorded in the above embodiments, or to replace some or all of the technical features therein with equivalents; or directly / indirectly apply them to other related technical fields, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A sensor, characterized in that: It includes a flexible circuit board and a shell, the flexible circuit board includes a connecting part and an output part connected to each other, the shell is covered on the connecting part to form a accommodating cavity, a MEMS chip and an ASIC chip for signal connection are arranged in the accommodating cavity, a support is connected to the side of the connecting part away from the shell, the output part is connected to the outer wall surface of the shell, and a solder pad is arranged on the side of the output part away from the shell.

2. The sensor according to claim 1, characterized in that The output portion includes a connecting section and a welding section, two ends of the connecting section are respectively connected to the connecting portion and the welding section, the welding section is connected to the top of the shell, the welding pad is provided on the side of the welding section away from the shell, and a deformation space is formed between the connecting section and the outer side wall of the shell.

3. The sensor according to claim 1, characterized in that The connecting portion is formed with a first sub-hole, the supporting member is formed with a second sub-hole, the first sub-hole and the second sub-hole are connected to form an acoustic hole, and the MEMS chip is adhered to the connecting portion and arranged facing the acoustic hole.

4. The sensor according to any one of claims 1 to 3, characterized in that: The support member is formed with a groove, the connecting portion is arranged in the groove, and the output portion extends out of the groove.

5. The sensor according to claim 4, characterized in that The size of the output part is smaller than that of the connecting part, the groove includes a receiving sub-groove and a communicating sub-groove which are connected to each other, the size of the communicating sub-groove is smaller than that of the receiving sub-groove, the connecting part is arranged in the receiving sub-groove, the communicating sub-groove passes through the outer edge of the supporting member, and the output part is partially arranged in the communicating sub-groove.

6. The sensor according to claim 5, characterized in that The accommodating sub-groove is arranged in the middle position of the supporting member, the number of the communicating sub-grooves is multiple, and the multiple communicating sub-grooves are arranged at intervals along the outer circumference of the accommodating sub-groove, the number of the output parts is also multiple and equal to the number of the communicating sub-grooves, and the multiple communicating sub-grooves are arranged in a one-to-one correspondence with the multiple output parts.

7. The sensor according to any one of claims 1 to 3, characterized in that: The support member is a support plate, and the support plate is attached to the flexible circuit board.

8. The sensor according to any one of claims 1 to 3, characterized in that: The support member and the flexible circuit board are pressed together into an integrated piece.

9. The sensor according to any one of claims 1 to 3, characterized in that: The supporting member is a metal member or a ceramic member.

10. An electronic device, characterized in that: The electronic device comprises the sensor according to any one of claims 1-9.

11. The electronic device according to claim 10, characterized in that: A grounding circuit is provided in the electronic device; The support member is a metal member, and the metal member is electrically connected to the grounding circuit through a conductive adhesive layer; and or, The output part is electrically connected to the grounding circuit through a conductive adhesive layer.

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