Wafer vacancy detection device

Abstract

The utility model discloses a wafer vacancy detection device, comprising a camera assembly and a light source assembly, the camera assembly comprises a plurality of camera units arranged according to a target arrangement mode, the camera assembly is located above a detected area, the detected area comprises a plurality of vacancy areas and a plurality of wafer areas, and the plurality of vacancy areas and the plurality of wafer areas are arranged on the light source assembly. Each wafer area corresponds to a wafer formed after the wafer body is cut, and the wafer in each wafer area and each vacant area correspond to a unique identification code; the light source assembly surrounds the outer side of the camera assembly, the light source assembly provides a shooting light source for the camera assembly, the target arrangement mode comprises any one of an M * N matrix arrangement mode or an annular arrangement mode, M is greater than or equal to 2, and N is greater than or equal to 2. According to the invention, multiple positions of the wafer body are simultaneously shot through the multiple camera units which are arranged in a matrix or an annular manner, so that the detection efficiency of the vacant wafer is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer detection, and in particular relates to a wafer vacancy detection device. Background Art

[0002] After the wafer is processed, it will be cut into multiple small chips. The cut chips are available for users to select. However, there may be problems with the selection process. It is necessary to check whether the selected chip is the chip in the correct position to find the wrong selection problem in time. In the prior art, the detection efficiency of the chip in the vacant position is low and cannot meet the requirements of high-efficiency detection. Utility Model Content

[0003] In view of the deficiencies of the prior art, the purpose of the present invention is to provide a wafer vacancy detection device, which solves the problem of low efficiency of wafer vacancy detection in the prior art.

[0004] In order to solve the problems existing in the prior art, the utility model discloses a chip vacancy detection device, including a camera assembly and a light source assembly, wherein the camera assembly includes a plurality of camera units arranged in a target arrangement manner, the camera assembly is located above an inspected area, the inspected area includes a plurality of vacant areas and a plurality of chip areas, each of the chip areas corresponds to a chip formed after wafer cutting, and each chip in the chip area and each of the vacant areas correspond to a unique identification code; the light source assembly surrounds the outside of the camera assembly, and the light source assembly provides a shooting light source for the camera assembly, wherein the target arrangement manner includes any one of an M×N matrix arrangement manner or a ring arrangement manner, M≧2, N≧2.

[0005] Furthermore, the camera assembly also includes a mounting plate, and the camera assembly is mounted on the mounting plate.

[0006] In an implementable solution, a plurality of mounting holes are provided on the mounting plate, and one of the camera units passes through each mounting hole.

[0007] In an implementable solution, the height of the camera unit relative to the light source assembly is adjustable, and the height of the mounting plate relative to the light source assembly is fixed.

[0008] In an implementable solution, the camera assembly further includes a fixed plate and a sliding member, wherein the fixed plate is fixedly mounted on the mounting plate, the sliding member is slidably mounted on the fixed plate, the camera unit is mounted on the sliding member, and the camera unit moves synchronously with the sliding member.

[0009] In yet another feasible solution, the height of the mounting plate relative to the light source assembly is adjustable.

[0010] Furthermore, the detection device also includes a connecting plate, and the mounting plate and the light source assembly are connected and fixed by the connecting plate.

[0011] In one practicable solution, the camera assembly includes 9 camera units arranged in a 3×3 matrix.

[0012] In another feasible solution, the camera assembly is arranged in a ring shape, including an outer ring and an inner ring, wherein the outer ring is provided with 5 cameras and the inner ring is provided with 4 cameras.

[0013] Furthermore, the camera assembly communicates with the image processor signals.

[0014] The wafer vacancy detection device of the present application includes a camera assembly and a light source assembly, wherein the camera assembly includes a plurality of camera units arranged in a target arrangement, the camera assembly is located above the detected area, the detected area includes a plurality of vacant areas and a plurality of wafer areas, each of the wafer areas corresponds to a wafer formed after wafer body cutting, and each of the vacant areas and each of the wafer areas corresponds to a unique identification code; the light source assembly surrounds the outside of the camera assembly, and the light source assembly provides a shooting light source for the camera assembly, wherein the target arrangement includes any one of an M×N matrix arrangement or a ring arrangement, M≧2, N≧2. In the present application, multiple positions of the wafer body are photographed simultaneously by multiple camera units arranged in a matrix or a ring, thereby improving the efficiency of vacant wafer detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0016] Figure 1 It is a structural schematic diagram of a wafer vacancy detection device according to an embodiment of the utility model;

[0017] Figure 2 This is a partial structural diagram of a wafer vacancy detection device according to an embodiment of the utility model.

[0018] Figure 3 It is a schematic diagram of the structure of the area to be detected in an embodiment of the utility model;

[0019] Figure 4 It is a schematic diagram of the structure of the detected area in an embodiment of the utility model;

[0020] In the figure, 1-camera assembly, 11-camera unit, 12-mounting plate, 13-mounting hole, 14-fixing plate, 2-light source assembly, 21-light source board, 3-vacant area, 4-wafer area, 5-wafer selection area, 6-vacant area to be inspected, 7-connecting plate, 8-inspected area. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] In order to solve the problems existing in the prior art, the utility model discloses a wafer vacancy detection device, specifically, as Figure 1 and Figure 2 As shown, it includes a camera component 1 and a light source component 2. The camera component 1 includes a plurality of camera units 11 arranged in a target arrangement. The camera component 1 is located above the inspected area 8. The inspected area 8 includes a plurality of vacant areas 3 and a plurality of chip areas 4. Each chip area 4 corresponds to a chip formed after wafer cutting. Each chip in each chip area 4 and each vacant area 3 correspond to a unique identification code. The light source component 2 surrounds the outside of the camera component 1. The light source component 2 provides a shooting light source for the camera component 1. The target arrangement includes any one of an M×N matrix arrangement or a ring arrangement, M≧2, N≧2.

[0023] In one feasible solution, Figures 1 to 4As shown, the camera assembly 1 includes 9 camera units 11 arranged in a 3×3 matrix, and the light source assembly 2 is based on multiple light source boards 21. Furthermore, each camera unit 11 communicates with the image processor signal, and the total shooting range of multiple camera units 11 can cover the overall diameter size of the wafer body. It can be understood that among the multiple camera units 11, the image captured by any camera unit 11 may be an image corresponding to the vacant area 3, or it may be an image corresponding to the chip area 4, and the images captured by two adjacent camera units 11 may have overlapping ranges. After each camera unit 11 uploads the captured images to the image processor, the image processor performs splicing processing on the multiple images to obtain a spliced ​​image of the vacant area 3 and the chip area 4 spliced ​​with each other. It should be noted that the detected area 8 refers to the detected area 8 formed on the wafer body after the user's selection is completed. In the detected area 8, each chip in the chip area 4 and each vacant area 3 correspond to a unique identification code. Before the user selects, the wafer body forms an area to be inspected, and the area to be inspected includes multiple chip selection areas 5, each chip selection area 5 corresponds to a chip with a unique identification code, and after the chip on each chip selection area 5 is selected, a vacant inspection area 6 is formed below the chip selection area 5, and the identification code of the vacant inspection area 6 is the same as the identification code of the chip on the chip selection area 5. It can be understood that when being inspected, the vacant inspection area 6 is equivalent to the vacant area 3, and the chip selection area 5 is equivalent to the chip area 4. Exemplarily, the relationship between the vacant inspection area 6, the chip selection area 5, the vacant area 3 and the chip area 4 is as follows: Figure 3 to Figure 4 As shown. Further, in this example, the background processor will pre-store the target identification code of the chip selected by the user. After the image processor splices the images uploaded by each camera unit 11 to form a spliced ​​image, the information of the spliced ​​image is sent to the background processor. The background processor reads the comparison identification code of the vacant area 3 in the spliced ​​image, and compares the read comparison identification code of the vacant area 3 with the target identification code corresponding to the selected chip. When there is an identification code in the comparison identification code that does not match the target identification code, it means that the chip selected by the user is wrong, and it is necessary to notify the relevant staff in time.

[0024] It can be understood that in the embodiment of the present application, multiple positions of the wafer body are photographed simultaneously by multiple camera units 11 arranged in a matrix or a ring, and based on the background image processing, it is determined whether the comparison identification code of the vacant area 3 matches the target identification code of the chip selected by the user in advance, and it is determined whether the chip selected by the user is correct. The present application improves the efficiency of vacant chip detection.

[0025] In an implementable solution, a plurality of mounting holes 13 are provided on the mounting plate 12 , and a camera unit 11 passes through each mounting hole 13 .

[0026] In an operative solution, the height of the camera unit 11 relative to the light source assembly 2 is adjustable, and the height of the mounting plate 12 relative to the light source assembly 2 is fixed. Exemplarily, the camera assembly 1 further includes a fixed plate 14 and a sliding member, the fixed plate 14 is fixedly mounted on the mounting plate 12, the sliding member is slidably mounted on the fixed plate 14, the camera unit 11 is mounted on the sliding member, and the camera unit 11 moves synchronously with the sliding member. It is understandable that after the camera unit 11 is mounted on the sliding member, it moves synchronously with the sliding member, and the sliding member can be driven by the camera unit 11 to adjust the height relative to the light source assembly 2, so as to achieve the shooting of the area to be detected with different clarity requirements.

[0027] In another feasible solution, the height of the mounting plate 12 relative to the light source assembly 2 is adjustable. Specifically, in this example, the light source assembly 2 is fixedly connected to the mounting plate 12 via the fixing plate 14, and the mounting plate 12 can be adjusted up and down relative to the light source assembly 2, and the camera assembly 1 can be adjusted up and down together with the mounting plate 12.

[0028] Further, the detection device further includes a connecting plate 7. In this example, the mounting plate 12 and the light source assembly 2 are connected and fixed via the connecting plate 7. It can be understood that in this example, the camera assembly 1 is fixedly mounted on the mounting plate 12, and the positions of the camera units 11 in the camera assembly 1 and the light source assembly 2 are fixed. It can be understood that keeping the positions of the camera units 11 and the light source assembly 2 fixed can ensure the stability of the camera unit 11 in taking pictures.

[0029] Furthermore, in the above embodiment, the camera assembly 1 includes 9 camera units 11 arranged in a 3×3 matrix, which is only a preferred arrangement. In other feasible schemes, the camera assembly 1 is arranged in a ring, including an outer ring and an inner ring, wherein the outer ring is provided with 5 cameras and the inner ring is provided with 4 cameras.

[0030] Further, the camera assembly 1 is in signal communication with the image processor.

[0031] The wafer vacancy detection device of the present application includes a camera assembly 1 and a light source assembly 2. The camera assembly 1 includes a plurality of camera units 11 arranged in a target arrangement. The camera assembly 1 is located above the detected area 8. The detected area 8 includes a plurality of vacant areas 3 and a plurality of wafer areas 4. Each wafer area 4 corresponds to a wafer formed after wafer cutting. Each vacant area 3 and each wafer area 4 corresponds to a unique identification code. The light source assembly 2 surrounds the outside of the camera assembly 1. The light source assembly 2 provides a shooting light source for the camera assembly 1. The target arrangement includes any one of an M×N matrix arrangement or a ring arrangement, M≧2, N≧2. In the present application, the efficiency of vacant wafer detection is improved by simultaneously shooting multiple positions of the wafer body with a plurality of camera units 11 arranged in a matrix or a ring.

[0032] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.

Claims

1. A wafer vacancy detection device, characterized in that: The invention comprises a camera assembly (1) and a light source assembly (2), wherein the camera assembly (1) comprises a plurality of camera units (11) arranged in a target arrangement, the camera assembly (1) is located above a detection area (8), the detection area (8) comprises a plurality of vacant areas (3) and a plurality of chip areas (4), each chip area (4) corresponds to a chip formed after wafer cutting, each chip on the chip area (4) and each vacant area (3) corresponds to a unique identification code; the light source assembly (2) surrounds the outside of the camera assembly (1), and the light source assembly (2) provides a shooting light source for the camera assembly (1), wherein the target arrangement comprises any one of an M×N matrix arrangement or a ring arrangement, M≧2, N≧2.

2. The wafer vacancy detection device according to claim 1, characterized in that: The camera assembly (1) further comprises a mounting plate (12), and the camera assembly (1) is mounted on the mounting plate (12).

3. The wafer vacancy detection device according to claim 2, characterized in that: The mounting plate (12) is provided with a plurality of mounting holes (13), and each mounting hole (13) passes through one of the camera units (11).

4. The wafer vacancy detection device according to claim 2, characterized in that: The height of the camera unit (11) relative to the light source assembly (2) is adjustable, and the height of the mounting plate (12) relative to the light source assembly (2) is fixed.

5. The wafer vacancy detection device according to claim 4, characterized in that: The camera assembly (1) further comprises a fixed plate (14) and a sliding member, wherein the fixed plate (14) is fixedly mounted on the mounting plate (12), the sliding member is slidably mounted on the fixed plate (14), the camera unit (11) is mounted on the sliding member, and the camera unit (11) moves synchronously with the sliding member.

6. The wafer vacancy detection device according to claim 2, characterized in that: The height of the mounting plate (12) relative to the light source assembly (2) is adjustable.

7. The wafer vacancy detection device according to claim 2, characterized in that: The detection device further comprises a connecting plate (7), and the mounting plate (12) and the light source assembly (2) are connected and fixed via the connecting plate (7).

8. The wafer vacancy detection device according to claim 1, characterized in that: The camera assembly (1) comprises 9 camera units (11) arranged in a 3×3 matrix.

9. The wafer vacancy detection device according to claim 1, characterized in that: The camera assembly (1) is arranged in a ring shape, comprising an outer ring and an inner ring, wherein the outer ring is provided with 5 cameras and the inner ring is provided with 4 cameras.

10. The wafer vacancy detection device according to claim 1, characterized in that: The camera assembly (1) is in signal communication with an image processor.

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