Silver paste overflow limiting structure and display screen

Abstract

The utility model discloses a silver paste overflow limiting structure and a display screen. The silver paste overflow limiting structure comprises a framework part.

Description

Technical Field

[0001] The utility model relates to the technical field of display screens, in particular to a silver paste overflow limiting structure and a display screen. Background Art

[0002] AG PAD design is an important component of full-view LCD grounding design. The design reserves the ITO (Indium Tin Oxide) layer as the silver paste dispensing area.

[0003] The AG PAD designs in related technologies are mostly small-area solid ITO. Due to its flat surface and the silver paste being a flowable glue-like substance, it needs to be cured after dispensing before it can be fixed. However, before this, the silver paste glue is easy to flow and diffuse, resulting in poor curing quality and reducing the utilization rate of the silver paste glue. Utility Model Content

[0004] The silver paste overflow limiting structure proposed in the utility model comprises:

[0005] A framework portion is provided with a plurality of mutually isolated blocking flow channels at intervals.

[0006] The utility model also provides a display screen, comprising a transistor layer, a filter film layer and the silver paste overflow limiting structure;

[0007] The light filter film layer and the silver paste overflow limiting structure are both arranged on the surface of the transistor layer, and the silver paste overflow limiting structure is in contact with the side of the light filter film layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0009] Figure 1 A structural schematic diagram of an embodiment of a silver paste overflow limiting structure provided by the utility model;

[0010] Figure 2 A structural schematic diagram of another embodiment of the silver paste overflow limiting structure provided by the utility model;

[0011] Figure 3 A structural schematic diagram of another embodiment of the silver paste overflow limiting structure provided by the utility model;

[0012] Figure 4This is a structural schematic diagram of an embodiment of a display screen provided by the utility model.

[0013] Description of Figure Numbers:

[0014] 100. Silver paste overflow limiting structure; 10. Framework; 20. Filling structure; 21. Vertical flow domain; 22. Inclined flow domain; 23. Horizontal flow domain; 30. Blocking flow channel; 31. Vertical flow channel; 32. Inclined flow channel; 40. Vertical ribs; 50. Inclined ribs; 60. Horizontal ribs; 70. Transistor layer; 80. Filter film layer.

[0015] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0017] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0018] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0019] The utility model provides a silver paste overflow limiting structure.

[0020] See also Figure 1In one embodiment of the utility model, the silver paste overflow limiting structure includes:

[0021] The framework portion 10 has a plurality of mutually isolated blocking channels 30 disposed thereon.

[0022] It can be understood that the framework portion 10 is a frame structure for supporting the filling structure 20 .

[0023] It can be understood that the plurality of barrier channels 30 are disposed on the filling structure 20 , and the arrangement of the plurality of barrier channels 30 is arranged according to the design of the designer.

[0024] It should be noted that the barrier channel 30 is filled with silver paste colloid.

[0025] The technical solution of the utility model forms mutually isolated barrier channels 30 on the framework part 10 so that a layer of barrier channels with a concave-convex feel is produced on the surface of the framework part 10, so that when filling the silver paste colloid, the barrier channels 30 are isolated from each other to avoid overflow and diffusion of the silver paste colloid, so that the silver paste colloid is solidified in the designed barrier channels 30, ensuring that the solidified silver paste colloid meets the design requirements, improving the infusion and solidification quality of the silver paste colloid, and improving the utilization rate of the silver paste colloid.

[0026] In one embodiment, the blocking flow channel 30 includes a vertical flow channel 31 and an inclined flow channel 32, a plurality of the vertical flow channels 31 are spaced apart on the side of the framework portion 10, a plurality of the inclined flow channels 32 are spaced apart around the vertical flow channel 31 in the extension direction of the vertical flow channel 31, and a plurality of the inclined flow channels 32 are spaced apart from each other.

[0027] It is understandable that if Figure 1 As shown, silver paste colloid is poured into the vertical flow channel 31, and the silver paste colloid flows along the flow channel wall of the vertical flow channel 31. Under the restriction of the flow channel wall of the vertical flow channel 31, the silver paste colloid is prevented from diffusing left and right.

[0028] It can be understood that the silver paste colloid is poured into the inclined flow channel 32 so that the silver paste colloid flows along the inclined flow channel wall, and the inclined flow channel wall serves to block or delay the silver paste colloid overflowing to the left and right.

[0029] It should be noted that if Figure 2 As shown, in the extension direction of the vertical channel 31, a plurality of inclined channels 32 are arranged around the vertical channel 31, so that during the dispensing process, when the silver paste colloid flows along the vertical channel 31, the plurality of inclined channels 32 play a role of blocking or delaying the flow, thereby causing the silver paste colloid to accumulate at the dispensing point, thereby ensuring the electrostatic conduction efficiency and quality after curing.

[0030] It should be noted that the channel wall of the inclined channel 32 extends in a straight line, or in a curve or arc shape.

[0031] In one embodiment, the vertical flow channel 31 and the inclined flow channel 32 are both disposed through the frame portion 10 .

[0032] It can be understood that the vertical flow channel 31 and the inclined flow channel 32 penetrate the framework portion 10 , so that the framework portion 10 presents a hollow structure.

[0033] It can be understood that after the glue is dispensed and cured on the framework part 10, the framework part 10 is arranged between the upper and lower polarizers, and the electrical connection between the upper and lower polarizers is achieved through the silver paste colloid. In addition, since the framework part 10 is a hollow structure, it is convenient to observe and identify the point surface through the back after the glue is dispensed and cured, thereby improving the detection quality and efficiency and improving the efficiency of defect analysis.

[0034] In one embodiment, the silver paste overflow limiting structure 100 also includes a filling structure 20 filled with silver paste colloid, and the filling structure 20 includes a vertical flow domain 21, an inclined flow domain 22 and a horizontal flow domain 23, and the vertical flow domain 21 and the horizontal flow domain 23 are respectively arranged on both sides of the framework portion 10, and the inclined flow domain 22 is arranged between the vertical flow domain 21 and the horizontal flow domain 23.

[0035] It can be understood that the vertical direct current domain 21 is used to limit the directional flow of silver paste colloid, limit the left and right overflow of silver paste colloid, and the side of the structural part 10 close to the vertical direct current domain 21 is in contact with the filter film layer 80. The setting of the vertical direct current domain 21 increases the amount of silver paste colloid gathered on the contact surface with the filter film layer 80, thereby ensuring the electrostatic conduction efficiency.

[0036] like Figures 1 to 3 As shown, the inclined flow basin 22 is provided to delay or block the flow of the colloid. The inclined flow basin 22 surrounds the vertical flow basin 21 in the extension direction of the vertical flow basin 21 , and plays a role in collecting the silver paste colloid flowing on the vertical flow basin 21 .

[0037] It can be understood that the horizontal flow basin 23 is arranged in the direction of the inclined flow basin 22 away from the vertical flow basin 21 to achieve the flow of the silver paste colloid flowing in the vertical flow basin 21 and avoid the overflow and diffusion of the silver paste colloid to affect the curing quality.

[0038] It should be noted that in order to ensure the quality of the inclined flow basin 22 for collecting the silver paste colloid, two inclined flow basins 32 are set, and the two inclined flow basins 32 are mirror-imaged, and the two inclined flow basins 32 are set at an angle, and the direction of the angle is toward the flow direction of the silver paste colloid on the vertical flow basin 21.

[0039] In one embodiment, the vertical flow domain 21 includes a plurality of vertical ribs 40 , and the plurality of vertical ribs 40 are spaced apart in the frame portion 10 , and the vertical flow channel 31 is formed between two adjacent vertical ribs 40 .

[0040] In order to prevent the silver paste colloid in the vertical flow domain 21 from overflowing to the left and right, a plurality of the vertical ribs 40 are provided, and two adjacent vertical ribs 40 are combined to form the vertical flow channel 21, so that the silver paste colloid can flow along the designed path while being restricted by the side walls of the vertical ribs 40 and being restricted by the inclined flow domain 22, thereby increasing the aggregation amount of the silver paste colloid and ensuring the quality of electrostatic conduction.

[0041] It can be understood that the plurality of vertical ribs 40 are arranged at intervals, and the gaps between the plurality of vertical ribs 40 form the vertical flow channel 21, so as to realize the quantitative flow of the silver paste colloid, avoid overflow to the left and right, ensure the curing quality of the silver paste colloid, and facilitate electrostatic conduction.

[0042] In one embodiment, the inclined flow area 22 includes a plurality of inclined ribs 50, and the plurality of inclined ribs 50 are spaced apart in the frame portion 10, and the inclined flow channel 32 is formed between two adjacent vertical ribs 40, and the side inclined ribs 50 are connected to the plurality of vertical ribs 40 and block the vertical flow channel 31.

[0043] It can be understood that the plurality of inclined ribs 50 are arranged at intervals and are arranged around the vertical flow channel 31 in the extension direction of the vertical flow domain 21 to achieve the collection of the silver paste colloid and improve the curing quality of the silver paste colloid.

[0044] like Figure 1 As shown, the inclined ribs 50 on the side are inclined so that the multiple vertical ribs 40 arranged vertically are connected to the inclined ribs 50 on the side to achieve the blocking of the vertical channel 31, avoid the overflow of the silver paste colloid flowing in the vertical channel 31 and affect the aggregation of the silver paste colloid, thereby ensuring the electrostatic conduction quality after the silver paste colloid is solidified.

[0045] It should be noted that the inclined ribs 50 are straight lines, curves, or arcs, so that the gaps between the multiple inclined ribs 50 are straight lines, curves, or arcs, which play a role in blocking or delaying the silver paste colloid, facilitating the accumulation and aggregation of the silver paste colloid.

[0046] In one embodiment, the transverse flow basin 23 includes a transverse rib 60 , a plurality of the vertical ribs 40 are spaced apart on the side of the frame portion 10 , and ends of the plurality of the vertical ribs 40 are respectively connected to the inclined ribs 50 , and the transverse rib 60 is transversely disposed on the plurality of the vertical ribs 40 .

[0047] like Figure 1 As shown, the transverse flow domain 23 is arranged perpendicular to the vertical flow domain 21, so that the transverse rib 60 can intercept the silver paste colloid overflowing from the inclined flow domain 22, thereby avoiding the influence of the static electricity conduction efficiency due to the small amount of silver paste colloid accumulated in the flow channel due to excessive overflow of silver paste colloid.

[0048] It can be understood that the transverse ribs 60 are connected to the multiple vertical ribs 40 arranged on the opposite side of the vertical flow domain 21, and the transverse ribs 60 are arranged at an angle to the vertical ribs 40. The silver paste colloid collected by the inclined flow domain 22 is blocked by the transverse ribs 60 to ensure the aggregation amount of the silver paste colloid, so as to facilitate the electrostatic conduction efficiency after its solidification.

[0049] It should be noted that the transverse rib 60 is arranged perpendicular to the vertical rib 40 .

[0050] In one embodiment, the number of the transverse ribs 60 is multiple, and the multiple transverse ribs 60 are arranged at intervals;

[0051] One transverse rib 60 is connected to one vertical rib 40 , and / or one transverse rib 60 is connected to a plurality of vertical ribs 40 .

[0052] In order to enable the transverse ribs 60 to delay the flow of silver paste colloid, each of the transverse ribs 60 is connected to one or more of the vertical ribs 40, so that there is a gap between two adjacent transverse ribs 60. The existence of the transverse ribs 60 serves the purpose of blocking the silver paste colloid, and the gap between two adjacent transverse ribs 60 facilitates the flow of silver paste colloid and slows down the flow rate of the silver paste colloid.

[0053] It can be understood that the silver paste colloid, after slowing down the flow rate through the inclined flow area 22, is again gathered by the transverse ribs 60, thereby avoiding leakage points after curing due to too little colloid gathering and improving the electrostatic conductive efficiency.

[0054] The utility model also proposes a display screen, which includes a transistor layer 70, a filter film layer 80 and a silver paste overflow limiting structure 100. The specific structure of the silver paste overflow limiting structure 100 refers to the above embodiment. Since the display screen adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here. Among them, the filter film layer 80 and the silver paste overflow limiting structure 100 are both arranged on the surface of the transistor layer 70, and the silver paste overflow limiting structure 100 is in contact with the side of the filter film layer 80.

[0055] In one embodiment, the frame portion 10 is connected to the filter layer 80 at a side away from the transverse flow region 23 in the filling structure 20 .

[0056] like Figure 4 As shown, the side of the vertical flow domain 21 on the framework portion 10 is in contact with the filter film layer 80. The presence of the plurality of vertical ribs 40 limits the flow of the silver paste colloid in the left and right directions, and causes the silver paste colloid on the contact surface with the side of the filter film layer 80 to gather. After curing, the silver paste colloid is prevented from overflowing and causing electrostatic conduction efficiency.

[0057] It can be understood that the vertical flow channel 31 and the inclined flow channel 32 are both arranged in the framework portion 10, so that the framework portion 10 has a hollow structure. When the framework portion 10 is set on the surface of the transistor layer 70 and covered with a polarizer, the solidified silver paste colloid can be observed and detected through the side of the transistor layer 70 away from the framework portion 10 through the transistor layer 70, so that defects such as leakage points after the silver paste colloid is dispensed can be identified on the reverse side, thereby improving the detection efficiency and quality.

[0058] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A silver paste overflow limiting structure, characterized in that: include: A framework portion is provided with a plurality of mutually isolated blocking flow channels at intervals.

2. The silver paste overflow limiting structure according to claim 1, characterized in that: The blocking flow channel includes a vertical flow channel and an inclined flow channel. A plurality of the vertical flow channels are spaced apart on the side of the framework portion. A plurality of the inclined flow channels are spaced apart around the vertical flow channel in the extension direction of the vertical flow channel. The plurality of the inclined flow channels are spaced apart from each other.

3. The silver paste overflow limiting structure according to claim 2, characterized in that: The vertical flow channel and the inclined flow channel are both arranged through the framework portion.

4. The silver paste overflow limiting structure according to claim 3, characterized in that: The silver paste overflow limiting structure also includes a filling structure filled with silver paste colloid, and the filling structure includes a vertical flow domain, an inclined flow domain and a horizontal flow domain. The vertical flow domain and the horizontal flow domain are respectively arranged on both sides of the frame part, and the inclined flow domain is arranged between the vertical flow domain and the horizontal flow domain.

5. The silver paste overflow limiting structure according to claim 4, characterized in that: The vertical flow domain includes a plurality of vertical ribs, the plurality of vertical ribs are arranged at intervals in the framework portion, and the vertical flow channel is formed between two adjacent vertical ribs.

6. The silver paste overflow limiting structure according to claim 5, characterized in that: The inclined flow area includes a plurality of inclined ribs, which are arranged at intervals in the frame portion, and the inclined flow channel is formed between two adjacent vertical ribs. The side inclined ribs are connected to the plurality of vertical ribs and block the vertical flow channel.

7. The silver paste overflow limiting structure according to claim 6, characterized in that: The transverse flow basin includes a transverse rib, a plurality of vertical ribs are arranged at intervals on the side of the frame portion, and ends of the plurality of vertical ribs are respectively connected to the inclined ribs, and the transverse rib is transversely arranged on the plurality of vertical ribs.

8. The silver paste overflow limiting structure according to claim 7, characterized in that: There are multiple transverse ribs, and the multiple transverse ribs are arranged at intervals; One of the transverse ribs is connected to one of the vertical ribs, and / or one of the transverse ribs is connected to a plurality of the vertical ribs.

9. A display screen, characterized in that: It comprises a transistor layer, a filter film layer and the silver paste overflow limiting structure according to any one of claims 1 to 8; The light filter film layer and the silver paste overflow limiting structure are both arranged on the surface of the transistor layer, and the silver paste overflow limiting structure is in contact with the side of the light filter film layer.

10. The display screen according to claim 9, characterized in that: The framework portion is connected to the filter film layer away from the side of the horizontal flow field in the filling structure.

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